STANFORD SCA-3

Product Description
Stanford Microdevices’ SCA-3 is a high performance Gallium
Arsenide Heterojunction Bipolar Transistor MMIC Amplifier. A
Darlington configuration is utilized for broadband performance
up to 5GHz. The heterojunction increases breakdown voltage
and minimizes leakage current between junctions. Cancellation
of emitter junction non-linearities results in higher suppression of
intermodulation products. Typical IP3 at 850 MHz with 65mA is
32.8 dBm.
Preliminary
Preliminary
SCA-3
DC-5 GHz, Cascadable
GaAs HBT MMIC Amplifier
NGA-489 Recommended for New Designs
These unconditionally stable amplifiers provide 13.7 dB of gain
and 17.3 dBm of 1dB compressed power and require only a
single positive voltage supply. Only 2 DC-blocking capacitors,
a bias resistor and an optional inductor are needed for
operation. This MMIC is an ideal choice for wireless applications such as cellular, PCS, CDPD, wireless data and SONET.
16
Product Features
• High Output IP3: 32.8 dBm @ 850 MHz
• Cascadable 50 Ohm Gain Block
• Patented GaAs HBT Technology
• Operates From Single Supply
Small Signal Gain vs. Frequency @ ID=65mA
15
14
dB
13
12
11
10
0
1
2
3
Frequency (GHz)
4
5
6
Applications
• Cellular, PCS, CDPD, Wireless Data, SONET
Electrical Specifications
Sy mbol
Parameters: Test Conditions:
Z0 = 50 Ohms, ID = 65GHz
mA, T = 25°C
P1dB
Output Pow er at 1dB Compression
f = 850 MHz
f = 1950 MHz
f = 2400 MHz
dBm
dBm
dBm
IP3
Third Order Intercept Point
Pow er out per tone = 0 dBm
f = 850 MHz
f = 1950 MHz
f = 2400 MHz
dBm
dBm
dBm
29.8
32.8
30.3
29.1
Small Signal Gain
f = 850 MHz
f = 1950 MHz
f = 2400 MHz
dB
dB
dB
12.3
S21
13.7
13.6
13.6
Bandw idth
Units
(Determined by S11, S22 Values)
Min.
Ty p.
17.3
17.6
17.4
MHz
5000
S11
Input VSWR
f = DC-5000 MHz
-
1.7:1
S22
Output VSWR
f = DC-5000 MHz
-
1.5:1
S12
Reverse Isolation
f = 850 MHz
f = 1950 MHz
f = 2400 MHz
dB
dB
dB
18.3
18.4
18.4
NF
Noise Figure, ZS = 50 Ohms
f = 1950 MHz
dB
5.6
VD
Device Voltage
Rth,j-l
V
Thermal Resistance (junction - lead)
o
C/W
Max.
4.4
4.9
5.4
224
The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions.
Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford
Microdevices product for use in life-support devices and/or systems.
Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
1
http://www.stanfordmicro.com
EDS-101392 Rev A
Preliminary
Preliminary
SCA-3 DC-5GHz Cascadable MMIC Amplifier
Absolute Maximum Ratings
Operation of this device above any one of these parameters
may cause permanent damage.
Bias Conditions should also satisfy the following expression:
IDVD (max) < (TJ - TOP)/Rth, j-l
Parameter
Supply Current
Operating Temperature
M aximum Input Pow er
Storage Temperature Range
Operating Junction Temperature
Parameter
500 MH z
Gai n
Noi se Fi gure
Output IP3
Output P1dB
Input Return Loss
Isolati on
850 MH z
Gai n
Noi se Fi gure
Output IP3
Output P1dB
Input Return Loss
Isolati on
1950 MH z
Gai n
Noi se Fi gure
Output IP3
Output P1dB
Input Return Loss
Isolati on
2400 MH z
Gai n
Output IP3
Output P1dB
Input Return Loss
Isolati on
Ty pical
Value
Unit
120
mA
-40 to +85
C
+16
dBm
-40 to +150
C
+175
C
Test C ondition
25°C
U nit
13.7
5.4
32.3
17.1
12.8
18.2
dB
dB ZS = 50 Ohms
dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm
dB m
dB
dB
13.7
5.5
32.8
17.3
12.3
18.3
dB
dB ZS = 50 Ohms
dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm
dB m
dB
dB
13.6
5.6
30.3
17.6
12.9
18.2
dB
dB ZS = 50 Ohms
dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm
dB m
dB
dB
13.6
29.1
17.4
15.2
18.4
dB
dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm
dB m
dB
dB
(ID = 65 mA, unless otherwise noted)
*NOTE: While the SCA-3 can be operated at different bias currents, 65 mA is the recommended
bias for lower junction temperature and longer life. This reflects typical operating conditions
which we have found to be an optimal balance between high IP3 and MTTF. In general, MTTF
is improved to more than 100,000 hours when biasing at 65 mA and operating up to 85°C ambient
temperature.
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
2
http://www.stanfordmicro.com
EDS-101392 Rev A
Preliminary
Preliminary
SCA-3 DC-5GHz Cascadable MMIC Amplifier
Junction Temp vs. Dissipated Power
MTTF vs. Dissipated Power
1.E+07
Device Lead Temp = +85C
Device Lead Temp = +85 C
230
1.E+06
MTTF (hrs)
Junction Temperature (°C)
250
210
1.E+05
190
+175C
1.E+04
170
150
0.35
0.45
0.55
Pdiss (W)
1.E+03
0.35
Output IP3 vs. ID vs. Frequency
0.45
0.55
Pdiss (W)
Output P1dB vs. ID vs. Frequency
40
20
P1dB_65mA
IP3_65mA
P1dB_80mA
19
IP3_80mA
P1dB_100mA
35
IP3_100mA
dBm
dBm
18
17
30
16
25
15
0.5
1.5
GHz
2.5
0.5
3.5
NF vs. ID vs. Frequency
6 .5
15
6
14
dB
dB
5 .5
N F_65m A
N F_80m A
NF_100mA
5
0.5
1
1 .5
2
GHz
2.5
3.5
Small Signal Gain vs. ID vs. Frequency
G_65mA
G_80mA
G_100mA
13
12
0.5
GHz
522 Almanor Ave., Sunnyvale, CA 94085
1.5
1.5
2.5
3.5
GHz
Phone: (800) SMI-MMIC
3
http://www.stanfordmicro.com
EDS-101392 Rev A
Preliminary
Preliminary
SCA-3 DC-5GHz Cascadable MMIC Amplifier
Pin #
Function
1
RF IN
RF input pin. This pin requires the use of an external DC blocking capacitor
chosen for the frequency of operation.
Description
2
GND
Connection to ground. Use via holes for best performance to reduce lead
inductance. Place vias as close to ground leads as possible.
3
RF OUT/Vcc
4
GND
RF output and bias pin. Bias should be supplied to this pin through an external
series resistor and RF choke inductor. Because DC biasing is present on this
pin, a DC blocking capacitor should be used in most applications (see
application schematic). The supply side of the bias netw ork should be w ell
bypassed.
Same as Pin 2.
Application Schematic for Operation at 850 MHz
R ecommended B ias R esistor Values
Supply Voltage(Vs)
8V
9V
12V
15V
R bias (Ohms)
@ 65 mA
47
62
110
160
R bias (Ohms)
@ 80 mA
39
51
91
130
R bias (Ohms)
@ 100 mA
30
43
68
100
1uF
68pF
Rbias
VS
33nH
50 ohm
microstrip
50 ohm
microstrip
2
1
3
100pF
4
100pF
Application Schematic for Operation at 1950 MHz
1uF
22pF
Rbias
VS
22nH
50 ohm
microstrip
50 ohm
microstrip
2
1
68pF
522 Almanor Ave., Sunnyvale, CA 94085
3
4
Phone: (800) SMI-MMIC
4
68pF
http://www.stanfordmicro.com
EDS-101392 Rev A
Preliminary
Preliminary
SCA-3 DC-5GHz Cascadable MMIC Amplifier
S21, ID=65mA, T=25°C
S12, ID=65mA, T=25°C
16
-10
15
-15
14
dB
dB -20
13
12
-25
11
10
-30
0
1
2
3
4
Frequency GHz
5
6
0
1
S11, ID=65mA, T=25°C
3
4
Frequency GHz
5
6
5
6
S22, ID=65mA, T=25°C
0
0
dB
2
-5
-5
-10
-10
dB
-15
-15
-20
-20
-25
-25
-30
-30
0
1
2
3
4
5
6
0
Frequency GHz
2
3
4
Frequency GHz
S22, ID=65mA, Ta=25°C
S11, ID=65mA, Ta=25°C
Freq. Min = 0.05 GHz
Freq. Max = 6.0 GHz
F = 6.0 GHz
522 Almanor Ave., Sunnyvale, CA 94085
1
Freq. Min = 0.05 GHz
Freq. Max = 6.0 GHz
F = 6.0 GHz
Phone: (800) SMI-MMIC
5
http://www.stanfordmicro.com
EDS-101392 Rev A
Preliminary
Preliminary
SCA-3 DC-5GHz Cascadable MMIC Amplifier
Caution: ESD Sensitive
Part Number Ordering Information
Appropriate precautions in handling, packaging and
testing devices must be observed.
Part Symbolization
The part will be symbolized with a “C3” designator on
the top surface of the package.
Part N umber
R eel Siz e
D ev ices/R eel
SC A-3
7"
1000
Outline Drawing
1
2
The data shown was taken on a 31 mil thick FR-4 board with
1 ounce of copper on both sides.
The board was mounted to a baseplate with 3 screws as
shown. The screws bring the top side copper temperature to
the same value as the baseplate.
3
C3
Mounting Instructions
4
1. Use 1 or 2 ounce copper, if possible.
2. Solder the copper pad on the backside of the device
package to the ground plane.
3. Use a large ground pad area with many plated throughholes as shown.
4. If possible, use at least one screw no more than 0.2 inch
from the device package to provide a low thermal resistance
path to the baseplate of the package.
5. Thermal resistance from ground lead to screws is
2 deg. C/W.
PCB Pad Layout
522 Almanor Ave., Sunnyvale, CA 94085
Phone: (800) SMI-MMIC
6
http://www.stanfordmicro.com
EDS-101392 Rev A