T R I Q U I N T S E M I C O N D U C T O R, I N C . TQ1089 Figure 1. Block Diagram FBIN GND REFCLK GND GND GND 11 10 9 TEST 12 8 7 6 GND 5 4 VDD Phase Detector VDD 13 3 Q10 2 Q9 11-Output Configurable Clock Buffer VCO 14 MUX GND 15 Q1 16 Q2 17 1 GND Divide Logic ÷2 Output Buffers Group B Group A VDD 18 28 Q8 27 Q7 26 VDD 19 20 21 22 23 24 25 GND Q3 Q4 VDD Q5 Q6 GND TriQuint’s TQ1089 is a configurable clock buffer which generates 11 outputs, operating over a wide range of frequencies from 65 MHz to 90 MHz and from 130 MHz to 180 MHz. The outputs are available at either 1x and 2x or at 1x and 1/2 x the reference clock frequency, fREF . When one of the Group A outputs (Q0–Q8) is used as feedback to the PLL, all Group A outputs will be at fREF , and all Group B outputs (Q9, Q10) will be at 2x fREF . When one of the Group B outputs is used as feedback to the PLL, all Group A outputs will be at 1/2 x fREF and all Group B outputs will be at fREF . A very stable internal Phase-Locked Loop (PLL) provides low-jitter operation. This completely self-contained PLL requires no external capacitors or resistors. The PLL’s Voltage-Controlled Oscillator (VCO) has a frequency range from 260 MHz to 360 MHz. By feeding back one of the output clocks to FBIN, the PLL continuously maintains frequency and phase synchronization between the reference clock (REFCLK) and each of the outputs. Features • Wide frequency range: 65 MHz to 90 MHz and 130 MHz to 180 MHz • Output configurations: eight outputs at fREF two outputs at 2x fREF or nine outputs at 1/2 x fREF one output at fREF • Low output-to-output skew: 150 ps (max) within a group • Near-zero propagation delay –350 ps + 500 ps (max) or –350 ps +700 ps (max) SYSTEM TIMING PRODUCTS Q0 • TTL–compatible with 30 mA output drive • 28–pin J–lead surface–mount package • Ideal for PowerPC ™–based designs TriQuint’s patented output buffer design delivers a very low output-tooutput skew of 150 ps (max). The TQ1089’s symmetrical TTL outputs are capable of sourcing and sinking 30 mA. For additional information and latest specifications, see our website: www.triquint.com 1 TQ1089 Functional Description The core of the TQ1089 is a Phase-Locked Loop (PLL) that continuously compares the reference clock (REFCLK) to the feedback clock (FBIN), maintaining a zero frequency difference between the two. Since one of the outputs is always connected to FBIN, the PLL keeps the propagation delay between the outputs and the reference clock within –350 ps +500 ps for the TQ1089–MC500, and within –350 ps +700 ps for the TQ1089–MC700. In the test mode, the PLL is bypassed and REFCLK is connected directly to the Divide Logic block via the MUX, as shown in Figure 1. This mode is useful for debug and test purposes. The test mode is outlined in Table 2. The internal Voltage-Controlled Oscillator (VCO), has an operating range of 260 MHz to 360 MHz, as shown in Table 1. The combination of the VCO and the Divide Logic enables the TQ1089 to operate between 65 MHz and 90 MHz and from 130 MHz to 180 MHz. Power Up/Reset Synchronization The maximum rise and fall time at the output pins is 1.4 ns. All outputs of the TQ1089 are TTL-compatible with 30 mA symmetric drive and a minimum VOH of 2.4 V. After power up or reset, the PLL requires time before it achieves synchronization lock. The maximum time required for synchronization (TSYNC) is 500 ms. Table 1. Frequency Mode Selection Test Output Feedback Mode Reference Clock Frequency Range 0 0 Group B Group A ÷2 ÷4 130 MHz – 180 MHz 65 MHz – 90 MHz Output Frequency Range Group A: Q0–Q8 Group B: Q9,Q10 65 MHz – 90 MHz 65 MHz – 90 MHz 130 MHz – 180 MHz 130 MHz – 180 MHz Table 2. Test Mode Selection 2 Test Mode Ref. Clock Group A Outputs Q0–Q8 Group B Outputs Q9, Q10 1 ÷2 f REF f REF ÷ 4 f REF ÷ 2␣ For additional information and latest specifications, see our website: www.triquint.com TQ1089 Layout Guidelines Multiple ground and power pins on the TQ1089 reduce ground bounce. Good layout techniques, however, are necessary to guarantee proper operation and to meet the specifications across the full operating range. TriQuint recommends bypassing each of the VDD supply pins to the nearest ground pin, as close to the chip as possible. (Approx. 3.3x) V DD C4 V DD C3 Pin 1 Ground Plane V DD C2 Pin 15 C1 C5 V DD V DD SYSTEM TIMING PRODUCTS Figure 2 shows the recommended power layout for the TQ1089. The bypass capacitors should be located on the same side of the board as the TQ1089. The VDD traces connect to an inner-layer VDD plane. All of the ground pins (GND) are connected to a small ground plane on the surface beneath the chip. Multiple through holes connect this small surface plane to an inner-layer ground plane. The capacitors (C1–C5) are 0.1 mF. TriQuint’s test board uses X7R temperature-stable capacitors in 1206 SMD cases. Figure 2. Top Layer Layout of Power Pins For additional information and latest specifications, see our website: www.triquint.com 3 TQ1089 Absolute Maximum Ratings 1 Storage temperature –65 °C to +150 °C Ambient temperature with power applied2 Supply voltage to ground potential –55 °C to +100 °C –0.5 V to +7.0 V DC input voltage –0.5 V to +(VDD + 0.5)V DC input current Package thermal resistance (MQuad) –30 mA to +5 mA θJA = 45 °C/W Die junction temperature TJ = 150 ° C␣ ␣ DC Characteristics (VDD = +5 V + 5%, TA = 0 °C to +70 °C) 3 Symbol Description Test Conditions Min Limits 4 Typ VOHT Output HIGH voltage VDD = Min IOH= –30 mA VIN= VIH or VIL 2.4 3.4 V VOHC Output HIGH voltage VDD = Min IOH= –1 mA VIN= VIH or VIL 3.2 4.1 V VOL Output LOW voltage VDD = Min IOL = 30 mA VIN= VIH or VIL VIH 5 Input HIGH level Guaranteed input logical HIGH Voltage for all Inputs VIL5 Input LOW level Guaranteed input logical LOW Voltage for all inputs IIL Input LOW current VDD = Max VIN = 0.40 V IIH Input HIGH current VDD = Max VIN = 2.7 V II Input HIGH current VDD = Max VIN = 5.5 V IDDS 6 Power supply current VDD = Max VI Input clamp voltage VDD = Min Symbol Description Test Conditions CIN 3,7 Input capacitance VIN = 2.0 V at f = 1 MHz 0.27 Max 0.5 2.0 IIN = –18 mA Unit V V 0.8 V –156 –400 µA 0 25 µA 2 1000 µA 119 170 mA –0.70 –1.2 V Typ Max Unit Capacitance Min 6 Notes: 1. Exceeding these parameters may damage the device. 2. Maximum ambient temperature with device not switching and unloaded. 3. These values apply to both TQ1089-MC500 and TQ1089-MC700. 4. Typical limits are at VDD = 5.0 V and TA = 25 °C. 5. These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 6. This parameter is measured with device not switching and unloaded. 7. These parameters are not 100% tested, but are periodically sampled. 