TI TAS5601

TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
20W STEREO (BTL) DIGITAL AMPLIFIER POWER STAGE
•
FEATURES
1
• Supports Multiple Output Configurations
– 2×20-W into a 8-Ω BTL Load at 18 V
– 4×10-W into a 4-Ω SE Load at 18 V
– 2×10W (SE) + 1×20W (BTL) at 18 V
• Thermally Enhanced Package
– DCA (56-pin HTTSOP)
• Wide Voltage Range: 10V–26V
– No Separate Supply Required for Gate
Drive
• Efficient Class-D Operation Eliminates Need
for Heat Sinks
• Closed Loop Power Stage Architecture
– Improved PSRR Reduces Power Supply
Performance Requirements
– High Damping Factor Provides for Tighter,
More Accurate Sound With Improved Bass
Response
– Constant Output Power Over Variation in
Supply Voltage
• Differential Inputs
2
Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature,
and Short Circuit With Error Reporting
APPLICATIONS
•
Flat-Panel, Rear-Projection, and CRT TV
DESCRIPTION
The TAS5601 is a 20-W (per channel) efficient,
stereo digital amplifier power stage for driving 4
single-ended speakers, 2 bridge-tied speakers, or
combination of single and bridge-tied loads. The
TAS5601 can drive a speaker with an impedance as
low as 4Ω. The high efficiency, >90% into 8-Ω loads,
of the TAS5601 eliminates the need for an external
heat sink.
A simple interface to a digital audio PWM processor
is shown below. The TAS5601 is fully protected
against faults with short-circuit protection and thermal
protection as well as overvoltage and undervoltage
protection. Faults are reported back to the processor
to prevent devices from being damaged during
overload conditions.
SIMPLIFIED APPLICATION CIRCUIT
3 - 4.2 V
Digital PWM Processor
10 - 26 V
DVDD
DGND
I2S
TAS5602
DVDD
DGND
OUTA_P
PWM_AP
OUTA_N
PWM_AN
OUTB_P
PWM_BP
OUTB_N
PVCC
AVCC
BSA
OUTA
OUTB
LC
Filter
PWM_BN
BSB
Control
Inputs
OUTC_P
PWM_CP
OUTC_N
PWM_CN
OUTD_P
PWM_DP
OUTD_N
PWM_DN
BSC
OUTC
OUTD
LC
Filter
BSD
VCLAMP_AB
VALID
ERROR
GPIO
RESET
VCLAMP_CD
FAULT
BYPASS
THERM_WARN
AGND
SE/BLT
PGND
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
System Two, Audio Precision are trademarks of Audio Precision, Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PINOUT
DCA PACKAGE
(TOP VIEW)
PGNDA
PGNDA
PGNDA
PVCCA
PVCCA
PVCCA
NC
DVDD
DGND
PWM_AP
PWM_AN
PWM_BP
PWM_BN
PWM_CP
PWM_CN
PWM_DP
PWM_DN
RESET
FAULT
SE/BTL
THERM_WARN
NC
PVCCD
PVCCD
PVCCD
PGNDD
PGNDD
PGNDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
OUTA
OUTA
PGNDB
PGNDB
PGNDB
OUTB
OUTB
PVCCB
PVCCB
BSB
VCLAMP_AB
BSA
NC
AVCC
AGND
BYPASS
BSD
VCLAMP_CD
BSC
PVCCC
PVCCC
OUTC
OUTC
PGNDC
PGNDC
PGNDC
OUTD
OUTD
TERMINAL FUNCTIONS
TERMINAL
NO.
2
I/O
DESCRIPTION
NAME
40
BSD
I/O
39
VCLAMP_CD
–
38
BSC
I/O
43
AVCC
–
42
AGND
Bootstrap I/O for channel D high-side FET
Internally generated voltage supply for channel C and D bootstrap. Not to be used as a supply or
connected to any component other than the decoupling capacitor.
Bootstrap I/O for channel C high-side FET
Analog power supply
Analog ground
8
DVDD
I
Digital supply (3V–4.2V). Supply for PWM input signal conditioning, FAULT and RST I/O buffers
9
DGND
I
Ground reference input for PWM and digital inputs
10
PWM_AP
I
Positive audio signal PWM input for channel A (Must be the compliment of PWM_AN)
11
PWM_AN
–
Negative audio signal PWM input for channel A (Must be compliant of PWM_AP)
12
PWM_BP
I
Positive audio signal PWM input for channel B (Must be the compliment of PWM_BN)
13
PWM_BN
–
Negative audio signal PWM input for channel B (Must be compliant at PWM_BR)
14
PWM_CP
I
Positive audio signal PWM input for channel C (Must be the compliment of PWM_CN)
15
PWM_CN
–
Negative audio signal PWM input for channel C (Must be the compliment of PWM_CN)
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NO.
