SONY CXP750097

CXP750096/750010
CXP750097/750011
CMOS 8-bit Single Chip Microcomputer
Description
The CXP750096/750010, CXP750097/750011 are the
CMOS 8-bit single chip microcomputer integrating on a
single chip an A/D converter, serial interface, timer/
counter, time-base timer, on-screen display function, I2C
bus interface, PWM output, remote control reception
circuit, HSYNC counter, watchdog timer, 32kHz timer/
counter besides the basic configurations of 8-bit CPU,
ROM, RAM, I/O ports.
The CXP750096/750010, CXP750097/750011 also
provide a sleep function that enables to lower the power
consumption.
64 pin SDIP (Plastic)
64 pin QFP (Plastic)
52 pin SDIP (Plastic)
Features
• A wide instruction set (213 instructions) which covers
various types of data
– 16-bit operation/multiplication and division/
Boolean bit operation instructions
• Minimum instruction cycle
167ns at 24MHz operation
122µs at 32kHz operation
• Incorporated ROM 96K bytes (CXP750096/750097)
120K bytes (CXP750010/750011)
• Incorporated RAM 2496 bytes
(Excludes VRAM for on-screen display)
• Peripheral functions
Structure
– A/D converter
8-bit 6-channel successive approximation method
Silicon gate CMOS IC
(Conversion time of 3.25µs at 16MHz)
– Serial interface
8-bit clock sync type, 1 channel
– Timer
8-bit timer
8-bit timer/counter
19-bit time-base timer
32 kHz timer/counter
– On-screen display (OSD) function
24 × 32 dots, 512 character types,
15 character colors, 2 lines × 32 characters,
frame background 8 colors/ half blanking,
background on full screen 15 colors/ half blanking
edging/ shadowing/ rounding for every line,
background with shadow for every character, double scanning,
sprite OSD,
24 × 32 dots, 1 screen, 8 colors for every dot
– I2C bus interface
– PWM output
8 bits, 8 channels
14 bits, 1 channel
– Remote control reception circuit
8-bit pulse measurement counter, 6-stage FIFO
– HSYNC counter
2 channels
– Watchdog timer
• Interruption
13 factors, 13 vectors, multi-interruption possible
• Standby mode
Sleep
• Package
64-pin plastic SDIP/QFP, 52-pin plastic SDIP
• Piggyback/evaluator
CXP750000 64-pin ceramic PQFP/PSDIP (Supports custom font)
Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components
in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E98767-PS
HSYNC COUNTER 1
ON SCREEN
DISPLAY
XLC
EXLC
R
G
B
I
YS
YM
HSYNC
VSYNC
HS1
8-BIT TIMER 1
TO
HSYNC COUNTER 0
8-BIT TIMER/
COUNTER 0
EC
HS0
SERIAL INTERFACE
UNIT
SI
SO
SCK
FIFO
2
2
I2C BUS
INTERFACE UNIT
SDA0
REMOCON
INTERRUPT CONTROLLER
INT0
INT1
INT2
SDA1
RMC
SCL0
A/D CONVERTER
6CH
SCL1
6
2
ADJ
AN0 to AN5
8 (6)
VDD
VSS
RST
EXTAL
XTAL
TX
14 BITS PWM 1CH
RAM
2496 BYTES
CLOCK GENERATOR
/SYSTEM CONTROL
TEX
8 BITS PWM 8CH (6CH)
32kHz
TIMER/COUNTER
WATCHDOG TIMER
PRESCALER/
TIME-BASE TIMER
ROM
96K/120K BYTES
SPC700 CPU CORE
PWM0 to PWM7
–2–
PWM
PORT A
PORT B
PORT C
PORT D
PC0 to PC5∗
PC6, PC7∗
6
2
PE2, PE3
PE4 to PE6
PF0 to PF7
2
3
8
5
Asterisks indicate pins missing from 52-pin
models.Parentheses indicate configurations
for 52-pin models.
