SONY CXG1024N

CXG1024N
High-Frequency SPDT Antenna Switch
For the availability of this product, please contact the sales office.
Description
The CXG1024N is a high power antenna switch
MMIC to connect TX/RX to one of 4 antennas. This
IC is designed using the Sony’s GaAs J-FET
process and operates at a single positive power
supply.
Features
• Single positive power supply operation
• Low insertion loss 0.4 dB (Typ.) at 1.0 GHz
(TX Port)
• Isolation
21 dB (Typ.) at 1.0 GHz
(TX Port)
• High power switching
P1 dB (Typ.)
32 dBm
at 1.5 GHz
VCTL (H)=3.0 V
35 dBm
at 1.5 GHz
VCTL (H)=4.0 V
16 pin SSOP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VDD
8
V
• Control voltage Vctl (H)–Vctl (L)
8
V
• Operating temperature Topr
–35 to +85
°C
• Storage temperature Tstg
–65 to +150 °C
• Input Power
Pin (RF2, RF3, RF4) 37
dBm
Pin (RF1, RF5, RF6) 30
dBm
Applications
Antenna switch for digital cellular telephones
Structure
GaAs J-FET MMIC
Function Block Diagram
Diversity Antenna 1
Diversity Antenna 2
Antenna 2
RX
Antenna 1
TX
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E96526-TE
CXG1024N
Pin Configuration and Recommended Circuit
16
1
100pF
RF1
100pF
RF6
CTLC
CTLD
CTLC
CTLD
VDD
GND
RF2
RF5
100pF
100pF
100pF
100PF
CTLB
100pF
100kΩ
GND
CTLB
GND
CTLA
CTLA
CTLA
100pF
100pF
RF3
100pF
RF4
CTLB
100kΩ
100pF
GND
GND
8
9
Logic Table
ON-Port
RF3–RF2
RF3–RF4
RF5–RF2
RF5–RF4
RF5–RF6
RF5–RF1
CTLA
H
L
L
H
L
L
CTLB
L
H
H
L
L
L
CTLC
H or L
H or L
L
L
L
H
CTLD
H or L
H or L
L
L
H
L
Min.
Typ.
Max.
6
Recommended Operating Conditions
Item
Control Voltage (high)
Control Voltage (low)
Difference of Control Voltage
Supply voltage
Symbol
Vctl (H)
Vctl (L)
Vctl (H)–Vctl (L)
VDD
–6
Vctl (H)–0.6
—2—
Vctl (H)–0.5
6
Vctl (H)–0.4
CXG1024N
Electrical Characteristics
Symbol
(Ta=25 °C)
Signal
Passes
RF3–RF2
RF3–RF4
RF5–RF2
Insertion Loss
RF5–RF1
RF5–RF6
ISO.
RF3–RF2
RF3–RF4
RF5–RF2
RF5–RF4
RF5–RF1
RF5–RF6
VSWR
1 dB
Compression
Power
∗2
Pin=30 dBm
∗2
Pin=20 dBm
IL.
RF5–RF4
Isolation
Test
Condition
VS.
RF3–RF2
RF3–RF4
RF5–RF2
RF5–RF4
RF5–RF1
RF5–RF6
RF3–RF2
RF3–RF4
P1 dB
RF5–RF2
RF5–RF4
RF5–RF1
RF5–RF6
∗2
Pin=20 dBm
∗2
Pin=20 dBm
∗2
Pin=30 dBm
∗2
Pin=20 dBm
∗2
Pin=30 dBm
∗2
Pin=20 dBm
∗3
∗2
∗1
∗3
∗2
∗1
Frequency
Min.
1 GHz
1.5 GHz
2 GHz
1 GHz
1.5 GHz
2 GHz
1 GHz
1.5 GHz
2 GHz
1 GHz
1.5 GHz
2 GHz
Typ.
Max.
Unit
0.4
0.5
0.7
0.5
0.65
0.9
0.6
0.75
1.2
0.4
0.5
0.7
0.65
0.8
1.0
0.8
0.95
1.2
0.9
1.05
1.5
0.7
0.8
1.0
dB
1 GHz
1.5 GHz
2 GHz
18
15
12
21
18
15
1 GHz
1.5 GHz
2 GHz
21
17
15
24
20
18
dB
0.1 to 2 GHz
1.3
1.5
0.1 to 2 GHz
1.3
1.5
1.5 GHz
1.5 GHz
1.5 GHz
1.5 GHz
1.5 GHz
1.5 GHz
0.1 to 2 GHz
30
33
35
22
25
27
32
35
37
24
27
29
dBm
Switching Time
tSW
Control Current
Ictl
∗2
100
Supply Current
IDD
∗2
100
∗1 : Vctl (H)=5 V, Vctl (L)=0 V, VDD=4.5 V
∗2 : Vctl (H)=4 V, Vctl (L)=0 V, VDD=3.5 V
∗3 : Vctl (H)=3 V, Vctl (L)=0 V, VDD=2.5 V
—3—
200
nsec
µA
µA
CXG1024N
Insertion Loss and Isolation vs. Frequency
(RF3–RF2, RF3–RF4)
0
0
0.4
–10
0.8
–20
Isolation [dB]
Insertion Loss [dB]
Insertion Loss
Isolation
1.2
–30
1.6
–40
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.7
3
Frequency [GHz]
Insertion Loss and Isolation vs. Frequency
(RF5–RF2, RF5–RF4)
0
0
Insertion Loss
–10
0.8
–20
Isolation [dB]
Insertion Loss [dB]
0.4
Isolation
1.2
–30
1.6
–40
0
0.3
0.6
0.9
1.2
1.5
1.8
Frequency [GHz]
—4—
2.1
2.4
2.7
3
CXG1024N
Insertion Loss and Isolation vs. Frequency
(RF5–RF1, RF5–RF6)
0
0
0.4
–10
0.8
–20
Isolation [dB]
Insertion Loss [dB]
Insertion Loss
Isolation
1.2
–30
1.6
–40
0
0.3
0.6
0.9
1.2
1.5
1.8
Frequency [GHz]
—5—
2.1
2.4
2.7
3
CXG1024N
Unit : mm
16PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
∗5.0 ± 0.1
0.1
16
9
A
1
+ 0.1
0.22 – 0.05
6.4 ± 0.2
∗4.4 ± 0.1
8
+ 0.05
0.15 – 0.02
0.65 ± 0.12
0.1 ± 0.1
0.5 ± 0.2
Package Outline
0° to 10°
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SSOP-16P-L01
LEAD TREATMENT
SOLDER / PALLADIUM
PLATING
EIAJ CODE
SSOP016-P-0044
LEAD MATERIAL
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.1g
JEDEC CODE
—6—