bq25050 www.ti.com SLUSA33 – MARCH 2010 1A, Single-Input, Single Cell Li-Ion Battery Charger with 50-mA LDO, External Power Path Control, and Single Input Interface Check for Samples: bq25050 FEATURES 1 • • • • • • • • • • • DESCRIPTION 30V input Rating, With 10.5V Over-Voltage Protection (OVP) FET Controller for External Battery FET for External Power Path Control (BGATE) Input Voltage Dynamic Power Management 50mA integrated Low Dropout Linear Regulator (LDO) Programmable Charge Current Through Single Input Interface (CTRL) 0.5% Battery Voltage Regulation Accuracy 7% Charge Current Regulation Accuracy Thermal Regulation and Protection Battery NTC Monitoring During Charge and Discharge Status Indication – Charging/Done and Temperature Faults Available in small 2mm × 3mm 10 Pin SON Package The bq25050 is a highly integrated Li-Ion linear battery charger targeted at space-limited portable applications. It operates from either a USB port or AC Adapter and charges a single-cell Li-Ion battery with up to 1A of charge current. The 30V input voltage range with input over-voltage protections supports low-cost unregulated adapters. The bq25050 has a single power output that charges the battery. The system load is connected to OUT. The low-battery system startup circuitry maintains OUT greater than 3.4V whenever an input source is connected. This allows the system to start-up and run whenever an input source is connected regardless of the battery voltage. The charge current is programmable up to 1A using the CTRL input. Additionally, a 4.9V 50mA LDO is integrated into the IC for supplying low power external circuitry. The battery is charged in three phases: conditioning, constant current and constant voltage. In all charge phases, an internal control loop monitors the IC junction temperature and reduces the charge current if an internal temperature threshold is exceeded. The charger power stage and charge current sense functions are fully integrated. The charger function has high accuracy current and voltage regulation loops, charge status display, and charge termination. APPLICATIONS • • • • Smart Phones Mobile Phones Portable Media Players Low Power Handheld Devices TYPICAL APPLICATION CIRCUIT VGPIO VGPIO bq25050 USB or Adaptor VBUS D+ DGND 1 R2 100kΩ CHG 8 OUT 10 STATUS IN C1 0.1uF VDD C2 1uF QBAT BGATE 9 7 CTRL BAT HOST 6 PACK+ 2 IMON 3 VSS TS 5 LDO 4 TEMP C4 0.1uF R1 1 kΩ PACK - VLDO C3 0.1uF ISENSE GPIO 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated bq25050 SLUSA33 – MARCH 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION PART NO. MARKING MEDIUM QUANTITY bq25050DQCR DAM Tape and Reel 3000 bq25050DQCT DAM Tape and Reel 250 PACKAGE DISSIPATION RATINGS TABLE PACKAGE RqJA RqJC TA < 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C 10 Pin 2mm × 3mm SON (1) 58.7°C/W (2) 3.9°C/W 1.70W 0.017W/°C (1) (2) Maximum power dissipation is a function of TJ(max), RqJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = [TJ(max) - TA]/RqJA. This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. The pad is connected to the ground plane by a 2×3 via matrix. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE / UNIT IN (with respect to VSS) –0.3 to 30 V CTRL, TS, CHG, BGATE (with respect to VSS) –0.3 to 7 V Output Voltage BAT, OUT, LDO, CHG, BGATE, IMON (with respect to VSS) –0.3 to 7 V Input Current (Continuous) IN 1.2 A Output Current (Continuous) BAT 1.2 A Output Current (Continuous) LDO 100 mA Output Sink Current CHG Input Voltage 5 mA Junction temperature, TJ –40°C to 150°C Storage temperature, TSTG –65°C to 150°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the network ground terminal unless otherwise noted. