AOSMD AOU417

AOU417
P-Channel Enhancement Mode Field Effect Transistor
General Description
Features
The AOU417 uses advanced trench technology to
provide excellent RDS(ON), and low gate charge.
This device is suitable for use as a load switch or in
PWM applications. Standard product AOU417 is Pbfree (meets ROHS & Sony 259 specifications).
AOU417L is a Green Product ordering option.
AOU417 and AOU417L are electrically identical .
VDS (V) = -30V
ID = -18A (VGS = -10V)
RDS(ON) < 22mΩ (VGS = -10V)
RDS(ON) < 40mΩ (VGS = -4.5V)
TO-251
D
Top View
Drain Connected
to Tab
G
D
G
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
Continuous Drain
Current B,G
TA=25°C G
Pulsed Drain Current
Avalanche Current C
Power Dissipation B
C
TC=25°C
Junction and Storage Temperature Range
V
A
-18
IAR
-18
A
EAR
16.2
mJ
-40
50
Steady-State
Steady-State
W
25
TJ, TSTG
Thermal Characteristics
Parameter
Alpha & Omega Semiconductor, Ltd.
±20
ID
IDM
PD
TC=100°C
Maximum Junction-to-Ambient A
Maximum Junction-to-Case C
Units
V
-18
TA=100°C G
Repetitive avalanche energy L=0.1mH
Maximum
-30
-55 to 175
Symbol
RθJA
RθJL
°C
Typ
Max
Units
105
2.5
125
3
°C/W
°C/W
AOU417
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
STATIC PARAMETERS
BVDSS
Drain-Source Breakdown Voltage
Conditions
Min
ID=-250µA, VGS=0V
-30
-1
Zero Gate Voltage Drain Current
IGSS
Gate-Body leakage current
VDS=0V, VGS=±20V
VGS(th)
Gate Threshold Voltage
VDS=VGS ID=-250µA
-1.4
ID(ON)
On state drain current
VGS=-10V, VDS=-5V
-40
RDS(ON)
Static Drain-Source On-Resistance
gFS
Forward Transconductance
VSD
Diode Forward Voltage
IS=-1A,VGS=0V
Maximum Body-Diode Continuous Current
TJ=55°C
VGS=-10V, ID=-18A
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge (10V)
Qg(4.5V) Total Gate Charge (4.5V)
Qgs
Gate Source Charge
Qgd
Gate Drain Charge
tD(on)
Turn-On DelayTime
tr
Turn-On Rise Time
tD(off)
Turn-Off DelayTime
tf
Turn-Off Fall Time
-5
-2
-2.7
V
A
22
30
VGS=-4.5V, ID=-10A
29
40
VDS=-5V, ID=-18A
21
-0.7
1573
VGS=-10V, VDS=-15V, ID=-18A
VGS=-10V, VDS=-15V, RL=0.83Ω,
RGEN=3Ω
mΩ
mΩ
S
-1
V
-1.2
A
1900
pF
319
pF
211
VGS=0V, VDS=0V, f=1MHz
µA
nA
18
VGS=0V, VDS=-15V, f=1MHz
Units
±100
25
TJ=125°C
DYNAMIC PARAMETERS
Ciss
Input Capacitance
Coss
Max
V
VDS=-24V, VGS=0V
IDSS
IS
Typ
pF
6.7
10
Ω
29.3
35
nC
15
18
nC
6.1
nC
7
nC
11.7
ns
29
ns
42
ns
32.5
trr
Body Diode Reverse Recovery Time
IF=-18A, dI/dt=100A/µs
28.3
Qrr
Body Diode Reverse Recovery Charge IF=-18A, dI/dt=100A/µs
20.5
ns
37
ns
nC
A: The value of R θJA is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C. The
value in any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance
rating.
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.
D. The R θJA is the sum of the thermal impedence from junction to lead R θJL and lead to ambient.
E. The static characteristics in Figures 1 to 6,12,14 are obtained using 80 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,
assuming a maximum junction temperature of TJ(MAX)=175°C.
G. The maximum current rating is limited by bond-wires.
Rev1: August 2005
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
Alpha & Omega Semiconductor, Ltd.
AOU417
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
30
-10V
-5V
25
VDS=-5V
25
-4V
20
15
-ID(A)
-ID (A)
20
-3.5V
15
10
10
125°C
VGS=-3V
5
5
0
25°C
0
0
1
2
3
4
5
1
1.5
35
3
3.5
4
4.5
5
1.6
Normalized On-Resistance
VGS=-4.5V
30
RDS(ON) (mΩ)
2.5
-VGS(Volts)
Figure 2: Transfer Characteristics
-VDS (Volts)
Fig 1: On-Region Characteristics
1.4
25
VGS=-10V
ID=-18A
1.2
VGS=-10V
20
15
10
VGS=-4.5V
ID=-10A
1
0.8
0
5
10
15
20
25
0
-ID (A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
25
50
75
100
125
150
175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
1.0E+01
60
ID=-18A
50
1.0E+00
1.0E-01
125°C
30
-IS (A)
40
RDS(ON) (mΩ)
2
125°C
1.0E-02
1.0E-03
20
25°C
10
1.0E-04
1.0E-05
0
3
4
5
6
7
8
9
10
-VGS (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
25°C
1.0E-06
0.0
0.2
0.4
0.6
0.8
-VSD (Volts)
Figure 6: Body-Diode Characteristics
1.0
AOU417
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
2500
10
VDS=-15V
ID=-18A
2000
Capacitance (pF)
-VGS (Volts)
8
6
4
2
Ciss
1500
Coss
1000
Crss
500
0
0
5
10
15
20
25
0
30
0
-Qg (nC)
Figure 7: Gate-Charge Characteristics
100
1
Power (W)
-ID (Amps)
100m
10s
1s
DC
1ms
10ms
10
100
-VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
ZθJC Normalized Transient
Thermal Resistance
10
30
120
80
0
0.0001
1
25
40
0.1
0.1
20
TJ(Max)=175°C
TA=25°C
160
100µs
RDS(ON)
limited
15
200
10µs
10
10
-VDS (Volts)
Figure 8: Capacitance Characteristics
10µs
TJ(Max)=175°C, TA=25°C
5
D=Ton/T
TJ,PK=TC+PDM.ZθJC.RθJC
RθJC=3°C/W
0.001
0.01
0.1
1
10
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-toCase (Note F)
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
1
0.1
PD
Ton
0.01
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
T
1
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
Alpha & Omega Semiconductor, Ltd.
10
100
AOU417
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
60
L ⋅ ID
tA =
BV − VDD
40
Power Dissipation (W)
-ID(A), Peak Avalanche Current
50
30
20
TA=25°C
10
0.0001
0.001
30
20
10
20
15
10
5
0
25
50
75
100
125
150
TCASE (°C)
Figure 14: Current De-rating (Note B)
Alpha & Omega Semiconductor, Ltd.
0
25
50
75
100
125
150
TCASE (°C)
Figure 13: Power De-rating (Note B)
Time in avalanche, tA (s)
Figure 12: Single Pulse Avalanche capability
Current rating -ID(A)
40
0
0
0.00001
0
50
175
175