SONY CXP832P40A

CXP832P40A
CMOS 8-bit Single Chip Microcomputer
Description
The CXP832P40A is a CMOS 8-bit single chip
microcomputer integrating on a single chip an A/D
converter, serial interface, timer/counter, time base
timer, 32kHz timer/counter, capture timer counter,
LCD controller/driver, remote control reception
circuit and 14-bit PWM output besides the basic
configurations of 8-bit CPU, PROM, RAM, and I/O port.
Also the CXP832P40A provides sleep/stop function
which enables to lower power consumption.
The CXP832P40A is the PROM-incorporated
version of the CXP83240A with built-in mask ROM.
This provides the additional feature of being able to
write directry into the program. Thus, it is most
suitable for evaluation use during system
development and for small-quantity production.
100 pin QFP (Plastic)
100 pin LQFP (Plastic)
tructure
Silicon gate CMOS IC
Features
• Wide-range instruction system (213 instructions) to cover various types of data.
— 16-bit arithmetic/multiplication and division/boolean bit operation instructions
• Minimum instruction cycle
400ns at 10MHz operation
8µs at 500kHz operation
122µs at 32kHz operation
• Incorporated PROM capacity 40K bytes
• Incorporated RAM capacity
1120 bytes (includes LCD display data area)
• Peripheral functions
— A/D converter
8-bit, 8-channel, successive approximation method
(Conversion time of 32µs/10MHz)
— Serial interface
8-bit, 8-stage FIFO incorporated
(Auto transfer for 1 to 8 bytes), 1 channel
8-bit clock synchronized type, 1 channel
— Timer
8-bit timer, 8-bit timer/counter, 19-bit time base timer,
16-bit capture timer/counter, 32kHz timer/counter
— LCD controller/driver
Maximum 160 segment display possible (during 1/4 duty)
4 common output, 40 segment output
Display method static, 1/2, 1/3, 1/4 duty
Bias method 1/2, 1/3 bias
— Remote control reception circuit
8-bit pulse measurement counter with on-chip, 6-stage FIFO
— PWM output circuit
14 bits, 1 channel
• Interruption
15 factors, 15 vectors, multi-interruption possible
• Standby mode
SLEEP/STOP
• Package
100-pin plastic QFP/LQFP
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94X39-PP
40
4
SEG0 to SEG39
COM0 to COM3
VL
VLC1
VLC2
VLC3
AVREF
ADJ
TO
CINT
EC1
16 BIT CAPTURE
TIMER/COUNTER 2
8 BIT TIMER 1
8 BIT TIMER/COUNTER 0
EC0
FIFO
SERIAL INTERFACE UNIT 1
SERIAL
INTERFACE
UNIT 0
CS0
SI0
SO0
SCK0
FIFO
SI1
SO1
SCK1
REMOCON
14 BIT PWM GENERATOR
LCD
CONTROLLER/
DRIVER
A/D CONVERTER
2
2
INT0
INT1
INT2
NMI/INT3
2 2
INTERRUPT CONTROLLER
AVSS
RMC
PWM
8
PRESCALER/
TIME BASE TIMER
PROM
40K BYTES
SPC 700
CPU CORE
TEX
TX
EXTAL2
XTAL2
EXTAL1
XTAL1
RST
VDD
VSS
32KHz
TIMER/COUNTER
RAM
1120 BYTES
CLOCK GEN/
SYSTEM CONTROL
PB0 to PB7
PC0 to PC7
PD0 to PD7
PE0 to PE4
PE5 to PE6
PF0 to PF7
PG0 to PG7
8
8
8
5
2
8
8
8
PH0 to PH7
PA0 to PA7
8
PORT B
PORT E
–2–
PORT F
AN0 to AN7
PORT A
PORT C
PORT D
PORT G
PORT H
Block Diagram
CXP832P40A
CXP832P40A
SEG27/PF3
SEG28/PF4
SEG29/PF5
SEG30/PF6
SEG31/PF7
SEG32/PG0
SEG33/PG1
SEG34/PG2
VDD
Vpp
Vss
TX
TEX
SEG35/PG3
SEG36/PG4
SEG37/PG5
SEG38/PG6
SEG39/PG7
PE0/INT0/EC0
PE1/INT1/EC1
Pin Assignment (Top View) (QFP package)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
PE2/INT2
1
80
SEG26/PF2
PE3/INT3/NMI
2
79
SEG25/PF1
PE4/RMC
3
78
SEG24/PF0
PE5/PWM
4
77
SEG23/PD7
PE6/TO/ADJ
5
76
SEG22/PD6
PB0/CINT
6
75
SEG21/PD5
PB1/ CS0
7
74
SEG20/PD4
PB2/SCK0
8
73
SEG19/PD3
PB3/SI0
9
72
SEG18/PD2
PB4/SO0
10
71
SEG17/PD1
PB5/SCK1
11
70
SEG16/PD0
PB6/SI1
12
69
SEG15
PB7/SO1
13
68
SEG14
PC0
14
67
SEG13
PC1
15
66
SEG12
PC2
16
65
SEG11
PC3
17
64
SEG10
PC4
18
63
SEG9
PC5
19
62
SEG8
PC6
20
61
SEG7
PC7
21
60
SEG6
PH0
22
59
SEG5
PH1
23
58
SEG4
PH2
24
57
SEG3
PH3
25
56
SEG2
PH4
26
55
SEG1
PH5
27
54
SEG0
PH6
28
53
COM3
PH7
29
52
COM2
PA0/AN0
30
51
COM1
Note)
