W24L011A 128K × 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W24L011A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that operates on a single 3.3-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES • High speed access time: 10/12/15 nS • All inputs and outputs directly TTL compatible • Single +3.3V power supply • Three-state outputs • Center power/ground pin configuration • Available packages: 32-pin 300 mil SOJ, Small TSOP-I (8 x 13.4 mm), TSOP-I (8 x 20 mm) and 400 mil SOJ • Fully static operation BLOCK DIAGRAM PIN CONFIGURATIONS VDD A0 A1 A2 A4 CS# I/O1 I/O2 Vcc Vss I/O3 I/O4 WE# A4 A5 A6 A7 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A0 1 32 A16 A1 2 31 A15 A2 3 30 A14 A3 4 29 A13 CS# 5 28 OE# I/O1 6 27 I/O8 VSS A0 . . CORE ARRAY A16 I/O2 7 26 I/O7 Vcc 8 25 Vss CS Vss 9 24 Vcc OE I/O3 10 23 I/O6 WE I/O4 11 22 I/O5 WE# 12 21 A12 A4 13 20 A11 A5 14 19 A10 A6 15 18 A9 A7 16 17 A8 32-pin TSOP DECODER CONTROL DATA I/O I/O1 . . I/O8 PIN DESCRIPTION SYMBOL 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A0 − A16 A16 A15 A14 A13 OE# I/O8 I/O7 Vss Vcc I/O6 I/O5 A12 A11 A10 A9 A8 I/O1 − I/O8 -1- DESCRIPTION Address Inputs Data Inputs/Outputs CS Chip Select Inputs WE Write Enable Input OE VDD Output Enable Input VSS Ground Power Supply Publication Release Date: April 26, 2002 Revision A3 W24L011A TRUTH TABLE I/O1 − I/O8 MODE VDD CURRENT CS OE WE H X X Not Selected High Z ISB, ISB1 L H H Output Disable High Z IDD L L H Read Data Out IDD L X L Write Data In IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT -0.5 to +4.6 V Input/Output to VSS Potential -0.5 to VDD +0.5 V Allowable Power Dissipation 1.0 W -65 to +150 °C 0 to +70 °C Supply Voltage to VSS Potential Storage Temperature Operating Temperature Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 3.3V ±5%, VSS = 0V, TA = 0 to 70° C) PARAMETER SYM. TEST CONDITIONS MIN. TYP. MAX. UNIT Input Low Voltage VIL - -0.5 - 0.8 V Input High Voltage VIIH - +2.0 - VDD +0.5 V Input Leakage Current ILI VIN = VSS to VDD -10 - +10 µA Output Leakage Current ILO VI/O = VSS to VDD, CS = VIH (min.) or -10 - +10 µA Output Low Voltage VOL IOL = +8.0 mA - - 0.4 V Output High Voltage VOH IOH = -4.0 mA 2.4 - - V Operating Power IDD CS = VIL (max.), I/O = 0 mA 10 - - 130 Cycle = mim., Duty = 100% 12 - - 120 15 - - 100 OE = VIH (min.) or WE = VIL (max.) Supply Current mA Standby Power ISB CS = VIH (min.) - - 15 mA Supply Current ISB1 CS ≥ VDD -0.2V - - 5 mA Note: Typical characteristics are at VDD = 3.3V, TA = 25° C. -2- W24L011A CAPACITANCE (VDD = 3.3V, TA = 25° C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 8 pF Input/Output Capacitance CI/O VOUT = 0V 10 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS Input Pulse Levels 0V to 3V Input Rise and Fall Times 3 nS Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA AC Test Loads and Waveform R1 320 ohm R1 320 ohm 3.3V 3.3V OUTPUT 5pF Including Jig and Scope OUTPUT 30 pF Including Jig and Scope R2 350 ohm R2 350 ohm (For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW ) 3.0V 