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) IN voltage range VIN IN operating voltage range MIN MAX 3.55 28 4.4 10.2 UNITS V IIN Input current, IN 1 A IOUT Ouput Current in charge mode, OUT 1 A TJ Junction Temperature 125 °C 0 ELECTRICAL CHARACTERISTICS Over junction temperature range 0°C ≤ TJ ≤ 125°C and VIN = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 3.25 3.30 3.55 UNITS INPUT VUVLO Under-voltage lock-out VIN: 0V → 4V VHYS-UVLO Hysteresis on UVLO VIN: 4V → 0V 2 Submit Documentation Feedback 250 V mV Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 ELECTRICAL CHARACTERISTICS (continued) Over junction temperature range 0°C ≤ TJ ≤ 125°C and VIN = 5V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 1.95 2.05 2.15 UNITS VBATUVLO Battery UVLO VBAT rising VHYS-BUVLO Hysteresis on BAT UVLO VBAT falling VIN-SLP Valid input source threshold VIN-SLP above VBAT Input power good if VIN > VBAT + VIN–SLP VBAT = 3.6V, VIN: 3.5V → 4V VHYS-INSLP Hysteresis on VIN-SLP VBAT = 3.6V, VIN: 4V → 3.5V 32 mV tDGL(NO-IN) Deglitch time, input power loss to charger turn-off Time measured from VIN: 5V → 2.5V 1µs fall-time 32 ms VOVP Input over-voltage protection threshold VIN: 5 V → 11 V VHYS-OVP Hysteresis on OVP VIN: 11 V → 5 V tDGL(OVP) Input over-voltage deglitch time tREC(OVP) Input over-voltage recovery time Time measured from VIN: 11V → 5V 1µs fall-time to LDO = HI, VBAT = 3.5V VIN_DPM Input DPM threshold VIN Falling, VIN-DPM enabled with CTRL 125 30 10.2 4.2 75 10.5 V mV 150 10.8 mV V 100 mV 100 µs 100 µs 4.30 4.4 V 120 150 µA 6 µA QUIESCENT CURRENT IBAT(PDWN) Battery current into BAT, No input connected VIN = 0V, VCHG = High, TS Enabled IBAT(DONE) BAT current, charging terminated VIN = 6V, VBAT > VBAT(REG) 10 µA IIN(STDBY) Standby current into IN pin CTRL = HI, VIN < VOVP 0.5 mA CTRL = HI, VIN ≥ VOVP 2 ICC Active supply current, IN pin VIN = 6V, no load on OUT pin, VBAT > VBAT(REG), IC enabled 3 VIN = 0V, VCHG = Low, TS Disabled, TJ = 85°C mA BATTERY CHARGER FAST-CHARGE VBAT(REG) Battery charge regulation voltage TA = 0°C to 125°C, IOUT = 50 mA TA = 25°C IIN(LIM) Input current limit (selected by CTRL interface) 4.16 4.20 4.23 4.179 4.200 4.221 4 pulses on CTRL 87 93 100 5 pulses on CTRL 174 187 200 6 pulses on CTRL 261 280 300 7 pulses on CTRL 348 374 400 8 pulses on CTRL 435 467 500 9 pulses on CTRL 608 654 700 10 pulses on CTRL 739 794 850 11 pulses on CTRL 864 935 1000 500 900 VDO(IN-OUT) VIN – VOUT VIN = 4.2V, IOUT = 0.75 A KIMON Input current monitor ratio KIMON = IIMON / ICHG, RIMON = 1kΩ, Current programmed using CTRL VIMON(MAX) Maximum IMON voltage IMON open IMON Accuracy 25 mA < IIN < 100 mA –25% 25% IIN = 100 mA to 1 A –8.5% 5% 1 1.2 V mA mV mA/A 1.25 V PRE-CHARGE AND CHARGE DONE VLOWV Pre-charge to fast-charge transition threshold tDGL1(LOWV) Deglitch time on pre-charge to fast-charge transition 25 ms tDGL2(LOWV) Deglitch time on fast-charge to pre-charge transition 25 ms IPRECHARGE Precharge current to BAT during precharge mode VBAT = 0V to 2.9V, Battery FET connected Default termination current threshold VIN = 5V, ICHARGE = 100 mA to 1 A ITERM External power path control disabled, BGATE = VSS 2.4 2.5 2.6 External power path control enabled 2.8 2.9 3.0 VBAT = 0V to 2.5V, BGATE = VSS, Input current limit regulated to IPRECHARGE 28 37 45 41.5 45 48.5 7.5 10.5 13.5 VBAT(REG) –0.13V VBAT(REG) –0.1V VBAT(REG) –0.065V V mA %ICHG RECHARGE OR REFRESH VRCH Recharge detection threshold VBAT falling Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 V 3 bq25050 SLUSA33 – MARCH 2010 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Over junction temperature range 0°C ≤ TJ ≤ 125°C and VIN = 5V (unless otherwise