SONY CXP86561

CXP86541/86549/86561
CMOS 8-bit Single Chip Microcomputer
Description
The CXP86541/86549/86561 are the CMOS 8-bit
microcomputer integrating on a single chip an A/D
converter, serial interface, timer/counter, time-base
timer, on-screen display function, I2C bus interface,
PWM output, remote control reception circuit,
HSYNC counter, watchdog timer, 32kHz timer/counter
besides the basic configurations of 8-bit CPU, ROM,
RAM, I/O ports.
The CXP86541/86549/86561 also provide a sleep
function that enables to lower the power consumption.
52 pin SDIP (Plastic)
Features
Structure
• A wide instruction set (213 instructions) which
Silicon gate CMOS IC
covers various types of data
– 16-bit operation/multiplication and division/
Boolean bit operation instructions
• Minimum instruction cycle 250ns at 16MHz operation (4.5 to 5.5V)
122µs at 32kHz operation (2.7 to 5.5V)
• Incorporated ROM
40K bytes (CXP86541)
48K bytes (CXP86549)
60K bytes (CXP86561)
• Incorporated RAM
1536 bytes
(Excludes VRAM for on-screen display and sprite RAM)
• Peripheral functions
– A/D converter
8-bit 6-channel successive approximation method
(Conversion time of 3.25µs at 16 MHz)
– Serial interface
8-bit clock sync type, 1 channel
– Timer
8-bit timer
8-bit timer/counter
19-bit time-base timer
32kHz timer/counter
– On-screen display (OSD) function 12 × 16 dots,
512 character types,
15 character colors, 2 lines × 24 characters,
frame background 8 colors/ half blanking,
background on full screen 15 colors/ half blanking
edging/ shadowing/ rounding for every line,
background with shadow for every character,
double scanning,
sprite OSD,
12 × 16 dots, 1 screen, 8 colors for every dot
– I2C bus interface
– PWM output
8 bits, 6 channels
14 bits, 1 channel
– Remote control reception circuit
8-bit pulse measurement counter, 6-stage FIFO
– HSYNC counter
2 channels
– Watchdog timer
• Interruption
13 factors, 13 vectors, multi-interruption possible
• Standby mode
Sleep
• Package
52-pin plastic SDIP
• Piggyback/evaluator
CXP86490 64-pin ceramic PSDIP (Supports custom font)
Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components
in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E96Z15A86
HSYNC COUNTER 1
ON SCREEN
DISPLAY
XLC
EXLC
R
G
B
I
YS
YM
HSYNC
VSYNC
HS1
8BIT TIMER 1
TO
HSYNC COUNTER 0
8BIT TIMER/
COUNTER 0
EC
HS0
SERIAL INTERFACE
UNIT
FIFO
SI
SO
SCK
REMOCON
2
2
I2C BUS
INTERFACE UNIT
SDA0
RMC
INTERRUPT CONTROLLER
INT0
INT1
INT2
SDA1
A/D CONVERTER
6CH
SCL0
6
SCL1
AN0 to AN5
2
ADJ
RAM
352/704/1536 BYTES
ROM
12K/16K/24K/32K/
40K/48K/60K BYTES
6
14BIT PWM
8BIT PWM
32kHz
TIMER/COUNTER
WATCHDOG TIMER
PRESCALER/
TIME BASE TIMER
CLOCK GENERATOR
/SYSTEM CONTROL
SPC700 CPU CORE
TEX
TX
EXTAL
XTAL
RST
MP
VDD
VSS
PWM0 to PWM5
–2–
PWM
PORT A
PORT B
PORT D
1
PG7
PF0 to PF7
8
PE0 to PE1
2
PE4 to PE6
PD0 to PD7
8
3
PB0 to PB7
8
PE2 to PE3
PA0 to PA7
8
2
PORT E
PORT F
PORT G
Block Diagram
CXP86541/86549/86561
CXP86541/86549/86561
Pin Assignment (Top View)
1
52
PF0/PWM0
RMC/PD6
2
51
PF1/PWM1
HS1/PD5
3
50
PF2/PWM2
HS0/PD4
4
49
PF3/PWM3
SI/PD3
5
48
PF4/SCL0
SO/PD2
6
47
PF5/SCL1/PWM4
SCK/PD1
7
46
PF6/SDA0
EC/PD7
INT2/PD0
8
45
PF7/SDA1/PWM5
HSYNC/PA7
9
44
PE0/TO/ADJ
VSYNC/PA6
10
43
PE1/PWM
RST
11
42
PE2/TEX/INT0
VSS
12
41
PE3/TX
XTAL
13
40
VSS
EXTAL
14
39
VDD
PA5/AN5
15
38
NC
PA4/AN4
16
37
EXLC
PA3/AN3
17
36
XLC
PA2/AN2
18
35
PE4/YM
PA1/AN1
19
34
PE5/YS
PA0/AN0
20
33
PE6/I
PB7
21
32
B
PB6
22
31
G
PB5
23
30
R
PB4
24
29
PB0
PB3
25
28
PB1
INT1/PG7
26
27
PB2
Note)