PG3 to PG6∗, PG7
PE0, PE1
PD0 to PD7
PB0 to PB7
8
8
PA0 to PA7
8
2
PORT E
PORT F
PORT G
Block Diagram
CXP750096/750010, CXP750097/750011
CXP750096/750010, CXP750097/750011
Pin Assignment (Top View) 64-pin SDIP
PC3
1
64
PC4
PC2
2
63
PC5
PC1
3
62
PC6/PWM6
PC0
4
61
PC7/PWM7
EC/PD7
5
60
PF0/PWM0
RMC/PD6
6
59
PF1/PWM1
HS1/PD5
7
58
PF2/PWM2
HS0/PD4
8
57
PF3/PWM3
SI/PD3
9
56
PF4/SCL0
SO/PD2
10
55
PF5/SCL1/PWM4
SCK/PD1
11
54
PF6/SDA0
INT2/PD0
12
53
PF7/SDA1/PWM5
HSYNC/PA7
13
52
PE0/TO/ADJ
VSYNC/PA6
14
51
PE1/PWM
RST
15
50
PE2/TEX/INT0
VSS
16
49
PE3/TX
XTAL
17
48
VSS
EXTAL
18
47
VDD
PA5/AN5
19
46
NC
PA4/AN4
20
45
EXLC
PA3/AN3
21
44
XLC
PA2/AN2
22
43
PE4/YM
PA1/AN1
23
42
PE5/YS
PA0/AN0
24
41
PE6/I
PB7
25
40
B
PB6
26
39
G
PB5
27
38
R
PB4
28
37
PB0
PB3
29
36
PB1
INT1/PG7
30
35
PB2
PG6
31
34
PG3
PG5
32
33
PG4
Note)
1. NC (Pin 46) is left open.
2. Vss (Pins 16 and 48) are both connected to GND.
–3–
CXP750096/750010, CXP750097/750011
PF2/PWM2
PF1/PWM1
PF0/PWM0
PC7/PWM7
PC6/PWM6
PC5
PC4
PC3
PC1
PC2
PC0
PD7/EC
PD6/RMC
Pin Assignment (Top View) 64-pin QFP
64 63 62 61 60 59 58 57 56 55 54 53 52
HS1/PD5
1
51
PF3/PWM3
HS0/PD4
2
50
PF4/SCL0
SI/PD3
3
49
PF5/SCL1/PWM4
SO/PD2
4
48
PF6/SDA0
SCK/PD1
5
47
PF7/SDA1/PWM5
INT2/PD0
6
46
PE0/TO/ADJ
HSYNC/PA7
7
45
PE1/PWM
VSYNC/PA6
8
44
PE2/TEX/INT0
RST
9
43
PE3/TX
VSS
10
42
VSS
XTAL
11
41
VDD
EXTAL
12
40
NC
PA5/AN5
13
39
EXLC
PA4/AN4
14
38
XLC
PA3/AN3
15
37
PE4/YM
PA2/AN2
16
36
PE5/YS
PA1/AN1
17
35
PE6/I
PA0/AN0
18
34
B
PB7
19
33
G
R
PB0
PB1
PB2
PG3
PG4
PG5
PG6
PB3
INT1/PG7
PB4
PB5
PB6
20 21 22 23 24 25 26 27 28 29 30 31 32
Note)
1. NC (Pin 40) is left open.
2. Vss (Pins 10 and 42) are both connected to GND.
–4–
CXP750096/750010, CXP750097/750011
Pin Assignment (Top View) 52-pin SDIP
1
52
PF0/PWM0
RMC/PD6
2
51
PF1/PWM1
HS1/PD5
3
50
PF2/PWM2
HS0/PD4
4
49
PF3/PWM3
SI/PD3
5
48
PF4/SCL0
SO/PD2
6
47
PF5/SCL1/PWM4
SCK/PD1
7
46
PF6/SDA0
EC/PD7
INT2/PD0
8
45
PF7/SDA1/PWM5
HSYNC/PA7
9
44
PE0/TO/ADJ
VSYNC/PA6
10
43
PE1/PWM
RST
11
42
PE2/TEX/INT0
VSS
12
41
PE3/TX
XTAL
13
40
VSS
EXTAL
14
39
VDD
PA5/AN5
15
38
NC
PA4/AN4
16
37
EXLC
PA3/AN3
17
36
XLC
PA2/AN2
18
35
PE4/YM
PA1/AN1
19
34
PE5/YS
PA0/AN0
20
33
PE6/I
PB7
21
32
B
PB6
22
31
G
PB5
23
30
R
PB4
24
29
PB0
PB3
25
28
PB1
INT1/PG7
26
27
PB2
Note)
1. NC (Pin 38) is left open.
2. Vss (Pins 12 and 40) are both connected to GND.
–5–
CXP750096/750010, CXP750097/750011
Pin Description
I/O
Symbol
PA0/AN0
to
PA5/AN5
I/O/
Analog input
PA6/VSYNC
I/O/Input
PA7/HSYNC
I/O/Input
PB0 to PB7
I/O
Description
(Port A)
8-bit I/O port.
I/O can be set in a
unit of single bits.
(8 pins)
Analog inputs to A/D converter.