1. Vpp (Pin 90) is always connected to VDD.
2. VSS (Pin 41 and 91) are both connected to GND.
–3–
COM0
VLC1
VLC2
VLC3
VL
AVss
AVREF
EXTAL2
XTAL2
Vss
XTAL1
EXTAL1
RST
PA7/AN7
PA6/AN6
PA5/AN5
PA4/AN4
PA3/AN3
PA2/AN2
PA1/AN1
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
CXP832P40A
SEG24/PF0
SEG25/PF1
SEG26/PF2
SEG27/PF3
SEG28/PF4
SEG29/PF5
SEG30/PF6
SEG31/PF7
SEG32/PG0
SEG33/PG1
SEG34/PG2
VDD
Vpp
Vss
TX
TEX
SEG35/PG3
SEG36/PG4
SEG37/PG5
SEG38/PG6
SEG39/PG7
PE0/INT0/EC0
PE1/INT1/EC1
PE2/INT2
PE3/INT3/NMI
Pin Assignment (Top View) (LQFP package)
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
PE4/RMC
1
75
SEG23/PD7
PE5/PWM
2
74
SEG22/PD6
PE6/TO/ADJ
3
73
SEG21/PD5
4
72
SEG20/PD4
PB0/CINT
PB1/CS0
5
71
SEG19/PD3
PB2/SCK0
6
70
SEG18/PD2
PB3/SI0
7
69
SEG17/PD1
PB4/SO0
8
68
SEG16/PD0
PB5/SCK1
9
67
SEG15
PB6/SI1
10
66
SEG14
PB7/SO1
11
65
SEG13
PC0
12
64
SEG12
PC1
13
63
SEG11
PC2
14
62
SEG10
PC3
15
61
SEG9
PC4
16
60
SEG8
PC5
17
59
SEG7
PC6
18
58
SEG6
PC7
19
57
SEG5
PH0
20
56
SEG4
PH1
21
55
SEG3
PH2
22
54
SEG2
PH3
23
53
SEG1
PH4
24
52
SEG0
PH5
25
51
COM3
Note)
1. Vpp (Pin 88) is always connected to VDD.
2. VSS (Pin 39 and 89) are both connected to GND.
–4–
COM2
COM1
COM0
VLC1
VLC2
VLC3
VL
AVss
AVREF
EXTAL2
XTAL2
Vss
XTAL1
EXTAL1
RST
PA7/AN7
PA6/AN6
PA5/AN5
PA4/AN4
PA3/AN3
PA2/AN2
PA1/AN1
PA0/AN0
PH7
PH6
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
CXP832P40A
Pin Description
Symbol
I/O
PA0/AN0
to
PA7/AN7
I/O/Analog input
PB0/CINT
I/O/Input
PB1/CS0
I/O/Input
PB2/SCK0
I/O/I/O
PB3/SI0
I/O/Input
PB4/SO0
I/O/Output
PB5/SCK1
I/O/I/O
PB6/SI1
I/O/input
PB7/SO1
I/O/Output
Functions
(Port A)
8-bit I/O port. I/O can
be set in a single bit
unit.
Incorporation of pull-up
resistor can be set
through the software in
a unit of 4 bits. (8 pins)
Analog inputs to A/D converter.
(8 pins)
External capture input to 16-bit timer/counter.
(Port B)
8-bit I/O port. I/O can
be set in a single bit
unit.
Incorporation of pull-up
resistor can be set
through the software in
a unit of 4 bits.
(8 pins)
Chip select input for serial interface (CH0).
Serial clock I/O (CH0).
Serial data input (CH0).
Serial data output (CH0).
Serial clock I/O (CH1).
Serial data input (CH1).
Serial data output (CH1).