1. NC (Pin 38) is left open.
2. Vss (Pins 12 and 40) are both connected to GND.
–3–
CXP86541/86549/86561
Pin Description
I/O
Symbol
PA0/AN0
to
PA5/AN5
I/O/
Analog input
PA6/VSYNC
I/O/Input
PA7/HSYNC
I/O/Input
Description
(Port A)
8-bit I/O port.
I/O can be set in a
unit of single bits.
(8 pins)
Analog inputs to A/D converter.
(6 pins)
OSD display vertical sync signal input.
OSD display horizontal sync signal input.
(Port B)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
PB0 to PB7
I/O
PD0/INT2
I/O/Input
PD1/SCK
I/O/I/O
PD2/SO
I/O/Output
PD3/SI
I/O/Input
PD4/HS0
I/O/Input
PD5/HS1
I/O/Input
PD6/RMC
I/O/Input
Remote control reception circuit input.
PD7/EC
I/O/Input
External event input for timer/counter.
PE0/TO/ADJ
I/O/Output/
Output
Rectangular wave output
for 8-bit timer/counter.
PE1/PWM
I/O/Output
PE2/TEX/INT0
Input/Input/
Input
PE3/TX
Input/Output
PE4/YM
Output/Output
PE5/YS
Output/Output
PE6/I
Output/Output
B
Output
G
Output
R
Output
External interruption request input. Active at the
falling edge.
(Port D)
8-bit I/O port. I/O
can be set in a
unit of single bits.
Can drive 12mA
synk current.
(8 pins)
(Port E)
Bits 0 and 1 are I/O
port; I/O can be set
in a unit of single bits.
Bits 2 and 3 are for
input. Bits 4, 5 and
6 are for output.
(7 pins)
Serial clock I/O.
Serial data output.
Serial data input.
HSYNC counter (CH0) input.
HSYNC counter (CH1) input.
14-bit PWM output.
External interruption
Connects a crystal for
request input. Active at
32kHz timer/counter
the falling edge.
clock oscillation. When
used as an event
counter, input to TEX pin and leave TX pin open.
OSD display 6-bit output.
(6 pins)
–4–
32kHz oscillation
frequency dividing output.
CXP86541/86549/86561
Symbol
I/O
Description
8-bit PWM output.
(4 pins)
Output/I/O/
Output
(Port F)
8-bit output port
and large current
(12mA) N-channel
open drain output.
Lower 4 bits are
midium drive voltage
(12V); upper 4 bits
are 5V drive.
(8 pins)
PG7/INT1
I/O/Input
(Port G)
1-bit I/O port.
External interruption request input.
Active at the falling edge.
EXTAL
Input
XTAL
Output
Connects a crystal for system clock oscillation. When a clock is
supplied externally, input it to EXTAL pin and input a reversed phase
clock to XTAL pin.
RST
Input
System reset; active at Low level.
EXLC
Input
XLC
Output
OSD display clock oscillation I/O. Oscillation frequency is determined
by the external L and C.
PF0/PWM0 to
PF3/PWM3
Output/Output
PF4/SCL0
Output/I/O
PF5/SCL1/
PWM4
Output/I/O/
Output
PF6/SDA0
Output/I/O
PF7/SDA1/
PWM5
I2C bus interface transfer clock I/O.
(2 pins)
8-bit PWM output.
I2C bus interface transfer data I/O.
(2 pins)
8-bit PWM output.
NC
No connected.
VDD
Positive power supply.
Vss
GND. Connect two Vss pins to GND.