(6 pins)
OSD display vertical sync signal input.
OSD display horizontal sync signal input.
(Port B)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
(Port C)
Lower 6 bits are I/O ports; I/O can be set in a unit of single bits. Upper
2 bits are output port and large current (12mA) N-channel open drain
output. Upper 2 bits are medium drive voltage (12V); lower 6 bits are
5V drive.
(8 pins)
8-bit PWM output.
(2 pins)
PC0 to PC5∗
I/O
PC6/PWM6∗ to
PC7/PWM7∗
Output/Output
PD0/INT2
I/O/Input
PD1/SCK
I/O/I/O
PD2/SO
I/O/Output
PD3/SI
I/O/Input
PD4/HS0
I/O/Input
PD5/HS1
I/O/Input
PD6/RMC
I/O/Input
Remote control reception circuit input.
PD7/EC
I/O/Input
External event input for timer/counter.
PE0/TO/ADJ
I/O/Output/
Output
Rectangular wave output
for 8-bit timer/counter.
PE1/PWM
I/O/Output
PE2/TEX/INT0
Input/Input/
Input
PE3/TX
Input/Output
PE4/YM
Output/Output
PE5/YS
Output/Output
PE6/I
Output/Output
B
Output
G
Output
R
Output
External interruption request input. Active at the
falling edge.
(Port D)
8-bit I/O port. I/O
can be set in a
unit of single bits.
Can drive 12mA
synk current.
(8 pins)
(Port E)
Bits 0 and 1 are I/O
port; I/O can be set
in a unit of single.
Bits 2 and 3 are
input port. Bits 4, 5
and 6 are output
port.
(7 pins)
Serial clock I/O.
Serial data output.
Serial data input.
HSYNC counter (CH0) input.
HSYNC counter (CH1) input.
14-bit PWM output.
External interruption
Connects a crystal for
request input. Active at
32kHz timer/counter
the falling edge.
clock oscillation. When
used as an event
counter, input to TEX pin and leave TX pin open.
OSD display 6-bit output.
(6 pins)
∗ Not incorporated for Pin 52 package.
–6–
TEX oscillation
frequency dividing output.
CXP750096/750010, CXP750097/750011
Symbol
I/O
Description
(Port F)
8-bit output port
and large current
(12mA) N-channel
open drain output.
Lower 4 bits are
medium drive
voltage (12V); upper
4 bits are 5V drive.
(8 pins)
8-bit PWM output.
(4 pins)
PF0/PWM0 to
PF3/PWM3
Output/Output
PF4/SCL0
Output/I/O
PF5/SCL1/
PWM4
Output/I/O/
Output
PF6/SDA0
Output/I/O
PF7/SDA1/
PWM5
Output/I/O/
Output
PG3 to PG6∗
I/O
PG7/INT1
I/O/Input
EXTAL
Input
XTAL
Output
Connects a crystal for system clock oscillation. When a clock is
supplied externally, input to EXTAL pin and input a reversed phase
clock to XTAL pin.
RST
Input
System reset; active at Low level.
EXLC
Input
XLC
Output
OSD display clock oscillation I/O. Oscillation frequency is determined
by the external L and C.
I2C bus interface transfer clock I/O.
(2 pins)
8-bit PWM output.
I2C bus interface transfer data I/O.
(2 pins)
8-bit PWM output.
(Port G)
5-bit I/O port. I/O can be set in a unit of single bits.
(5 pins)
External interruption request input.
Active at the falling edge.
NC
No connected.
VDD
Positive power supply.
Vss
GND. Connect two Vss pins to GND.
∗ Not incorporated for Pin 52 package.
–7–
CXP750096/750010, CXP750097/750011
Input/Output Circuit Formats for Pins
Pin
Circuit format
Port A
After a reset
Port A data
Port A direction
PA0/AN0
to
PA5/AN5
“0” after a reset
IP
Internal data bus
Input
protection
circuit
RD (Port A)
Port A function selection
6 pins
“0” after a reset
A/D converter
Hi-Z
Input multiplexer
Port A
Port A data
Port A direction
“0” after a reset
PA6/VSYNC
PA7/HSYNC
Schmitt input
Internal data bus
Hi-Z
IP
RD (Port A)
HSYNC, VSYNC
Input polarity
2 pins
“0” after a reset
Port B
Ports B, C, G data
Port C
PB0 to PB7
PC0 to PC5∗2
PG3 to PG6∗2
PG7/INT1
Port G
Ports B, C, G direction
“0” after a reset
PB0 to PB2
Schmitt input only
for PG7
Internal data bus
Hi-Z
IP
RD (Ports B, C, G)
19 pins
INT1
Port C
PC6/PWM6∗2
PC7/PWM7∗2
PF0/PWM0
to
PF3/PWM3
Port F
PWM0 to PWM3
PWM6, PWM7
Ports C and F
function selection
∗1
“0” after a reset
Hi-Z
Ports C and F data
∗1 12V drive voltage
Large current 12mA
“1” after a reset
Internal data bus
6 pins
RD (Ports C, F)
∗2 Not incorporated for Pin 52 package.
