SN11087 2003/7/8 ver 0.3 SN11087 Second Generation USB1.1 Flash Memory Controller Version 0.3 2003/7/8 1 General Description SN11087 is a high-performance integrated circuit to access the NAND type Flash memory via the USB 1.1 bus. It provides a flexible and cost efficient single chip solution for external storage applications such as USB Disk (Flash Disk). With the capability to be pin-to-pin compatible to SN11085, the current user of SN11085 can easily upgrade to SN11087 with no engineering effort needed at all. With all the features inherited from SN11085/086 like the low 6MHz system clock to reduce the EMI, the embedded translation table to eliminate the cost of external memory, the Sonix proprietary randomization algorithm to extend the lifetime of flash memory and ensure the product robustness, and the real time ECC correction function, the SN 11087 adds several other unique features to reduce the cost of the end product and meet the customer’s requirements. To enrich the product line of the OEM manufacture, with the ability to support 8 pieces of flash memories and the new types of 2G bits flashes, SN11087 can be used to build up a storage device up to 2 Giga bytes. To reduce the total cost of the end product, SN11087 incorporates a power MOS inside to meet the current requirement (500 uA) in USB suspend state. The usage of EEPROM can also now be eliminated by the capability to program the customized vendor/product ID/string in the flash itself. Therefore, the total cost is reduced by upgrade from SN11085 to SN11087. For fulfilling different customers’ needs, SN11087 now provides several ways to build different end products. The first one is to provide different security functions. The OEM manufacturers can program one of the two ways in manufacturing via software. The flashing ways of LED can also be selected by software now. The pin 35 of SN11087 is now used to support new security feature. The original two security features provided in SN11085/86 still 1 SN11087 2003/7/8 ver 0.3 exist. The customers can select any one of them during the mass production stage, making production much easier. With these flexibilities, the manufacturers can easily build different products by using exactly the same components. The only place needs to be changed on PCB is pin 35. The USB Mass Storage Class compliance capability of SN11087 makes it a truly “plug-and-play” device without vendor drivers under Windows 2000/ME/XP and Mac OS 9/10. SN11087 also provides PC boot up and data security function that exact the same as a floppy disk (1.44M), which makes it an ideal replacement for the legacy floppy disk. 2 Features USB 1.1 12 MHz full-speed compatible USB 1.1 Mass Storage Class compliant USB Mass Storage Class Bulk-Only Transport 1.0 supported USB Mass Storage Class SCSI transparent command set supported Low system clock (6MHz) to reduce EMI Customized VID, PID, serial number, and 28 characters of Vendor/Product/Revision string supported within flash or external EEPROM. EEPROM in system programmable (ISP) capability Support Samsung and Toshiba NAND-type flash memory, from 32Mbits to 1Gbits Support new type of Samsung NAND type flash memory, from 1Gbits to 4Gbits Real-time ECC correction circuit for data integrity and memory access speed acceleration Embedded SRAM for logical-to-physical address translation to extend the life time of NAND-type flash Support up to 8 NAND type flash memories are supported Support up to 2 Gbytes of disk capacity Embedded FIFO for upstream and downstream data transfer Built-in power MOS to meet USB suspend requirement (500 uA) Data transfer rate up to 1.5 MB/s (burst), 1.1 MB/s (read average) LED indicator pin Three modes of LED flashing patterns can be selected Five speed of LED flashing speed provided 2 SN11087 2003/7/8 ver 0.3 PC boot up capability (host BIOS with USB boot up support is necessary) Flash disk security function provided, up to 16 characters of password for high sensitive data protection from illegally access Three types of security functions can be selected ROM-type flash disk capability provided (permanent write protect) No Driver needed under Microsoft Windows ME/2000/XP, Mac OS 9.x/10.x Sonix Driver for Microsoft Windows 98 Sonix mass production tool available for mass production Sonix security program available Sonix bonus programs available Single 3.3V operation 48 pin LQFP package 3 SN11087 2003/7/8 ver 0.3 35 AVDD VDDIN VDDOUT FLP OWER GP IO 0 RO MCS GND VDD ROMS K ROMDI RO MDO GP IO 1 FLWP S W 3. Pin Assignment 25 30 XOUT AVS S XIN DP LUS NC DMINUS TE S T 40 FLCE8 20 RS TN FLCE6 LED1 FLCE4 FLCE7 FLCE2 FLCE5 FLD4 FLCE3 45 FLD5 15 FLD3 FLCE1 FLCLE VDD VDD GND FLALE FLRE FLWE FLRB FLWP 10 FLD0 FLD1 FLD7 FLD2 5 FLD6 GND 1 Table 1 SN11087 pin list (red character is the pins different to SN11085) # pin name type drive special description 1 