–5–
CXP86541/86549/86561
Input/Output Circuit Formats for Pins
Pin
Circuit format
When reset
Port A
Port A data
Port A direction
PA0/AN0
to
PA5/AN5
“0” when reset
IP
Data bus
Input
protection
circuit
RD (Port A)
Port A function selection
“0” when reset
A/D converter
Hi-Z
Input multiplexer
6 pins
Port A
Port A data
Port A direction
“0” when reset
PA6/VSYNC
PA7/HSYNC
Schmitt input
Data bus
Hi-Z
IP
RD (Port A)
HSYNC, VSYNC
Input polarity
2 pins
“0” when reset
Port B
Ports B, G data
Port G
Ports B, G direction
PB0 to PB7
PG7/INT1
“0” when reset
Schmitt input
for PB0, PB1, PB2,
PG7
Data bus
Hi-Z
IP
RD (Ports B, G)
9 pins
INT1
Port F
PWM0 to PWM3
PF0/PWM0
to
PF3/PWM3
Port F function selection
∗
“0” when reset
Port F data
∗ 12V drive voltage
Large current 12mA
“1” when reset
4 pins
–6–
Hi-Z
CXP86541/86549/86561
Pin
Circuit format
When reset
Port D
Port D data
PD0/INT2
PD3/SI
PD4/HS0
PD5/HS1
PD6/RMC
PD7/EC
Port D direction
∗
“0” when reset
Hi-Z
Schmitt input
Data bus
IP
RD (Port D)
6 pins
∗ Large current 12mA
INT2, SI, HS0,
HS1, RMC, EC
Port D
SCK, SO
SIO output enable
Port D data
PD1/SCK
PD2/SO
∗
Port D direction
Hi-Z
“0” when reset
Schmitt input
only for PD1
Data bus
IP
RD (Port D)
2 pins
∗ Large current 12mA
SCK only
Port E
Internal reset signal
PE0/TO/ADJ
Port E data
00
“1” when reset
TO
ADJ16K∗1
ADJ2K∗1
01
10
11
MPX
∗2
Port E function selection (Upper)
Port E function selection (Lower)
“00” when reset
Port E direction
“1” when reset
Data bus
1 pin
∗1 ADJ signals are frequency
dividing outputs for 32kHz
oscillation frequency
IP
adjustment. ADJ2K provides
usage as buzzer output.
∗2 Pull-up resistors approx. 150kΩ
RD (Port E)
–7–
High level
(with
approximately
150kΩ
resistor when
reset)
CXP86541/86549/86561
Pin
Circuit format
When reset
Port E
PWM
Port E function selection
“0” when reset
Port E data
“1” when reset
PE1/PWM
High level
Port E direction
“1” when reset
IP
Data bus
RD (Port E)
1 pin
Port E
32kHz oscillation circuit control
“1” when reset
Schmitt input
INT0
Data bus
RD (Port E)
PE2/TEX/INT0
PE3/TX
Data bus
RD (Port E)
Schmitt input
PE2/
TEX/
INT0
2 pins
IP
Oscillation
halted
Port input
IP
Clock input
PE3/
TX
Port E
YM, YS, I
Output polarity
PE4/YM
PE5/YS
PE6/I
“0” when reset
Port E function selection
Hi-Z
“0” when reset
Port E data
Writing data to output polarity
register and port data register
brings output to active.
3 pins
–8–
CXP86541/86549/86561
Pin
Circuit format
Port F
When reset
SCL, SDA
I2C bus enable
PF4/SCL0
PF5/SCL1/PWM4
PF6/SDA0
PF7/SDA1/PWM5
∗
PWM4, PWM5
Port F function selection
“0” when reset
Hi-Z
Port F data
Schmitt input
“1” when reset
SCL, SDA
(I2C bus circuit)
IP
BUS SW
4 pins
I 2C
To internal
pins
(SCL1 for SCL0)
∗ Large current 12mA
R, G, B
R
G
B
Output polarity
“0” when reset
Hi-Z
Writing data to output
polarity register brings
output to active.
3 pins
Oscillation control
EXLC
XLC
EXLC
2 pins
XLC
EXTAL
XTAL
2 pins
IP
IP
OSD display clock
Oscillation
halted
IP
EXTAL
• Diagram shows the
circuit composition
during oscillation.
