WINBOND W24258-LL

W24258/LL
32K × 8 CMOS STATIC RAM
GENERAL DESCRIPTION
The W24258/LL is a normal speed, very low power CMOS static RAM organized as 32768 × 8 bits
that operates on a single 5-volt power supply. This device is manufactured using Winbond's high
performance CMOS technology.
FEATURES
•
•
•
•
•
Low power consumption:
− Active: 350 mW (max.)
− Standby: 25 µW (max.)
Access time: 55/70 nS (max.)
Single 5V power supply
Fully static operation
All inputs and outputs directly TTL compatible
•
•
•
•
Three-state outputs
Battery back-up operation capability
Data retention voltage: 2V (min.)
Packaged in 28-pin 600 mil DIP, 330 mil SOP
and standard type one TSOP (8 mm × 13.4
mm)
BLOCK DIAGRAM
PIN CONFIGURATIONS
CLK GEN.
PRECHARGE CKT.
A12
A14
A2
A3
A14
1
28
VDD
A12
2
27
WE
A4
A7
3
26
A13
A5
A6
4
25
A8
A6
A5
5
24
A9
A7
A4
6
23
A11
A13
A3
7
22
OE
A2
8
21
A10
28-pin
DIP
A1
9
20
CS
A0
10
19
I/O8
I/O1
11
18
I/O7
I/O2
12
17
I/O6
I/O3
13
16
I/O5
V SS
14
15
I/O4
I/O1
I/O8
R
O
W
D
E
C
O
D
E
R
DATA
CNTRL.
CORE CELL ARRAY
512 ROWS
64 X 8 COLUMNS
I/O CKT.
COLUMN DECODER
CLK
GEN.
A11 A10 A1 A0 A8 A9
WE
CS
OE
PIN DESCRIPTION
OE
A11
A9
A8
A13
WE
V DD
A14
A12
A7
A6
A5
A4
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28-pin
TSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
A10
CS
I/O8
I/O7
I/O6
I/O5
I/O4
V SS
I/O3
I/O2
I/O1
A0
A1
A2
SYMBOL
A0−A14
I/O1−I/O8
CS
WE
OE
VDD
VSS
-1-
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Select Input
Write Enable Input
Output Enable Input
Power Supply
Ground
Publication Release Date: November 1998
Revision A5
W24258/LL
TRUTH TABLE
CS
H
OE
X
WE
X
L
H
L
L
MODE
VDD CURRENT
I/O1−I/O8
Not Selected
High Z
ISB, ISB1
H
Output Disable
High Z
IDD
L
H
Read
Data Out
IDD
X
L
Write
Data In
IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER
Supply Voltage to VSS Potential
Input/Output to VSS Potential
RATING
UNIT
-0.5 to +7.0
V
-0.5 to VDD +0.5
V
Allowable Power Dissipation
Storage Temperature
1.0
W
-65 to +150
°C
0 to 70
°C
Operating Temperature
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the
device.
Operating Characteristics
(VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C)
PARAMETER
SYM.
TEST CONDITIONS
MIN.
TYP.*
MAX.
UNIT
Input Low Voltage
VIL
-
-0.5
-
+0.8
V
Input High Voltage
VIH
-
+2.2
-
VDD +0.5
V
Input Leakage Current
ILI
VIN = VSS to VDD
-1
-
+1
µA
Output Leakage Current
ILO
VI/O = VSS to VDD, CS = VIH
(min.) or OE = VIH (min.) or
WE = VIL (max.)
-1
-
+1
µA
Output Low Voltage
VOL
IOL = +2.1 mA
-
-
0.4
V
Output High Voltage
VOH
IOH = -1.0 mA
2.4
-
-
V
Operating Power
IDD
CS = VIL (max.), I/O = 0
I/O = 0 mA, Cycle =
min.
Duty =100%
55
-
-
70
mA
70
-
-
60
mA
ISB
CS = VIH (min.), Cycle = min.
Duty = 100%
-
-
3
mA
ISB1
CS ≥ VDD -0.2V
-
0.7
5
µA
Supply Current
Standby Power Supply
Current
Note : Typical parameter is measured under ambient temperature TA = 25° C and VDD = 5V.
-2-
W24258/LL
CAPACITANCE
(VDD = 5V, TA = 25° C, f = 1 MHz)
PARAMETER
SYM.
CONDITIONS
MAX.