GND PWR 2 FLD6 DIO 24mA PD Flash memory I/O port bit 6 3 FLD2 DIO 24mA PD Flash memory I/O port bit 2 4 FLD7 DIO 24mA PD Flash memory I/O port bit 7 5 FLD1 DIO 24mA PD Flash memory I/O port bit 1 6 FLD0 DIO 24mA PD Flash memory I/O port bit 0 7 FLWP DO 24mA Flash memory write protect 8 FLRB DI 9 FLWE DIO 24mA Flash memory write enable 10 FLRE DIO 24mA Flash memory read enable 11 FLALE DO 24mA Flash memory address latch enable Digital ground Flash memory ready/busy 4 SN11087 2003/7/8 ver 0.3 12 GND PWR Digital ground 13 VDD PWR Digital 3.3V 14 FLCLE DO 24mA Flash memory command latch enable 15 FLCE1 DO 8mA Flash memory chip enable 1 16 FLCE3 DO 8mA Flash memory chip enable 3 17 FLCE5 DO 8mA Flash memory chip enable 5 18 FLCE7 DO 8mA Flash memory chip enable 7 19 LED DIO 24mA PD LED lighter 20 RSTN DI PU Chip reset, connected to external RC circuit 21 TEST DI PD Test pin, NC in normal operation 22 GPIO1 DIO 8mA 23 XIN I - - Crystal input or oscillator input 24 XOUT O - - Crystal output or no connection 25 VDD PWR - Digital 3.3V 26 FLVDD PWR - 3.3V power to flash VDD Do Not Connect 27 FLPOWER DO 8mA OC Flash power control, connect to external MOS Needs to be pulled up externally. 28 GPIO0 DIO 8mA General Purpose Input/Output 0 for internal test Always pull up for normal operation 29 ROMCS DO 4mA Chip select for external EEPROM 30 GND PWR Digital ground 31 VDD PWR Digital 3.3V 32 ROMSK DO 4mA Clock for external serial EEPROM 33 ROMDI DO 4mA Serial data to external EEPROM 34 ROMDO DI 4mA Serial data from external EEPROM, pull up externally if no EEPROM is connected 35 GPIO1 DIO 8mA 36 FLWPSW DI PU General Purpose Input/Output 1. Pull up/down depends on operation modes Flash write protect switch 37 AVDD PWR Analog 3.3V 38 AVSS PWR Analog ground 39 DPLUS AIO - - USB D+ signal 40 DMINUS AIO - - USB D- signal 41 FLCE8 DO 8mA Flash memory chip enable 8 42 FLCE6 DO 8mA Flash memory chip enable 6 5 SN11087 2003/7/8 ver 0.3 43 FLCE4 DO 8mA Flash memory chip enable 4 44 FLCE2 DO 8mA Flash memory chip enable 2 45 FLD4 DIO 24mA PD Flash memory I/O port bit 4 46 FLD5 DIO 24mA PD Flash memory I/O port bit 5 47 FLD3 DIO 24mA PD Flash memory I/O port bit 3 48 VDD P - Digital 3.3V - Note: 1. P: power pin; AI: analog input pin, AIO: analog input/output pin; DI: digital input pin; DO: digital output pin; DIO: digital input/output pin. 2. TTL: TTL compatible input pin; PD: pull down; PU: pull up. 3. All pads are Schmitt triggered and with slew rate control 6 SN11087 2003/7/8 ver 0.3 3 Block diagram FIFO US B inte rfa ce logics S witch Ma trix fla s h me mory inte rfa ce logics S RAM S RAM CP U ROM 4 Functional description 5.1 Flash memory connection Up to 8 NAND type flash memories from Samsung or Toshiba can be connected to SN11087, the number of flash memory connected can be detected automatically upon power on. Each flash memory has its own chip enable control signal path (FLCE 1 to FLCE8). All flash memories connected to SN11087 must be of the same capacity, and it is suggested to connect them with concatenated ascending order from FLCE1 to FLCE8. There is no special rule for the number of flash memory. (e.g. not necessarily 7 SN11087 2003/7/8 ver 0.3 to be the multiples of 2 or 4). 5.2 VID/PID/SN and Strings format The default USB vendor ID, product ID and the strings for vendor name and product name can be changed by storing customized values into the flash or EEPROM. The serial number (defined in mass storage device class) can also be customized. It should be noted that the VID and PID values cannot be set to 0x0000 or 0xFFFF. The default vendor string of the SN11087 is “USB NAND”. The default product string is “FLASH DISK”. Therefore, the Windows will show “USB NAND FLASH DISK” when the default string is used. Upon power up, if 93C46 EEPROM is not detected and the flash doesn’t have VID/PID stored, default USB vendor ID (hex 0C45) and product ID (hex 1060) are returned to the host. The ROMDO pin must be pulled high when no EEPROM exists. The VID/PID/Serial number and vendor/product strings can be programmed through the mass production software provided by Sonix. The serial number format in the Mass Storage Class device descriptor is described in section 5.1.1.1 of the spec. If the manufacturers needs to have serial number, then the value of the highest two nibbles (nibble 1 and 2) of the serial number can not be 0xFF, or the serial number feature will be disabled. 