noted) PARAMETER tDGL(RCH) TEST CONDITIONS MIN Deglitch time, recharge threshold detected TYP MAX 25 UNITS ms EXTERNAL POWER PATH CONTROL VOUT(REG) Output regulation voltage VBAT ≤ 2.9 V 2.9 V < VBAT ≤ 3.6V VBAT > 3.6 V 3.4 3.5 3.6 V 3.44 3.59 3.75 V VBAT + Vdrop(QBAT) V VSUPP1 Enter supplement mode threshold VBAT = 3.4 V, VOUT Falling VOUT ≤ VBAT -60mV V VSUPP2 Exit supplement mode threshold VBAT = 3.4 V, VOUT Rising VOUT ≥ VBAT-20mV V VLDO LDO Output Voltage VIN = 5.5V, ILDO = 0mA to 50mA ILDO Maximum LDO Output Current VDO Dropout Voltage LDO 4. 4.9 5.1 60 VIN = 4.5V, ILDO = 50mA V mA 200 300 mV CTRL INTERFACE tCTRL-DGL CTRL Deglitch timer 5 tCTRL-LATCH CTRL Latch timer 2 ms tCTRL-HIGH High Duration on CTRL 50 1000 tCTRL-LOW Low Time Duration on CTRL 50 1000 RPULLDOWN CTRL Pulldown Resistor ms 260 ms µs kΩ LOGIC LEVELS ON CTRL, CHG, BGATE VIL Logic LOW input voltage VIH Logic HIGH input voltage 0.4 1.4 V V BATTERY-PACK NTC MONITOR (TS) VTS_CLAMP Maximum TS Voltage ITS-0C Current source for 0°C TS sensing 1.5 V 3.75 4 4.25 µA ITS Current source for 45°C and 60°C TS sensing 19 20 21 µA VCOLD TS Cold Threshold, when BGATE is disabled VTS < VCOLD to begin charge (Corresponds to 0°C, 2°C, 4°C (1) 0.55 0.575 0.600 V VCUTOFF_0 TS Cold Cutoff Threshold Temp falling (Corresponds to –1°C, 1°C, 3°C (1) (2)) 0.575 0.600 0.625 V VHOT_45 TS Hot Threshold (0°C to 45°C), when BGATE is disabled VTS > VHOT_45 to begin charge, 0°C to 45°C thresholds selected. (Corresponds to 40°C, 42°C, 44°C (1) (2)) 0.44 0.45 0.46 V VCUTOFF_45 TS Hot Cutoff Threshold (0°C to 45°C) Temp rising (Corresponds to 45°C, 47°C, 49°C (1) (2)) 0.365 0.375 0.385 V VHOT_60 TS Hot Threshold (0°C to 60°C), when BGATE is disabled VTS > VHOT_60 to begin charge, 0°C to 60°C thresholds selected, Temp rising (Corresponds to 54.5°C, 57°C, 60°C (1) 0.240 0.250 0.258 V VCUTOFF_60 TS Hot Cutoff Threshold (0°C to 60°C) Temp rising. (Corresponds to 58.5°C, 61.5°C, 64°C (1) (2)) 0.204 0.213 0.223 V V-20 –20°C TS Voltage See (1) 0.968 V80 +80°C TS Voltage See (1) 0.110 tdgl(TS) Deglitch for TS Fault Fault detected on TS to stop charge VOL Output LOW voltage ISINK = 5 mA IIH Leakage current V/CHG = 5 V tFLSH(TS) TS fault flash period 50% Duty Cycle, TS out of valid range 100 ms (2) ) (2) ) V V 25 ms CHG OUTPUT 0.45 V 1 µA THERMAL REGULATION TJ(REG) Temperature Regulation Limit TJ rising 125 °C TJ(OFF) Thermal shutdown temperature TJ rising 155 °C (1) (2) 4 Information is based on using the NCP15WB473F NTC thermistor. Temperature references give design guidance only, actual absolute temperatures are not guaranteed. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 ELECTRICAL CHARACTERISTICS (continued) Over junction temperature range 0°C ≤ TJ ≤ 125°C and VIN = 5V (unless otherwise noted) PARAMETER TJ(OFF-HYS) Thermal shutdown hysteresis TEST CONDITIONS TJ falling MIN TYP MAX 20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 UNITS °C 5 bq25050 SLUSA33 – MARCH 2010 www.ti.com DEVICE INFORMATION SIMPLIFIED BLOCK DIAGRAM LDO + Q1 Q2 OUT VIN Precharge Current Source + IMON + 125C TJ Charge Pump 1.5V + IIN(REG) External Power Path Control Mode 2.9V BAT VOUT(REG) + VIN_DPM + Charge Pump VOUT(MIN) ILIM TERMINATION COMPARATOR BGATE + VREF + VOUTMIN 150mV VIN-DPM Enable External Power Path Control Mode Sleep Comparator 75mV VBAT + CTRL Digital Decode CHARGE CONTROL 260k OVP Comparator + VIN VOUTMIN Enable Comparator VBAT 3.5V + VOVP V IN TS Current VREF Source Control STATUS OUTPUT DISABLE + VREF + /CHG TS COLD TS HOT TS VSS 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 PIN CONFIGURATION IN 1 10 IMON 2 9 BGATE VSS 3 8 CHG OUT bq 25050 LDO 4 7 CTRL TS 5 6 BAT 10-pin 2mm x 3mm SON