IX2127 High-Voltage Power MOSFET & IGBT Driver Driver Characteristics Parameter VOFFSET IO +/- (Source/Sink) Description Rating Units 600 V 250/500 mA VCSth 250 mV tON / tOFF (Typical) 100 ns The IX2127 is a high-voltage, high-speed power MOSFET and IGBT driver. High-voltage level-shift circuitry enables this device to operate up to 600V. Clare’s proprietary common-mode design techniques provide stable operation in high dV/dt noise environments. An on-board comparator can be used to detect an over-current condition in the driven MOSFET or IGBT device, and then shut down drive to that device. An open-drain output, FAULT, indicates that an over-current shutdown has occurred. Features • Floating Channel Designed for Bootstrap Operation up to 600V • Tolerant to Negative Transient Voltages; dV/dt Immune • Undervoltage Lockout • 3.3V, 5V, and 12V Input Logic Compatible • Open-Drain FAULT Indicator Pin Shows Over-Current Shutdown • Output in Phase with the Input The gate driver output typically can source 250mA and sink 500mA, which is suitable for fluorescent lamp ballast, motor control, SMPS, and other converter drive topologies. The IX2127 is provided in 8-pin DIP and 8-pin SOIC packages, and is available in Tape & Reel versions. See ordering information below. Applications • High-Speed Gate Driver • Motor Drive Inverter Pb Ordering Information e3 RoHS 2002/95/EC Part Description IX2127G 8-Pin DIP (50/Tube) IX2127N 8-Pin SOIC (100/Tube) IX2127NTR 8-Pin SOIC (2000/Reel) IX2127 Block Diagram VCC Low Side VCC VB High Side Undervoltage Lockout HO Buffer Data Latch Transmitter IN Low-High Level Shift Receiver VS Enable Blanking Signal Delay FAULT Q Enable R Receiver COM S High-Low Level Shift Transmitter + Data Latch CS _ Comparator DS-IX2127 - R01 www.clare.com 1 IX2127 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 General Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 4 5 2. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . R01 www.clare.com 10 10 11 11 2 IX2127 1 Specifications 1.2 Pin Description 1.1 Package Pinout VCC 1 8 VB IN 2 7 HO FAULT 3 6 CS COM 4 5 VS Pin# Name Description 1 VCC 2 IN 3 FAULT Fault Indicator Output 4 COM Logic Ground 5 VS High Side Return 6 CS Comparator Input, Over-Current Detect 7 HO High Side Gate Drive Output 8 VB High Side Supply Voltage Logic Supply Voltage Logic Input 1.3 Absolute Maximum Ratings Unless otherwise specified, ratings are provided at TA=25°C and all bias levels are with respect to COM. Parameter Symbol Minimum Maximum Logic Supply Voltage VCC -0.3 15 High Side Floating Supply Voltage VB -0.3 625 High Side Floating Offset Voltage VS VB-12 VB+0.3 Logic Input Voltage VIN -0.3 VCC+0.3 High Side Floating Output Voltage VHO VS-0.3 VB+0.3 Current Sense Voltage VCS VS-0.3 VB+0.3 FAULT Output Voltage VFLT -0.3 VCC+0.3 dVS/dt - 50 - 1 - 0.625 Allowable Offset Supply Voltage Transient Units V V/ns Package Power Dissipation 8-Lead DIP PD 8-Lead SOIC Junction Temperature TJ - 150 Storage Temperature TS -55 150 W °C Absolute maximum electrical ratings are at 25°C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R01 www.clare.com 3 IX2127 1.4 Recommended Operating Conditions Parameter Logic Supply High Side Floating Supply High Side Offset Voltage Logic Input Voltage Symbol VCC VB VS VIN Minimum Maximum 9 VS+9 12 VS+12 -5 600 VCC High