(Port C)
8-bit I/O port. I/O can be set in a single bit unit. Capable of driving 12mA
sync current. Incorporation of pull-up resistor can be set through the
software in a unit of 4 bits.
(8 pins)
PC0 to PC7
I/O
PE0/INT0/
EC0
Input/Input/Input
PE1/INT1/
EC1
Input/Input/Input
PE2/INT2
Input/Input
PE3/INT3/
NMI
Input/Input/Input
PE4/RMC
Input/Input
PE5/PWM
Output/Output
14-bit PWM output.
PE6/TO/
ADJ
Output/Output/
Output
Rectangular wave output
for 16-bit timer/counter
(duty output 50%).
PH0 to PH7
I/O
External event inputs for
timer/counter.
(2 pins)
(Port E)
7-bit port. lower 5 bits
are for inputs; upper
2 bits are for outputs.
(7 pins)
External interruption request inputs.
(4 pins)
Non-maskable interruption request
input.
Remote control reception circuit input.
Output for 32kHz
oscillation
frequency division.
(Port H)
8-bit I/O port. I/O can be set in a single bit unit. Incorporation of pull-up
resistor can be set through the software in a unit of 4 bits.
(8 pins)
–5–
CXP832P40A
Symbol
I/O
Functions
PD0/SEG16
to
PD7/SEG23
Output/Output
(Port D)
8-bit output port.
(8 pins)
PF0/SEG24
to
PF7/SEG31
Output/Output
(Port F)
8-bit output port.
(8 pins)
PG0/SEG32
to
PG7/SEG39
Output/Output
(port G)
8-bit output port.
(8 pins)
SEG0 to SEG15 Output
LCD segment signal output.
COM0 to COM3 Output
LCD common signal output.
VLC1 to VLC3
LCD bias power supply.
LCD segment signal output.
Control pin to cut off the current flowing to external LCD bias resistor
during standby.
VL
Output
EXTAL1
Input
Crystal connectors for system clock oscillation. When the clock is
supplied externally, input to EXTAL1; opposite phase clock should be
input to XTAL1. System clock oscillation of EXTAL1 and XTAL1 is used
for normal operation mode (Max. 10MHz).
Input
Crystal connectors for system clock oscillation. When the clock is
supplied externally, input to EXTAL2; opposite phase clock should be
input to XTAL2. System clock oscillation of EXTAL2 and XTAL2 is used
for sub clock mode (Typ. 500kHz).
TEX
Input
TX
Output
Crystal connectors for 32kHz timer/counter clock generation circuit.
Connect a 32.768kHz crystal oscillator between TEX and TX. For usage
as event input, connect clock oscillation source to TEX, and leave TX
open.
RST
Input
Low-level active system reset.
XTAL1
EXTAL2
XTAL2
Positive power supply for built-in PROM writing.
Under normal operating conditions, connect to VDD.
Vpp
AVREF
Input
Reference voltage input for A/D converter.
AVSS
A/D converter GND.
VDD
Positive power supply.
VSS
GND. Two VSS are connected to GND.
–6–
CXP832P40A
I/O Circuit Format for Pins
Pin
When reset
Circuit format
Port A
∗
Pull-up resistor
"0" when reset
Port A data
PA0/AN0
to
PA7/AN7
Port A direction
IP
"0" when reset
Input protection
circuit
Hi-Z
Data bus
RD (Port A)
Port A input selection
Input multiplexer
"0" when reset
A/D converter
∗ Pull-up transistors
approx. 100kΩ
8 pins
Port B
∗
Pull-up resistor
"0" when reset
Port B data
PB0/CINT
PB1/CS0
PB3/SI0
PB6/SI1
Port B direction
IP
Hi-Z
"0" when reset
Schmitt input
Data bus
RD (Port B)
CINT
CS0
SI0
SI1
4 pins
∗ Pull-up transistors
approx. 100kΩ
Port B
∗
Pull-up resistor
"0" when reset
SCK OUT
Output enable
Port B output selection
PB2/SCK0
PB5/SCK1
"0" when reset
Hi-Z
Port B data
IP
Port B direction
"0" when reset
Data
bus
Schmitt input
RD (Port B)
2 pins
∗ Pull-up transistors
approx. 100kΩ
SCK in
–7–
CXP832P40A
Pin
When reset
Circuit format
Port B
∗
Pull-up resistor
"0" when reset
SO
Output enable
Port B output selection
PB4/SO0
PB7/SO1
"0" when reset
Hi-Z
Port B data
IP
Port B direction
"0" when reset
Data
bus
RD (Port B)
∗ Pull-up transistors
approx. 100kΩ
2 pins
Port C
∗2
Pull-up resistor
"0" when reset
Port C data
PC0 to PC7
∗1
Port C direction
IP
Hi-Z
"0" when reset
Data bus
∗1 Large currentt drive
of 12mA possible
∗2 Pull-up transistors
approx. 100kΩ
RD (Port C)
8 pins
Port E
PE0/INT0/EC0
PE1/INT1/EC1
PE2/INT2
PE3/INT3/NMI
PE4/RMC
Schmitt input
IP
RD (Port E)
5 pins
–8–
INT0/EC0
INT1/EC1
INT2
INT3/NMI
RMC
Data bus
Hi-Z
CXP832P40A
P in
When reset
Circuit format
Port E
PWM
Port E output selection
PE5/PWM
"0" when reset
High level
Reset E data
"1" when reset
Data bus
RD (Port E)
1 pin
Port E
∗1
Internal reset signal
Port E data
"1" when reset
MPX
TO
PE6/TO/ADJ
High level
(High level
with 150kΩ
resistor
when reset)
∗2 ADJ16K
ADJ2K
Port E output selection
Port E output selection
∗1 Pull-up transistors approx. 150kΩ.