–8–
CXP750096/750010, CXP750097/750011
Pin
Circuit format
After a reset
Port D
Port D data
PD0/INT2
PD3/SI
PD4/HS0
PD5/HS1
PD6/RMC
PD7/EC
Port D direction
∗
“0” after a reset
Hi-Z
Schmitt input
Internal data bus
IP
RD (Port D)
6 pins
∗ Large current 12mA
INT2, SI, HS0,
HS1, RMC, EC
Port D
SCK, SO
SIO output enable
Port D data
PD1/SCK
PD2/SO
∗
Port D direction
Hi-Z
“0” after a reset
Schmitt input
only for PD1
Internal data bus
IP
RD (Port D)
2 pins
∗ Large current 12mA
SCK only
Port E
Internal reset signal
PE0/TO/ADJ
Port E data
00
“1” after a reset
TO
ADJ16K∗1
ADJ2K∗1
01
10
11
MPX
∗2
Port E function selection (Upper)
Port E function selection (Lower)
“00” after a reset
Port E direction
“1” after a reset
Internal data bus
1 pin
∗1 ADJ signals are frequency
dividing outputs for 32kHz
oscillation frequency
IP
adjustment. ADJ2K provides
usage as buzzer output.
∗2 Pull-up resistors approx. 150kΩ
RD (Port E)
–9–
High level
H level at ON
resistance of
pull-up
transistor
during a reset
( )
CXP750096/750010, CXP750097/750011
Pin
Circuit format
After a reset
Port E
PWM
Port E function selection
“0” after a reset
Port E data
“1” after a reset
PE1/PWM
High level
Port E direction
“1” after a reset
IP
Internal data bus
RD (Port E)
1 pin
Port E
TEX oscillation circuit control
“1” after a reset
Schmitt input
INT0
Intrenal data bus
RD (Port E)
PE2/TEX/INT0
PE3/TX
Internal data bus
RD (Port E)
Schmitt input
PE2/
TEX/
INT0
2 pins
IP
Oscillation
halted
Port input
IP
Clock input
PE3/
TX
Port E
YM, YS, I
Output polarity
“0” after a reset
PE4/YM
PE5/YS
PE6/I
Port E function selection
Hi-Z
“1” after a reset
Port E data
Writing data to output polarity
register and port data register
brings output to active.
Internal data bus
3 pins
RD (Port E)
– 10 –
CXP750096/750010, CXP750097/750011
Pin
Circuit format
Port F
After a reset
SCL, SDA
I2C bus enable
∗
PWM4, PWM5
PF4/SCL0
PF5/SCL1/PWM4
PF6/SDA0
PF7/SDA1/PWM5
Port F function selection
“0” after a reset
Hi-Z
Port F data
“1” after a reset
Internal data bus
RD (Port F)
Schmitt input
SCL, SDA
(I2C bus circuit)
IP
BUS SW
To internal I2C pins
(SCL1 for SCL0)
∗ Large current 12mA
4 pins
R, G, B
R
G
B
Output polarity
“0” after a reset
Hi-Z
Writing data to output
polarity register brings
output to active.
3 pins
Oscillation control
EXLC
XLC
EXLC
2 pins
XLC
EXTAL
XTAL
IP
IP
OSD display clock
Oscillation
halted
IP
EXTAL
• Diagram shows the
circuit composition
during oscillation.
• Feedback resistor is
removed and XTAL is driven
at "H" level driving stop.
(This device does not enter the
stop mode.)