NAME
16
PWM_DP
I
Positive audio signal PWM input for channel D (Must be the compliment of PWM_DN)
17
PWM_DN
–
Negative audio signal PWM input for channel D (Must be the compliment of PWM_DN)
18
RESET
I
Enable/Disable pin
RESET = High, normal operation
RESET = Low, held in reset mode
19
FAULT
O
Short circuit fault
FAULT = High, normal operation
FAULT = Low, short circuit at output detected. FAULT will latch if short circuit detected and will be
reset if the RESET pin is pulled low or the VCC power supplies are turned off. Thermal fault will
not be reported by the FAULT pin.
20
SE/BTL
I
Single-ended or Bridge-tied output select terminal. If any output is configured as a single-ended
load, this pin should be connected to DVDD. For 2-channel, BTL operation, connect to GND.
21
THERM_WARN
O
Thermal warning output flag.
THERM_WARN = HIGH, normal operation.
THERM_WARN = LOW, die temperature has reached 125 deg. C. Automatically resets when
temperature falls back to normal range. TTL compatible push-pull output.
41
BYPASS
O
VCC/8 reference for analog cells
47
BSB
I/O
Bootstrap I/O for channel B high-side FET
46
VCLAMP_AB
–
45
BSA
I/O
Bootstrap I/O for channel A high-side FET
Internally generated voltage supply for channel A and B bootstrap. Not to be used as a supply or
connected to any component other than the decoupling capacitor.
4–6
PVCCA
–
Positive power supply for channel A output
55, 56
OUTA
O
Channel A 1/2 H-bridge output
1–3
PGNDA
–
Power ground reference for channel A output
48, 49
PVCCB
–
Positive power supply for channel B output
52–54
PGNDB
–
Power ground reference for channel B output
50, 51
OUTB
O
Channel B 1/2 H-bridge output
34, 35
OUTC
O
Channel C 1/2 H-bridge output
31–33
PGNDC
–
Power ground reference for channel C output
36, 37
PVCCC
–
Positive power supply for channel C output
26–28
PGNDD
–
Power ground reference for channel D output
29, 30
OUTD
O
Channel D 1/2 H-bridge output
23–25
PVCCD
–
Positive power supply for channel D output
7, 22,
44
NC
–
No internal connection.
–
Thermal Pad
Connect to PGNDx
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
3
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted) (1)
Supply Voltage
Input Voltage
VALUE
UNIT
DVDD
–0.3 to 5
V
AVCC, PVCC
–0.3 to 30
–0.3 to DVDD + 0.3
V
Operating free-air temperature, TA
RESET, SE/BTL, PWM_xP, PWM_xN
–40 to 85
°C
Operating junction temperature range, TJ
–40 to 150
°C
Storage temperature range, Tstg
–65 to 150
°C
260
°C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
PACKAGE
TA ≤ 25°C
DERATING FACTOR
TA = 70°C
TA = 85°C
DCA (56 pin HTSSOP)
5.5 W
44 mW/°C
3.52 W
2.86 W
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage, VCC
10
26
PVCCx, AVCC (output is fully protected from shorts
with no inductance between short and terminal)
10
20
DVDD
3
High-level input voltage, VIH
PWM_xx, RESET, SE/ BTL
2
Low-level input voltage, VIL
PWM_xx, RESET, SE/ BTL
High-level output voltage, VOH
FAULT, THERM_WARN, IOH = 10 µA
Low-level output voltage, VOL
FAULT, THERM_WARN, IOL = –10 µA
PWM input frequency, fPWM
PWM_xx
Load Impedance
RL(PBTL)
UNIT
V
V
V
DVDD–0.4V
V
V
DGND+0.4V
6.0
8
3.2
4
V
400
kHz
85
°C
Ω
3.2
Lo(BTL)
Output-filter
Inductance
Minimum output inductance under short-circuit
condition
Lo (PBTL)
4
4.2
0.8
–40
Output filter: L= 22 µH, C = 680 nF
Lo (SE)
3.3
200
Operating free-air temperature, TA
RL(SE)
MAX
PVCCx, AVCC (minimum series inductance of 5uH
for full output short circuit protection)
Digital reference voltage
RL(BTL)
NOM
10
µH
10
10
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
DC ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
| VOS |