Side Floating Output VHO 0 VS Current Sense Signal Voltage VCS VS VS+5 FAULT Output Voltage Ambient Temperature VFLT TA 0 VCC -40 +125 Units V VB °C 1.5 General Conditions Typical values are characteristic of the device at 25°C and are the result of engineering evaluations. They are provided for information purposes only and are not part of the manufacturing testing requirements. Unless otherwise noted, all electrical specifications are listed for TA=25°C. 1.6 Electrical Characteristics Unless otherwise specified, the test conditions are: VCC=VBS=12V; VCC, IN, FAULT, and Leakage voltages and currents are referenced to COM; VB, HO, and CS voltages and currents are referenced to VS . 1.6.1 Power Supply Specifications Parameter Quiescent VCC Supply Current Conditions VIN=0V Symbol Minimum IQCC - Quiescent VBS Supply Current VIN=0V IQBS - VBS UVLO Positive-Going Threshold - VBS_UV+ 6.8 7.7 8.6 VBS UVLO Negative-Going Threshold VB=VS=600V VBS_UV- 6.3 7.2 8.1 ILKG - - 2 μA Parameter High Level Output Voltage, VB-VHO Conditions IHO=0A Symbol Minimum Typical Maximum Units VOH - - 100 Low Level Output Voltage, VHO Output Short Circuit Pulsed Current IHO=0A mV VOL - - 100 IHO+ -200 -250 - Offset Supply Leakage Current Typical Maximum Units 280 400 μA 500 1000 V 1.6.2 Gate Drive and Shutdown Specifications CS Input, Positive-Going Threshold VHO=0V, VIN=5V, PW<10μs, RGATE=20Ω* (see Figure 1) VHO=12V, VIN=0V, PW<10μs, RGATE=20Ω* (see Figure 1) VCC=9V to 12V IHO- 420 500 - VCS_TH+ 180 260 320 mV VCS=3V ICS+ - - 1 VCS=0V ICS- - - -1 μA “High” CS Bias Current mA * RGATE value must be 20Ω or greater. 4 www.clare.com R01 IX2127 1.6.3 Logic I/O Specifications Parameter Symbol Minimum Typical Logic “1” Input Voltage Conditions VCC=9V to 12V Maximum Units VIH 3.0 Logic “0” Input Voltage VCC=9V to 12V VIL - - - V - 0.8 Logic “1” Input Bias Current VIN=5V IIN+ Logic “0” Input Bias Current VIN=0V IIN- - 2.6 15 - - -1 - FLT, RON - 72 - Ω Conditions Symbol Minimum Typical Maximum Units - RθJA - - 125 200 °C/W Conditions Symbol Minimum Typical Maximum Units Turn-On Propagation Delay ton - 100 200 Turn-Off Propagation Delay toff - 73 200 tr - 23 130 tf - 20 65 tblk 550 766 950 CS Shutdown Propagation Delay tCS - 220 360 CS to FLT Propagation Delay tFLT - 236 510 FAULT On-Resistance μA 1.6.4 Thermal Specifications Parameter Thermal Resistance, Junction to Ambient: 8-Lead DIP 8-Lead SOIC 1.7 Timing Characteristics Parameter Turn-On Rise Time VCC=VBS=12V, CL=1nF, TA=25°C Turn-Off Fall Time Start-Up Blanking Delay ns 1.7.1 Typical Connection Diagram VCC 1 VCC IN 2 IN HO 7 3 FAULT CS 6 4 COM VS FAULT R01 VB 8 RGATE 5 www.clare.com 5 IX2127 1.7.2 I/O Timing Diagram 1.7.5 CS Shutdown Waveforms IN VCS_TH+ CS CS FAULT tcs HO HO 90% 1.7.3 Switching Time Waveforms 50% 1.7.6 CS to FLT Waveforms IN 90% HO VCS_TH+ 10% CS ton tr toff tflt tf FAULT 90% 1.7.4 Startup Blanking Time Waveforms 50% IN tblk CS 90% HO FAULT 6 www.clare.com R01 IX2127 2 Performance Data 500 200 400 150 100 10 Threshold UVLO+ (V) 250 300 200 100 50 9.