UNIT
Input Capacitance
CIN
VIN = 0V
6
pF
Input/Output Capacitance
CI/O
VOUT = 0V
8
pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER
CONDITIONS
Input Pulse Levels
0V to 3.0V
Input Rise and Fall Times
5 nS
Input and Output Timing Reference Level
1.5V
Output Load
See the drawing below
AC TEST LOADS AND WAVEFORM
1 TTL
1 TTL
OUTPUT
OUTPUT
5 pF
Including
Jig and
Scope
100 pF
Including
Jig and
Scope
(For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW )
3.0V
90%
10%
0V
90%
10%
5 nS
5 nS
-3-
Publication Release Date: November 1998
Revision A5
W24258/LL
AC Characteristics, continued
(VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C)
Read Cycle
PARAMETER
SYM.
W24258-55LL
W24258-70LL
MIN.
MAX.
MIN.
MAX.
UNIT
Read Cycle Time
TRC
55
-
70
-
nS
Address Access Time
TAA
-
55
-
70
nS
Chip Select Access Time
TACS
-
55
-
70
nS
Output Enable to Output Valid
TAOE
-
27
-
35
nS
Chip Selection to Output in Low Z
TCLZ*
10
-
10
-
nS
Output Enable to Output in Low Z
TOLZ*
5
-
5
-
nS
Chip Deselection to Output in High Z
TCHZ*
-
25
-
30
nS
Output Disable to Output in High Z
TOHZ*
-
25
-
30
nS
Output Hold from Address Change
TOH
10
-
10
-
nS
∗ These parameters are sampled but not 100% tested
Write Cycle
PARAMETER
SYM.
W24258-55LL
W24258-70LL
MIN.
MAX.
MIN.
MAX.
UNIT
Write Cycle Time
TWC
55
-
70
-
nS
Chip Selection to End of Write
TCW
40
-
50
-
nS
Address Valid to End of Write
TAW
40
-
50
-
nS
Address Setup Time
TAS
0
-
0
-
nS
Write Pulse Width
TWP
40
-
50
-
nS
TWR
0
-
0
-
nS
Data Valid to End of Write
TDW
25
-
30
-
nS
Data Hold from End of Write
TDH
0
-
0
-
nS
Write to Output in High Z
TWHZ*
-
20
-
25
nS
Output Disable to Output in High Z
TOHZ*
-
20
-
25
nS
Output Active from End of Write
TOW
5
-
5
-
nS
Write Recovery Time
CS, WE
∗ These parameters are sampled but not 100% tested
-4-
W24258/LL
TIMING WAVEFORMS
Read Cycle 1
(Address Controlled)
TRC
Address
TAA
TOH
TOH
DOUT
Read Cycle 2
(Chip Select Controlled)
CS
TACS
TCHZ
TCLZ
DOUT
Read Cycle 3
(Output Enable Controlled)
T RC
Address
T AA
OE
T OH
T AOE
T OLZ
CS
T ACS
D OUT
T CHZ
T OHZ
TCLZ
-5-
Publication Release Date: November 1998
Revision A5
W24258/LL
Timing Waveforms, continued
Write Cycle 1
TWC
Address
T WR
OE
TCW
CS
T AW
WE
T WP
TAS
TOHZ
(1, 4)
D OUT
T DW
TDH
D IN
Write Cycle 2
( OE = VIL Fixed)
T WC
Address
TWR
TCW
CS
TAW
WE
T WP
TAS
TOH
TWHZ
(1, 4)
D OUT
TDW
(2)
(3)
TOW
TDH
DIN
Notes:
1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.
2. The data output from DOUT are the same as the data written to DIN during the write cycle.
3. DOUT provides the read data for the next address.
4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
-6-
W24258/LL
DATA RETENTION CHARACTERISTICS
(TA = 0° C to 70° C)
PARAMETER
SYM.
TEST CONDITIONS
VDD for Data Retention
VDR
CS ≥ VDD -0.2V
Data Retention Current
IDDDR
Chip Deselect to Data
Retention Time
TCDR
Operation Recovery Time
TR
MIN.
TYP. MAX. UNIT
2.0
-
-
V
CS ≥ VDD -0.2V, VDD = 3V
-
-
2
µA
See data retention waveform
0
-
-
nS
TRC*
-
-
nS
* Read Cycle Time
DATA RETENTION WAVEFORM
VDD
0.9 VDD
0.9 V DD
VDR >
= 2V
TCDR
TR
CS >
= V DD - 0.2V
VIH
CS
VIH
ORDERING INFORMATION
ACCESS
TIME
(nS)
OPERATING
CURRENT MAX.
(mA)
STANDBY
CURRENT MAX.