PIN FUNCTIONS PIN NAME NO. I/O DESCRIPTION IN 1 I Input power supply. IN is connected to the external DC supply (AC adapter or USB port). Bypass IN to VSS with at least a 0.1µF ceramic capacitor. IMON 2 O Current monitoring output. Connect a 1kΩ resistor from IMON to VSS to monitor the input current. The voltage at IMON ranges from 0V to 1V which corresponds to an input current from 0A to 1A. VSS 3 – Ground terminal. Connect to the thermal pad and the ground plane of the circuit. LDO 4 O LDO output. LDO is regulated to 4.9V and drives up to 50mA. Bypass LDO to VSS with a 0.1µF ceramic capacitor. LDO is enabled when VUVLO < VIN < VOVP. TS 5 I Battery pack NTC monitoring input. Connect the battery pack 47-kΩ NTC from TS to VSS to monitor battery pack temperature. The default pack temperature range is 0°C to 45°C thresholds. CTRL 7 I Single-input interface Input. Drive CTRL with pulses to enable/disable the device, enable/disable VIN-DPM, select battery temperature range and select current limits. See the interface section for details on using the CTRL interface. CHG 8 I/O Charge status indicator open-drain output. CHG is pulled low while the device is charging the battery. CHG goes high impedance when the battery is fully charged and does not indicate subsequent recharge cycles. CHG pulses to indicate TS faults. BAT 6 O BGATE 9 I/O Battery P-Channel FET gate drive output. Connect BGATE to the gate of the external P-Channel FET that connects the battery to OUT. Connect BGATE to VSS if the external FET is not used. No external capacitor is recommended from BGATE to GND. OUT 10 O System output connection. OUT supplies the system with a minimum voltage of 3.4V (min.) to ensure system operation whenever an input adapter is connected regardless of the battery voltage. Bypass OUT to VSS with a 1µF ceramic capacitor. Pad – There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times. Thermal PAD Battery connection output. BAT is the sense input for the battery as well as the precharge current output. Connect BAT to the battery and bypass BAT to VSS with a 0.1µF ceramic capacitor. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 7 bq25050 SLUSA33 – MARCH 2010 www.ti.com APPLICATION CIRCUITS VGPIO VGPIO bq25050 USB or Adaptor VBUS D+ DGND 1 R2 100kΩ CHG 8 OUT 10 STATUS IN C1 0.1uF VDD C2 1uF QBAT BGATE 9 7 CTRL BAT 6 TS 5 HOST PACK+ 2 TEMP C4 0.1uF IMON R1 1 kΩ PACK - 3 VSS LDO 4 VLDO C3 0.1uF ISENSE GPIO Figure 1. Typical Application Circuit Using the External Power Path Control Feature VGPIO VGPIO bq25050 USB or Adaptor VBUS D+ DGND 1 R2 100kΩ CHG 8 OUT 10 STATUS IN C1 0.1uF VDD C2 1uF 7 CTRL BGATE 9 BAT 6 TS 5 HOST PACK+ 2 TEMP IMON R1 1 kΩ PACK - 3 VSS LDO 4 VLDO C3 0.1uF ISENSE GPIO Figure 2. Typical Application Circuit Disabling the External Power Path Control Feature 8 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 TYPICAL CHARACTERISTICS Using circuit in Figure 1, TA = 25°C, unless otherwise specified ADAPTER INSERTION ENABLE USING CTRL CTRL 2 V/div VIN = 0 V - 5 V, VBAT = 3.3 V, ICHG = 280 mA VIN = 5 V, VBAT = 3 V, ICHG = 280 mA CHG 2 V/div VIN 5 V/div BGATE 2 V/div BGATE 2 V/div LDO 2 V/div ICHG 0.5 A/div IIN 100 mA/div 20 ms/div 10 ms/div Figure 3. Figure 4. DISABLE USING CTRL CONTROL CURRENT LIMIT - STEP UP CTRL 2 V/div LDO 2 V/div CTRL 2 V/div VIN = 5 V, VBAT = 3.4 V, ICHG = 280 mA VIN = 5 V, VBAT = 3.4 V, ICHG = 93 mA to 935 mA BGATE 2 V/div IMON 500 mV/div BGATE 2 V/div IBAT 0.5 A/div IIN 2 mA/div 1 ms/div 5 ms/div Figure 5. Figure 6. CONTROL CURRENT LIMIT - STEP DOWN BGATE FORCED ON CTRL 2 V/div VIN = 5 V, VBAT = 3.4 V, ICHG = 935 mA to 93 mA CTRL 2 V/div VBAT 2 V/div Offset 4.1 V VOUT 2 V/div Offset 4.1 V