TI 052AI

ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1
VDDO
Power
Type
Description
Output supply pin.
2
GND
Power
3, 6
CLK1, CLK0
Input
Pulldown Single-ended clock inputs. LVCMOS/LVTTL interface levels.
Power supply ground.
4
VDD
Power
5
OE
Input
7
SEL0
Input
8
Q
Output
Core supply pin.
Output enable. When LOW, outputs are in HIGH impedance state.
Pullup
When HIGH, outputs are active. LVCMOS / LVTTL interface levels.
Clock select input. See Control Input Function Table.
Pulldown
LVCMOS / LVTTL interface levels.
Single-ended clock output. LVCMOS/LVTTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Test Conditions
Minimum
Typical
Maximum
Units
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
18
pF
Power Dissipation Capacitance
(per output)
VDDO = 3.465V
CPD
VDDO = 2.625V
19
pF
VDDO = 1.89V
19
pF
15
Ω
Output Impedance
ROUT
TABLE 3. CONTROL INPUT FUNCTION TABLE
Control Inputs
SEL0
0
1
83052AGI
Input Selected to Q
CLK0
CLK1
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2
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VDD
4.6V
Inputs, VI
-0.5V to VDD + 0.5 V
Outputs, VO
-0.5V to VDDO + 0.5V
Package Thermal Impedance, θJA
101.7°C/W (0 mps)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = 3.3V±5%, VDDO = 3.3V±5%, 2.5V±5% OR 1.8V±5%,TA = -40°C TO 85°C
Symbol
Parameter
Minimum
Typical
Maximum
Units
VDD
Core Supply Voltage
Test Conditions
3.135
3.3
3.465
V
3.135
3.3
3.465
V
VDDO
Output Supply Voltage
2.375
2. 5
2.625
V
1.6
1.8
2.0
V
IDD
Power Supply Current
40
mA
IDDO
Output Supply Current
5
mA
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VDD = 2.5V±5%, VDDO = 2.5V±5% OR 1.8V±5%, TA = -40°C TO 85°C
Symbol
Parameter
VDD
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
2.375
2. 5
2.625
V
2.375
2. 5
2.625
V
1.6
1.8
2.0
V
VDDO
Output Supply Voltage
IDD
Power Supply Current
36
µA
IDDO
Output Supply Current
5
µA
83052AGI
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3
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
TABLE 4C. LVCMOS/LVTTL DC CHARACTERISTICS, TA = -40°C TO 85°C
Symbol
VIH
VIL
IIH
IIL
VOH
VOL
Parameter
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
CLK0, CLK1,
SEL0
OE
CLK0, CLK1,
SEL0
OE
Output HighVoltage
Output Low Voltage
Test Conditions
Minimum
Maximum
Units
VDD = 3.3V ± 5%
2
Typical
VDD + 0.3
V
VDD = 2.5V ± 5%
1.7
VDD + 0.3
V
VDD = 3.3V ± 5%
-0.3
0.8
V
VDD = 2.5V ± 5%
-0.3
0.7
V
VDD = 3.3V or 2.5V ± 5%
150
µA
VDD = 3.3V or 2.5V ± 5%
5
µA
VDD = 3.3V or 2.5V ± 5%
-5
µA
VDD = 3.3V or 2.5V ± 5%
-150
µA
VDDO = 3.3V ± 5%; NOTE 1
2.6
V
VDDO = 2.5V ± 5%; NOTE 1
1.8
V
VDDO = 1.8V ± 5%; NOTE 1
VDD - 0.3
V
VDDO = 3.3V ± 5%; NOTE 1
0.5
V
VDDO = 2.5V ± 5%; NOTE 1
0.45
V
VDDO = 1.8V ± 5%; NOTE 1
0.35
V
NOTE 1: Outputs terminated with 50Ω to VDDO/2. See Parameter Measurement section, "Load Test Circuit" diagrams.
TABLE 5A. AC CHARACTERISTICS, VDD = VDDO = 3.3V ± 5%, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Propagation Delay, Low to High;
NOTE 1
Propagation Delay, High to Low;
NOTE 1
Input Skew; NOTE 4
tpLH
tpHL
t sk(i)
t sk(pp)
Test Conditions
tR / tF
Par t-to-Par t Skew; NOTE 2, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter section,
NOTE 3
Output Rise/Fall Time
odc
Output Duty Cycle
t jit
155.52MHz,
Integration Range:
12kHz - 20MHz
20% to 80%
Minimum
Typical
Maximum
Units
250
MHz
2.0
2.4
2.7
ns
2.0
2.5
2.9
ns
36
160
ps
490
ps
0.18
200
700
ps
45
55
%
45
MUXISOLATION MUX Isolation
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.