5.3 Software support Sonix provides the following software to customers 1) Application software and driver for Win98/2000/Me/XP; boot up utility is included for Win98/Me 2) Mass production tool which provides the following function i) Flash memory format ii) File copy/compare for data validation iii) Copying files into the flash memory which are to be delivered with the flash disk iv) ISP of EEPROM (93C46) 8 SN11087 v) vi) 2003/7/8 ver 0.3 Customize USB VID/PID and strings into flash memory or EEPROM Disable the PC lock and security function 5 Operating rating and electrical characteristics 6.1 Absolute maximum rating Table 4 symbol parameter value unit Dvmin min digital supply voltage DGND – 0.3 V Dvmax max digital supply voltage DGND + 4.6 V Avmin min analog supply voltage AGND – 0.3 V Avmax max analog supply voltage AGND + 4.6 V Dvinout voltage on any digital input or output pin DGND –0.3 to 5.5 V Avinout voltage on any analog input or output pin AGND –0.3 to Avdd + 0.3 V Tstg storage temperature range -40 to +125 0 ESD (HBM) ESD human body mode 5000 V C C=100pF, R=1.5KΩ ESD (MM) ESD machine mode 200 V Ioff leakage current 10 uA Ilatch minimum latch up current 100 mA 6.2 Operation conditions Table 5 symbol parameter value unit DVdd digital supply voltage +3 to +3.6 V Avdd analog supply voltage +3 to +3.6 V TA operating ambient temperature range 0 to 70 0 TJ operating junction temperature range 0 to 115 0 9 C C SN11087 6.3 2003/7/8 ver 0.3 DC electrical characteristics Table 6 symbol parameter test condition value unit VDI USB differential input sensitivity | (D+) – (D-) | 0.2 (min) V VCM USB differential common mode range USB single ended receiver threshold Included range VDI 0.8 (min) 2.5 (max) 0.8 (min) 2.0 (max) V VSE V VIH high level input voltage 2.0 (min) V VIL low level input voltage 0.8 (max) V VOH high level output voltage IOH = -4 mA 2.3 (min) V VOL low level output voltage IOL= 4 mA 0.5 (max) V IIL low level input current VI = 0 V RSTN pin : - 50.0 (max) µA the other pins : - 3.0 (max) IIH high level input current VI = 3.6 V 3.0 (max) µA IDD input supply current 20 (max) mA Isuspend supply current in suspend 20 (max) µA 6.4 AC electrical characteristics 6.4.1 USB transceiver signal (full speed mode) Table 7 symbol parameter Tr min max unit transition rise time for DP or DM 4 20 ns Tf transition fall time for DP or DM 4 20 ns Trfm rise / fall time matching 90 110 % Vo(crs) signal crossover voltage 1.3 2.0 V 6.4.2 test condition (Tr / Tf ) * 100 Operation clocks Table 8 symbol parameter value 10 unit SN11087 USBCLKin 6.4.3 2003/7/8 ver 0.3 XI/XOUT crystal value 6 (typ) MHz USBCLKin duty cycle 50 ± 2 % External EEPROM interface Table 9 symbol parameter value unit Fsk ROMSK pin clock frequency 200 kHz 6.5 Power consumption Table 10 symbol parameter value unit Io_max Max current in operation 20 mA Is_max Max current in suspend mode TBD uA 11 SN11087 7. Packaging dimension 12 2003/7/8 ver 0.3 SN11087 2003/7/8 ver 0.3 Version Control 0.1 0.2 May-28-2003 June-08-2003 0.3 July-08-2003 first draft modified typing errors add descriptions for new features modified typing errors 13 SN11087 2003/7/8 ver 0.3 DISCLAIMER The information appearing in this publication is believed to be accurate. However, this publication could contain technical inaccuracies or typographical errors. The reader should not assume that this publication is error-free or that it will be suitable for any particular purpose. SONiX makes no warranty, express, statutory implied or by description in this publication or other documents which are referenced by or linked to this publication. In no event shall SONiX be liable for any special, incidental, indirect or consequential damages of any kind, or any damages whatsoever, including, without limitation, those resulting from loss of use, data or profits, whether or not advised of the possibility of damage, and on any theory o f liability, arising out of or in connection with the use or performance of this publication or other documents which are referenced by or linked to this publication. This publication was developed for products offered in Taiwan. SONiX may not offer the products discussed in this document in other countries. Information is subject to change without notice. Please contact SONiX or its local representative for information on offerings available. Integrated circuits sold by SONiX are covered by the warranty and patent indemnification provisions stipulated in the terms of sale only. The application circuits illustrated in this document are for reference purposes only. SONIX DISCLAIMS ALL WARRANTIES, INCLUDING THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PURPOSE. SONIX reserves the right to halt production or alter the specifications and prices, and discontinue marketing the Products listed at any time without notice. Accordingly, the reader is cautioned to verify that the data sheets and other information in this publication are current before placing orders. Products described herein are intended for use in normal commercial applications. Applications involving unusual environmental or reliability requirements, e.g. military equipment or medical life support equipment, are specifically not recommended without additional processing by SONIX for such application. 14