BGATE 2 V/div BGATE 2 V/div IMON 500 MV/div IBAT 500 mA/div VIN = 5 V, VBAT = 4.18 V, VBAT(REG) = 4.2 V 5 ms/div 1 ms/div Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 9 bq25050 SLUSA33 – MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Using circuit in Figure 1, TA = 25°C, unless otherwise specified CANCEL BGATE FORCED ON INPUT OVP VIN 10 V/div CTRL 2 V/div VIN = 5 V to 29 V, VBAT = 3.8 V VBAT 2 V/div Offset 4.1 V VOUT 2 V/div Offset 4.1 V VBAT 2V/div LDO 2 V/div BGATE 2 V/div VIN = 5 V, VBAT = 4.18 V, VBAT(REG) = 4.2 V IBAT 0.5 A/div 1 ms/div 50 µs/div Figure 9. Figure 10. PRE-CHARGE MODE TO MINIMUM OUTPUT REGULATION MODE MINIMUM OUTPUT REGULATION MODE TO CONSTANT CURRENT (CC) MODE VIN = 5 V, VBAT = 1.8 V to 3.45 V, ICHG = 467 mA VIN = 5 V, VBAT = 2.4 V to 3.6 V, ICHG = 467 mA VBAT 500 V/div VBAT 500 V/div IMON 500 mV/div IMON 500 mV/div BGATE 2 V/div BGATE 2 V/div IBAT 500 mA/div IBAT 500 mA/div 20 ms/div 20 ms/div Figure 11. Figure 12. PRE-CHARGE TO CONSTANT VOLTAGE (CV) MODE VIN-DPM VIN 2 V/div VBAT 500 mV/div IMON 500 mV/div VIN = 5 V, VBAT = 2.8 V to 4.18 V, ICHG = 467 mA IIN 500 mA/div IMON 500 mV/div BGATE 2 V/div BGATE 2 V/div IBAT 500 mA/div 20 ms/div 200 µs/div Figure 13. 10 VIN = 5 V with current limit of 600 mA, VBAT = 3.2 V, ICHG = 93 mA to 935 mA Figure 14. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 TYPICAL CHARACTERISTICS (continued) Using circuit in Figure 1, TA = 25°C, unless otherwise specified SUPPLEMENT MODE CHARGE CYCLE DEMO VOUT 2 V/div IMON 1 V/div VBAT 2 V/div BGATE 1 V/div VIN = 5 V, ICHG = 280 mA, BGATE =Enabled, CBAT = 2000 µF, No battery connected, RDSon from IN to OUT IIN 100 mA/div VOUT 2 V/div IOUT 2 A/div BGATE 2 V/div VIN = 5 V, VBAT = 3.2 V, ICHG = 935 mA, IOUT = 0 A to 2 A 20 ms/div 100 µs/div Figure 15. Figure 16. BATTERY VOLTAGE vs CHARGE CURRENT RDSON (From IN to OUT) vs JUNCTION TEMPERATURE 4.24 1.20 CV Mode Iload = 500 mA 4.23 1.00 4.22 RDSON - W VBAT - Battery Voltage - V 0.80 4.21 4.20 0.60 4.19 0.40 4.18 0.20 4.17 4.16 0 200 400 600 800 1000 0.00 -50 ICHRG - Charge Current - mA Figure 17. 0 50 100 TJ - Junction Temperature - °C 150 Figure 18. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 11 bq25050 SLUSA33 – MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Using circuit in Figure 1, TA = 25°C, unless otherwise specified INPUT CURRENT LIMIT vs INPUT VOLTAGE OUTPUT VOLTAGE vs CHARGE CURRENT 4.00 1000 VBAT = 3 V 900 3.90 Dropout Thermal Regulation 3.80 700 VOUT - Output Voltage - V IINLIM - Input Current Limit - mA 800 600 500 400 300 3.70 3.60 3.50 3.40 3.30 200 3.20 100 3.10 0 4 5 6 7 8 9 10 11 External Power Path Control Mode VBAT = 3 V 3.00 0.000 VIN - Input Voltage - V 0.200 0.400 0.600 0.800 1.000 ICHRG - Charge Current - mA Figure 19. Figure 20. DETAILED FUNCTIONAL DESCRIPTION The bq25050 is a highly integrated Li-Ion linear battery charger targeted at space-limited portable applications. It operates from either a USB port or AC Adapter and charges a single-cell Li-Ion battery with up to 1A of charge current. The 30V input voltage range with input over-voltage protections supports low-cost unregulated adapters. The bq25050 has a single power output that charges the battery. The system load is connected to OUT. The low-battery system startup circuitry maintains OUT pin voltage at VOUT(REG) whenever an input source is connected. This allows the system to start-up and run whenever an input source is connected regardless of the battery voltage. The charge current is programmable up to 1A using the CTRL input. Additionally, a 4.9V 50mA LDO is integrated into the IC for supplying low power external circuitry. External FET Controller (BGATE) The External