∗2 ADJ signals are frequency divider outputs
for 32kHz oscillation frequency adjustment.
ADJ2K provides usage as buzzer output.
"00" when reset
TO Output enable
1 pin
Port H
∗
Pull-up resistor
"0" when reset
Port H data
PH0 to PH7
Hi-Z
Port H direction
IP
"0" when reset
Data bus
RD (Port H)
∗ Pull-up transistors approx. 100kΩ
8 pins
–9–
CXP832P40A
Pin
When reset
Circuit format
Port D
Port F
PD0 to PD7
PF0 to PF7
PG0 to PG7
Port data
Port G
PD7 to PD4 by a single bit unit
PD3 to PD0 by 4-bit unit
PF7 to PF0
PG7 to PG0 by 8-bit unit
Segment
output
(VDD level)
Port/segment output
selection
"0" when reset
Segment data
24 pins
Segment
driver
Segment
VCH
SEG0 to
SEG15
VDD level
VCL
16 pins
Common
VDD
COM0 to
COM3
VLC1
VDD level
VLC2
4 pins
VLC3
VL
LCD control
(DSP bit)
1 pin
Hi-Z
"0" when reset
– 10 –
CXP832P40A
Pin
EXTAL1
XTAL1
2 pins
EXTAL2
XTAL2
2 pins
TEX
TX
2 pins
When reset
Circuit format
EXTAL1
IP
IP
• Feedback resistor is
removed during stop.
XTAL1 becomes "High"
level.
XTAL1
IP
EXTAL2
• Diagram shows circuit
composition during
oscillation.
IP
• Diagram shows circuit
composition during
oscillation.
• Feedback resistor is
removed during stop.
XTAL2 becomes "High"
level.
Oscillation
EXTAL2
Hi-Z
XTAL2
High level
XTAL2
TEX
IP
IP
• Diagram shows circuit
composition during
oscillation.
• When the operation of the oscillation
circuit is stopped by the software, the
feedback resistor is removed and TEX
and TX become "Low" level and "High"
level respectively.
TX
Oscillation
Pull-up resistor
RST
OP
Low level
Mask option
IP
Schmitt input
1 pin
– 11 –
CXP832P40A
Absolute Maximum Ratings
Iem
Supply voltage
(Vss = 0V)
Symbol
Rating
Unit
VDD
–0.3 to +7.0
V
Vpp
–0.3 to +13.0
V
AVSS
–0.3 to +0.3
–0.3 to +7.0∗1
V
LCD bias voltage
VLC1, VLC2, VLC3
Input voltage
VIN
Output voltage
VOUT
High level output current
IOH
–0.3 to +7.0∗1
–0.3 to +7.0∗1
Remarks
Incorporated PROM
V
V
V
–5
mA
Output per pin
–50
mA
Total for all output pins
IOL
15
mA
IOLC
20
mA
Value per pin, excluding large current outputs
Value per pin∗2 for large current outputs
Low level total output current ∑IOL
100
mA
Total for all output pins
High level total output current ∑IOH
Low level output current
Operating temperature
Topr
–10 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
Allowable power dissipation PD
600
mW
QFP package
380
LQFP package
∗1 VIN and VOUT must not exceed VDD + 0.3V.
∗2 The large current drive transistor is the N-ch transistor of Port C (PC)
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding these conditions may
adversely affect the reliability of the LSI.