NOTE 3: Driving only one input clock.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83052AGI
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4
ps
dB
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
TABLE 5B. AC CHARACTERISTICS, VDD = 3.3V ± 5%, VDDO = 2.5V ± 5%, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Propagation Delay, Low to High;
NOTE 1
Propagation Delay, High to Low;
NOTE 1
Input Skew; NOTE 4
tpLH
tpHL
t sk(i)
t sk(pp)
Test Conditions
tR / tF
Par t-to-Par t Skew; NOTE 2, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter section,
NOTE 3
Output Rise/Fall Time
odc
Output Duty Cycle
tjit
Minimum
155.52MHz,
Integration Range:
12kHz - 20MHz
20% to 80%
Typical
Maximum
Units
250
MHz
2.3
2.6
2. 9
ns
2.3
2.6
2. 9
ns
23
106
ps
350
ps
0.14
ps
30 0
700
ps
46
54
%
45
MUXISOLATION MUX Isolation
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.
NOTE 3: Driving only one input clock.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
dB
TABLE 5C. AC CHARACTERISTICS, VDD = 3.3V ± 5%, VDDO = 1.8V ± 5%, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Propagation Delay, Low to High;
NOTE 1
Propagation Delay, High to Low;
NOTE 1
Input Skew; NOTE 4
tpLH
tpHL
t sk(i)
t sk(pp)
Test Conditions
Typical
Maximum
Units
250
MHz
2.3
3.1
3.9
ns
2.3
3.1
3.9
ns
19
tR / tF
Par t-to-Par t Skew; NOTE 2, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter section,
NOTE 3
Output Rise/Fall Time
odc
Output Duty Cycle
t j it
Minimum
155.52MHz,
Integration Range:
12kHz - 20MHz
20% to 80%
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5
ps
ps
0.16
ps
35 0
850
46
54
45
MUXISOLATION MUX Isolation
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.
NOTE 3: Driving only one input clock.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83052AGI
66
350
ps
%
dB
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
TABLE 5D. AC CHARACTERISTICS, VDD = VDDO = 2.5V ± 5%, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Propagation Delay, Low to High;
NOTE 1
Propagation Delay, High to Low;
NOTE 1
Input Skew; NOTE 4
tpLH
tpHL
t sk(i)
t sk(pp)
Test Conditions
tR / tF
Par t-to-Par t Skew; NOTE 2, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter section,
NOTE 3
Output Rise/Fall Time
odc
Output Duty Cycle
t jit
Minimum
Typical
Maximum
Units
250
MHz
2.2
2.7
3.2
ns
2.2
2.7
3.2
ns
28
155.52MHz,
Integration Range:
12kHz - 20MHz
20% to 80%
123
ps
400
ps
0.22
ps
30 0
700
45
55
45
MUXISOLATION MUX Isolation
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.
NOTE 3: Driving only one input clock.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
ps
%
dB
TABLE 5E. AC CHARACTERISTICS, VDD = 2.5V ± 5%, VDDO = 1.8V ± 5%, TA = -40°C TO 85°C
Symbol
Parameter
fMAX
Output Frequency
Propagation Delay, Low to High;
NOTE 1
Propagation Delay, High to Low;
NOTE 1
Input Skew; NOTE 4
tpLH
tpHL
t sk(i)
t sk(pp)
Test Conditions
tR / tF
Par t-to-Par t Skew; NOTE 2, 4
Buffer Additive Phase Jitter, RMS;
refer to Additive Phase Jitter section,
NOTE 3
Output Rise/Fall Time
odc
Output Duty Cycle
t j it
155.52MHz,
Integration Range:
12kHz - 20MHz
20% to 80%
Minimum
Typical
Maximum
Units
250
MHz
2.1
3.1
4.1
ns
2.1
3.1
4.2
ns
19
73
ps
350
ps
0.19
35 0
85 0
45
55
45
MUXISOLATION MUX Isolation
NOTE 1: Measured from VDD/2 of the input to VDDO/2 of the output.
NOTE 2: Defined as skew between outputs on different devices operating a the same supply voltages and
with equal load conditions. Using the same type of input on each device, the output is measured at VDDO/2.
NOTE 3: Driving only one input clock.
NOTE 4: This parameter is defined in accordance with JEDEC Standard 65.
83052AGI
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6
ps
ps
%
dB
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
ADDITIVE PHASE JITTER
the 1Hz band to the power in the fundamental. When the required offset is specified, the phase noise is called a dBc value,
which simply means dBm at a specified offset from the fundamental. By investigating jitter in the frequency domain, we get a
better understanding of its effects on the desired application over
the entire time record of the signal. It is mathematically possible
to calculate an expected bit error rate given a phase noise plot.