Class-D output offset voltage (measured with respect
to VCC/2 for SE and output-to-output for BTL)
50% duty cycle PWM at PWM_xx inputs
VBYPASS
VCC/8 reference for analog section
No load
IIH
High-level input current
PWM_xx, RESET, SE/BTL, VI = DVDD, DVDD = 5 V
IIL
Low-level input current
PWM_xx, RESET, SE/BTL, VI = 0, DVDD = 5 V
IDVDD
DVDD supply current
RESET = 2.0 V, DVDD = 3.3 V, No load
ICC
Quiescent supply current
RESET = 2.0 V No load, PVCC = 18 V
ICC(RESET) Quiescent supply current in reset mode
RDS(on)
TON
TOFF
MAX
26
80
mV
5
µA
5
µA
VCC/8
19
RESET = 0.8 V, No load, PVCC = 18 V
Drain-source on-state resistance
TYP
VCC = 24 V, Io = 500 mA, TJ = 25°C
UNIT
V
11
22
µA
35
60
mA
64
216
µA
High side
360
Low side
330
Total
690
Turn-on time (SE mode), voltage on BYPASS pin
reaches final value of PVCC/8
C(BYPASS) = 1µF, RESET = 2 V, SE/BTL = 2V
Turn-on time (BTL mode) , voltage on BYPASS pin
reaches final value of PVCC/8
C(BYPASS) = 1µF, RESET = 2 V, SE/BTL = 0.8 V
30
Turn-off time (SE mode), voltage on BYPASS pin
reaches final value of PVCC/8
C(BYPASS) = 1 µF, RESET = 0.8 V, SE/BTL = 2 V
500
Turn-off time (BTL mode) , voltage on BYPASS pin
reaches final value of PVCC/8
C(BYPASS) = 1 µF, RESET= 0.8 V, SE/BTL = 0.8 V
mΩ
500
ms
ms
1
DC ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted)
PARAMETER
TEST CONDITIONS
| VOS |
Class-D output offset voltage (measured with
respect to VCC/2 for SE and output-to-output
for BTL)
50% duty cycle PWM at PWM_xx inputs
VBYPASS
VCC/8 reference for analog section
No load
IDVDD
DVDD supply current
RESET = 2.0 V, DVDD = 3.3 V, No load
ICC
Quiescent supply current
RESET = 2.0 V, No load
ICC(RESET)
Quiescent supply current in reset mode
RESET = 0.8 V, No load
RDS(on)
TON
TOFF
Drain-source on-state resistance
VCC = 12 V, Io = 500 mA, TJ = 25°C
MIN
TYP
MAX
26
80
mV
22
µA
28
51
mA
64
216
µA
VCC/8
11
14
High side
360
Low side
330
Total
690
Turn-on time (SE mode), voltage on BYPASS
pin reaches final value of PVCC/8
C(BYPASS) = 1µF, RESET = 2 V, SE/BTL = 2V
Turn-on time (BTL mode), voltage on BYPASS
pin reaches final value of PVCC/8
C(BYPASS) = 1µF, RESET = 2 V, SE/BTL = 0.8 V
30
Turn-off time (SE mode), voltage on BYPASS
pin reaches final value of PVCC/8
C(BYPASS) = 1 µF, RESET = 0.8 V, SE/BTL = 2 V
500
Turn-off time (BTL mode), voltage on BYPASS
pin reaches final value of PVCC/8
C(BYPASS) = 1 µF, RESET= 0.8 V, SE/BTL = 0.8 V
V
Product Folder Link(s): TAS5601
mΩ
500
1
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
UNIT
ms
ms
5
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
AC ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 24 V, RL = 8Ω (unless otherwise noted)
PARAMETER
KSVR
PO
THD+N
Vn
SNR
TEST CONDITIONS
Supply Ripple Rejection
MIN
200 mVpp ripple at 20 Hz–20 kHz, BTL 50%
duty cycle PWM at inputs
Continuous output power
TYP MAX
–60
BTL – RL = 8Ω, THD+N = 7%, f = 1 kHz,
VCC = 18 V
20
SE – RL = 4Ω, THD+N = 10%, f = 1 kHz,
VCC = 24 V
19
UNIT
dB
W
Total Harmonic Distortion + Noise (SE)
VCC = 24 V, f = 1 kHz, Po = 10 W
0.08%
Total Harmonic Distortion + Noise (BTL)
Vcc = 18 V, Rl = 8Ω, f = 1 kHz,
Po = 10 W (half-power)
0.04%
Output Integrated Noise
20 Hz to 22 kHz, A-weighted filter, GD
modulation
Crosstalk
Po = 1 W, f = 1 kHz
Signal-to-noise ratio
Max. Output at THD+N <1%, f = 1 kHz,
A-weighted, VCC = 18 V
125
µV
–78
dB
–70
dB
99
dB
Thermal trip point (output shutdown,
unlatched fault)
150
°C
Thermal warning trip (THERM_WARN = Low)
125
°C
20
°C
–60
Thermal hysteresis
AC ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 12 V, RL = 8Ω (unless otherwise noted)
PARAMETER
KSVR
Supply Ripple Rejection
PO
Continuous output power