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 9.0 12.0 8 6 4 2 0 0 0 Quiescent VCC Supply Current IQCC vs. Temperature 9.5 10.0 10.5 11.0 VBS Supply Voltage (V) 11.5 -50 12.0 500 250 400 200 150 0 25 50 75 Temperature (ºC) 100 125 10 Threshold UVLO- (V) 300 -25 VBS Undervoltage Lockout Negative-Going Threshold UVLOvs. Temperature Quiescent VBS Supply Current IQBS vs. Temperature IQBS (μA) IQCC (μA) VBS Undervoltage Lockout Positive-Going Threshold UVLO+ vs. Temperature Quiescent VBS Supply Current IQBS vs. Voltage IQBS (μA) IQCC (μA) Quiescent VCC Supply Current IQCC vs. Voltage 300 200 100 100 8 6 4 2 50 -50 -25 0 25 50 75 Temperature (ºC) 100 -50 125 Logic "1" Input Threshold Voltage vs. VCC 3.0 3.0 0 25 50 75 Temperature (ºC) 100 2.0 1.5 1.0 Logic "0" Input Threshold Voltage vs. VCC 350 1.5 1.0 0.5 0.0 0.0 9.0 9.5 10.0 10.5 11.0 VCC Supply (V) 11.5 12.0 Logic "1" Input Threshold Voltage vs. Temperature (VCC=12V) 3.0 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 1.0 1.5 1.0 25 50 75 Temperature (ºC) 100 125 100 9.0 9.5 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 CS Input Positive Going Threshold vs. Temperature (VCC=12V) 250 200 150 100 0 -50 0 150 50 0.0 -25 CS Input Positive Going Threshold vs. VCC 300 2.0 0.5 -50 125 200 350 0.5 0.0 100 250 12.0 Threshold (mV) Input Voltage (V) 1.5 25 50 75 Temperature (ºC) 0 9.5 2.5 2.0 0 50 Logic "0" Input Threshold Voltage vs. Temperature (VCC=12V) 3.0 2.5 -25 300 2.0 0.5 9.0 R01 -50 125 Threshold (mV) Input Voltage (V) Input Voltage (V) -25 2.5 2.5 Input Voltage (V) 0 0 0 -25 0 25 50 75 Temperature (ºC) www.clare.com 100 125 -50 -25 0 25 50 75 Temperature (ºC) 100 125 7 IX2127 Logic "1" Input Current IIN+ vs. Voltage 4 3 2 1 0 200 200 175 175 150 150 Rise Time (ns) Turn-On Delay Time (ns) Input Current (μA) 5 125 100 75 50 9.5 10.0 10.5 11.0 Voltage (V) 11.5 12.0 175 3.0 2.5 2.0 1.5 1.0 0.5 -50 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) 9.0 12.0 150 125 100 75 50 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 Turn-On Rise Time vs. Temperature (VCC=VBS=12V) 200 -25 0 25 50 75 Temperature (ºC) 100 150 100 50 0 0 125 -50 Logic "0" Input Current IINvs. Voltage -25 0 25 50 75 Temperature (ºC) 100 -50 125 0.0 -0.5 -1.0 150 125 100 75 50 25 10.0 10.5 11.0 Voltage (V) 11.5 9.0 12.0 Logic "0" Input Current IINvs. Temperature 1.0 -0.5 -1.0 10.0 10.5 11.0 11.5 VBIAS Supply Voltage (V) -25 0 25 50 75 Temperature (ºC) 100 125 15 10 5 9.0 50 175 150 125 100 75 50 25 0 -50 125 20 12.0 Turn-Off Fall Time (ns) Turn-Off Delay Time (ns) 0.0 9.5 Turn-Off Time vs. Temperature (VCC=VBS=12V) 200 0.5 100 0 0 9.5 25 50 75 Temperature (ºC) 25 175 Turn-Off Fall Time (ns) Turn-Off Delay Time (ns) 0.5 0 Turn-Off Fall Time vs. Supply Voltage 200 9.0 -25 Turn-Off Time vs. Supply Voltage 1.0 Input Current (μA) 50 25 0.0 Input Current (μA) 9.5 Rise Time (ns) Turn-On Time (ns) Input Current (μA) 200 75 Turn-On Time vs. Temperature (VCC=VBS=12V) Logic "1" Input Current IIN+ vs. Temperature 3.5 100 0 9.0 4.0 125 25 25 0 9.0 8 Turn-On Rise Time vs. Supply Voltage Turn-On Time vs. Supply Voltage -50 -25 0 25 50 75 Temperature (ºC) www.clare.com 100 125 9.5 10.0 10.5 11.0 Supply Voltage (V) 11.5 12.0 Turn-Off Fall Time vs. Temperature (VCC=VBS=12V) 40 30 20 10 0 -50 -25 0 25 50 75 Temperature (ºC) 100 125 R01 IX2127 -50 -25 0 25 50 75 Temperature (ºC) 100 Output Source Current vs. Voltage (VCC=VBS=VBIAS, VIN=5V, PW≤10μs) 250 200 150 100 Ref. Fig. 1: RGATE=20Ω 50 0 10.0 125 Output Source Current (mA) Output Voltage (mV) 11.0 11.5 VBIAS Voltage (V) 350 250 200 150 100 Ref. Fig. 1: RGATE=20Ω -25 0 25 50 75 Temperature (ºC) 100 