(µ A)
W24258-55LL
55
70
5
600 mil DIP
W24258-70LL
70
60
5
600 mil DIP
W24258S-55LL
55
70
5
330 mil SOP
W24258S-70LL
70
60
5
330 mil SOP
W24258Q-55LL
55
70
5
Standard type one TSOP
W24258Q-70LL
70
60
5
Standard type one TSOP
PART NO.
PACKAGE
Notes:
1. Winbond reserves the right to make changes to its products without prior notice.
2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications
where personal injury might occur as a consequence of product failure.
-7-
Publication Release Date: November 1998
Revision A5
W24258/LL
PACKAGE DIMENSIONS
28-pin P-DIP
Dimension in Inches
Symbol
A
A1
A2
B
B1
c
D
E
E1
e1
L
D
28
15
E1
a
eA
S
Notes:
1
14
E
S
c
A A2
A1
Base Plane
L
Seating Plane
B
e1
eA
a
B1
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
5.33
0.210
0.010
0.25
0.150
0.155
0.160
3.81
3.94
4.06
0.016
0.018
0.022
0.41
0.46
0.56
0.058
0.060
0.064
1.47
1.52
1.63
0.008
0.010
0.014
0.20
0.25
0.36
1.460
1.470
37.08
37.34
0.590
0.600
0.610
14.99
15.24
15.49
0.540
0.545
0.550
13.72
13.84
13.97
0.090
0.100
0.110
2.29
2.54
2.79
0.120
0.130
0.140
3.05
3.30
3.56
15
0
0.670
16.00
16.51
17.02
0
0.630
0.650
15
0.090
2.29
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion. .
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin SOP Wide Body
Dimension in Inches
Symbol
28
A
A1
A2
b
c
D
E
e
HE
L
LE
S
y
θ
15
e1
E
HE
θ
L
Detail F
14
1
b
Min. Nom. Max.
Dimension in mm
Min. Nom. Max.
2.85
0.112
0.004
0.10
0.093
0.098
0.103
2.36
2.49
2.62
0.014
0.016
0.020
0.36
0.41
0.51
0.008
0.010
0.014
0.20
0.25
0.36
0.713
0.733
18.11
18.62
0.326
0.331
0.336
8.28
8.41
8.53
0.044
0.050
0.056
1.12
1.27
1.42
0.453
0.465
0.477
11.51
11.81
12.12
0.028
0.036
0.044
0.71
0.91
1.12
0.075
1.50
1.70
1.91
0.059
0
0.067
0.047
1.19
0.004
0.10
10
0
10
Notes:
e1
D
c
A2 A
S
e
y
LE
A1
See Detail F
Seating Plane
-8-
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E include
mold mismatch
.
and determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
W24258/LL
Package Dimensions, continued
28-pin Standard Type One TSOP
HD
Dimension In Inches
Dimension In mm
Symbol
Min.
D
c
A
A1
A2
b
c
D
E
HD
e
L
L1
Y
θ
1
e
E
b
A2 A
θ
A1
L
Nom.
Max.
Min.
Nom.
0.002
0.006
Max.
1.20
0.047
0.05
0.15
0.035
0.040
0.041
0.95
1.00
0.007
0.008
0.011
0.17
0.20
0.27
0.004
0.006
0.008
0.10
0.15
0.21
11.90
1.05
0.461
0.465
0.469
11.70
11.80
0.311
0.315
0.319
7.90
8.00
8.10
0.520
0.528
0.536
13.20
13.40
13.60
0.020
0.024
0.028
0.50
0.60
0.022
0.55
0.010
0.000
0
3
0.70
0.25
0.004
0.00
5
0
0.10
3
5
Controlling dimension: Millimeters
Y
L1
-9-
Publication Release Date: November 1998
Revision A5
W24258/LL
VERSION HISTORY
VERSION
DATE
PAGE
A4
Apr. 1998
2
A5
Nov. 1998
1, 2, 7, 9
Headquarters
DESCRIPTION
Add standby power supply current (ISB1) typical
parameter when operation temperature TA = 25° C
Deduct reverse type one TSOP package
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
No. 4, Creation Rd. III,
123 Hoi Bun Rd., Kwun Tong,
Science-Based Industrial Park,
Kowloon, Hong Kong
Hsinchu, Taiwan
TEL: 852-27513100
TEL: 886-3-5770066
FAX: 852-27552064
FAX: 886-3-5796096
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Note: All data and specifications are subject to change without notice.
- 10 -
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798