– 12 –
CXP832P40A
Recommended Operating Conditions
Item
Symbol
VDD
Supply voltage
Vpp
(Vss = 0V)
Min.
Max.
4.5
5.5
3.5
5.5
3.0
5.5
2.7
5.5
Guaranteed operation range with TEX clock
2.5
5.5
V
Guaranteed data hold range during STOP
∗6
Vpp = VDD
Unit
Remarks
High-speed mode guaranteed operation range∗1
Low-speed mode guaranteed operation range∗1
V
Guaranteed operation range during
EXTAL2 clock (sub clock mode)
VLC1
LCD bias voltage
Vss
VDD
V
LCD power supply range∗5
VIH
0.7VDD
VDD
V
∗2
VIHS
0.8VDD
VDD
V
VLC2
VLC3
High level
input voltage
VIHEX
Low level
input voltage
Operating temperature
VDD – 0.4 VDD + 0.3
V
Hysteresis input∗3
EXTAL∗4
∗2
VIL
0
0.3VDD
V
VILS
0
0.2VDD
V
VILEX
–0.3
0.4
V
Topr
–10
+75
°C
Hysteresis input∗3
EXTAL∗4
∗1 During EXTAL1 clock (main clock mode), high-speed mode is 1/2 frequency division clock selection; lowspeed mode is 1/16 frequency division clock selection.
∗2 Value for each pin of normal input ports (PA, PB4, PB7, PC and PH).
∗3 Value of the following pins; RST, CINT CS0, SI0, SI1, SCK0, SCK1, EC0/INT0, EC1/INT1, INT2, NMI/INT3,
and RMC.
∗4 Specifies only during external clock input.
∗5 Optimal values are determined by LCD used.
∗6 Vpp and VDD should be set to same voltage.
– 13 –
CXP832P40A
Electrical Characteristics
(Ta = –10 to +75°C, Vss = 0V)
DC Characteristics
Item
High level
output voltage
Symbol
VOH
Low level
VOL
output voltage
Pins
Input current
IILR
IIH
IIL
I/O leakage
current
IIZ
Common
output
impedance
RCOM
Segment
output
impedance
RSEG
Max.
Unit
4.0
V
VDD = 4.5V, IOH = –1.2mA
3.5
V
PC
EXTAL1
EXTAL2
IIHT
IILT
Typ.
VDD = 4.5V, IOH = –0.5mA
IIHE2
IILE2
Min.
PA, PB, PC,
PD∗1, PE5,
PE6
PF to PG∗1
VL (VOL only)
IIHE1
IILE1
Conditions
TEX
RST∗2
PA to PC∗3,
PH∗3
PE0 to PE4,
RST∗2
COM0 to
COM3
SEG0 to
SEG15
SEG16 to
SEG39∗1
VDD = 4.5V, IOL = 1.8mA
0.4
V
VDD = 4.5V, IOL = 3.6mA
0.6
V
VDD = 4.5V, IOL = 12.0mA
1.5
V
VDD = 5.5V, VIH = 5.5V
0.5
40
µA
VDD = 5.5V, VIL = 0.4V
–0.5
–40
µA
VDD = 5.5V, VIH = 5.5V
0.3
30
µA
VDD = 5.5V, VIL = 0.4V
–0.3
–30
µA
VDD = 5.5V, VIH = 5.5V
0.1
10
µA
VDD = 5.5V, VIL = 0.4V
–0.1
–10
µA
VDD = 5.5V, VIL = 0.4V
–1.5
–400
µA
VDD = 4.5V, VIH = 4.0V
–3.33
VDD = 5.5V, VIL = 0.4V
–50
µA
VDD = 5.5V,
VI = 0, 5.5V
±10
µA
3
5
kΩ
5
15
kΩ
20
45
mA
VDD = 5V,
VLC1 = 3.75V,
VLC2 = 2.5V,
VLC3 = 1.25V
High-speed mode operation
(1/2 frequency division clock)
IDD1
µA
VDD = 5.5V, 10MHz crystal oscillation
(C1 = C2 = 15pF)
Supply
current∗4
IDD2
VDD = 3.5V, 500kHz crystal oscillation
(C1 = C2 = 22pF)
2.0
3.8
mA
IDD3
VDD = 3V, 32kHz crystal oscillation
(C1 = C2 = 47pF)
0.6
1.3
mA
1.5
8
mA
SLEEP mode
IDDS1
VDD
VDD = 5.5V, 10MHz crystal oscillation
(C1 = C2 = 15pF)
IDDS2
VDD = 3.5V, 500kHz crystal oscillation
(C1 = C2 = 22pF)
0.5
1.0
mA
IDDS3
VDD = 3V, 32kHz crystal oscillation
(C1 = C2 = 47pF)
9
30
µA
IDDSS
STOP mode
VDD = 5.5V, 10MHz, 500kHz crystal
oscillation and termination of 32kHz
oscillation
30
µA
– 14 –
CXP832P40A
Item
Input capacity
Symbol
Pins
CIN
Pins other than
PB7, PE5, PE6
VLC1 to VLC3
COM0 to COM3
SEG0 to SEG15
PD0/SEG16 to
PD7/SEG23
PF0/SEG24 to
PF7/SEG31
PG0/SEG32 to
PG7/SEG39
AVREF, AVSS,
VDD, VSS
Conditions
Clock 1MHz
0V for all pins excluding
measured pins
Min.