Power Path Control feature is implemented using the BGATE output. BGATE is also used to enable/ disable the External Power Path Control feature. When power is first applied to either VBAT or VIN on the bq25050, the BGATE output is tested. If the BGATE pin is connected to VSS, the External Power Path Control feature is disabled. In order to enable the External Power Path Control feature after it has been disabled, the battery and the input source must be removed and reconnected and BGATE must NOT be connected to VSS. With External Power Path Control enabled, BGATE is used to drive an external P-channel MOSFET that connects the battery to the system output. This state of this MOSFET is dependant on the battery voltage and the IC status. In discharge mode, BGATE is pulled to GND to turn the MOSFET on fully. During discharge mode, the output is connected directly to the battery. Discharge mode is entered under the following conditions: 1. IC disabled or no input power 2. Supplement mode 3. "Force On" – enabled through CTRL When not in one of these conditions, the BGATE output is controlled by the bq25050 and changes depending on which mode is required. See the Charging Operation section for more details. 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 Enable/ Disable External Power Path Control When power is first applied to the bq25050, either at the IN or BAT input, the bq25050 checks the BGATE output. The device sources a small current out of BGATE for 32ms and monitors the voltage. If VBGATE is connected to ground and the voltage does not rise above logic High, the External Power Path Control feature is disabled and VLOWV is set to 2.5V. If the BGATE voltage rises above logic High, the External Power Path Control feature is enabled and VLOWV is set to 2.9V. The bq25050 only does this check when power is initially applied. Power must removed from IN and BAT and then reapplied to initiate another check. Figure 21 illustrates the startup check procedure. No Input Source or Battery Connected Input source OR Battery connected? NO YES Source Current to BGATE BGATE = VSS? YES External Power Path Control Disabled V LOWV = 2.5V NO External Power Path Control Enabled VLOWV = 2.9V Figure 21. BGATE Monitor Sequence Charging Operation The bq25050 charges a battery in 3 stages while maintaining a minimum system output. When the bq25050 is enabled by CTRL, the battery voltage is monitored to verify which stage of charging must be used. The bq25050 charges in precharge mode, minimum output regulation mode, or normal CC/CV mode based on the battery voltage. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 13 bq25050 SLUSA33 – MARCH 2010 www.ti.com Charger Operation with External Power Path Control Mode Enabled PRECHARGE 4.2V CC FAST CHARGE Maximum Charge Current (ILIM ) CV TAPER System Voltage IFASTCHG 3.5V VLOWV Battery Voltage IPRECHG CHG = Hi -Z ITERM Figure 22. Typical Charging Cycle with External Power Path Control Enabled Precharge Mode (VBAT ≤ VLOWV) The bq25050 enters precharge mode when VBAT ≤ VLOWV. Upon entering precharge mode, the battery is charged with a 40mA current source and /CHG goes low. During precharge mode, VOUT is regulated to 3.5V and the battery is charged from the internal fixed 40mA current source connected to the BAT output. With BGATE connected to GND, the system output is connected to the battery and therefore the system voltage is equal to the battery voltage. Minimum Output Regulation Mode (2.9V<VBAT<3.6V) Once VBAT exceeds 2.9V, the bq25050 enters Minimum Output Regulation Mode. While 2.9V<VBAT<3.6V, VOUT is regulated to VOUT(REG) by the external FET (QBAT) while the internal FETs between IN and