TMT T14L1024A-10J

tm
TE
CH
Preliminary T14L1024A
SRAM
128K X 8 HIGH SPEED
CMOS STATIC RAM
FEATURES
GENERAL DESCRIPTION
The T14L1024A is a one-megabit density, fast
static random access memory organized as 131,072
• Fast Address Access Times : 10/12/15ns
• Single 3.3V ±0.3V power supply
words by 8 bits. It is designed for use in high
performance memory applications such as main
• Low Power Consumption : 110/105/100mA
• TTL I/O compatible
• 2.0V data retention mode
• Automatic power-down when deselected
• Available packages :
32-pin 300 mil DIP/SOJ & 32-pin SOP/TSOP-I
• Industry Standard Pin Assignment
memory storage and high speed communication
buffers. Fabricated using high performance CMOS
technology, access times down to 10ns are achieved.
Memory expansion by banking is easily
accomplished using the chip enable pins CE1 and
CE2. This device is packaged in a standard 32-pin
300 mil DIP/SOJ and 32-pin SOP/TSOP-I.
BLOCK DIAGRAM
Vcc
Vss
A0
..
.
.
A16
PIN CONFIGURATION
A15
A14
A13
A12
WE
CE2
A11
VCC
NC
A10
A9
A8
A7
A6
A5
A4
NC
1
32
Vcc
A10
2
31
A11
A9
3
30
CE2
A8
4
29
WE
A7
5
28
A12
A6
6
27
A13
A5
7
26
A14
A4
8
25
A15
24
OE
23
A16
DIP
/
SOJ
/
SOP
A3
9
A2
10
A1
11
22
CE1
A0
12
21
I/O7
I/O0
13
20
I/O6
I/O1
14
19
I/O5
I/O2
15
18
I/O4
Vss
16
17
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TSOP-I
DECODER
CORE
ARRAY
CE1
CE2
DATA I/O
WE
OE
I/O0
.
.
.
I/O7
PIN DESCRIPTION
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A16
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
VSS
I/O2
I/O1
I/O0
A0
A1
A2
A3
TM Technology, Inc. reserves the right
to change products or specifications without notice.
SYMBOL
A0 - A16
I/O0 - I/O7
/CE1,CE2
/WE
/OE
Vcc
Vss
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Select Inputs
Write Enable
Output Enable
Power Supply
Ground
PART NUMBER EXAMPLES
PACKAGE
SPEED
T14L1024A-10J
SOJ 300mil
10ns
T14L1024A-10P TSOP-I 8x13.4mm 10ns
T14L1024A-10H
TSOP-I 8x20mm 10ns
10ns
T14L1024A-10N
DIP 300mil
T14L1024A-10D
SOP
10ns
P. 1
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
DC CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS
PARAMETER
Power Supply Voltage
Input Voltage
Output Voltage
Operating Temperatrue
Storage Temperature
Power Dissipation
Short Circuit Output Current
SYM
Vcc
VIN
VOUT
TOPR
TSTG
PD
IOUT
RATING
-0.5 to 4.6
-0.5 to Vcc+0.5
-0.5 to Vcc+0.5
0 to +70
-55 to +150
1.0
50
UNIT
V
V
V
°C
°C
W
mA
TRUTH TABLE
CE1
H
CE2
X
OE
X
WE
X
MODE
Not Selected
I/O0- I/O7
High-Z
X
L
X
X
Not Selected
High-Z
I SB, I SB1
I SB, I SB1
Vcc
L
L
L
H
H
H
H
L
X
H
H
L
Output Disable
Read
Write
High-Z
Data Out
Data In
Icc
Icc
Icc
OPERATING CHARACTERISTICS
(Vcc = 3.3V ±0.3V, Ta = 0 to 70°C)
PARAMETER
Power Supply Voltage
Input Low Voltage
Input High Voltage
Input Leakage Current
SYM.
Vcc
VIL
VIH
ILI
TEST CONDITIONS
MIN.
3.0
-0.5
2.1
-
MAX.
3.6
0.8
Vcc+0.3
5
UNIT
V
V
V
uA
-
5
uA
2.4
-
0.4
110
V
V
mA
CE2 = VIH ;f=max
12ns
IO = 0mA
15ns
CE1 = VIH , CE2 = VIL, IO = 0mA
-
105
100
25
mA
mA
mA
Vcc = max; CE1 > Vcc-0.2V or CE2<
Vss+0.2V; f=0mhz; IO = 0mA
-
5
mA
VIN =Vss to Vcc
VIN=Vss to Vcc , CE1 = VIH or CE2
Output Leakage Current
ILO
Output Low Voltage
Output High Voltage
Operating Power
VOL
VOH
= VIL or OE = VIH or WE = VIL
I OL = 4.0 mA
I OH =-2.0 mA
Icc
CE1 = VIL
Supply Current
Standby Power
Supply Current
I SB
I SB1
10ns
Note: Typical characteristics are at Vcc = 3.3V, Ta = 25°C
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 2
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
RECOMMENDED OPERATING CONDITIONS
PARAMETER
Supply Voltage
Input Voltage, low
Input Voltage, high
Ambient Temperature
SYM
Vcc
MIN
Typ-0.3
-0.3
2.1
0
VIL
VIH
TA
TYP
3.3
-
MAX
Typ+0.3
0.8
Vcc+0.3
70
UNIT
V
V
V
°C
MAX.
