SPEC. No.
ISSUE
DG-087008
Jun-27-08
ELECTRONIC COMPONENTS AND DEVICES GROUP
SHARP CORPORATION
SPECIFICATION
DEVICE SPECIFICATION FOR
LIGHT EMITTING DIODE MODULE
MODEL No.
GW5BNF15L10
Ｓｐｅｃｉｆｉｅｄ ｆｏｒ
Reference
CUSTOMERS' APPROVAL
PRESENTED
Date
Date
By
By
Y.Inada,
Department General Manager
A1249 Project Team
ELECTRONIC COMPONENTS
AND DEVICES GROUP
SHARP CORPORATION
※ This specification is reference.
No.
PRODUCT NAME
MODEL No.
DG-087008
Jun-27-08
Light Emitting Diode Module
GW5BNF15L10
1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp").
Please do not reproduce or cause anyone to reproduce them without Sharp's consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines * Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
* Other safety equipment
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Manufacturing method or materials of this product which does not influence on its specifications
are subject to change without notice.
4. Please contact and consult with a Sharp sales representative for any questions about this product.
※ This specification is reference.
DG-087008
MODEL No.
GW5BNF15L10
GW5BNF15L10 Specification
1. Application
This specification applies to the light emitting diode module Model No. GW5BNF15L10
[White (from InGaN Blue LED chip + Phosphor) LED module]
Main use : Illumination
2. Outline dimensions and terminal connections -------------------------- Refer to the attached sheet Page 3.
3. Ratings and characteristics ------------------------------------------------ Refer to the attached sheet Page 4. ～ 6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability -------------------------------------------------------------------- Refer to the attached sheet Page 7.
4-1. Test items and test conditions
4-2. Failure judgment criteria
5. Quality level ----------------------------------------------------------------- Refer to the attached sheet Page 8.
5-1. Inspection method
5-2. Description of inspection and criteria
6. Supplement------------------------------------------------------------------- Refer to the attached sheet Page 9. ～ 10.
6-1. Chromaticity coordinates
6-2. Packing
6-3. Label
6-4.Indication to the product
7. Precautions for use ---------------------------------------------------------- Refer to the attached sheet Page 11. ～ 12.
※ This specification is reference.
Page
2/12
DG-087008
MODEL
Page
GW5BNF15L10
2. Outline dimensions and terminal connections
(Outline dimension)
* (
) is reference.
(Internal circuit diagram)
"3series × 16parallel=48 pcs of LED"
(3 serially connected LED compose a block.16 blocks are parallelly connected)
※ This specification is reference.
unit
mm
Material
Substrate: Alumina ceramic
Finish
Connection terminal: Au plating
Drawing No.
52006022
3/12
DG-087008
MODEL No.
GW5BNF15L10
3. Ratings and characteristics
3-1. Absolute maximum ratings
Item
Power dissipation *1
Forward current *1
Reverse Voltage
Operating temperature *2
Storage temperature
Symbol
P
IＦ
VR
Topr
Tstg
Rating
8.0
700
-15
-30～+90
-40～+100℃
Unit
W
ｍＡ
V
℃
℃
*1 Power dissipation and forward current are the value when the module temperature
is set lower than the rating by using an adequate heat sink.
*2 Operating temperature is fixed to the temperature of module's external part.
(Not an ambient temperature)
The derating curve in the next page is applied to the operating current.
3-2．Electro-optical characteristics
Item
Forward voltage
Tc＝25 ℃
Typ. Max. Unit
(10.2) 11.5
V
Symbol
VF
Condition
IF=640mA
Min.
8.5
φ
IF=640mA
260 （350）
Luminous Flux
*3
lm
0.316
0.324
(6000) 6500 (7000)
K
* ( ) is reference.
(*3) Monitored by 8 inch integrating sphere of Sharp Standards.
(After 20 ms drive) (Tolerance: ±15%)
(*4) Monitored by 8 inch integrating sphere of Sharp Standards
Measured by Otsuka electronics MODEL LE-3400
(After 20 ms drive) （Tolerance：x, y: ±0.02）
Chromaticity
*4
※ This specification is reference.
ｘ
ｙ
Tc
IF=640mA
-
Page
4/12
DG-087008
MODEL No.
Page
GW5BNF15L10
3-3. Derating Curve
Forward current IF [mA]
800
700
600
500
400
300
200
100
0
-40
-30
-20
-10
0
10
20
30
40
50
Forward current derating curve
60
70
*To keep case temperature lower than the rating, enough heat-radiation
performance needs to be secured by using an adequate heat sink.
To secure long-term life,use it by the current equal to or less than 640mA .
（Measuring point for case temperature）
measuring point
（Example of heat sink attachment）
（Thermal resistance）
Junction
①
Case
②
Ambient
①Thermal resistance： 4.5℃/W ＜Reference value＞
（Junction-Case)
②Thermal resistance ：Depends on performance of attached heat sink.
（Case-Atmosphere）
※ This specification is reference.