XTAL
2 pins
Oscillation
Pull-up resistor
RST
1 pin
AA
AA
OP Mask option
Schmitt input
– 11 –
Low level
(during a
reset)
CXP750096/750010, CXP750097/750011
Absolute Maximum Ratings
Item
(Vss = 0V reference)
Symbol
Ratings
Unit
V
Remarks
Supply voltage
VDD
Input voltage
VIN
–0.3 to +7.0
–0.3 to +7.0∗1
Output voltage
VOUT
–0.3 to +7.0∗1
V
Medium drive output voltage
VOUTP
–0.3 to +15.0
V
High level output current
IOH
–5
mA
High level total output current
∑IOH
–50
mA
Total of all output pins
IOL
15
mA
Ports excluding large current output
(value per pin)
IOLC
20
mA
Large current output ports
(value per pin∗2)
Low level total output current
∑IOL
130
mA
Total of all output pins
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
Allowable power dissipation
PD
1000
mW
SDIP-64P-01
600
mW
QFP-64P-L01
V
Low level output current
∗1 VIN and VOUT should not exceed VDD + 0.3V.
∗2 The large current output port is Port C (PC6, PC7), Port D (PD) and Port F (PF).
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding those conditions may
adversely affect the reliability of the LSI.
– 12 –
CXP750096/750010, CXP750097/750011
Recommended Operating Conditions
Item
Supply voltage
High level input
voltage
Symbol
(Vss = 0V reference)
Min.
Max.
Unit
4.5
5.5
V
Guaranteed operation range for 1/2 and 1/4
frequency dividing modes
3.5
5.5
V
Guaranteed operation range for 1/16 frequency
dividing mode or sleep
2.7
5.5
V
—
—
V
Guaranteed operation range for TEX mode
Guaranteed data hold range for stop∗5
VIH
0.7VDD
VDD
V
∗1
VIHS
0.8VDD
VDD
V
∗2
V
VDD
Remarks
VIL
0
0.3VDD
V
EXTAL pin∗3, TEX pin∗4
∗1
VILS
0
0.2VDD
V
∗2
VILEX
–0.3
0.4
V
EXTAL pin∗3, TEX pin∗4
Operating temperature Topr
–20
+75
°C
VIHEX
Low level input
voltage
∗1
∗2
∗3
∗4
∗5
VDD – 0.4 VDD + 0.3
This device does not enter the stop mode.
PA0 to PA5, PB3 to PB7, PC0 to PC5, PD2, PE0, PE1, PE3, PG3 to PG6, SCL0, SCL1, SDA0, SDA1 pins
VSYNC, HSYNC, INT2, SCK, SI, HS0, HS1, RMC, EC, INT0, INT1, RST pins
Specifies only during external clock input.
Specifies only during external event count input.
– 13 –
CXP750096/750010, CXP750097/750011
Electrical Characteristics
DC characteristics
Item
High level output
voltage
Low level output
voltage
(Ta = –20 to +75°C, Vss = 0V reference)
Symbol
VOH
VOL
Pins
PA, PB, PC0 to PC5,
VDD = 4.5V, IOH = –0.5mA
PD, PE0 to PE1,
PE4 to PE6, PG, R,
VDD = 4.5V, IOH = –1.2mA
G, B
Input current
IIHT
IILT
Min.
Typ.
Max.
Unit
4.0
V
3.5
V
PA to PD, PE0 to PE1, VDD = 4.5V, IOL = 1.8mA
PE4 to PE6, PF0 to
VDD = 4.5V, IOL = 3.6mA
PF3, PG, R, G, B
0.4
V
0.6
V
PC6, PC7, PD, PF
VDD = 4.5V, IOL = 12.0mA
1.5
V
PF4 to PF7
(SCL0, SCL1,
SDA0, SDA1)
VDD = 4.5V, IOL = 3.0mA
0.4
V
VDD = 4.5V, IOL = 4.0mA
0.6
V
IIHE
IILE
Conditions
EXTAL
TEX
VDD = 5.5V, VIH = 5.5V
0.5
40
µA
VDD = 5.5V, VIL = 0.4V
–0.5
–40
µA
VDD = 5.5V, VIH = 5.5V
0.1
10
µA
–0.1
–10
µA
–1.5
–400
µA
±10
µA
VDD = 5.5V, VIL = 0.4V
IILR
RST∗1
I/O leakage current
IIZ
PA, PB, PC0 to PC5,PD, VDD = 5.5V,
PE, PG, R, G, B, RST∗1 VI = 0, 5.5V
Open drain I/O
leakage current
(in N-ch Tr off state)
ILOH
I2C bus switch
connection impedance
(in output Tr off state)
RBS
PC6, PC7, PF0 to PF3
VDD = 5.5V, VOH = 12.0V
50
µA
PF4 to PF7
VDD = 5.5V, VOH = 5.5V
10
µA
SCL0: SCL1
SDA0: SDA1
VDD = 4.5V
VSCL0 = VSCL1 = 2.25V
VSDA0 = VSDA1 = 2.25V
120
Ω
1/2 frequency dividing mode
VDD = 5.5V,
16MHz crystal oscillation
(C1 = C2 = 15pF)
IDD1
IDD2
Supply current∗2
VDD
IDDS1
IDDS2
IDDS3
20
30
mA
VDD = 5.5V,
24MHz crystal oscillation
29
45
VDD = 3.3V,
32kHz crystal oscillation
(C1 = C2 = 47pF)
33
82
µA
2.2
3.8
mA
12
35
µA
—
—
µA
Sleep mode
VDD = 5.5V,
24MHz crystal oscillation
(C1 = C2 = 15pF)
VDD = 3.3V,
32kHz crystal oscillation
(C1 = C2 = 47pF)
Stop mode∗3
VDD = 5.5V,
termination of 24MHz
and 32kHz oscillation
– 14 –
—
CXP750096/750010, CXP750097/750011
Item
Input capacitance
Symbol
CIN
Pins
PA, PB,PC0 to PC5,
PD,PE0 to PE3,
PF4 to PF7, PG,
EXTAL, EXLC, RST
Conditions
Clock 1 MHz
0V other than the
measured pins
Min.