TEST CONDITIONS
SNR
–60
BTL – RL = 8Ω, THD+N = 10%, f = 1 kHz,
9.5
SE – RL = 4Ω, THD+N = 10%, f = 1 kHz,
4.5
MAX
UNIT
dB
W
VCC = 12 V, f = 1 kHz, Po = 2 W (half-power)
0.04
%
Total Harmonic Distortion + Noise (BTL)
Vcc = 12 V, Rl = 8Ω, f = 1 kHz,
Po = 5 W (half-power)
0.07
%
Output Integrated Noise
20 Hz to 22 kHz, A-weighted filter, BD
modulation
125
µV
–78
dB
Crosstalk
Po = 1 W, f = 1 kHz
–70
dB
Signal-to-noise ratio
Max. Output at THD+N <1%, f = 1 kHz,
A-weighted
96
dB
Thermal trip point (output shutdown, unlatched
fault)
150
°C
Thermal warning trip (THERM_WARN = Low)
125
°C
20
°C
Thermal hysteresis
6
TYP
Total Harmonic Distortion + Noise (SE)
THD+N
Vn
MIN
200 mVpp ripple at 20 Hz–20 kHz, BTL 50%
duty cycle PWM at inputs
Submit Documentation Feedback
–60
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
APPLICATION CIRCUITS
PA1
PGND
0.68 mF
8W
PGND
0.68 mF
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
To PWM
Modulater
PGND
0.68 mF
8W
PGND
PGND
PGND
PGND
0.68 mF
Figure 1. Bridge Tied Load (BTL) Application Schematic
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
7
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
PA1
4W
PGND
PGND
PGND
4W
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
PGND
To PWM
Modulater
PGND
DVDD
4W
PGND
PGND
PGND
PGND
PGND
4W
TAS5601DCA
PGND
Figure 2. Single Ended (SE) Application Schematic
8
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
TYPICAL CHARACTERISTICS
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
VCC = 12 V
RL = 8 Ω
1
P=5W
P = 2.5 W
0.1
P = 0.5 W
0.01
20
100
1k
VCC = 18 V
RL = 8 Ω
1
P=5W
0.1
0.01
P=1W
P = 10 W
0.001
20
10k 20k
100
1k
f − Frequency − Hz
10k 20k
f − Frequency − Hz
G002
Figure 3. THD+N Vs. Frequency (BTL)
Figure 4. THD+N Vs. Frequency (BTL)
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
VCC = 24 V
RL = 8 Ω
1
0.1
P=5W
0.01
P=1W
P = 10 W
0.001
20
100
1k
10k 20k
VCC = 12 V
RL = 8 Ω
1
f = 20 Hz
f = 1 kHz
0.1
0.01
f = 10 kHz
0.001
0.01
f − Frequency − Hz
G003
Figure 5. THD+N Vs. Frequency (BTL)
0.1
1
10
PO − Output Power − W
Product Folder Link(s): TAS5601
G004
Figure 6. THD+N Vs. Output Power (BTL)
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
40
9
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
TYPICAL CHARACTERISTICS (continued)
10
THD+N − Total Harmonic Distortion + Noise − %
THD+N − Total Harmonic Distortion + Noise − %
10
VCC = 18 V
RL = 8 Ω
1
0.1
f = 1 kHz
f = 10 kHz
0.01
f = 20 Hz
0.001
0.01
0.1
1
10
1
f = 10 kHz
0.1
f = 1 kHz
0.01
f = 20 Hz
0.001
0.01
40
PO − Output Power − W
VCC = 24 V
RL = 8 Ω
0.1
G005
Figure 7. THD+N Vs. Output Power (BTL)
100
4.5
90
4.0
40
G006
R L = 8Ω
VCC = 24 V
VCC = 18 V
60
I CC − Supply Current − A
3.5
70
Efficiency − %
10
Figure 8. THD+N Vs. Output Power (BTL)
80
VCC = 12 V
50
40
30
3.0
2.5
V CC = 24 V
2.0
1.5
V CC = 18 V
1.0
20
V CC = 12 V
0.5
10
RL = 8 Ω
0.0
0
0
5
10
15
20
25
30
35
40
45
50
0
10
20
30
40
50
60
70
80
P O − Total Output Power − W
PO − Output Power − W
G008
Figure 9. Efficiency Vs. Output Power (BTL)
10
1
PO − Output Power − W
90 100
G009
Figure 10. Supply Current Vs. Total Output Power (BTL)
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
TYPICAL CHARACTERISTICS (continued)
0
50
RL = 8 Ω
45
−20
35
−40
Crosstalk − dB
PO − Output Power − W
40
30
THD+N = 10%
25
20
THD+N = 1%
15
−60
−80
10
−100
5
0
10
12
14
16
18
20
22
24
Left to Right
26
VCC − Supply Voltage − V
Right to Left
RL = 8 Ω
VCC = 12 V
−120
20
28
100
G014
Figure 12. Crosstalk Vs. Frequency
0
THD+N − Total Harmonic Distortion + Noise − %
10
−20
Crosstalk − dB
−40
−60
Right to Left
−80
Left to Right
−120
20
10k 20k
G010