• Feedback resistor is
removed during stop mode.
(This device does not
enter stop mode.)
XTAL
Oscillation
Pull-up resistor
RST
1 pin
AA
AA
OP Mask option
Schmitt input
–9–
Low level
CXP86541/86549/86561
Absolute Maximum Ratings
Item
(Vss = 0V reference)
Symbol
Ratings
Unit
V
Supply voltage
VDD
Input voltage
VIN
–0.3 to +7.0
–0.3 to +7.0∗1
VOUT
–0.3 to +7.0∗1
V
–0.3 to +15.0
V
Output voltage
Mid-voltage drive output voltage VOUTP
Remarks
V
High level output current
IOH
–5
mA
High level total output current
∑IOH
–50
mA
Total of all output pins
IOL
15
mA
Ports excluding large current output
(value per pin)
IOLC
20
mA
Large current output ports
(value per pin∗2)
Low level total output current
∑IOL
130
mA
Total of all output pins
Operating temperature
Topr
–20 to +75
°C
Storage temperature
Tstg
–55 to +150
°C
Allowable power dissipation
PD
375
mW
Low level output current
SDIP-52P-01
∗1 VIN and VOUT should not exceed VDD + 0.3V.
∗2 The large current output port is Port D (PD) and Port F (PF).
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding those conditions may
adversely affect the reliability of the LSI.
Recommended Operating Conditions
Item
Supply voltage
High level input
voltage
Symbol
(Vss = 0V reference)
Min.
Max.
Unit
4.5
5.5
V
Guaranteed operation range for 1/2 and 1/4
frequency dividing modes
3.5
5.5
V
Guaranteed operation range for 1/16 frequency
dividing mode or sleep mode
2.7
5.5
V
—
—
V
Guaranteed operation range for TEX mode
Guaranteed data hold range for stop mode∗5
VIH
0.7VDD
VDD
V
∗1
VIHS
0.8VDD
VDD
V
∗2
V
VDD
Remarks
VIL
0
0.3VDD
V
EXTAL pin∗3, TEX pin∗4
∗1
VILS
0
0.2VDD
V
∗2
VILEX
–0.3
0.4
V
EXTAL pin∗3, TEX pin∗4
Operating temperature Topr
–20
+75
°C
VIHEX
Low level input
voltage
∗1
∗2
∗3
∗4
∗5
VDD – 0.4 VDD + 0.3
PA1 to PA5, PB3 to PB7, PD2, PE0, PE1, PE3, SCL0, SCL1, SDA0, SDA1 pins
VSYNC, HSYNC, INT2, SCK, SI, HS0, HS1, RMC, EC, INT0, INT1, RST, PB0, PB1, PB2 pins
Specifies only during external clock input.
Specifies only during external event count input.
This device does not enter the stop mode.
– 10 –
CXP86541/86549/86561
Electrical Characteristics
(Ta = –20 to +75°C, Vss = 0V reference)
DC characteristics
Item
High level output
voltage
Low level output
voltage
Symbol
VOH
VOL
Pins
PA, PB, PD,
PE0 to PE1,
PE4 to PE6, PG7,
R, G, B
Input current
IIHT
IILT
Min.
Typ.
Max.