Typ.
Max.
Unit
10
20
pF
∗1 For RST pin, specifies the input current when pull-up resistance is selected, and specifies the leakage
current when non-resistor is selected.
∗2 When all output pins are left open. Specifies only when the OSD oscillation is halted.
∗3 This device does not enter the stop mode.
– 15 –
CXP750096/750010, CXP750097/750011
AC Characteristics
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
(1) Clock timing
Item
Symbol
System clock frequency
fC
Event count input clock rise
and fall times
tXL,
tXH
tCR,
tCF
tEH,
tEL
tER,
tEF
System clock frequency
fC
Event count input clock input
pulse width
tTL,
tTH
tTR,
tTF
System clock input pulse width
System clock input rise and fall
times
Event count input clock pulse
width
Event count input clock rise
and fall times
Pins
Conditions
Min.
XTAL
EXTAL
Fig. 1, Fig.2
8
EXTAL
Fig. 1, Fig.2
External clock drive
17
EXTAL
Fig. 1, Fig.2
External clock drive
EC
Fig. 3
EC
Fig. 3
TEX
TX
VDD = 2.7 to 5.5 V
Fig. 2 (32kHz clock
applied conditions)
TEX
Fig. 3
TEX
Fig. 3
Typ.
Max
Unit
24
MHz
ns
200
4tsys∗1
ns
ns
20
ms
kHz
32.768
µs
10
20
ms
∗1 Indicates three values according to the contents of the clock control register (CLC: 000FEh) upper 2 bits
(CPU clock selection).
tsys [ns] = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
1/fc
VDD – 0.4V
EXTAL
0.4V
AAAAA
AAAA
AAAA
AAAAAAAAA AAAA
AAAAAAAAA AAAA
tXH
tCF
tXL
tCR
Fig. 1. Clock timing
Crystal oscillation
Ceramic oscillation
EXTAL
C1
External clock
EXTAL
XTAL
C2
32kHz clock applied condition
Crystal oscillation
TEX
XTAL
74HC04
TX
C2
C1
Fig.2. Clock applied conditions
0.8VDD
TEX
EC
0.2VDD
tEF
tTF
tEH
tTH
tEL
tTL
Fig. 3. Event count clock timing
– 16 –
tER
tTR
CXP750096/750010, CXP750097/750011
(2) Serial transfer
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Pins
tKCY
SCK
SCK High and Low level
width
tKH
tKL
SCK
SI input setup time
(for SCK ↑)
tSIK
SI
SI hold time
(for SCK ↑)
tKSI
SI
SCK ↓ → SO delay time
tKSO
SO
SCK cycle time
Conditions
Min.
Input mode
Max.
1000
ns
8000/fc
ns
400
ns
4000/fc – 50
ns
SCK input mode
100
ns
SCK output mode
200
ns
SCK input mode
200
ns
SCK output mode
100
ns
Output mode
SCK input mode
SCK output mode
SCK input mode
200
ns
SCK output mode
100
ns
Note) The load of SCK output mode and SO output delay time is 50pF + 1TTL.
tKCY
tKL
tKH
0.8VDD
SCK
0.2VDD
tSIK
tKSI
0.8VDD
Input data
SI
Unit
0.2VDD
tKSO
0.8VDD
SO
Output data
0.2VDD
Fig. 4. Serial transfer timing
– 17 –
CXP750096/750010, CXP750097/750011
(3) A/D converter
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Max.