6
8
UNIT
pF
pF
CAPACITANCE
PARAMETER
Input Capacitance
Input/ Output Capacitance
SYMBOL
CONDITION
VIN = 0V
VOUT = 0V
C IN
C I/O
Note: These parameters are sampled but not 100% tested.
AC TEST CONDITIONS
PARAMETER
CONDITIONS
Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Reference Level
Output Load
0V to 3V
3.0 ns
1.5V
C L =30pF, I OH / I OL = -2mA/4mA
AC TEST LOADS AND WAVEFORM
3.3V
R1 319 ohm
RL=50 ohm
Vt=1.5V
OUTPUT
Zo=50 ohm
OUTPUT
30pF
5pF
Including
Jig and
Scope
R2
353 ohm
(For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW )
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 3
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
AC CHARACTERISTICS
( Vcc =3.3V ±0.3V, Vss = 0V, Ta = 0 to 70°C)
(1) READ CYCLE
PARAMETER
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable to Output Valid
Chip Enable to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change
SYM.
tRC
tAA
tACS
tAOE
tCLZ*
tOLZ*
tCHZ*
tOHZ*
tOH
T14L1024A-10 T14L1024A-12
MIN. MAX. MIN. MAX.
10
12
-
T14L1024A-15
UNIT
MIN. MAX.
15
ns
-
10
-
12
-
15
ns
-
10
-
12
-
15
ns
-
6
-
7
-
7
ns
3
-
3
-
3
-
ns
0
-
0
-
0
-
ns
-
5
-
6
-
7
ns
-
5
-
6
-
7
ns
3
-
3
-
3
-
ns
* These parameters are sampled but not 100% tested.
(2)WRITE CYCLE
PARAMETER
Write Cycle Time
Chip Enable to End of Write
Address Valid to End of Write
Address Setup Time
Write Pulse Width
Write Recovery Time
Data Valid to End of Write
Data Hold from End of Write
Write to Output in High Z
Output Disable to Output in High Z
Output Active from End of Write
SYM.
tWC
tCW
tAW
tAS
tWP
tWR
tDW
tDH
tWHZ*
tOHZ*
tOW
T14L1024A-10 T14L1024A-12
MIN. MAX. MIN. MAX.
10
12
-
T14L1024A-15
UNIT
MIN. MAX.
15
ns
8
-
10
-
11
-
ns
8
-
10
-
11
-
ns
0
-
0
-
0
-
ns
8
-
10
-
11
-
ns
0
-
0
-
0
-
ns
6
-
8
-
8
-
ns
0
-
0
-
0
-
ns
-
5
-
6
-
6
ns
-
5
-
6
-
7
ns
0
-
0
-
0
-
ns
* These parameters are sampled but not 100% tested.
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 4
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
TIMING WAVEFORMS
READ CYCLE 1
(Address
Controlled)
tR C
Address
tA A
tO H
tO H
D out
READ CYCLE 2
(Chip Enable
Controlled)
tR C
Address
tA A
OE
tA O E
tO H
tO LZ
CE1
CE2
tA CS
tCLZ
tO H Z
tCH Z
D out
DON'T CARE
UNDEFINED
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 5
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
WRITE CYCLE 1
Preliminary T14L1024A
( OE CLOCK)
tW
C
A d d re ss
OE
tC W
tA W
tW
R
CE1
CE2
tA S
tW
P
W E
tO H Z
D
out
tD W
D
tD H
IN
WRITE CYCLE 2
( OE = V
IL
Fixed)
tW
C
A d d ress
tC W
tA W
tW
R
C E1
C E2
tA S
tW
P
W E
tW
tO H
H Z
tO W
(1 ,4 )
D
tD W
D
(2 )
(3 )
out
tD H
IN
D O N 'T C A R E
U N D E F IN E D
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 6
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the
outputs should not be applied.
2. The data output from D OUT are the same as the data written to D IN during the write cycle.
3. D OUT provides the read data for the next address.
4. Transition is measured ± 500 mV from steady state with C L = 5pF.
guaranteed but not 100% tested.
This parameter is
5. If OE is low during a WE controlled write cycle, the write pulse width must be the larger of
tWP or (tWHZ + tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the
required tDW. If OE is high during a WE controlled write cycle, this requirement does
not apply and the write pulse can be as short as the specified tWP.
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 7
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
PACKAGE DIMENSIONS
32-LEAD SOJ (300 mil)
SYMBOL
A
A1
A2
B
B1
C
D
E
E1
e
L
y
DIMENSIONS IN INCHES
0.140(MAX)
0.026(MIN)
0.100±0.005
0.018(TYP)
0.028(TYP)
0.008(TYP)
0.823±0.005
0.335±0.010
0.300±0.005
0.050(TYP)
0.086±0.010
0.003(MAX)
TM Technology, Inc. reserves the right
to change products or specifications without notice.