Unit
VDD = 4.5V, IOH = –0.5mA
4.0
V
VDD = 4.5V, IOH = –1.2mA
3.5
V
PA, PB, PD, PE0 to PE1, VDD = 4.5V, IOL = 1.8mA
PE4 to PE6, PF0 to PF3,
VDD = 4.5V, IOL = 3.6mA
PG7, R, G, B
0.4
V
0.6
V
PD, PF
VDD = 4.5V, IOL = 12.0mA
1.5
V
PF4 to PF7
(SCL0, SCL1,
SDA0, SDA1)
VDD = 4.5V, IOL = 3.0mA
0.4
V
VDD = 4.5V, IOL = 4.0mA
0.6
V
IIHE
IILE
Conditions
EXTAL
TEX
VDD = 5.5V, VIH = 5.5V
0.5
40
µA
VDD = 5.5V, VIL = 0.4V
–0.5
–40
µA
VDD = 5.5V, VIH = 5.5V
0.1
10
µA
–0.1
–10
µA
–1.5
–400
µA
±10
µA
VDD = 5.5V, VIL = 0.4V
IILR
RST∗1
I/O leakage current
IIZ
VDD = 5.5V,
PA, PB, PD, PE,
PG7, R, G, B, RST∗1 VI = 0, 5.5V
Open drain I/O
leakage current
(in N-ch Tr off state)
ILOH
I2C bus switch
connection impedance
(in output Tr off state)
RBS
PF0 to PF3
VDD = 5.5V, VOH = 12.0V
50
µA
PF4 to PF7
VDD = 5.5V, VOH = 5.5V
10
µA
SCL0: SCL1
SDA0: SDA1
VDD = 4.5V
VSCL0 = VSCL1 = 2.25V
VSDA0 = VSDA1 = 2.25V
120
Ω
18
28
mA
30
80
µA
1.2
2.1
mA
12
35
µA
—
—
µA
1/2 frequency dividing mode
VDD = 5.5V,
16MHz crystal oscillation
(C1 = C2 = 15pF)
IDD1
VDD = 3.3V,
32MHz crystal oscillation
(C1 = C2 = 47pF)
IDD2
SLEEP mode
Supply current∗2
IDDS1
IDDS2
IDDS3
VDD
VDD = 5.5V,
16MHz crystal oscillation
(C1 = C2 = 15pF)
VDD = 3.3V,
32MHz crystal oscillation
(C1 = C2 = 47pF)
STOP mode∗3
VDD = 5.5V,
termination of 16MHz
and 32MHz oscillation
– 11 –
—
CXP86541/86549/86561
Item
Input capacitance
Symbol
CIN
Pins
PA, PB, PD,PE0 to
PE3, R, G, B, PF4 to
PF7 ,PG7 ,EXTAL,
TEX, EXLC, RST
Conditions
Clock 1 MHz
0V other than the
measured pins
Min.
Typ.
Max.
Unit
10
20
pF
∗1 For RST pin, specifies the input current when pull-up resistance is selected, and specifies the leakage
current when non-resistor is selected.
∗2 When all output pins are left open. Specifies only when the OSD oscillation is halted.
∗3 This device does not enter the stop mode.
– 12 –
CXP86541/86549/86561
AC Characteristics
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
(1) Clock timing
Item
Symbol
System clock frequency
fC
Event count input clock rise
and fall times
tXL,
tXH
tCR,
tCF
tEH,
tEL
tER,
tEF
System clock frequency
fC
Event count input clock
pulse width
tTL,
tTH
tTR,
tTF
System clock input pulse width
System clock input rise and fall
times
Event count input clock pulse
width
Event count input clock rise
and fall times
Pins
Conditions
Min.
XTAL
EXTAL
Fig. 1, Fig.2
8
EXTAL
Fig. 1, Fig.2
External clock drive
28
EXTAL
Fig. 1, Fig.2
External clock drive
EC
Fig. 3
EC
Fig. 3
TEX
TX
VDD = 2.7 to 5.5 V
Fig. 2 (32kHz clock
applied conditions)
TEX
Fig. 3
TEX
Fig. 3
Typ.
Max
Unit
16
MHz
ns
ns
200
4tsys∗1
ns
ms
20
kHz
32.768
µs
10
20
∗1 Indicates three values according to the contents of the clock control register (CLC: 00FEh) upper 2 bits
(CPU clock selection).
tsys (ns) = 2000/fc (Upper 2 bits = “00”), 4000/fc (Upper 2 bits = “01”), 16000/fc (Upper 2 bits = “11”)
Fig. 1. Clock timing
1/fc
VDD – 0.4V
EXTAL
0.4V
tXH
tCF
tXL
tCR
AAAAAAAAA AAAA
AAAAA
AAAA
AAAA
AAAAAAAAA AAAA
Fig.2. Clock applied conditions
Crystal oscillation
Ceramic oscillation
EXTAL
C1
External clock
EXTAL
XTAL
C2
32kHz clock applied condition
Crystal oscillation
TEX
XTAL
74HC04
TX
C2
C1
Fig. 3. Event count clock timing
0.8VDD
TEX
EC
0.2VDD
tEF
tTF
tEH
tTH
– 13 –
tEL
tTL
tER
tTR
ms
CXP86541/86549/86561
(2) Serial transfer
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Pins
tKCY
SCK
SCK High and Low level
widths
tKH
tKL
SCK
SI input setup time
(for SCK ↑)
tSIK
SI
SI hold time
(for SCK ↑)
tKSI
SI
SCK ↓ → SO delay time
tKSO
SO
SCK cycle time
Conditions
Min.