Unit
Resolution
8
Bits
Linearity error
±3
LSB
Zero transition
voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
Sampling time
tCONV
tSAMP
Analog input voltage
VIAN
Pins
Conditions
Ta = 25°C
VDD = 5.0V
Vss = 0V
Min.
Typ.
–10
10
70
mV
4910
4970
5030
mV
26/fADC∗3
6/fADC∗3
AN0 to AN5
0
µs
µs
VDD
V
Digital conversion value
FFh
FEh
∗1 VZT: Value at which the digital conversion value changes
from 00h to 01h and vice versa.
∗2 VFT: Value at which the digital conversion value changes
from FEh to FFh and vice versa.
∗3 fADC indicates the below values due to the contents of bit
6 (CKS) of the A/D control register (ADC: 000F6h):
Linearity error
01h
00h
fADC = fc (CKS = “0”), fc/2 (CKS = “1”)
VZT
VFT
Analog input
Fig. 5. Definitions for A/D converter terms
– 18 –
CXP750096/750010, CXP750097/750011
(4) Interruption, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
External interruption High,
Low level width
tIH
tIL
INT0
INT1
INT2
1
µs
Reset input Low level width
tRSL
RST
32/fc
µs
tIH
INT0
INT1
INT2
(falling edge)
tIL
0.8VDD
0.2VDD
Fig. 6. Interruption input timing
tRSL
RST
0.2VDD
Fig. 7. RST input timing
– 19 –
CXP750096/750010, CXP750097/750011
(5) I2C bus timing
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
0
100
kHz
SCL clock frequency
fSLC
SCL
Bus-free time before starting transfer
tBUF
tHD; STA
tLOW
tHIGH
tSU; STA
tHD; DAT
tSU; DAT
tR
tF
tSU; STO
SDA, SCL
4.7
µs
SDA, SCL
4.0
µs
SCL
4.7
µs
SCL
4.0
µs
SDA, SCL
µs
SDA, SCL
4.7
0∗1
SDA, SCL
250
ns
Hold time for starting transfer
Clock Low level width
Clock High level width
Setup time for repeated transfers
Data hold time
Data setup time
SDA, SCL rise time
SDA, SCL fall time
Setup time for transfer completion
µs
SDA, SCL
1
µs
SDA, SCL
300
ns
SDA, SCL
4.7
µs
∗1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it.
SDA
tBUF
tR
tF
tHD; STA
SCL
tHD; STA
tSU; STA
P
S
tLOW
tHD; DAT
tHIGH
St
tSU; DAT
tSU; STO
P
Fig. 8. I2C bus transfer timing
I2C bus
device
RS
I2C bus
device
RS RS
R S RP
RP
SDA0
(or SDA1)
SCL0
(or SCL1)
Fig. 9. I2C bus device recommended circuit
• A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
• The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300Ω or less) can be used to reduce the
spike noise caused by CRT flashover.
– 20 –
CXP750096/750010, CXP750097/750011
(6) OSD timing
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max
Unit
40.8
MHz
EXLC
XLC
Fig. 11
4
tHWD
tVWD
HSYNC
Fig. 10
30/fc
VSYNC
Fig. 10
1
HSYNC afterwrite rise and fall
times
tHCG
HSYNC
Fig. 10
200
ns
VSYNC beforewrite rise and fall
times
tVCG
VSYNC
Fig. 10
1.0
µs
OSD clock frequency
fOSC
HSYNC pulse width
VSYNC pulse width
µs
H∗2
∗1 The maximum value of fosc is specified with the following equation.
fosc [max] ≤ fc × 1.7
∗2 H indicates 1HSYNC period.
tHWD
tHCG
0.8VDD
HSYNC
For OSD I/O polarity register
(OPOL: 001FEh)
bit 7 at “0”
0.2VDD
tVCG
tVWD
0.8VDD
VSYNC
For OSD I/O polarity register
(OPOL: 001FEh)
bit 6 at “0”
0.2VDD
Fig. 10. OSD timing
EXLC
XLC
R∗3
L
C2
C1
Fig. 11. LC oscillation circuit connection
∗3 The series resistor for XLC (R = 1kΩ or less) can reduce the frequency of occurrence of the undesired
radiation.
– 21 –
CXP750096/750010, CXP750097/750011
Appendix
AAAA
AAAA
AAAA
(i) Main clock
EXTAL
EXTAL
XTAL
Rd
C1
AAAA AAAAA
AAAA
AAAAA
AAAA
AAAAA
AA
A
A
(ii) Main clock
(iii) Sub clock
TEX
XTAL
Rd
C2
TX
Rd
C2
C1
C1 C2
Fig. 12. Recommended oscillation circuit
Manufacture
Model
MURATA MFG
CO., LTD.