DIMENSIONS IN MM
3.556(MAX)
0.660(MIN)
2.540±0.127
0.457(TYP)
0.711(TYP)
0.203(TYP)
20.904±0.127
8.509±0.254
7.620±0.127
1.270(TYP)
2.184±0.254
0.076(MAX)
P. 8
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
PACKAGE DIMENSIONS
32-LEAD TSOP-I (8x20mm)
HD
C
1
32
b
E
e
16
17
A2
"A "
A
A1
S e a t in g p la n e
y
D
S e a t in g p la n e
L
D e t a il " A "
SYMBOL
A
A1
A2
b
C
HD
D
E
e
L
L1
θ
DIMENSIONS IN INCHES
MIN
NOM
MAX
0.047
0.002
0.006
0.035
0.040
0.041
0.007
0.008
0.011
0.004
0.006
0.008
0.787 TYP
0.724 TYP
0.315 TYP
0.020 TYP
0.020
0.024
0.028
0.032 TYP
0°
3°
5°
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 9
L1
DIMENSIONS IN MM
MIN
NOM
MAX
1.20
0.05
0.15
0.90
1.00
1.05
0.17
0.20
0.27
0.10
0.15
0.21
20.00 TYP
18.40 TYP
8.00 TYP
0.50 TYP
0.50
0.60
0.70
0.813 TYP
0°
3°
5°
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
PACKAGE DIMENSIONS
32-LEAD TSOP-I (8x13.4mm)
HD
C
1
32
b
E
e
16
17
A2
"A "
A
A1
S e a t in g p la n e
y
D
S e a t in g p la n e
L
D e t a il " A "
SYMBOL
A
A1
A2
b
C
HD
D
E
e
L
L1
θ
DIMENSIONS IN INCHES
MIN
NOM
MAX
0.047
0.002
0.006
0.035
0.040
0.041
0.007
0.008
0.011
0.004
0.006
0.008
0.528 TYP
0.465 TYP
0.315 TYP
0.020 TYP
0.020
0.024
0.028
0.032TYP
0°
3°
5°
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 10
L1
DIMENSIONS IN MM
MIN
NOM
MAX
1.20
0.05
0.15
0.90
1.00
1.05
0.17
0.20
0.27
0.10
0.15
0.21
13.40 TYP
11.80 TYP
8.00 TYP
0.50 TYP
0.50
0.60
0.7
0.813 TYP
0°
3°
5°
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
PACKAGE DIMENSIONS
32-LEAD DIP (300 mil)
A
32
17
1
16
A1
B4
D
B2
B
B3
B1
C2
C1
C
D1
0
Symbol
A
A1
B
B1
B2
B3
B4
C
C1
C2
D
D1
θ
Dimension in mm
Min
Nom
Max
40.64
41.15
7.26
7.36
7.46
5.08
3.05
3.30
3.56
3.68
3.81
3.94
0.38
1.65
2.29
2.54
2.79
0.41
0.46
0.56
1.47
1.52
1.63
7.49
8.00
8.50
10.92
11.43
11.94
0°
15°
TM Technology, Inc. reserves the right
to change products or specifications without notice.
Dimension in inch
Min
Nom
Max
1.60
1.62
0.286
0.290
0.294
0.200
0.120
0.130
0.140
0.145
0.150
0.155
0.015
0.065
0.090
0.100
0.110
0.016
0.018
0.022
0.58
0.60
0.64
0.295
0.315
0.335
0.430
0.450
0.470
0°
15°
P. 11
Publication Date: SEP. 2002
Revision:0.F
tm
TE
CH
Preliminary T14L1024A
PACKAGE DIMENSIONS
32-LEAD SOP
e1
32
17
E HE
Detail F
1
b
L
16
e1
D
C
A2
S
y
e
A
LE
A1
See Detail F
Seating Plane
Symbol
A
A1
A2
b
C
D
E
e
HE
L
LE
S
y
•
Dimension in inches
min.
typ.
max
0.118
0.004
0.101 0.106 0.111
0.014 0.016 0.020
0.006 0.008 0.012
0.805 0.817
0.440 0.445 0.450
0.044 0.050 0.056
0.546 0.556 0.556
0.023 0.031 0.039
0.047 0.055 0.063
0.036
0.004
0°
10°
Dimension in mm
min.
typ. max.
3.00
0.10
2.57
2.69
2.82
0.36
0.41
0.51
0.15
0.20
0.31
20.45 20.75
11.18 11.30 11.43
1.12
1.27
1.42
13.87 14.12 14.38
0.58
0.79
0.99
1.19
1.40
1.60
0.91
0.10
0°
10°
TM Technology, Inc. reserves the right
to change products or specifications without notice.
P. 12
Notes :
1. Dimensions D max. & S
include mold flash or tie bar
burrs.
2. Dimension b does not include
dambar protrusion / intrusion.
3. Dimensions D & E include
mold mismatch and determined
at the mold parting line.
4. controlling dimension : inches
5. general appearance spec should
be based on final visual
inspection spec.
Publication Date: SEP. 2002
Revision:0.F