CXG1060N High-Frequency SPDT Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1060N is a high power antenna switch MMIC to connect TX/RX to one of 4 antennas. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply. Features • Single positive power supply operation • Low insertion loss 0.4 dB (Typ.) at 1.0 GHz (TX Port) • Isolation 21 dB (Typ.) at 1.0 GHz (TX Port) • High power switching P1 dB (Typ.) 32 dBm at 1.5 GHz VCTL (H)=3.0 V 35 dBm at 1.5 GHz VCTL (H)=4.0 V 16 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VDD 8 V • Control voltage Vctl (H)–Vctl (L) 8 V • Operating temperature Topr –35 to +85 °C • Storage temperature Tstg –65 to +150 °C • Input Power Pin (RF2, RF3, RF4) 37 dBm Pin (RF1, RF5, RF6) 30 dBm Applications Antenna switch for digital cellular telephones (PDC 1.5 GHz) Structure GaAs J-FET MMIC Function Block Diagram Diversity Antenna 1 Diversity Antenna 2 Antenna 2 RX Antenna 1 TX Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96Z30-TE CXG1060N Pin Configuration and Recommended Circuit 16 1 100pF RF1 100pF RF6 CTLC CTLD CTLC CTLD VDD GND RF2 RF5 100pF 100pF 100pF 100PF CTLB 100pF 100kΩ GND CTLB GND CTLA CTLA CTLA 100pF 100pF RF3 100pF RF4 CTLB 100kΩ 100pF GND GND 8 9 Logic Table ON-Port RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF6 RF5–RF1 CTLA H L L H L L CTLB L H H L L L CTLC H or L H or L L L L H CTLD H or L H or L L L H L Min. Typ. Max. 6 Recommended Operating Conditions Item Control Voltage (high) Control Voltage (low) Difference of Control Voltage Supply voltage Symbol Vctl (H) Vctl (L) Vctl (H)–Vctl (L) VDD –6 Vctl (H)–0.6 —2— Vctl (H)–0.5 6 Vctl (H)–0.4 CXG1060N Electrical Characteristics Item Symbol (Ta=25 °C) Signal Passes RF3–RF2 RF3–RF4 RF5–RF2 Insertion Loss RF5–RF1 RF5–RF6 ISO. RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 VSWR 1 dB Compression Power ∗2 Pin=30 dBm ∗2 Pin=20 dBm IL. RF5–RF4 Isolation Test Condition VS. RF3–RF2 RF3–RF4 RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 RF3–RF2 RF3–RF4 P1 dB RF5–RF2 RF5–RF4 RF5–RF1 RF5–RF6 ∗2 Pin=20 dBm ∗2 Pin=20 dBm ∗2 Pin=30 dBm ∗2 Pin=20 dBm ∗2 Pin=30 dBm ∗2 Pin=20 dBm ∗3 ∗2 ∗1 ∗3 ∗2 ∗1 Frequency Min. 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz 1 GHz 1.5 GHz 2 GHz Typ. Max. Unit 0.4 0.5 0.7 0.5 0.65 0.9 0.6 0.75 1.2 0.4 0.5 0.7 0.65 0.8 1.0 0.8 0.95 1.2 0.9 1.05 1.5 0.7 0.8 1.0 dB 1 GHz 1.5 GHz 2 GHz 18 15 12 21 18 15 1 GHz 1.5 GHz 2 GHz 21 17 15 24 20 18 dB 0.1 to 2 GHz 1.3 1.5 0.1 to 2 GHz 1.3 1.5 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 1.5 GHz 0.1 to 2 GHz 30 33 35 22 25 27 32 35 37 24 27 29 dBm Switching Time tSW Control Current Ictl ∗2 100 Supply Current IDD ∗2 100 ∗1 : Vctl (H)=5 V, Vctl (L)=0 V, VDD=4.5 V ∗2 : Vctl (H)=4 V, Vctl (L)=0 V, VDD=3.5 V ∗3 : Vctl (H)=3 V, Vctl (L)=0 V, VDD=2.5 V —3— 200 nsec µA µA CXG1060N Insertion Loss and Isolation vs. Frequency (RF3–RF2, RF3–RF4) 0 0 0.4 –10 0.8 –20 Isolation [dB] Insertion Loss [dB] Insertion Loss Isolation 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3 Frequency [GHz] Insertion Loss and Isolation vs. Frequency (RF5–RF2, RF5–RF4) 0 0 Insertion Loss –10 0.8 –20 Isolation [dB] Insertion Loss [dB] 0.4 Isolation 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 Frequency [GHz] —4— 2.1 2.4 2.7 3 CXG1060N Insertion Loss and Isolation vs. Frequency (RF5–RF1, RF5–RF6) 0 0 0.4 –10 0.8 –20 Isolation [dB] Insertion Loss [dB] Insertion Loss Isolation 1.2 –30 1.6 –40 0 0.3 0.6 0.9 1.2 1.5 1.8 Frequency [GHz] —5— 2.1 2.4 2.7 3 CXG1060N Unit : mm 16PIN SSOP (PLASTIC) + 0.2 1.25 – 0.1 ∗5.0 ± 0.1 0.1 16 9 A 1 + 0.1 0.22 – 0.05 6.4 ± 0.2 ∗4.4 ± 0.1 8 + 0.05 0.15 – 0.02 0.65 ± 0.12 0.1 ± 0.1 0.5 ± 0.2 Package Outline 0° to 10° DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SSOP-16P-L01 LEAD TREATMENT SOLDER / PALLADIUM PLATING EIAJ CODE SSOP016-P-0044 LEAD MATERIAL COPPER / 42 ALLOY PACKAGE WEIGHT 0.1g JEDEC CODE —6—