C1 (pF)
C2 (pF)
30
30
CSA10.0MTZ
10.0
CSA12.0MTZ
12.0
CSA16.00MXZ040
16.0
5
5
CSA24.00MXZ040
CST10.0MTW∗
24.0
OPEN
OPEN
30
30
10.0
Rd (Ω)
Circuit example Remarks
(i)
0 ∗1
CST12.0MTW∗
12.0
CST16.00MXW0C1∗
16.0
5
5
8.0
18
18
12.0
12
12
16.0
10
10
8.0
10
10
12.0
5
5
16.0
OPEN
OPEN
24.0
3
3
32.768kHz
30
33
120k
(iii)
32.768kHz
18
18
330k
(iii)
RIVER ELETEC
HC-49/U03
CO., LTD.
KINSEKI LTD.
fc (MHz)
HC-49/U (-S)
P3
VTC-200
SEIKO
Instruments Inc. SP-T
(ii)
330 ∗1
(i)
0 ∗1
∗ Models with an astarisk (∗) have the built-in ground capacitance (C1, C2).
∗1 The series resistor for XTAL (Rd = 500Ω or less) can reduce the effect of the noise caused by the
electrostatic discharge.
Mask Option Table
Item
Reset pin pull-up resistor
Content
Non-existent
– 22 –
Existent
CL = 12.5pF
CXP750096/750010, CXP750097/750011
IDD vs. VDD
IDD vs. fc
(Ta = 25°C, Typical)
(VDD = 5V, Ta = 25°C, Typical)
100
30
fc = 24MHz
fc = 16MHz 1/2 dividing mode
fc = 24MHz
fc = 16MHz 1/4 dividing mode
fc = 24MHz
fc = 16MHz 1/16 dividing mode
25
1/2 dividing mode
20
IDD – Supply current [mA]
fc = 24MHz
Sleep mode
fc = 16MHz
1
0.1
32kHz operation mode
15
1/4 dividing mode
10
32kHz sleep mode
5
1/16 dividing mode
0.01
0
1
2
3
4
6
5
Sleep mode
7
0
0
VDD – Supply voltage [V]
5
10
15
Frequency [MHz]
Parameter curve for OSD oscillator L vs. C
(Analytically calculated value)
100
10
L – Inductance [µH]
IDD – Supply current [mA]
10
16MHz
20MHz
24MHz
28MHz
32MHz
36MHz
40MHz
1
0.1
0.01
0
10
20
30
40
50
60
70
80
90 100
C1, C2 – Capacitance [pF]
Fig. 13. Characteristic curves
– 23 –
20
25
CXP750096/750010, CXP750097/750011
Unit: mm
+ 0.1
0.05
0.25 –
64PIN SDIP (PLASTIC)
+ 0.4
57.6 – 0.1
64
19.05
+ 0.3
17.1 – 0.1
33
1
0° to 15°
32
3.0 MIN
0.5 MIN
+ 0.4
4.75 – 0.1
1.778
0.5 ± 0.1
0.9 ± 0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SDIP-64P-01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SDIP064-P-0750
LEAD MATERIAL
42 ALLOY
PACKAGE MASS
8.6g
JEDEC CODE
64PIN QFP(PLASTIC)
23.9 ± 0.4
+ 0.4
20.0 – 0.1
+ 0.1
0.15 – 0.05
0.15
32
64
20
1
16.3
52
17.9 ± 0.4
33
+ 0.2
0.1 – 0.05
19
+ 0.35
2.75 – 0.15
+ 0.15
0.4 – 0.1
1.0
0.2
M
0° to10°
0.8 ± 0.2
51
+ 0.4
14.0 – 0.1
Package Outline
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
SONY CODE
QFP-64P-L01
LEAD TREATMENT
EIAJ CODE
QFP064-P-1420
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
1.5g
JEDEC CODE
– 24 –
CXP750096/750010, CXP750097/750011
+ 0.1
.05
0.25 – 0
52PIN SDIP (PLASTIC)
+ 0.4
47.0 – 0.1
15.24
+ 0.3
13.5 – 0.1
27
52
0° to 15°
26
1
5.0 MIN
2.8 MIN
0.51 MIN
1.778
0.5 ± 0.1
+ 0.1
0.9 – 0.05
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SDIP-52P-01
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
EIAJ CODE
SDIP052-P-0600
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
5.6g
JEDEC CODE
– 25 –