SMD Schottky Barrier Diodes RB551V-30 Io = 500 mA V R = 20 Volts RoHS Device SOD-323 Features -Low reverse current. 0.071 ( 1.80 ) 0.063(1.60) -Designed for mounting on small surface. -Extremely thin / leadless package. 0.055 ( 1.40 ) 0.047(1.20) 0.014 ( 0.35 ) 0.010(0.25) -Majority carrier conduction. Mechanical data 0.106 ( 2.70 ) 0.098(2.50) -Case: SOD-323 Standard package, molded plastic. -Terminals: Gold plated, solderable per MIL-STD-750D, method 2026. 0.039 (1.00)Max. 0) 0.006 ( 0.15 )Max. 0.004 (0.10)Max. 0) -Mounting position: Any. 0.019 ( 0.475 )REF Dimensions in inches and (millimeter) Maximum Ratings (at T =25°C unless otherwise noted) A Parameter Conditions Repetitive peak reverse voltage Symbol Min Typ Max Unit V RRM 30 V Reverse voltage VR 20 V Average forward current IO 500 mA I FSM 2 A +125 °C +125 °C Forward current,surge peak 8.3ms single half sine-wave superimposed on rate load(JEDEC method) Storage temperature T STG Junction temperature Tj -40 Electrical Characteristics (At Ta=25°C, unless otherwise noted) Parameter Conditions Symbol Min Typ Max Unit Forward voltage I F = 100 mA I F = 500 mA VF 0.36 0.47 V Reverse current V R = 20 V IR 100 uA REV:B Page 1 QW-BB026 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes RATING AND CHARACTERISTIC CURVES (RB551V-30) Fig.2 - Reverse characteristics Fig.1 - Forward Characteristics 10A 100m 1A 10m °C C 5° TA =2 5 =7 TA 10m Reverse current ( A ) 5°C °C =1 2 TA 100m TA =-2 5 IF, Forward Current (A) O 1m 125 C 1m O 75 C 100u O 25 C 10u O -25 C fu 100μ 0.0 0.1 0.3 0.2 0.4 100n 0.5 5 10 15 20 25 30 35 VF, Forward Voltage (V) Reverse voltage (V) Fig.3 - Capacitance between terminals characteristics Fig.4 - Current derating curve 40 1.0 100.0 f = 1 MHz Ta = 25 C Average forward current(%) Capacitance between terminals ( P F) 0 10.0 0.5 0 1.0 0.0 10.0 20.0 30 40 0 Reverse voltage (V) 25 50 75 100 125 150 Ambient temperature (°C) REV:B Page 2 QW-BB026 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes Reel Taping Specification d P0 P1 T E Index hole F W B P C A 12 o 0 D2 D1 D W1 Trailer ....... ....... End Device ....... ....... Leader ....... ....... ....... ....... 10 pitches (min) Start 10 pitches (min) Direction of Feed SOD-323 SOD-323 SYMBOL A B C d D D1 D2 (mm) 1.52 ± 0.10 2.90 ± 0.10 1.35 ± 0.10 1.50 ± 0.10 178 ± 1 54.4 MIN. 13.0 ± 0.20 (inch) 0.060± 0.004 0.114 ± 0.004 0.053 ± 0.004 0.059 ± 0.004 7.008 ± 0.040 2.142 MIN. 0.512 ± 0.008 SYMBOL E F P P0 P1 W W1 (mm) 1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 8.00 ± 0.30 9.5 MAX. (inch) 0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.002 0.315 ± 0.012 0.374 MAX REV:B Page 3 QW-BB026 Comchip Technology CO., LTD. SMD Schottky Barrier Diodes Marking Code Part Number Marking Code RB551V-30 D D Suggested PAD Layout SOD-323 D SIZE (mm) (inch) A 2.33 0.092 B 0.70 0.028 C 0.70 0.028 D 3.03 0.119 E 1.63 0.064 A E C B Standard Packaging REEL PACK Case Type SOD-323 REEL Reel Size ( pcs ) (inch) 3,000 7 REV:B Page 4 QW-BB026 Comchip Technology CO., LTD.