4 For additional information and latest specifications, see our website: www.triquint.com pF TQ1089 AC Characteristics (VDD = +5 V + 5%, TA = 0 °C to +70 °C) Test Conditions (Figure 3) 1 Symbol Input Clock (REFCLK) t CPWH CLK pulse width HIGH Figure 4 3 --- — ns t CPWL CLK pulse width LOW Figure 4 3 --- — ns t IR Input rise time (0.8 V - 2.0V) — — 2.0 ns Symbol Output Clocks (Q0–Q10) Min Typ Max Unit t OR,t OF Rise/fall time (0.8 V – 2.0V) Figure 4 350 — 1400 ps t PD1 2 CLK ↑ to FBIN ↑ (TQ1089-MC500) Figure 4 –850 –350 +150 ps t PD2 2 CLK ↑ to FBIN ↑ (TQ1089-MC700) Figure 4 –1050 –350 +350 ps t SKEW1 3 Rise–rise, fall–fall (within group) Figure 5 — 60 150 ps t SKEW2 3 Rise–rise, fall–fall (group-to-group, aligned) Figure 6 (skew 2 takes into account skew 1) — 75 350 ps t SKEW3 3 Rise-rise, fall-fall (group-to-group, non-aligned) Figure 7 (skew 3 takes into account skews 1, 2) — — 650 ps t SKEW4 3 Min Test Conditions (Figure 3) 1 Typ Max Unit Rise–fall, fall–rise Figure 8 (skew 4 takes into account skew 3) — — 1200 ps t CYC 4 Duty-cycle Variation Figure 4 –1000 0 +1000 ps t JP 5 Period-to-Period Jitter Figure 4 — 80 200 ps t JR 5 Random Jitter Figure 4 — 190 400 ps t SYNC 6 Synchronization Time — 10 500 µs SYSTEM TIMING PRODUCTS Notes: 1. All measurements are tested with a REFCLK having a rise time of 0.5 ns (0.8 V to 2.0 V). 2. The PLL maintains alignment of CLK and FBIN at all times. This specification applies to the rising edge only because the input duty cycle can vary while the output duty cycle is typically 50/50. The delay tPD is measured at the 1.5 V level between CLK and FBIN. 3. Skew specifies the width of the window in which outputs switch, and is measured at 1.5 V. 4. This specification represents the deviation from 50/50 on the outputs. 5. Jitter specifications refer to peak-to-peak value. tJR is the jitter on the output with respect to the reference clock. tJP is the jitter on the output with respect to the output’s previous rising edge. 6. tSYNC is the time required for the PLL to synchronize; this assumes the presence of a CLK signal and a connection from one of the outputs to FBIN. Figure 3. AC Test Circuit Y +5 V R1 50 Ω X Z FBIN R2 +5 V R1 Z CLK R2 Q0 Q1 Q2 • • • • Q10 • • • • +5 V R1 +5 V R2 R1 R2 +5 V R1 R2 Notes: R1 = 160 Ω R2 = 71 Ω Y+Z=X For additional information and latest specifications, see our website: www.triquint.com 5 TQ1089 Switching Waveforms Figure 4. General Timing tCPW tCPW REFCLK t PD1,2 t JR FBIN Q0 – Q10 (INDIVIDUALLY) t PERIOD t JP Figure 5. tSKEW1 Figure 7. tSKEW3 (For Group A Feedback) Group A Period = f = 2x f REF Group A 1 f REFCLK Group B t SKEW1 t SKEW1 t1 Group B t SKEW3 = Period – t1 2 Group B t SKEW1 Figure 6. tSKEW2 t SKEW1 Figure 8. tSKEW4 Period = f = f REF Group A 1 f REFCLK Group A t2 f = 2x f REF Group B Group B t3 t SKEW2 6 t SKEW4 = Period – t2 = 2 For additional information and latest specifications, see our website: www.triquint.com t4 Period – t3 = 4 Period – t4 4 TQ1089 28-Pin MQuad J-Leaded Package Mechanical Specification (All dimensions are in inches) .172 ±.005 .490 ±.005 .132 ±.005 .445 ±.005 .045 X 45°° .040 MIN PIN 1 8 .490 ±.005 22 .018 .445 .028 ±.005 .445 ±.005 .410 ±.015 .050 TYP. 0.125 VENT PLUG 15 .060 .015 X 45°° .104 ±.005 .050 TYP. NON-ACCUM. Pin # Pin Name Description I/O Pin # Pin Name Description I/O 1 GND Ground — 15 GND Ground — 2 Q9 Output Clock 9 (B1) O 16 Q1 Output Clock 1 (A2) O 3 Q10 Output Clock 10 (B2) O 17 Q2 Output Clock 2 (A3) O 4 VDD +5 V — 18 VDD +5 V — 5 GND Ground — 19 GND Ground — 6 GND Ground — 20 Q3 Output Clock 3 (A4) O 7 GND Ground — 21 Q4 Output Clock 4 (A5) O 8 GND Ground — 22 VDD +5 V — 9 REFCLK Reference Clock 10 GND Ground I 23 Q5 Output Clock 5 (A6) O — 24 Q6 Output Clock 6 (A7) O 11 FBIN Feedback In I 25 GND Ground — 12 TEST Test I 26 VDD +5 V — 13 VDD +5 V — 27 Q7 Output Clock 7 (A8) O 14 Q0 Output Clock 0 (A1) O 28 Q8 Output Clock 8 (A9) O For additional information and latest specifications, see our website: www.triquint.com SYSTEM TIMING PRODUCTS 28-Pin MQuad Pin Description 7 TQ1089 Output Characteristics The IV characteristics, transition