Typ.
Max.
Unit
10
20
pF
∗1 Common pins of PD0/SEG16 to PD7/SEG23, PF0/SEG24 to PF7/SEG31, PG0/SEG32 to PG7/SEG39,
PD, PF and PG are the case when the common pin is selected as port; SEG16 to SEG39 are when the
common pin is selected as segment output.
∗2 RST specifies the input current when pull-up resitor has been selected; leakage current when no resistor
has been selected.
∗3 PA to PC, and PH specify the input current when a pull-up resistor has been selected; leakage current
when no resistor has been selected. (PE0 to PE4 specify the leakage current.)
∗4 When all output pins are left open.
– 15 –
CXP832P40A
AC Characteristics
(1) Clock timing
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)
Item
Symbol
Pin
Conditions
Min.
XTAL1
EXTAL1
Fig. 1, Fig. 2
EXTAL1
Fig. 1, Fig. 2
external clock drive
EXTAL1
Fig. 1, Fig. 2
external clock drive
fC
XTAL2
EXTAL2
VDD = 3.0 to 5.5V
Fig. 1, Fig. 2
0.3
System clock input pulse width
tXL,
tXH
EXTAL2
VDD = 3.0 to 5.5V
Fig. 1, Fig. 2
external clock drive
450
System clock input rise and
fall time
tCR,
tCF
EXTAL2
VDD = 3.0 to 5.5V
Fig. 1, Fig. 2
external clock drive
Event count input clock pulse
width
EC0
EC1
Fig. 3
Event count input clock rise
and fall time
tEH,
tEL
tER,
tEF
EC0
EC1
Fig. 3
System clock frequency
fC
TEX
TX
VDD = 2.7 to 5.5V
Fig. 2 (32kHz clock
applied condition)
Event count input clock input
pulse width
tTL,
tTH
tTR,
tTF
TEX
Fig. 3
TEX
Fig. 3
System clock frequency
fC
System clock input
pulse width
System clock input rise and
fall time
tXL,
tXH
tCR,
tCF
System clock frequency
Event count input clock rise
and fall time
Typ.
1
Max.
Unit
10
MHz
ns
37.5
0.5
200
ns
0.7
MHz
ns
200
tsys + 50∗
ns
ns
20
ms
kHz
32.768
µs
10
20
ms
∗ tsys indicates the three values below according to the upper two bits (CPU clock selection) of the clock
control register (address: 00FEH).
tsys [ns] = 2000/fc (upper two bits = “00”), 4000/fc (upper two bits = “01”), 16000/fc (upper two bits = “11”).
Fig. 1. Clock timing
1/fc
VDD – 0.4V
EXTAL1
EXTAL2
0.4V
tCF
tXH
tXL
tCR
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA AAAAAAAA
Fig. 2. Clock applied conditions
Crystal oscillation
Ceramic oscillation
EXTAL
C1
XTAL
C2
External clock
EXTAL
32kHz clock applied condition
Crystal oscillation
TEX
XTAL
74HC04
– 16 –
C1
TX
C2
CXP832P40A
Fig. 3. Event count clock timing
0.8VDD
TEX
EC0
EC1
0.2VDD
tEF
tTF
tEH
tTH
(2) Serial transfer (CH0)
Item
tEL
tTL
tER
tTR
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)
Symbol
Conditions
Pin
Min.
Max.