Figure 11. Output Power Vs. Supply Voltage (BTL)
−100
1k
f − Frequency − Hz
RL = 8 Ω
VCC = 18 V
100
1k
10k 20k
PO = 1 W
RL = 4 Ω
1
VCC = 12 V
0.1
0.01
VCC = 24 V
VCC = 18 V
0.001
20
f − Frequency − Hz
G015
Figure 13. Crosstalk Vs. Frequency
100
1k
10k 20k
f − Frequency − Hz
G017
Figure 14. THD+N Vs. Frequency (SE)
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
11
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
TYPICAL CHARACTERISTICS (continued)
90
f = 1 kHz
RL = 4 Ω
80
70
1
VCC = 12 V
0.1
VCC = 18 V
50
VCC = 12 V
40
30
0.01
20
VCC = 18 V
VCC = 24 V
10
0.001
0.01
0
0.1
1
10
40
0
5
10
15
20
PO − Output Power (Per Channel) − W
PO − Output Power − W
G018
Figure 15. THD+N Vs. Output Power (SE)
12
VCC = 24 V
60
Efficiency − %
THD+N − Total Harmonic Distortion + Noise − %
10
25
G020
Figure 16. Efficiency Vs. Output Power (SE)
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
APPLICATION INFORMATION
CLOSED-LOOP POWER STAGE CHARACTERISTICS
The TAS5601 is PWM input power stage with a closed loop architecture. A 2nd order feedback loop varies the
PWM output duty cycle with changes in the supply voltage. This ensures that the output voltage (and output
power) remain the same over transitions in the power supply.
Open-loop power stages have an output duty cycle that is equal to the input duty cycle. Since the duty cycle
does NOT change to compensate for changes in the supply voltage, the output voltage (and power) change with
supply voltage changes. This is undesirable effect that closed-loop architecture of the TAS5601 solves.
The single-ended (SE) gain of the TAS5601 is fixed, and specified below:
TAS5601 Gain = 0.13 / Modulation Level (Vrms/%)
Modulation level = fraction of full-scale modulation of the PWM signal at the input of the power stage.
TAS5601 (SE) Voltage Level (in Vrms) = 0.13 x Modulation Level
The bridge-tied (BTL) gain of the TAS5601 is equal to 2x the SE gain:
TAS5601 (BTL) Voltage Level (in Vrms) = 0.26 x Modulation Level
For a digital modulator like the TAS5706, the default maximum modulation limit is 97.7%. For a full scale input,
the PWM output switches between 2.3% and 97.7%. This equates to a modulation level of 95.4% for a full scale
input (0 dBFS).
For example, calculate the output voltage in RMS volts given a –20 dBFS signal to a digital modulator with a
maximum modulation limit of 97.7% in a BTL output configuration:
TAS5601 Output Voltage = 0.1 (–20dB) x 0.26 (Gain) x 95.4 (Modulation Level)
= 2.48 Vrms
It is also important to maintain a switching signal at the PWM inputs of the TAS5601 while the RESET terminal is
held HIGH (>1.9V). If a switching signal is not maintained on the inputs under the previous condition, a loud
“pop” can occur in the speaker. The TAS5601 is not compatible with modulators that hard mute the outputs
(output go to LOW-LOW state). For MUTE case, the modulator needs to hold outputs switching at 50% duty
cycle.
For power-up, ensure that the PWM inputs are switching before RESET is transitioned HIGH (>1.9V). For
shutdown and power-down, the PWM inputs should remain switching for the “turn-off” time specified in the DC
Electrical Characteristics table. For SE mode, this is approximately 500ms. For BTL mode, the time is much
faster, at 30ms. This ensures the best “pop” performance in the system.
POWER SUPPLIES
To allow simplified system design, the TAS5601 requires only a single supply (PVCC) for the the power blocks
and a 3.3 V (DVDD) supply for PWM input blocks. In addition, the high-side gate drive is provided by built-in
bootstrap circuits requiring only an external capacitor for each half-bridge.