times, package characteristics, device and bond wire characteristics for the TQ1089 are describedin Tables 4 through 9 and Figures 9 through 11. These output characteristics are provided for modelling purposes only. TriQuint does not guarantee the information in these tables and figures. Figure 9. IOH vs.VOH Figure 10. IOL vs.VOL HIGH 0 0.0 1.0 2.0 3.0 4.0 160 VOH min -20 -40 VOH max -60 IOL (mA) IOH (mA) LOW 5.0 -80 -100 140 VOL min 120 VOL max 100 80 60 -120 40 -140 20 -160 0 Volts 0.0 1.0 2.0 3.0 4.0 5.0 Volts Table 5. IOL vs.VOL Table 4. IOH vs.VOH 8 VOH IOH min (mA) IOH max (mA) VOL IOL min (mA) IOL max (mA) 0.0 –70 –160 –2.5 –145 –435 0.5 –70 –157 –2.0 –135 –410 1.0 –68 –152 –1.5 –115 –350 –90 –265 –120 1.5 –65 –142 –1.0 2.0 –59 –130 –0.5 –40 2.5 –48 –106 0.0 0 0 3.0 –29 –79 0.5 37 97 3.5 0 –42 1.0 49 140 4.0 0 0 1.5 53 155 4.5 0 0 2.0 54 157 5.0 0 0 2.5 54 159 5.5 40 120 3.0 54 160 6.0 90 265 3.5 54 160 6.5 115 350 4.0 54 160 7.0 135 410 4.5 54 160 7.5 145 435 5.0 54 160 10.0 54 160 For additional information and latest specifications, see our website: www.triquint.com TQ1089 V Diode to GND␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ ␣ I (mA) Diode Stack to VDD V I (mA) Table 9. Rise and Fall Times (Into 0 pF, 50 Ohms to 1.5 V) Time (ns) TR min (V) TR max (V) TF min (V) TF max (V) 0.0 0.15 0.32 3.20 3.04 0.0 0 5.0 0 0.1 0.15 0.32 3.20 3.04 –0.4 0 5.4 0 0.2 0.16 0.32 3.06 2.95 –0.5 0 5.5 0 0.3 0.18 0.32 2.86 2.90 –0.6 –5 5.6 5 0.4 0.23 0.32 2.62 2.68 –0.7 –15 5.7 15 0.5 0.26 0.32 2.38 2.50 –0.8 –35 5.8 35 0.6 0.34 0.32 2.17 2.36 –0.9 –55 5.9 55 0.7 0.46 0.34 2.00 2.22 –1.0 –75 6.0 75 0.8 0.67 0.39 1.85 2.09 –2.0 –300 7.0 300 0.9 0.89 0.49 1.69 1.95 –2.5 –350 7.5 350 1.0 1.12 0.63 1.52 1.86 –3.0 –360 8.0 360 1.1 1.32 0.86 1.38 1.68 1.2 1.50 1.09 1.26 1.59 1.3 1.73 1.27 1.12 1.49 1.4 1.93 1.45 0.96 1.36 1.5 2.15 1.64 0.83 1.23 1.6 2.75 2.23 0.52 0.95 1.7 2.58 2.00 0.61 1.00 1.8 2.75 2.23 0.52 0.95 1.9 2.90 2.41 0.45 0.91 2.0 3.02 2.50 0.39 0.86 2.1 3.12 2.64 0.33 0.77 2.2 3.17 2.77 0.29 0.73 2.3 3.19 2.86 0.24 0.68 2.4 3.20 2.95 0.21 0.64 2.5 3.20 2.99 0.19 0.59 2.6 3.20 3.02 0.17 0.55 2.7 3.20 3.02 0.16 0.53 2.8 3.20 3.04 0.16 0.50 2.9 3.20 3.04 0.15 0.45 3.0 3.20 3.04 0.15 0.41 3.1 3.20 3.04 0.15 0.40 3.2 3.20 3.04 0.15 0.37 3.3 3.20 3.04 0.15 0.36 3.4 3.20 3.04 0.15 0.32 3.5 3.20 3.04 0.15 0.32 Note: TriQuint does not guarantee diode operation for purposes other than ESD protection. Figure 11. Output Model L1 L2 OUTPUT DIE C1 C2 Table 7. Device and Bond-Wire Characteristics (Estimated) L1 2 nH C1 10 pF Table 8. 28-Pin MQuad Package Characteristics L2 1.85 nH C2 0.40 pF For additional information and latest specifications, see our website: www.triquint.com SYSTEM TIMING PRODUCTS Table 6. Above-VDD and Below-Ground Characteristics 9 TQ1089 Ordering Information To order, please specify as shown below: TQ1089-MC nnn 11-Output Configurable Clock Buffer Propagation delay skew: 500 –350 ps ± 500 ps 700 –350 ps ± 700 ps Note: All parts are marked as MC500. MC700 parts have a “2” added to the marking. Temperature range: 0 °C to 70 °C (Commercial) Package: MQuad Additional Information For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: (503) 615-9000 Fax: (503) 615-8900 For technical questions and additional information on specific applications: Email: [email protected] The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright © 1997 TriQuint Semiconductor, Inc. All rights reserved. Revision 1.1.A November 1997 10 For additional information and latest specifications, see our website: www.triquint.com