Ref. Fig. 1: RGATE=20Ω 100 700 10.5 11.0 11.5 VBIAS Voltage (V) 12.0 Output Sink Current vs. Temperature (VCC=VBS=12V, VIN=0V, PW≤10μs) 500 400 300 200 Ref. Fig. 1: RGATE=20Ω 100 -25 0 25 50 75 Temperature (ºC) 100 -25 0 125 CS Shutdown Propagation Delay vs. Input Voltage Start-Up Blanking Delay vs. Input Voltage 25 50 75 Temperature (ºC) 100 125 CS to FLT Propagation Delay vs. VCC Supply Voltage 350 250 300 600 200 250 400 300 Delay (ns) Delay (nS) 500 Delay (ns) 200 -50 -50 125 300 0 0 -50 400 600 300 50 500 0 10.0 12.0 Output Source Current vs. Temperature (VCC=VBS=12V, VIN=5V, PW≤10μs) Low-Level Output Voltage VOL vs. Temperature 100 90 80 70 60 50 40 30 20 10 0 -10 10.5 Output Sink Current vs. V Bias Voltage (VCC=VBS=VBIAS, VIN=0V, PW≤10μs) 600 Output Sink Current (mA) 300 Output Sink Current (mA) 100 90 80 70 60 50 40 30 20 10 0 -10 Output Source Current (mA) Output Voltage (mV) High-Level Output Voltage VOH (VB-VHO) vs. Temperature 150 100 150 100 200 50 50 100 200 0 0 0 9.0 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 12.0 Start-Up Blanking Delay vs. Temperature (VCC=VBS=12V) 800 9.5 10.0 10.5 11.0 Input Voltage (V) 11.5 600 300 350 250 300 10.0 10.5 11.0 VCC Supply Voltage (V) 11.5 12.0 CS to FLT Propagation Delay vs. Temperature (VCC=VBS=12V) 250 400 300 200 100 200 Delay (ns) Delay (ns) 500 150 200 150 100 100 50 50 0 0 -50 R01 9.5 12.0 CS Shutdown Propogation Delay vs. Temperature 700 Delay (ns) 9.0 9.0 -25 0 25 50 75 Temperature (ºC) 100 125 -50 0 -50 -25 0 25 50 75 Temperature (ºC) www.clare.com 100 125 -25 0 25 50 75 Temperature (ºC) 100 125 9 IX2127 3 Manufacturing Information 3.1 Mechanical Dimensions 3.1.1 8-Pin DIP Through-Hole Package 9.652 ± 0.381 (0.380 ± 0.015) 2.540 ± 0.127 (0.100 ± 0.005) PCB Hole Pattern 7.620 ± 0.254 (0.300 ± 0.010) 8-0.800 DIA. (8-0.031 DIA.) 2.540 ± 0.127 (0.100 ± 0.005) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 6.350 ± 0.127 (0.250 ± 0.005) 3.302 ± 0.051 (0.130 ± 0.002) 0.457 ± 0.076 (0.018 ± 0.003) 7.239 TYP. (0.285) 4.064 TYP (0.160) 0.254 TYP (0.01) 7.620 ± 0.127 (0.300 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) Dimensions mm (inches) 0.889 ± 0.102 (0.035 ± 0.004) 3.1.2 8-Pin SOIC Package PCB Land Pattern 0.1905 / 0.2489 (0.0075 / 0.0098) 5.8014 / 6.1976 (0.2284 / 0.2440) 3.810 / 3.988 (0.150 / 0.157) 0.356 / 0.457 (0.014 / 0.018) 1.27 TYP (0.05 TYP) 0.406 / 1.270 (0.016 / 0.050) 1.372 / 1.575 (0.054 / 0.062) 1.50 (0.059) 0.60 (0.024) 5.30 (0.209) 1.27 (0.050) 4.801 / 4.978 (0.189 / 0.196) 0.1016 / 0.2489 (0.0040 / 0.0098) 0.533 REF (0.021 REF) 10 Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.524 / 1.727 (0.060 / 0.068) www.clare.com R01 IX2127 3.1.3 Tape & Reel Packaging for 8-Pin SOIC Package 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) W=12.00 (0.472) B0=5.30 (0.209) K0= 2.10 (0.083) A0=6.50 (0.256) P=8.00 (0.315) Dimensions mm (inches) User Direction of Feed Embossed Carrier Embossment NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2 3.2 Soldering 3.3 Washing For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. Clare does not recommend ultrasonic cleaning or the use of chlorinated hydrocarbons. Pb RoHS 2002/95/EC e3 For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX2127-R01 ©Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 2/22/2010 R01 www.clare.com 11