90% 90% 10% 0V 10% 3 nS 3 nS -3- Publication Release Date: April 26, 2002 Revision A3 W24L011A AC Characteristics, continued (VDD = 3.3V ±5%, VSS = 0V, TA = 0 to 70°) Read Cycle PARAMETER SYM. W24L011A-10 W24L011A-12 W24L011A-15 MIN. MAX. MIN. MAX. MIN. MAX. UNIT Read Cycle Time TRC 10 - 12 - 15 - nS Address Access Time TAA - 10 - 12 - 15 nS Chip Select Access Time TACS - 10 - 12 - 15 nS Output Enable to Output Valid TAOE - 5 - 6 - 8 nS Chip Selection to Output in Low Z TCLZ 3 - 3 - - 3 nS Output Enable to Output in Low Z TOLZ* 0 - 0 - - Chip Deselection to Output in High Z TCHZ - 5 - 6 - 8 nS Output Disable to Output in High Z TOHZ* - 5 - 6 - 8 nS Output Hold from Address Change TOH 3 - 3 - 3 - nS nS * These parameters are sampled but not 100% tested. Write Cycle PARAMETER SYM. W24L011A-10 W24L011A-12 W24L011A-15 MIN. MAX. MIN. MAX. MIN. MAX. UNIT Write Cycle Time TWC 10 - 12 - 15 - nS Chip Selection to End of Write TCW 9 - 10 - 12 - nS Address Valid to End of Write TAW 9 - 10 - 12 - nS Address Setup Time TAS 0 - 0 - 0 - nS Write Pulse Width TWP 9 - 10 - 12 - nS TWR 0 - 0 - 0 - nS Data Valid to End of Write TDW 5 - 7 - 9 - nS Data Hold from End of Write TDH 0 - 0 - 0 - nS Write to Output in High Z TWHZ* - 5 - 6 - 8 nS Output Disable to Output in High Z TOHZ* - 5 - 6 - 8 nS Output Active from End of Write TOW 0 - 0 - 0 - nS Write Recovery Time CS , WE * These parameters are sampled but not 100% tested. -4- W24L011A TIMING WAVEFORMS Read Cycle 1 (Address Controlled, CS = OE = VIL, WE = VIH) TRC Address TOH TAA TOH D OUT Read Cycle 2 (Chip Select Controlled) T RC Address CS T ACS TCHZ TCLZ D OUT Read Cycle 3 (Output Enable Controlled) TRC Address TAA OE TAOE TOH TOLZ CS TACS TCLZ TCHZ DOUT -5- Publication Release Date: April 26, 2002 Revision A3 W24L011A Timing Waveforms, continued Write Cycle 1 (OE Clock) T WC Address TWR OE TCW CS TAW WE TWP TAS TOHZ (1, 4) D OUT TDW TDH D IN Write Cycle 2 (OE = VIL Fixed) TWC Address TCW TWR CS TAW WE TWP TAS TWHZ (1, 4) TOH TOW (2) (3) DOUT TDW TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured ±200 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- W24L011A ORDERING INFORMATION PART NO. ACCESS TIME (nS) OPERATING CURRENT MAX. (mA) STANDBY CURRENT MAX. (mA) OPERATION TEMPERATURE (°C) W24L011AJ-10 10 130 10 0 to +70 300 mil SOJ W24L011AJ-12 12 120 10 0 to +70 300 mil SOJ W24L011AJ-15 15 110 10 0 to +70 300 mil SOJ W24L011AI-10 10 130 10 0 to +70 400 mil SOJ W24L011AI-12 12 120 10 0 to +70 400 mil SOJ W24L011AI-15 15 110 10 0 to +70 400 mil SOJ W24L010AT-10 10 130 10 0 to +70 TSOP (8 x 20 mm) W24L010AT-12 12 120 10 0 to +70 TSOP (8 x 20 mm) W24L010AT-15 15 110 10 0 to +70 TSOP (8 x 20 mm) W24L010AQ-10 10 130 10 0 to +70 TSOP (8 x 13.4 mm) W24L010AQ-12 12 120 10 0 to +70 TSOP (8 x 13.4 mm) W24L010AQ-15 15 110 10 0 to +70 TSOP (8 x 13.4 mm) PACKAGE Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: April 26, 2002 Revision A3 W24L011A PACKAGE DIMENSIONS 32-pin SOJ (300 mil) Symbol 17 32 A E 1 He 16 Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. __ __ __ __ __ 0.140 __ Max. __ 3.556 __ 2.540 2.667 0.711 0.813 0.457 0.559 A1 0.020 A2 0.095 0.100 0.105 2.413 B 0.026 0.028 0.032 0.660 b c 0.016 0.018 0.022 0.406 0.008 0.010 0.014 0.203 0.254 0.356 D E e 0.815 0.825 0.835 20.701 20.955 21.209 0.295 0.300 0.305 7.493 7.620 7.747 0.044 0.050 0.056 1.118 1.270 1.422 e1 0.247 0.267 0.287 6.274 6.782 7.290 He 0.325 L 0.335 __ 0.345 __ 8.255 0.080 __ 8.509 __ __ 0.045 __ __ 0.004 0 __ S Y θ 10 0.508 2.032 __ __ 8.763 __ 1.143 __ __ 0° __ 0.102 10° D A2 c A L e1 B S e A1 b θ Y Seating Plane 32-pin SOJ (400 mil) Dimension in inches Symbol 32 17 E 1 HE 16 D c A2 A s Seating Plane b b1 e 3.51 3.68 2.67 2.79 2.91 0.66 0.71 0.81 0.41 0.46 0.51 0.011 0.15 0.20 0.28 0.830 20.83 20.96 21.08 0.395 0.400 0.405 10.03 10.16 10.29 0.044 0.050 0.056 1.12 1.27 0.360 0.37 0.380 9.15 9.40 0.435 0.440 0.445 11.05 11.18 0.131 0.138 0.145 3.33 0.025 0.635 0.105 0.110 0.115 0.026 0.028 0.032 0.016 0.018 0.020 0.006 0.008 0.820 0.825 0.082 9.65 11.31 2.08 1.14 0.045 0.10 0.004 -5 1.42 2 6 -5 2 Notes: L θ A1 A A1 A2 b1 b c D E e e1 HE L S y θ Dimension in mm Min. Nom. Max. Min. Nom. Max. e1 y -8- 1. Dimension D Max & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec. should be based on final visual inspection spec. 6 W24L011A Package Dimensions, continued 32-pin TSOP HD Dimension in Inches Dimension in mm Symbol D A c A1 M e E 0.10(0.004) b __ 0.002 Nom. __ __ 0.006 0.05 __ Max. 1.20 0.15 0.039 0.041 0.95 1.00 1.05 0.008 0.009 0.17 0.20 0.23 c 0.005 0.006 0.007 0.12 0.15 0.17 D 0.720 0.724 0.728 18.30 18.40 18.50 E 0.311 0.315 0.319 7.90 8.00 8.10 HD 0.780 0.787 0.795 19.80 20.00 20.20 __ __ 0.024 0.40 __ __ 0.004 0.00 5 1 __ 0.016 __ Y 0.000 A1 θ 1 L1 Min. 0.037 A2 Y __ 0.047 0.007 L L __ Max. b L1 θ Nom. A2 e A Min. 0.020 0.020 0.031 __ 3 0.50 0.50 0.80 __ __ 0.60 __ 0.10 5 3 Note: Controlling dimension: Millimeter 32-Lead Small Type One TSOP (8 x 13.4) HD Symbol D Min. 1 e E b A 2 A A1 L Y L1 Nom. Max. A c θ Dimension in Inches Dimension in mm Min. Nom. Max. 0.049 1.25 0.006 0.05 0.15 A1 0.002 A2 b c 0.037 0.039 0.041 0.95 1.00 1.05 0.007 0.008 0.009 0.17 0.20 0.27 0.0056 0.0059 0.0062 0.14 0.15 0.16 D E HD e 0.461 0.465 0.469 11.70 11.80 11.90 L 0.012 0.020 0.028 0.30 L1 0.027 0.675 Y θ 0.000 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.50 0.020 0 0.004 3 5 0.50 0.00 0 0.70 0.10 3 5 Controlling dimension: Millimeters -9- Publication Release Date: April 26, 2002 Revision A3 W24L011A VERSION HISTORY VERSION DATE PAGE DESCRIPTION A1 Aug. 1997 - Initial Issued A2 Aug. 1999 1, 2, 4, 7 Add 15 nS specification A3 Apr. 26, 2002 1, 2, 7, 9 Add TSOP package and change (IDD, ISB & ISBC) current Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd. No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798 27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998 Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd. 9F, No.480, Rueiguang Rd., Neihu Chiu, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579 7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners. - 10 -