80
90
100
Case temperature Ｔｃ [℃]
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GW5BNF15L10
6/12
3-4. Characteristics Diagram
3-4-① High color renderring "BNH"type. (*1)
Forward current - Relative luminous flux
Forward current - Forward Voltage
Tc=25°C
Tc=25°C
12.0
Forward Voltage VF [V]
Relative luminous flux
120%
100%
80%
60%
40%
20%
0%
11.0
10.0
9.0
8.0
0
200
400
600
800
0
200
Forward current IF [mA]
800
Case temperature - Forward Voltage
120%
13.0
110%
12.0
Forward Voltage VF [V]
Relative luminous flux
600
Forward current IF [mA]
Case temperature - Relative luminous flux
100%
90%
80%
70%
60%
50%
-40
400
11.0
10.0
9.0
8.0
7.0
6.0
-20
0
20
40
60
80
100
-40
-20
Case temperature [°C]
0
20
40
60
80
100
80
100
Case temperature [°C]
Case tenperature - Chromaticity coordinate
Case temperature - Color temperature
7500
0.330
25°C
-30°
y
60°C
0.320
0.310
0.300
90°C
Color temperature [K]
0°C
7250
7000
6750
6500
6250
6000
0.304
0.308
0.312
0.316
-40
x
(*1)Above characteristics data are typical data and not a guaranteed data.
※ This specification is reference.
-20
0
20
40
60
Case temperature [°C]
DG-087008
MODEL No.
Page
GW5BNF15L10
7/12
4. Reliability
The reliability of products shall be satisfied with items listed below.
4-1. Test items and test conditions
No.
Test items
Confidence level: 90%
Test conditions
１ Temperature
-40 ℃(30 min)～+100 ℃(30 min), 30 times
cycle
２ High temp and high Ta*=+60℃, RH=90％, t=1,000h
humidity storage
３ High temperature
Ta*= +100℃, t=1,000h
storage
４ Low temperature
Ta*= -40 ℃, t=1000h
storage
５ Operating test
Tc=60 ℃，IF=640mA, t=1,000h
６ Mechanical shock
15,000 m/s2, 0.5 ms
test
±X･±Y･±Z direction, 3 times
７ Variable frequency
200 m/s2, 100～2,000～100 Hz / sweep for 4 min.
vibration
X･Y･Z direction, 4 times
4-2. Failure judgment criteria
No.
Parameter
Symbol
VF
１
Forward voltage
２
Luminous flux
Φ
※ This specification is reference.
Samples Defective LTPD
ｎ
Ｃ
（％）
11
0
20
11
0
20
11
0
20
11
0
20
11
0
20
5
0
50
5
0
50
Failure judgment criteria (*2)
VF ＞ U.S.L × 1.1
Φ＜Initial value × 0.5,Φ＞Initial value × 2.0
DG-087008
MODEL No.
Page
GW5BNF15L10
5. Incoming inspection
5-1. Inspection method
A single sampling plan, normal inspection S-4 based on ISO 2859-1 shall be adopted.
5-2. Description of inspection and criteria
No. Inspection items
1
2
3
4
Emission
Electro-optical
characteristics
Outline
dimensions
Appearance
No emission
Criteria
Defect
Major
defect
AQL
0.1%
Not conforming to the specification (Forward voltage,
Luminous flux and Chromaticity)
Not conforming to the specification
Minor
0.4%
（Outline dimensions of ①、② in page3）
defect
Nonconformity observed in product appearance is
determined as good product except that electro-optical
characteristics is affected by.
*Products with removable foreign material attached on is not determined to be defective.
※ This specification is reference.
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DG-087008
MODEL No.
Page
GW5BNF15L10
6．Supplement
6-1 Chromaticity coordinates
（Chromaticity table）
BN:High color
rendering 6500K
ｘ
ｙ
0.302
0.336
0.310
0.298
0.324
0.311
0.321
0.354
（Chromaticity coordinates）
0.36
0.35
0.34
y
0.33
0.32
0.31
0.30
0.29
0.30
0.31
0.32
x
※ This specification is reference.
0.33
9/12
DG-087008
MODEL No.
Page
GW5BNF15L10
10/12
6-2 Packing
・Amount in one box ： 400 (2 bags)
・Amount in one bag ： 200 (5 trays)
・Amount in one tray ： 40
・Putting 5 pieces of tray in a damp proofing packing bag and 2 bags in a box.
・Dimensions of the box: 235×220×90mm
(Packing form: Box）
200×2bags= 400
(Packing form: bag）
40×5trays= 200
(Packing form: Tray）
5×8= 40
*The packing dimensions are reference.
There is a case to become another packing specifications.
6-3．Label
The following label is put on the packing box.
SHARP CORPORATION
PART No. GW5BNF15L10
QUANTITY
500
LOT No.KA081A
<EIAJ C-3>MADE IN JAPAN
← Model number
← Quantity of products
← EIAJ C-3 Bar code
← EIAJ C-3 Bar code
← Lot number
← Production country
１）About Lot number
ＫＡ ０８ １ Ａ
① ② ③ ④
① Production plant code (to be indicated alphabetically)
② Year of production (the last two figures of the year)
③ Month of production
(to be indicated alphabetically with January
corresponding to A)
④ Date of production (01～31)
6-4．Indication to the product
Model No. and Control NO. are indicated on the substrate surface.
