Product Description Stanford Microdevices SCA-3 is a high performance Gallium Arsenide Heterojunction Bipolar Transistor MMIC Amplifier. A Darlington configuration is utilized for broadband performance up to 5GHz. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction non-linearities results in higher suppression of intermodulation products. Typical IP3 at 850 MHz with 65mA is 32.8 dBm. Preliminary Preliminary SCA-3 DC-5 GHz, Cascadable GaAs HBT MMIC Amplifier NGA-489 Recommended for New Designs These unconditionally stable amplifiers provide 13.7 dB of gain and 17.3 dBm of 1dB compressed power and require only a single positive voltage supply. Only 2 DC-blocking capacitors, a bias resistor and an optional inductor are needed for operation. This MMIC is an ideal choice for wireless applications such as cellular, PCS, CDPD, wireless data and SONET. 16 Product Features High Output IP3: 32.8 dBm @ 850 MHz Cascadable 50 Ohm Gain Block Patented GaAs HBT Technology Operates From Single Supply Small Signal Gain vs. Frequency @ ID=65mA 15 14 dB 13 12 11 10 0 1 2 3 Frequency (GHz) 4 5 6 Applications Cellular, PCS, CDPD, Wireless Data, SONET Electrical Specifications Sy mbol Parameters: Test Conditions: Z0 = 50 Ohms, ID = 65GHz mA, T = 25°C P1dB Output Pow er at 1dB Compression f = 850 MHz f = 1950 MHz f = 2400 MHz dBm dBm dBm IP3 Third Order Intercept Point Pow er out per tone = 0 dBm f = 850 MHz f = 1950 MHz f = 2400 MHz dBm dBm dBm 29.8 32.8 30.3 29.1 Small Signal Gain f = 850 MHz f = 1950 MHz f = 2400 MHz dB dB dB 12.3 S21 13.7 13.6 13.6 Bandw idth Units (Determined by S11, S22 Values) Min. Ty p. 17.3 17.6 17.4 MHz 5000 S11 Input VSWR f = DC-5000 MHz - 1.7:1 S22 Output VSWR f = DC-5000 MHz - 1.5:1 S12 Reverse Isolation f = 850 MHz f = 1950 MHz f = 2400 MHz dB dB dB 18.3 18.4 18.4 NF Noise Figure, ZS = 50 Ohms f = 1950 MHz dB 5.6 VD Device Voltage Rth,j-l V Thermal Resistance (junction - lead) o C/W Max. 4.4 4.9 5.4 224 The information provided herein is believed to be reliable at press time. Stanford Microdevices assumes no responsibility for inaccuracies or omissions. Stanford Microdevices assumes no responsibility for the use of this information, and all such information shall be entirely at the users own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. Stanford Microdevices does not authorize or warrant any Stanford Microdevices product for use in life-support devices and/or systems. Copyright 2000 Stanford Microdevices, Inc. All worldwide rights reserved. 522 Almanor Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC 1 http://www.stanfordmicro.com EDS-101392 Rev A Preliminary Preliminary SCA-3 DC-5GHz Cascadable MMIC Amplifier Absolute Maximum Ratings Operation of this device above any one of these parameters may cause permanent damage. Bias Conditions should also satisfy the following expression: IDVD (max) < (TJ - TOP)/Rth, j-l Parameter Supply Current Operating Temperature M aximum Input Pow er Storage Temperature Range Operating Junction Temperature Parameter 500 MH z Gai n Noi se Fi gure Output IP3 Output P1dB Input Return Loss Isolati on 850 MH z Gai n Noi se Fi gure Output IP3 Output P1dB Input Return Loss Isolati on 1950 MH z Gai n Noi se Fi gure Output IP3 Output P1dB Input Return Loss Isolati on 2400 MH z Gai n Output IP3 Output P1dB Input Return Loss Isolati on Ty pical Value Unit 120 mA -40 to +85 C +16 dBm -40 to +150 C +175 C Test C ondition 25°C U nit 13.7 5.4 32.3 17.1 12.8 18.2 dB dB ZS = 50 Ohms dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm dB m dB dB 13.7 5.5 32.8 17.3 12.3 18.3 dB dB ZS = 50 Ohms dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm dB m dB dB 13.6 5.6 30.3 17.6 12.9 18.2 dB dB ZS = 50 Ohms dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm dB m dB dB 13.6 29.1 17.4 15.2 18.4 dB dBm Tone spaci ng = 1 MHz, Pout per tone = 0 dBm dB m dB dB (ID = 65 mA, unless otherwise noted) *NOTE: While the SCA-3 can be operated at different bias currents, 65 mA is the recommended bias for lower junction temperature and longer life. This reflects typical operating conditions which we have found to be an optimal balance between high IP3 and MTTF. In general, MTTF is improved to more than 100,000 hours when biasing at 65 mA and operating up to 85°C ambient temperature. 