Unit
CS0 ↓ → SCK0
delay time
tDCSK
SCK0
Chip select transfer mode
(SCK0 = output mode)
tsys + 200
ns
CS0 ↑ → SCK0
float delay time
tDCSKF SCK0
Chip select transfer mode
(SCK0 = output mode)
tsys + 200
ns
CS0 ↓ → SO0
delay time
tDCSO
SO0
Chip select transfer mode
tsys + 200
ns
CS0 ↑ → SO0
float delay time
tDCSOF SO0
Chip select transfer mode
tsys + 200
ns
CS0 high level width
tWHCS CS0
Chip select transfer mode
tsys + 200
ns
tKCY
SCK0
Input mode
2tsys + 200
ns
SCK0 cycle time
16000/fc
ns
SCK0 high and low level
widths
tKH
tKL
Input mode
tsys + 100
ns
SCK0
Output mode
8000/fc – 50
ns
SI0 input setup time
(for SCK0 ↑)
100
SI0
SCK0 input mode
ns
tSIK
SCK0 output mode
200
ns
SI0 input hold time
(for SCK0 ↑)
SI0
tsys + 200
ns
tKSI
100
ns
SCK0 ↓ → SO0
delay time
tKSO
SO0
Output mode
SCK0 input mode
SCK0 output mode
SCK0 input mode
SCK0 output mode
tsys + 200
ns
100
ns
Note 1) tsys indicates the three values below according to the upper two bits (CPU clock selection) of the
clock control register (address: 00FEH).
tsys [ns] = 2000/fc (upper two bits = “00”), 4000/fc (upper two bits = “01”), 16000/fc (upper two bits = “11”)
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF + 1TTL.
– 17 –
CXP832P40A
Fig. 4. Serial transfer CH0 timing
tWHCS
CS0
0.8VDD
0.2VDD
tKCY
tDCSK
tKL
tDCSKF
tKH
0.8VDD
0.8VDD
SCK0
0.2VDD
tSIK
tKSI
0.8VDD
Input data
SI0
0.2VDD
tDCSO
tKSO
tDCSOF
0.8VDD
SO0
Output data
0.2VDD
– 18 –
CXP832P40A
Serial Transfer (CH1)
Item
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)
Symbol
Pin
Conditions
tKCY
SCK1
SCK1 high and low level
widths
tKH
tKL
SCK1
SI1 input setup time
(for SCK1 ↑)
tSIK
SI1
SI1 input hold time
(for SCK1 ↑)
tKSI
SI1
SCK1 ↓ → SO1 delay time
tKSO
SO1
SCK1 cycle time
Min.
Input mode
Max.
1000
ns
16000/fc
ns
400
ns
8000/fc – 50
ns
SCK1 input mode
100
ns
SCK1 output mode
200
ns
SCK1 input mode
200
ns
SCK1 output mode
100
ns
Output mode
input mode
Output mode
SCK1 input mode
200
ns
SCK1 output mode
100
ns
Note) The load condition for the SCK1 output mode and SO1 output delay time is 50pF + 1TTL.
Fig. 5. Serial transfer CH1 timing
tKCY
tKL
tKH
0.8VDD
SCK1
0.2VDD
tSIK
tKSI
0.8VDD
SI1
Unit
Input data
0.2VDD
tKSO
0.8VDD
Output data
SO1
0.2VDD
– 19 –
CXP832P40A
(3) A/D converter characteristics
Item
Symbol
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = AVSS = 0V)
Max.
Unit
Resolution
8
Bits
Linearity error
±3
LSB
Zero transition
voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
tCONV
tSAMP
Sampling time
Pin
Conditions
Ta = 25°C
VDD = AVREF = 5.0V
VSS = AVSS = 0V
AVREF
Analog input voltage
AN0 to AN7
IREF
AVREF current
Typ.
–10
10
70
mV
4910
4970
5030
mV
160/fADC∗3
12/fADC∗3
Reference input voltage VREF
VIAN
Min.
AVREF
µs
VDD – 0.5
VDD
V
0
AVREF
V
1.0
mA
10
µA
0.6
Operation mode
IREFS
µs
SLEEP mode
STOP mode
32kHz operation mode
Fig. 6. Definition of A/D converter terms
Digital conversion value
FFH
FEH
∗1 VZT: Value at which the digital conversion value changes
from 00H to 01H and vice versa.
∗2 VFT: Value at which the digital conversion value changes
from FEH to FFH and vice versa.
∗3 fADC indicates the below values due to the Bit 6 (CKS) of
A/D control register (address: 00F9H) and the Bit 7 (PCK1)
and Bit 6 (PCK0) of clock control register (address: 00FFH).
Linearity error
01H
00H
CKS
VFT
VZT
Analog input
PCK1, PCK0
0 (φ/2 selection)
1 (φ selection)
00 (φ = fEX/2)
fADC = fC/2
fADC = fC
01 (φ = fEX/4)
fADC = fC/4
fADC = fC/2
11 (φ = fEX/16)
fADC = fC/16
fADC = fC/8
– 20 –
CXP832P40A
(4) Interruption, reset input
Item
(Ta = –10 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V)
Syymbol
Pin
Conditions
External interruption
high and low level widths
tIH
tIL
INT0
INT1
INT2
NMI/INT3
Reset input low level width
tRSL
RST
Min.
