COMCHIP RB551V

SMD Schottky Barrier Diodes
RB551V-30
Io = 500 mA
V R = 20 Volts
RoHS Device
SOD-323
Features
-Low reverse current.
0.071 ( 1.80 )
0.063(1.60)
-Designed for mounting on small surface.
-Extremely thin / leadless package.
0.055 ( 1.40 )
0.047(1.20)
0.014 ( 0.35 )
0.010(0.25)
-Majority carrier conduction.
Mechanical data
0.106 ( 2.70 )
0.098(2.50)
-Case: SOD-323 Standard package,
molded plastic.
-Terminals: Gold plated, solderable per
MIL-STD-750D, method 2026.
0.039 (1.00)Max.
0)
0.006 ( 0.15 )Max.
0.004 (0.10)Max.
0)
-Mounting position: Any.
0.019 ( 0.475 )REF
Dimensions in inches and (millimeter)
Maximum Ratings (at T =25°C unless otherwise noted)
A
Parameter
Conditions
Repetitive peak reverse voltage
Symbol Min Typ Max Unit
V RRM
30
V
Reverse voltage
VR
20
V
Average forward current
IO
500
mA
I FSM
2
A
+125
°C
+125
°C
Forward current,surge peak
8.3ms single half sine-wave superimposed
on rate load(JEDEC method)
Storage temperature
T STG
Junction temperature
Tj
-40
Electrical Characteristics (At Ta=25°C, unless otherwise noted)
Parameter
Conditions
Symbol Min Typ Max Unit
Forward voltage
I F = 100 mA
I F = 500 mA
VF
0.36
0.47
V
Reverse current
V R = 20 V
IR
100
uA
REV:B
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SMD Schottky Barrier Diodes
RATING AND CHARACTERISTIC CURVES (RB551V-30)
Fig.2 - Reverse characteristics
Fig.1 - Forward Characteristics
10A
100m
1A
10m
°C
C
5°
TA
=2
5
=7
TA
10m
Reverse current ( A )
5°C
°C
=1 2
TA
100m
TA
=-2
5
IF, Forward Current (A)
O
1m
125 C
1m
O
75 C
100u
O
25 C
10u
O
-25 C
fu
100μ
0.0
0.1
0.3
0.2
0.4
100n
0.5
5
10
15
20
25
30
35
VF, Forward Voltage (V)
Reverse voltage (V)
Fig.3 - Capacitance between
terminals characteristics
Fig.4 - Current derating curve
40
1.0
100.0
f = 1 MHz
Ta = 25 C
Average forward current(%)
Capacitance between terminals ( P F)
0
10.0
0.5
0
1.0
0.0
10.0
20.0
30
40
0
Reverse voltage (V)
25
50
75
100
125
150
Ambient temperature (°C)
REV:B
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diodes
Reel Taping Specification
d
P0
P1
T
E
Index hole
F
W
B
P
C
A
12
o
0
D2
D1 D
W1
Trailer
.......
.......
End
Device
.......
.......
Leader
.......
.......
.......
.......
10 pitches (min)
Start
10 pitches (min)
Direction of Feed
SOD-323
SOD-323
SYMBOL
A
B
C
d
D
D1
D2
(mm)
1.52 ± 0.10
2.90 ± 0.10
1.35 ± 0.10
1.50 ± 0.10
178 ± 1
54.4 MIN.
13.0 ± 0.20
(inch)
0.060± 0.004
0.114 ± 0.004
0.053 ± 0.004
0.059 ± 0.004
7.008 ± 0.040
2.142 MIN.
0.512 ± 0.008
SYMBOL
E
F
P
P0
P1
W
W1
(mm)
1.75 ± 0.10
3.50 ± 0.05
4.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
8.00 ± 0.30
9.5 MAX.
(inch)
0.069 ± 0.004
0.138 ± 0.002
0.157 ± 0.004
0.157 ± 0.004
0.079 ± 0.002
0.315 ± 0.012
0.374 MAX
REV:B
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Comchip Technology CO., LTD.
SMD Schottky Barrier Diodes
Marking Code
Part Number
Marking Code
RB551V-30
D
D
Suggested PAD Layout
SOD-323
D
SIZE
(mm)
(inch)
A
2.33
0.092
B
0.70
0.028
C
0.70
0.028
D
3.03
0.119
E
1.63
0.064
A
E
C
B
Standard Packaging
REEL PACK
Case Type
SOD-323
REEL
Reel Size
( pcs )
(inch)
3,000
7
REV:B
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Comchip Technology CO., LTD.