CXG1016N High-Frequency SPDT Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1016N is a high power antenna switch MMIC. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply Features • Single positive power supply operation • Low insertion loss 0.45 dB (Typ.) at 1.5 GHz • Isolation 20 dB (Typ.) at 1.5 GHz • High power switching P1 dB (Typ.) 33 dBm at 1.5 GHz VCTL (H)=3.0 V 37 dBm at 1.5 GHz VCTL (H)=4.0 V Applications Antenna switch for digital cellular telephones 8 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Control voltage Vctl 7 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition • Control voltage 0/4 V °C °C V Structure GaAs J-FET MMIC Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E96525-TE CXG1016N Electrical Characteristics VCTL (L)=0 V, VCTL (H)=4 V, PIN=32 dBm, REF=75 kΩ Item Insertion Loss Isolation Insertion Loss Isolation Insertion Loss Isolation VSWR Switching Time Symbol IL1 ISO1 IL1.5 ISO1.5 IL2 ISO2 VSWR TSW (Ta=25 °C) Test Condition Min. f=1.0 GHz 20 f=1.5 GHz 17 14 f=2.0 GHz Typ. 0.4 23 0.45 20 0.5 17 Max. 0.7 0.75 0.8 1.5 100 ns VCTL (L)=0 V, f=2 GHz Item 1 dB Compression Point 1 dB Compression Point (Ta=25 °C) Symbol P1 dB (3) P1 dB (4) Min. 31 35 Test Condition VCTL (H)=3 V VCTL (H)=4 V Typ. 33 37 Max. VCTL (L)=0 V, RRF=75 kΩ Item Control Current Control Current Control Current Unit dB dB dB dB dB dB Unit dBm dBm (Ta=25 °C) Symbol ICTL (1) ICTL (2) ICTL (3) Test Condition VCTL (H)=3 V VCTL (H)=4 V VCTL (H)=5 V Block Diagram Min. Typ. 120 170 250 Max. 170 220 300 Package Outline/Pin Configuration Port3 Port1 Port2 CTLB 1 8 Port3 Port1 2 7 GND GND 3 6 GND CTLA 4 5 Port2 8pin SSOP (PLASTIC) VCTLA VCTLB High Low Low High Port1-Port2 ON Port1-Port3 OFF Port1-Port2 OFF Port1-Port3 ON —2— Unit µA µA µA CXG1016N Recommended Circuit 100pF CTLB 1 Port3 8 100pF 75kΩ Port1 2 7 100pF CXG1016N 3 6 100pF CTLA 4 5 100pF 75kΩ Example of Representative Characteristics (Ta=25 °C) AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA AAAAAAAAAAAA Insertion Loss and Isolation vs. Input Power 0 0 Insertion Loss VCTL (H)=5V VCTL (H)=4V VCTL (H)=3V -2 VCTL (H)=3V VCTL (H)=4V VCTL (H)=5V -20 Isolation -30 @1.5GHZ 24 28 32 36 40 44 Input Power [dBm] Insertion Loss and Isolation vs. Frequency 0 0 -10 -2 -20 Isolation -3 -30 -4 -40 -50 1 2 Frequency [GHz] —3— 3 -50 Isolation [dB] Insertion Loss -1 Isolation [dB] -10 -6 Insertion Loss [dB] Insertion Loss [dB] -4 Port2 CXG1016N Unit : mm 8PIN SSOP (PLASTIC) + 0.2 1.25 – 0.1 ∗3.0 ± 0.1 0.1 8 5 A 6.4 ± 0.2 ∗4.4 ± 0.1 4 1 0.65 + 0.08 0.24 – 0.07 0.25 0.13 M (0.5) + 0.08 0.24 – 0.07 (0.22) 0.6 ± 0.15 0.1 ± 0.05 B 0° to 10° (0.15) + 0.025 0.17 – 0.015 Package Outline DETAIL A DETAIL B NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SSOP-8P-L01 LEAD TREATMENT SOLDER / PALLADIUM PLATING EIAJ CODE SSOP008-P-0044 LEAD MATERIAL COPPER ALLOY PACKAGE WEIGHT 0.04g JEDEC CODE —4—