The spectral purity in a band at a specific offset from the fundamental compared to the power of the fundamental is called the
dBc Phase Noise. This value is normally expressed using a
Phase noise plot and is most often the specified plot in many
applications. Phase noise is defined as the ratio of the noise
power present in a 1Hz band at a specified offset from the fundamental frequency to the power value of the fundamental. This
ratio is expressed in decibels (dBm) or a ratio of the power in
0
-10
Additive Phase Jitter (Random)
-20
at 155.52MHz (12kHz - 20MHz)
= 0.18ps (typical)
-30
-40
-50
SSB PHASE NOISE dBc/HZ
-60
-70
-80
-90
-100
-110
-120
-130
-140
-150
-160
-170
-180
-190
1k
10k
100k
1M
10M
100M
OFFSET FROM CARRIER FREQUENCY (HZ)
As with most timing specifications, phase noise measurements have issues. The primary issue relates to the limitations of the equipment. Often the noise floor of the equipment
is higher than the noise floor of the device. This is illustrated
83052AGI
above. The device meets the noise floor of what is shown, but
can actually be lower. The phase noise is dependant on the
input source and measurement equipment.
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REV. A AUGUST 2, 2005
ICS83052I
Integrated
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Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
PARAMETER MEASUREMENT INFORMATION
1.65V±5%
1.25V±5%
SCOPE
VDD,
VDDO
LVCMOS
SCOPE
VDD,
VDDO
Qx
Qx
LVCMOS
GND
GND
-1.65V±5%
-1.25V±5%
3.3V CORE/3.3V OUTPUT LOAD AC TEST CIRCUIT
2.5V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
2.05V±5%
2.4±5%
1.25V±5%
SCOPE
V DD
VDDO
LVCMOS
SCOPE
V DD
VDDO
Qx
Qx
LVCMOS
GND
GND
-0.9V±5%
-1.25V±5%
3.3V CORE/2.5V OUTPUT LOAD AC TEST CIRCUIT
1.6V±5%
0.9V±5%
3.3V CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
0.9V±5%
Part 1
SCOPE
VDD
VDDO
LVCMOS
Qx
V
DDO
2
Qx
Part 2
GND
Qy
V
DDO
2
tsk(pp)
-0.9V±5%
2.5 CORE/1.8V OUTPUT LOAD AC TEST CIRCUIT
83052AGI
PART-TO-PART SKEW
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REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
VDD
CLK0, CLK1
80%
80%
tR
tF
2
VDDO
Clock
Outputs
2
tpLH
Q
PROPAGATION DELAY
20%
20%
OUTPUT RISE/FALL TIME
CLKx
V
DDO
2
Q
Q
t PW
tPD1
t
odc =
PERIOD
t PW
x 100%
t PERIOD
CLKy
Q
tPD2
tsk(i) = ⏐tPD1 – tPD1⏐
INPUT SKEW
83052AGI
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
APPLICATION INFORMATION
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS:
CLK INPUT:
For applications not requiring the use of the test clock, it can
be left floating. Though not required, but for additional
protection, a 1kΩ resistor can be tied from the CLK input to
ground.
LVCMOS OUTPUT:
All unused LVCMOS output can be left floating. We
recommend that there is no trace attached.
CONTROL PINS:
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
RELIABILITY INFORMATION
TABLE 6. θJAVS. AIR FLOW TABLE
FOR
8 LEAD TSSOP
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
101.7°C/W
90.5°C/W
89.8°C/W
TRANSISTOR COUNT
The transistor count for ICS83052I is: 967
83052AGI
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10
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
PACKAGE OUTLINE - G SUFFIX
2:1, SINGLE-ENDED MULTIPLEXER
FOR
8 LEAD TSSOP
TABLE 7. PACKAGE DIMENSIONS
SYMBOL
Millimeters
Minimum
N
A
Maximum
8
--
1.20
A1
0.05
0.15
A2
0.80
1.05
b
0.19
0.30
c
0.09
0.20
D
2.90
3.10
E
E1
6.40 BASIC
4.30
e
4.50
0.65 BASIC
L
0.45
0.75
α
0°
8°
aaa
--
0.10
Reference Document: JEDEC Publication 95, MO-153
83052AGI
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11
REV. A AUGUST 2, 2005
ICS83052I
Integrated
Circuit
Systems, Inc.
2:1, SINGLE-ENDED MULTIPLEXER
TABLE 8. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS83052AGI
052AI
8 lead TSSOP
tube
-40°C to 85°C
ICS83052AGIT
052AI
8 lead TSSOP
2500 tape & reel
-40°C to 85°C
ICS83052AGILF
TBD
8 lead "Lead-Free" TSSOP
tube
-40°C to 85°C
ICS83052AGILFT
TB D
8 lead "Lead-Free" TSSOP
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
The aforementioned trademark, HiPerClockS is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use
in normal commercial and industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not
recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product
for use in life support devices or critical medical instruments.
83052AGI
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12
REV. A AUGUST 2, 2005
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