In order for the bootstrap circuit to function properly, it is necessary to connect a small ceramic capacitor from
each bootstrap pin (BS_) to the corresponding output pin (OUT_). When the power-stage output is low, the
bootstrap capacitor is charged through an internal diode. When the power-stage output is high, the bootstrap
capacitor potential is shifted above the output potential and thus provides a suitable voltage supply for the
high-side gate drive.
DEVICE PROTECTION SYSTEM
The TAS5601 contains a complete set of protection circuits carefully designed to make system design efficient as
well as to protect the device against any kind of permanent failures due to short circuits, overload,
overtemperature, and undervoltage.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
13
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
Protection Mechanisms in the TAS5601
•
•
•
•
SCP (short-circuit protection, OCP) protects against shorts across the load, to GND, and to PVCC.
OTP turns off the device if Tdie (typical) > 150°C.
UVP turns off the device if PVCC (typical) < 8.4 V
OVP turns off the device if PVCC (typical) > 27.5 V
Single-Ended Output Capacitor, CO
In single-ended (SE) applications, the dc blocking capacitor forms a high-pass filter with the speaker impedance.
The frequency response rolls of with decreasing frequency at a rate of 20 dB/decade. The cutoff frequency is
determined by
fc = 1/2πCOZL
Table 1 shows some common component values and the associated cutoff frequencies:
Table 1. Common Filter Responses
CSE – DC Blocking Capacitor (µF)
Speaker Impedance (Ω)
fc = 60 Hz (–3 dB)
fc = 40 Hz (–3 dB)
fc = 20 Hz (–3 dB)
4
680
1000
2200
8
330
470
1000
Output Filter and Frequency Response
For the best frequency response, a flat-passband output filter (second-order Butterworth) may be used. The
output filter components consist of the series inductor and capacitor to ground at the output pins. There are
several possible configurations, depending on the speaker impedance and whether the output configuration is
single-ended (SE) or bridge-tied load (BTL). Table 2 lists the recommended values for the filter components. It is
important to use a high-quality capacitor in this application. A rating of at least X7R is required.
Table 2. Recommended Filter Output Components
Output Configuration
Speaker Impedance (Ω)
Filter Inductor (µH)
Filter Capacitor (nF)
4
22
680
8
47
390
4
10
1500
8
22
680
Single Ended (SE)
Bridge Tied Load (BTL)
Lfilter
OUTA
Lfilter
OUTA
Cfilter
Cfilter
OUTB
Lfilter
Cfilter
Figure 17. BTL Filter Configuration
Figure 18. SE Filter Configuration
Power-Supply Decoupling, CS
The TAS5601 is a high-performance CMOS audio amplifier that requires adequate power-supply decoupling to
14
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
ensure that the output total harmonic distortion (THD) is as low as possible. Power-supply decoupling also
prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is
achieved by using two capacitors of different types that target different types of noise on the power-supply leads.
For higher-frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR)
ceramic capacitor, typically 0.1 µF to 1 µF, placed as close as possible to the device VCC lead works best. For
filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 220 µF or greater placed near
the audio power amplifier is recommended. The 220-µF capacitor also serves as local storage capacitor for
supplying current during large signal transients on the amplifier outputs. The PVCC terminals provide the power
to the output transistors, so a 220-µF or larger capacitor should be placed on each PVCC terminal. A 10-µF
capacitor on the AVCC terminal is adequate. These capacitors must be properly derated for voltage and
ripple-current rating to ensure reliability.
BSN and BSP Capacitors
The half H-bridge output stages use only NMOS transistors. Therefore, they require bootstrap capacitors for the
high side of each output to turn on correctly. A 220-nF ceramic capacitor, rated for at least 25 V, must be
connected from each output to its corresponding bootstrap input.
The bootstrap capacitors connected between the BSx pins and their corresponding outputs function as a floating
power supply for the high-side N-channel power MOSFET gate-drive circuitry. During each high-side switching
cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side MOSFETs
turned on.
VCLAMP Capacitor
To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, one
internal regulator clamps the gate voltage. One 1-µF capacitor must be connected from each VCLAMP (terminal)
to ground and must be rated for at least 16 V. The voltages at the VCLAMP terminal may vary with VCC and may
not be used for powering any other circuitry.
VBYP Capacitor Selection
The scaled supply reference (BYPASS) nominally provides an AVCC/8 internal bias for the preamplifier stages.
The external capacitor for this reference (CBYP) is a critical component and serves several important functions.
During start-up or recovery from shutdown mode, CBYP determines the rate at which the amplifier starts. The start
up time is proportional to 0.5 s per microfarad in single-ended mode (SE/BTL = DVDD). Thus, the recommended
1-µF capacitor results in a start-up time of approximately 500 ms (SE/BTL = DVDD). The second function is to
reduce noise produced by the power supply caused by coupling with the output drive signal. This noise could
result in degraded power-supply rejection and THD+N.