Max.
Unit
1
µs
32/fc
µs
Fig. 7. Interruption input timing
tIH
tIL
0.8VDD
INT0
INT1
INT2
NMI/INT3
(NMI specifies only
for the falling edge)
0.2VDD
tIL
tIH
Fig. 8. RST input timing
tRSL
RST
0.2VDD
– 21 –
CXP832P40A
Appendix
Fig. 9. SPC700 series recommended oscillation circuit
AAAA
AAAA
AAAA
AAAA
AAAA
AAAA
(i) Main clock
500kHz sub clock
EXTAL
EXTAL
XTAL
Rd
C1
AAAAA
AAAAA
AAAAA
(iii) 32kHz sub clock
(ii) Main clock
500kHz sub clock
EXTAL
TEX
XTAL
Rd
C2
XTAL
TX
Rd
C2
C1
C 1 C2
Manufacturer
MURATA MFG
CO., LTD.
Model
fc (MHz)
CSA4.19MG
4.19
CSA8.00MG
8.00
CSA10.0MT
10.00
CST4.19MGW∗
CST8.00MTW∗
CST10.00MTW∗
RIVER
ELETEC
CO., LTD.
C1 (pF)
Rd (Ω)
Circuit
example
(i)
30
30
0
4.19
8.00
(ii)
10.00
4.19
HC-49/U03
8.00
15
15
HC-49/U (-S)
2.2k
470
10.00
4.19
KINSEKI LTD.
C2 (pF)
8.00
22
22
560
18
18
0
10.00
(i)
Those marked with an asterisk (∗) signify types with built-in ground capacitance (C1, C2).
Selection Guide
Option item
Product name
Package
Mask product
Incorporated PROM product
CXP83120A CXP83124A CXP83232A CXP83240A
100-pin plastic QFP/LQFP
ROM capacitance 20K bytes 24K bytes 32K bytes 40K bytes
Reset pin
pull-up resistor
Existent/Non-existent
– 22 –
CXP832P40AQ1-
CXP832P40AR1-
100-pin plastic QFP 100-pin plastic LQFP
PROM 40K bytes
Existent
Existent
CXP832P40A
Characteristics Curves
IDD vs. VDD
IDD vs. fc
(Ta = 25°C, typical)
(VDD = 5V, Ta = 25°C, typical)
fc = 10MHz main clock
1/2 frequency dividing mode
20.0
10.0
20
fc = 500kHz sub clock
1/2 frequency dividing mode
Main clock
1/2 frequency
dividing mode
5.0
fc = 10MHz main clock
SLEEP mode
1.0
fc = 500kHz sub clock
SLEEP mode
0.5
0.1
(100µA)
0.05
(50µA)
32kHz
SLEEP mode
IDD – Supply current [mA]
IDD – Supply current [mA]
32kHz mode (Instruction)
15
10
5
Main clock
SLEEP mode
0.01
(10µA)
2
3
4
5
6
7
0
VDD – Supply voltage [V]
5
10
fc – System clock [MHz]
– 23 –
1
5
CXP832P40A
Unit: mm
100PIN QFP (PLASTIC)
+ 0.1
0.15 – 0.05
15.8 ± 0.4
+ 0.4
14.0 – 0.01
17.9 ± 0.4
23.9 ± 0.4
+ 0.4
20.0 – 0.1
A
0.65
+ 0.35
2.75 – 0.15
±0.12 M
0° to 15°
DETAIL A
0.8 ± 0.2
(16.3)
0.15
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER PLATING
SONY CODE
QFP-100P-L01
LEAD TREATMENT
EIAJ CODE
∗QFP100-P-1420-A
LEAD MATERIAL
COPPER / 42 ALLOY
PACKAGE WEIGHT
1.4g
JEDEC CODE
100PIN LQFP (PLASTIC)
16.0 ± 0.2
∗
14.0 ± 0.1
75
51
76
(15.0)
50
0.5 ± 0.2
A
26 (0.22)
100
1
0.5 ± 0.08
+ 0.08
0.18 – 0.03
25
+ 0.2
1.5 – 0.1
+ 0.05
0.127 – 0.02
0.1
0.1 ± 0.1
0° to 10°
0.5 ± 0.2
Package Outline
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY/PHENOL RESIN
SONY CODE
LQFP-100P-L01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
∗QFP100-P-1414-A
LEAD MATERIAL
42 ALLOY
JEDEC CODE
PACKAGE WEIGHT
– 24 –