Input mode
Max.
1000
ns
8000/fc
ns
400
ns
4000/fc – 50
ns
SCK input mode
100
ns
SCK output mode
200
ns
SCK input mode
200
ns
SCK output mode
100
ns
Output mode
SCK input mode
SCK output mode
SCK input mode
200
ns
SCK output mode
100
ns
Note) The load of SCK output mode and SO output delay time is 50pF + 1TTL.
Fig. 4. Serial transfer timing
tKCY
tKL
tKH
0.8VDD
SCK
0.2VDD
tSIK
tKSI
0.8VDD
Input data
SI
Unit
0.2VDD
tKSO
0.8VDD
SO
Output data
0.2VDD
– 14 –
CXP86541/86549/86561
(3) A/D converter
Item
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Symbol
Max.
Unit
Resolution
8
Bits
Linearity error
±3
LSB
Zero transition
voltage
VZT∗1
Full-scale transition
voltage
VFT∗2
Conversion time
Sampling time
tCONV
tSAMP
Analog input voltage
VIAN
Pins
Conditions
Ta = 25°C
VDD = 5.0V
Vss = 0V
Min.
Typ.
–10
10
70
mV
4910
4970
5030
mV
26/fADC∗3
6/fADC∗3
AN0 to AN5
0
µs
µs
VDD
V
Fig. 5. Definitions for A/D converter terms
Digital conversion value
FFh
FEh
∗1 VZT: Value at which the digital conversion value changes
from 00h to 01h and vice versa.
∗2 VFT: Value at which the digital conversion value changes
from FEh to FFhand vice versa.
∗3 fADC indicates the below values due to the contents of bit
6 (CKS) of the A/D control register (ADC: 00F6h):
Linearity error
01h
00h
fADC = fc (CKS = “0”), fc/2 (CKS = “1”)
VZT
VFT
Analog input
– 15 –
CXP86541/86549/86561
(4) Interruption, reset input (Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
External interruption High,
Low level widths
tIH
tIL
INT0
INT1
INT2
1
µs
Reset input Low level width
tRSL
RST
32/fc
µs
Fig. 6. Interruption input timing
tIH
INT0
INT1
INT2
(falling edge)
tIL
0.8VDD
0.2VDD
Fig. 7. RST input timing
tRSL
RST
0.2VDD
– 16 –
CXP86541/86549/86561
(5) I2C bus timing
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
0
100
kHz
SCL clock frequency
fSLC
SCL
Bus-free time before starting transfer
tBUF
tHD; STA
tLOW
tHIGH
tSU; STA
tHD; DAT
tSU; DAT
tR
tF
tSU; STO
SDA, SCL
4.7
µs
SDA, SCL
4.0
µs
SCL
4.7
µs
SCL
4.0
µs
SDA, SCL
µs
SDA, SCL
4.7
0∗1
SDA, SCL
250
ns
Hold time for starting transfer
Clock Low level width
Clock High level width
Setup time for repeated transfers
Data hold time
Data setup time
SDA, SCL rise time
SDA, SCL fall time
Setup time for transfer completion
µs
SDA, SCL
1
µs
SDA, SCL
300
ns
SDA, SCL
4.7
µs
∗1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it.
Fig. 8. I2C bus transfer timing
SDA
tBUF
tR
tF
tHD; STA
SCL
tHD; STA
tSU; STA
P
S
tLOW
tHD; DAT
tHIGH
St
tSU; DAT
tSU; STO
P
Fig. 9. I2C bus device recommended circuit
I2C bus
device
RS
I2C bus
device
RS RS
R S RP
RP
SDA0
(or SDA1)
SCL0
(or SCL1)
• A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
• The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance can be used to reduce the spike noise caused
by CRT flashover.