The circuit is designed for a CBYP value of 1 µF for best pop performance. The input capacitors should have the
same value. A ceramic or tantalum low-ESR capacitor is recommended.
RESET OPERATION
The TAS5601 employs a RESET mode of operation designed to reduce supply current (ICC) to the absolute
minimum level during periods of nonuse for power conservation. The RESET input terminal should be held high
(see specification table for trip point) during normal operation when the amplifier is in use. Pulling RESET low
causes the outputs to amp to GND and the amplifier to enter a low-current state. Never leave RESET
unconnected, because amplifier operation would be unpredictable.
For the best power-up pop performance, place the amplifier in the RESET mode prior to applying the
power-supply voltage.
USING LOW-ESR CAPACITORS
Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor
can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor
minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance,
the more the real capacitor behaves like an ideal capacitor.
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
15
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
SHORT-CIRCUIT PROTECTION
The TAS5601 has short-circuit protection circuitry on the outputs that prevents damage to the device during
output-to-output shorts and output-to-GND shorts after the filter and output capacitor (at the speaker terminal.)
Directly at the device terminals, the protection circuitry prevents damage to device during output-to-output,
output-to-ground, and output-to-supply. When a short circuit is detected on the outputs, the part immediately
disables the output drive. This is latched fault and is cleared by cycling the RESET pin. Normal operation is
restored when the fault is removed.
The FAULT will transition low when a short is detected. The FAULT pin will be cleared after RESET is cycled.
THERMAL PROTECTION
Thermal protection on the TAS5601 prevents damage to the device when the internal die temperature exceeds
150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature exceeds the
thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not a latched
fault. The thermal fault is cleared once the temperature of the die is reduced by 20°C. The device begins normal
operation at this point with no external system interaction.
Thermal protection fault is NOT reported on the FAULT terminal.
A THERM_WARN terminal can be used to monitor when the internal device temperature reaches 125°C. The
terminal will transition low at this point and transition back high after the device cools approximately 20°C. It is
not necessary to cycle RESET to clear this warning flag.
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
Because the TAS5601 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
• Decoupling capacitors—The high-frequency 0.1-µF decoupling capacitors should be placed as close to the
PVCC and AVCC terminals as possible. The BYPASS capacitor and VCLAMP_XX capacitors should also be
placed as close to the device as possible. Large (220-µF or greater) bulk power-supply decoupling capacitors
should be placed near the TAS5601 on the PVCCx terminals. For single-ended operation, a 220 µF capacitor
should be placed on each PVCC pin. For Bridge-tied operation, a single 220 µF, capacitor can be shared
between A and B or C and D.
• Grounding—The AVCC decoupling capacitor and BYPASS capacitor should each be grounded to analog
ground (AGND). The PVCCx decoupling capacitors and VCLAMP_xx capacitors should each be grounded to
power ground (PGND). Analog ground and power ground should be connected at the thermal pad, which
should be used as a central ground connection or star ground for the TAS5601.
• Output filter—The reconstruction LC filter should be placed as close to the output terminals as possible for the
best EMI performance. The capacitors should be grounded to power ground.
• Thermal pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land are described in the mechanical section at the
back of the data sheet. See TI Technical Briefs SLMA002 and SLOA120 for more information about using the
thermal pad. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TAS5601 Evaluation Module (TAS5601EVM) User Manual, (SLOU189). Both the
EVM user manual and the thermal pad application note are available on the TI Web site at http://www.ti.com.
BASIC MEASUREMENT SYSTEM
This section focuses on methods that use the basic equipment listed below:
• Audio analyzer or spectrum analyzer
• Digital multimeter (DMM)
• Oscilloscope
• Twisted-pair wires
• Signal generator
• Power resistor(s)
• Linear regulated power supply
• Filter components
16
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
•
SLAS585 – FEBRUARY 2008
EVM or other complete audio circuit
Figure 19 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine
wave is normally used as the input signal because it consists of the fundamental frequency only (no other
harmonics are present). An analyzer is then connected to the audio power amplifier (APA) output to measure the
voltage output. The analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power
supply is used to reduce the noise and distortion injected into the APA through the power pins. A System Two™
audio measurement system (AP-II) by Audio Precision™ includes the signal generator and analyzer in one
package.
The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling
capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid
attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the
analyzer input impedance should be high. The output resistance, ROUT, of the APA is normally in the hundreds of
milliohms and can be ignored for all but the power-related calculations.
Figure 19(a) shows a class-AB amplifier system. It takes an analog signal input and produces an analog signal
output. This amplifier circuit can be directly connected to the AP-II or other analyzer input.