522 Almanor Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC 2 http://www.stanfordmicro.com EDS-101392 Rev A Preliminary Preliminary SCA-3 DC-5GHz Cascadable MMIC Amplifier Junction Temp vs. Dissipated Power MTTF vs. Dissipated Power 1.E+07 Device Lead Temp = +85C Device Lead Temp = +85 C 230 1.E+06 MTTF (hrs) Junction Temperature (°C) 250 210 1.E+05 190 +175C 1.E+04 170 150 0.35 0.45 0.55 Pdiss (W) 1.E+03 0.35 Output IP3 vs. ID vs. Frequency 0.45 0.55 Pdiss (W) Output P1dB vs. ID vs. Frequency 40 20 P1dB_65mA IP3_65mA P1dB_80mA 19 IP3_80mA P1dB_100mA 35 IP3_100mA dBm dBm 18 17 30 16 25 15 0.5 1.5 GHz 2.5 0.5 3.5 NF vs. ID vs. Frequency 6 .5 15 6 14 dB dB 5 .5 N F_65m A N F_80m A NF_100mA 5 0.5 1 1 .5 2 GHz 2.5 3.5 Small Signal Gain vs. ID vs. Frequency G_65mA G_80mA G_100mA 13 12 0.5 GHz 522 Almanor Ave., Sunnyvale, CA 94085 1.5 1.5 2.5 3.5 GHz Phone: (800) SMI-MMIC 3 http://www.stanfordmicro.com EDS-101392 Rev A Preliminary Preliminary SCA-3 DC-5GHz Cascadable MMIC Amplifier Pin # Function 1 RF IN RF input pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation. Description 2 GND Connection to ground. Use via holes for best performance to reduce lead inductance. Place vias as close to ground leads as possible. 3 RF OUT/Vcc 4 GND RF output and bias pin. Bias should be supplied to this pin through an external series resistor and RF choke inductor. Because DC biasing is present on this pin, a DC blocking capacitor should be used in most applications (see application schematic). The supply side of the bias netw ork should be w ell bypassed. Same as Pin 2. Application Schematic for Operation at 850 MHz R ecommended B ias R esistor Values Supply Voltage(Vs) 8V 9V 12V 15V R bias (Ohms) @ 65 mA 47 62 110 160 R bias (Ohms) @ 80 mA 39 51 91 130 R bias (Ohms) @ 100 mA 30 43 68 100 1uF 68pF Rbias VS 33nH 50 ohm microstrip 50 ohm microstrip 2 1 3 100pF 4 100pF Application Schematic for Operation at 1950 MHz 1uF 22pF Rbias VS 22nH 50 ohm microstrip 50 ohm microstrip 2 1 68pF 522 Almanor Ave., Sunnyvale, CA 94085 3 4 Phone: (800) SMI-MMIC 4 68pF http://www.stanfordmicro.com EDS-101392 Rev A Preliminary Preliminary SCA-3 DC-5GHz Cascadable MMIC Amplifier S21, ID=65mA, T=25°C S12, ID=65mA, T=25°C 16 -10 15 -15 14 dB dB -20 13 12 -25 11 10 -30 0 1 2 3 4 Frequency GHz 5 6 0 1 S11, ID=65mA, T=25°C 3 4 Frequency GHz 5 6 5 6 S22, ID=65mA, T=25°C 0 0 dB 2 -5 -5 -10 -10 dB -15 -15 -20 -20 -25 -25 -30 -30 0 1 2 3 4 5 6 0 Frequency GHz 2 3 4 Frequency GHz S22, ID=65mA, Ta=25°C S11, ID=65mA, Ta=25°C Freq. Min = 0.05 GHz Freq. Max = 6.0 GHz F = 6.0 GHz 522 Almanor Ave., Sunnyvale, CA 94085 1 Freq. Min = 0.05 GHz Freq. Max = 6.0 GHz F = 6.0 GHz Phone: (800) SMI-MMIC 5 http://www.stanfordmicro.com EDS-101392 Rev A Preliminary Preliminary SCA-3 DC-5GHz Cascadable MMIC Amplifier Caution: ESD Sensitive Part Number Ordering Information Appropriate precautions in handling, packaging and testing devices must be observed. Part Symbolization The part will be symbolized with a C3 designator on the top surface of the package. Part N umber R eel Siz e D ev ices/R eel SC A-3 7" 1000 Outline Drawing 1 2 The data shown was taken on a 31 mil thick FR-4 board with 1 ounce of copper on both sides. The board was mounted to a baseplate with 3 screws as shown. The screws bring the top side copper temperature to the same value as the baseplate. 3 C3 Mounting Instructions 4 1. Use 1 or 2 ounce copper, if possible. 2. Solder the copper pad on the backside of the device package to the ground plane. 3. Use a large ground pad area with many plated throughholes as shown. 4. If possible, use at least one screw no more than 0.2 inch from the device package to provide a low thermal resistance path to the baseplate of the package. 5. Thermal resistance from ground lead to screws is 2 deg. C/W. PCB Pad Layout 522 Almanor Ave., Sunnyvale, CA 94085 Phone: (800) SMI-MMIC 6 http://www.stanfordmicro.com EDS-101392 Rev A