– 17 –
CXP86541/86549/86561
(6) OSD timing
(Ta = –20 to +75°C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max
Unit
28∗1
MHz
OSD clock frequency
fOSC
EXLC
XLC
Fig. 11
4
HSYNC pulse width
tHWD
tVWD
HSYNC
Fig. 10
2
VSYNC
Fig. 10
1
HSYNC afterwrite rise and fall
times
tHCG
HSYNC
Fig. 10
200
ns
VSYNC beforewrite rise and fall
times
tVCG
VSYNC
Fig. 10
1.0
µs
VSYNC pulse width
µs
H∗2
∗1 The maximum value of fosc is specified with the following equation.
fosc [max] ≤ fc × 1.9
∗2 H indicates 1HSYNC period.
Fig. 10. OSD timing
tHWD
tHCG
0.8VDD
HSYNC
For OSD I/O polarity register
(OPOL: 01FEh)
bit 7 at “0”
0.2VDD
tVCG
tVWD
0.8VDD
VSYNC
For OSD I/O polarity register
(OPOL: 01FEh)
bit 6 at “0”
0.2VDD
Fig. 11. LC oscillation circuit connection
EXLC
XLC
R∗1
L
C2
C1
∗1 The series resistor for XLC is used to reduce the frequency of occurrence of the undesired radiation.
– 18 –
CXP86541/86549/86561
Appendix
Fig. 12. Recommended oscillation circuit
AAAA
AAAA
AAAAA
AAAA
AAAA
AAAAA
AAAA AAAA
AAAAA
AA
A
A
(i) Main clock
EXTAL
XTAL
(ii) Main clock
(iii) Sub clock
EXTAL
TEX
XTAL
Rd
C1
Rd
TX
Rd
C2
C2
C1
C1 C2
Manufacture
Model
MURATA MFG
CO., LTD.
RIVER
ELETEC CO.,
LTD.
fc (MHz)
CSA10.0MTZ
10.0
CSA12.0MTZ
12.0
CSA16.00MXZ040
CST10.0MTW∗
16.0
10.0
C1 (pF)
C2 (pF)
30
30
5
5
30
30
12.0
CST16.00MXW0C1∗
16.0
5
5
8.0
18
18
12.0
12
12
16.0
10
10
8.0
10
10
12.0
5
5
16.0
Open
Open
32.768kHz
30
33
HC-49/U (-S)
KINSEKI LTD.
P3
Circuit example
(i)
CST12.0MTW∗
HC-49/U03
Rd (Ω)
0 ∗1
(ii)
330 ∗1
(i)
0 ∗1
120k
(iii)
∗ Models with an astarisk have the built-in ground capacitance (C1, C2).
∗1 The series resistor for XTAL (Rd = 500Ω or less) can reduce the effect of the noise caused by the
electrostatic discharge.
Mask Option Table
Item
Reset pin pull-up resistor
Content
Non-existent
– 19 –
Existent
CXP86541/86549/86561
Fig. 13. Characteristic curve
IDD vs. VDD
IDD vs. fc
(fc = 16MHz, Ta = 25°C, Typical)
(VDD = 5V, Ta = 25°C, Typical)
100
1/2 dividing mode
1/4 dividing mode
10
15
IDD – Supply current [mA]
Sleep mode
1
10
1/4 dividing mode
0.1
32kHz operation mode
5
32kHz sleep mode
1/16 dividing mode
0.01
Sleep mode
1
0
2
3
6
7
4
5
VDD – Supply voltage [mA]
0
5
10
Frequency [MHz]
Parameter curve for OSD oscillator L vs. C
(Analytically calculated value)
100
10
L – Inductance [µH]
IDD – Supply current [mA]
1/16 dividing mode
1/2 dividing mode
16MHz
20MHz
24MHz
28MHz
30MHz
1
fOSC =
1
2π√ LC
C = C1//C2
0.1
0.01
0
10
20
30
40
50
60
70
C1, C2 – Capacitance [pF]
– 20 –
80
90 100
15
CXP86541/86549/86561
Package Outline
Unit: mm
+ 0.1
.05
0.25 – 0
52PIN SDIP (PLASTIC) 600mil
+ 0.4
47.0 – 0.1
15.24
+ 0.3
13.5 – 0.1
27
52
0° to 15°
26
1
5.0 MIN
2.8 MIN
0.51 MIN
1.778
0.5 ± 0.1
+ 0.1
0.9 – 0.05
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SDIP-52P-01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SDIP052-P-0600-A
LEAD MATERIAL
COPPER
JEDEC CODE
PACKAGE WEIGHT
– 21 –