This is not true of the class-D amplifier system shown in Figure 19(b), which requires low-pass filters in most
cases in order to measure the audio output waveforms. This is because it takes an analog input signal and
converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some
analyzers.
Power Supply
Signal
Generator
APA
RL
Analyzer
20 Hz - 20 kHz
(a) Basic Class-AB
Power Supply
Lfilt
Signal
Generator
Class-D APA
Cfilt
RL
Analyzer
20 Hz - 20 kHz
(b) Traditional Class-D
Figure 19. Audio Measurement Systems
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
17
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
SE Input and SE Output (TAS5601 Stereo Configuration)
The SE input and output configuration is used with class-AB amplifiers. A block diagram of a fully SE
measurement circuit is shown in Figure 20. SE inputs normally have one input pin per channel. In some cases,
two pins are present; one is the signal and the other is ground. SE outputs have one pin driving a load through
an output ac-coupling capacitor and the other end of the load is tied to ground. SE inputs and outputs are
considered to be unbalanced, meaning one end is tied to ground and the other to an amplifier input/output.
The generator should have unbalanced outputs, and the signal should be referenced to the generator ground for
best results. Unbalanced or balanced outputs can be used when floating, but they may create a ground loop that
affects the measurement accuracy. The analyzer should have balanced inputs to cancel out any common-mode
noise in the measurement.
Evaluation Module
Audio Power
Amplifier
Generator
Analyzer
CIN
VGEN
RIN
RGEN
Lfilt
CL
Cfilt
Twisted-Pair Wire
RL
RANA
CANA
RANA
CANA
Twisted-Pair Wire
Figure 20. SE Input—SE Output Measurement Circuit
The following general rules should be followed when connecting to APAs with SE inputs and outputs:
• Use an unbalanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted-pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure the cables from the power supply to the APA, and from the APA to the load, can handle the large
currents (see Table 3).
18
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
TAS5601
www.ti.com
SLAS585 – FEBRUARY 2008
DIFFERENTIAL INPUT AND BTL OUTPUT (TAS5601 Mono Configuration)
Many of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied-load (BTL) outputs.
Differential inputs have two input pins per channel and amplify the difference in voltage between the pins.
Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly
used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180°
out of phase. The load is connected between these pins. This has the added benefits of quadrupling the output
power to the load and eliminating a dc-blocking capacitor.
A block diagram of the measurement circuit is shown in Figure 21. The differential input is a balanced input,
meaning the positive (+) and negative (–) pins have the same impedance to ground. Similarly, the SE output
equates to a balanced output.
Evaluation Module
Audio Power
Amplifier
Generator
Analyzer
CIN
RGEN
VGEN
Lfilt
RIN
Cfilt
CIN
RGEN
RL
Lfilt
RIN
Cfilt
Twisted-Pair Wire
RANA
CANA
RANA
CANA
Twisted-Pair Wire
Figure 21. Differential Input, BTL Output Measurement Circuit
The generator should have balanced outputs, and the signal should be balanced for best results. An unbalanced
output can be used, but it may create a ground loop that affects the measurement accuracy. The analyzer must
also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise in
the circuit and providing the most accurate measurement.
The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs:
• Use a balanced source to supply the input signal.
• Use an analyzer with balanced inputs.
• Use twisted-pair wire for all connections.
• Use shielding when the system environment is noisy.
• Ensure that the cables from the power supply to the APA, and from the APA to the load, can handle the large
currents (see Table 3).
Table 3 shows the recommended wire size for the power supply and load cables of the APA system. The real
concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations
are based on 12-inch (30.5-cm)-long wire with a 20-kHz sine-wave signal at 25°C.
Table 3. Recommended Minimum Wire Size for Power Cables
DC POWER LOSS
(mW)
AWG Size
AC POWER LOSS
(mW)
POUT (W)
RL(Ω)
10
4
18
22
16
40
18
42
2
4
18
22
3.2
8
3.7
8.5
1
8
22
28
2
8
2.1
8.1
< 0.75
8
22
28
1.5
6.1
1.6
6.2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TAS5601
19
PACKAGE OPTION ADDENDUM
www.ti.com
20-Mar-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TAS5601DCA
ACTIVE
HTSSOP
DCA
56
35
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5601DCAG4
ACTIVE
HTSSOP
DCA
56
35
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5601DCAR
ACTIVE
HTSSOP
DCA
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5601DCARG4
ACTIVE
HTSSOP
DCA
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TAS5601DCAR
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
DCA
56
Reel
Reel
Diameter Width
(mm) W1 (mm)
330.0
24.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.6
1.8
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TAS5601DCAR
HTSSOP
DCA
56
2000
346.0
346.0
41.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated