CXG1063TN High Power 2 × 4 Antenna Switch MMIC Description The CXG1063TN is a high power antenna switch MMIC. The CXG1063TN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1063TN to be operated with low voltage. Features • Low Control voltage • Low Insertion Loss: 16 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta = 25°C) • Control voltage Vctl 7 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 0.4dB (Typ.) @900MHz, 0.5dB (Typ.) @1.5GHz • Small Package: TSSOP-16pin • High Power Handling: PldB: 36dBm @VDD = Vctl (H) = 4V V °C °C Operating Condition (Ta = 25°C) Control voltage Vctl (H) – Vctl (L) = 2.5 to 6V Application 2 × 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC Pin Configuration Block Diagram RF1 RF1 9 CTLC 8 RF6 6 RF5 CTLD RF2 11 CTLB CTLA CTLA RF3 13 4 RF4 CTLB 9 8 RF6 GND 10 7 GND RF2 11 6 RF5 GND 12 5 GND RF3 13 4 RF4 GND 14 3 VDD CTLA 15 2 CTLB CTLC 16 1 CTLD • GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E98747-PS CXG1063TN Recommended Circuit 9 RF1 RF2 100pF 10 7 11 6 100pF RF3 100pF GND RF5 100pF 12 5 13 220kΩ 4 14 3 GND RF6 8 100pF GND RF4 100pF VDD 100pF 15 CTLA 1kΩ 100pF 1kΩ 100pF 2 16 CTLC CTLB 100pF 1kΩ 100pF 1kΩ 1 –2– CTLD CXG1063TN Electrical Characteristics (Ta = 25°C) Frequency Item RF3-RF2 RF3-RF4 Insertion loss RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 Isolation RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 889MHz to 960MHz 810MHz to 885MHz 889MHz to 960MHz 810MHz to 885MHz Min. Typ. Max. Unit Pin = 30dBm ∗1, ∗2 0.40 0.65 dB Pin = 10dBm ∗3 0.55 0.80 dB Pin = 10dBm ∗3 0.50 0.75 dB Condition Pin = 30dBm ∗1, ∗2 18 21 dB Pin = 10dBm ∗3 18 21 dB Pin = 10dBm ∗3 21 25 dB 810MHz to 960MHz VSWR 1.3 ACP (±50kHz) RF3-RF2 RF3-RF4 889MHz to 960MHz Pin = 30dBm ∗1, ∗2, ∗4 –65 –60 dBc ACP (±100kHz) RF3-RF2 RF3-RF4 889MHz to 960MHz Pin = 30dBm ∗1, ∗2, ∗4 –70 –65 dBc 2nd, 3rd harmonics RF3-RF2 RF3-RF4 889MHz to 960MHz Pin = 30dBm ∗1, ∗2, ∗4 –65 –60 dBc ∗1 20 60 µA ∗2 15 50 µA ∗3 15 50 µA ∗1 40 90 µA ∗2 25 70 µA ∗3 25 70 µA Control current Ictl (H) Bias current IDD 200 Switching speed ∗1 ∗2 ∗3 ∗4 Vctl (L) = 0V, Vctl (H) = 4V, VDD = 4V Vctl (L) = –2.5V, Vctl (H) = 3V, VDD = 3V Vctl (L) = 0V, Vctl (H) = 3V, VDD = 3V Input signal: ACP (±50kHz) < –65dBc, ACP (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd harmonics < –65dBc –3– ns CXG1063TN Electrical Characteristics (Ta = 25°C) Frequency Item RF3-RF2 RF3-RF4 Insertion loss RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 RF3-RF2 RF3-RF4 Isolation RF5-RF2 RF5-RF4 RF5-RF1 RF5-RF6 1429MHz to 1453MHz 1477MHz to 1501MHz 1429MHz to 1453MHz 1477MHz to 1501MHz Min. Typ. Max. Unit Pin = 30dBm ∗1, ∗2 0.50 0.75 dB Pin = 10dBm ∗3 0.65 0.90 dB Pin = 10dBm ∗3 0.60 0.8 dB Condition Pin = 30dBm ∗1, ∗2 15 18 dB Pin = 10dBm ∗3 15 18 dB Pin = 10dBm ∗3 17 21 dB 1429MHz to 1501MHz VSWR 1.3 ACP (±50kHz) RF3-RF2 RF3-RF4 1429MHz to 1453MHz Pin = 30dBm ∗1, ∗2, ∗4 –65 –60 dBc ACP (±100kHz) RF3-RF2 RF3-RF4 1429MHz to 1453MHz Pin = 30dBm ∗1, ∗2, ∗4 –70 –65 dBc 2nd, 3rd harmonics RF3-RF2 RF3-RF4 1429MHz to 1453MHz Pin = 30dBm ∗1, ∗2, ∗4 –65 –60 dBc ∗1 20 60 µA ∗2 15 50 µA ∗3 15 50 µA ∗1 40 90 µA ∗2 25 70 µA ∗3 25 70 µA Control current Ictl (H) Bias current IDD Switching speed ∗1 ∗2 ∗3 ∗4 200 Vctl (L) = 0V, Vctl (H) = 4V, VDD = 4V Vctl (L) = –2.5V, Vctl (H) = 3V, VDD = 3V Vctl (L) = 0V, Vctl (H) = 3V, VDD = 3V Input signal: ACP (±50kHz) < –65dBc, ACP (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd Harmonics < –65dBc –4– ns CXG1063TN Unit: mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 S 2.05 A 16 B 0.08 S X2 9 0.2 S A B 0.1 ± 0.05 (3.0) 3.9 2.9 0.1 X 0.25 0.1 X 8 X4 0.1 0.5 S A B 0.45 ± 0.1 1 0° to 8° 0.08 M S A B 0.2 ± 0.02 + 0.036 0.22 – 0.03 DETAIL B 0.1 ± 0.01 + 0.026 0.12 – 0.02 Package Outline PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.03g SONY CODE TSSOP-16P-L01 –5–