Indication contents are to be announced.
①
Model No.
Abbreviated Model No. "5BNF15L10" is indicated.
②
Control No.
Control No. is indicated as below;
Model No.
Ｍ ０８ Ｇ ０１
① ② ③ ④
① Production plant code (to be indicated alphabetically)
Control No.
② Year of production (the last two figures of the year)
③ Month of production (to be indicated alphabetically with January corresponding to A)
④ Date of production (01 to 31)
※ This specification is reference.
DG-087008
MODEL No.
GW5BNF15L10
Page
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7. Precautions
① Storage conditions
Please follow the conditions below.
・Before opened： Temperature 5～30℃, humidity less than 60%RH
・After opened： Temperature 5～30℃, humidity less than 60%RH (Please apply soldering within 1 week.)
・Avoid exposing to air with corrosive gas.
If exposed, electrode surface would be damaged, which may affect soldering.
② Usage conditions
The products are not designed for the use under any of the following conditions.
Please confirm their performance and reliability well enough if you use under any of the following conditions;
・ In a place with a lot of moisture, dew condensation, briny air, and corrosive gas
(Cl, H2S, NH3, SO2, NOX, etc.).
・Under the direct sunlight, outdoor exposure, and in a dusty place.
・In water, oil, medical fluid, and organic solvent.
③ Heat radiation
If the forward current(IF) is applied to single-state module at 360mA, there is a risk of damaging module
or emitting smoke.
Equip with specified heat radiator, and avoid heat stuffed inside the module.
Applying thermal conductive sheet or grease between module and heat radiator enables heat to radiate effectively.
④ Installation
Material of board is alumina ceramic. If installed inappropriately, trouble of no radiation may occur due to
board crack. Please take particular notice of install method.
Further information on installation, refer to the following cautions.
・ Apply ether screws or adhesives, or both of them when installed to heat radiator.
In case of applying adhesive only, check the effectiveness before fixing.
In case of screw, apply thread locker in order to prevent loosening.
If LED comes off from the heat radiator, unusual temperature rise entails hazardous phenomena including
device deterioration, coming off of solder at leads, and emitting smoke.
・ Refer to recommended dimensions when installing with screws.
・ Screw torque: Within 0.2Nｍ
If it is inefficient to tighten screws, apply locker to prevent loosening.
・ It is recommended to apply screws which use low corrosive materials such as Stainless steel.
Avoid applying flat-head screws, which cause board crack due to applying stress to screw holes.
・ Avoid convexly uneven boards.
Those convex boards are subject to crack when tightening screws.
・ It is recommended to apply thermal conductive sheet or grease with adhesiveness and heat radiatingadhesives, because of thermal and mechanical combination between module and heat radiator.
However, depending on their thickness, board crack may be entailed by warped board, which is
caused when tightening screws. So please check your actual conditions carefully as for the screw torque.
※ This specification is reference.
DG-087008
MODEL No.
GW5BNF15L10
Page
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⑤ Module surface strength
Module surface is subject to mechanical stress. Applying stress to surface of modules results in damage on resin,
and inside-failure.
⑥ Connecting method
In case of solder connecting method, apply solder to the leads
by soldering iron with thermo controller (tip temperature 380℃), within 10seconds per one place.
Put the board on materials whose conductivity is poor enough not to radiate heat of soldering.
Avoid touching yellow phosphor with soldering iron.
This product is not designed for reflow and flow soldering.
⑦ Static electricity
This product is subject to static electricity, so take measures to cope with it.
Install circuit protection device to drive circuit, if necessary.
⑧ Drive method
Module is composed of LEDs connected in both series and parallel. Constant voltage power supply
runs off more than specified current amount due to lowered VF caused by temperature rise.
Constant current power supply is recommended to drive.
Any reverse voltage cannot be applied to LEDs when they are in operation or not.
Design a circuit so that any flow of reverse or forward voltage can not be applied to LEDs when they are
out of operation.
⑨ Cleaning
Avoid cleaning, since silicone resin is eroded by it.
⑩ Color-tone variation
Chromaticity of this product is monitored by integrating sphere right after the operation.
Chromaticity varies depending on measuring method, light spread condition, or ambient temperature.
Please verify your actual conditions before use.
⑪ Safety
Looking directly at LEDs for a long time may result in hurt your eyes.
In case that excess current(over ratings) are supplied to the device, hazardous phenomena including abnormal
heat generation, emitting smoke, or catching fire can be caused.
Take appropriate measures to excess current and voltage.
In case of solder connecting method, there is a possibility of fatigue failure by heat.
Please fix the leads in such case to protect from short circuit or leakage of electricity caused by contact.
Please confirm the safety standards or regulations of application devices.
※ This specification is reference.