OUT is used to regulate the fast charge current. The total current is shared between the output load and the battery. As the system current increases, the battery charge current decreases. In order to maintain the minimum output regulation voltage VOUT(REG), the system load must be less than the input current limit. Normal CC/CV Mode Once VBAT>3.6V, QBAT is fully turned on and VOUT = VBAT + Vdrop(Q1). At this point, the bq25050 is in constant current (CC) mode where charge current is regulated using the internal FETs between IN and OUT. The VOUT voltage is not regulated. The total current is shared between the output load and the battery. Once the battery voltage charges up to VBAT(REG), the bq25050 enters constant voltage (CV) mode where VBAT is regulated to VBAT(REG) and the current is reduced. Once the input current falls below the termination threshold (ITERM) BGATE is turned off and CHG goes high impedance. The system output is regulated to 4.2V and the battery is disconnected from OUT, however supplement mode is still available. 14 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 Charger Operation With External Power Path Control Mode Disabled (BGATE = VSS) PRECHARGE CC FAST CHARGE CV TAPER VOUT(REG) IFASTCHG VLOWV Battery Current Battery and Output Voltage CHG = Hi-Z IPRECHG ITERM Figure 23. Charging Cycle with External Power Path Control Disabled (BGATE = VSS) Precharge Mode (VBAT ≤ VLOWV) The bq25050 enters precharge mode when VBAT ≤ VLOWV. Upon entering precharge mode, CHG goes low and the input current limit is set to IPRECHARGE. With BGATE connected to GND, the system output is connected to the battery and therefore the system voltage is equal to the battery voltage. During precharge mode, the input current is regulated to 50mA and as such, only loads up to 50mA are supported. Normal CC/CV Mode Once VBAT > VLOWV, the bq25050 enters constant current (CC) mode where charge current is regulated using the internal MOSFETs between IN and OUT. The total current is shared between the output load and the battery. Once the battery voltage charges up to VBAT(REG), the bq25050 enters constant voltage (CV) mode where VBAT is regulated to VBAT(REG) and the current is reduced. Once the input current falls below the termination threshold (ITERM), CHG goes high impedance but the system remains charging and regulates the output to VBAT(REG). Charge Current Translator (IMON) When the charger is enabled, internal circuits generate a current proportional to the charge current at the IMON input. The current out of IMON is 1/1000 (±10%) of the charge current. This current, when applied to the external charge current programming resistor, R1 (see Figure 1), generates an analog voltage that can be monitored by an external host to calculate the current sourced from BAT. Connect a 1kΩ resistor from IMON to VSS. The voltage at IMON is calculated as: VIMON = 1IN × 1 V/A Using this output allows for the host to calculate the actual charging current and therefore perform more accurate termination. The input current to the system must be monitored and subtracted from the current into the bq25050 which is show by VIMON. Input Over Voltage Protection The bq25050 contains an input over voltage protection circuit that disables the LDO output and charging when the input voltage rises above VOVP. This prevents damage from faulty adapters. The OVP circuitry contains an deglitch that prevents ringing on the input from line transients from tripping the OVP circuitry falsely. If an adapter with an output greater than VOVP is plugged in, the IC completes power up and then shuts down if the voltage remains above VOVP after the deglitch. The LDO remains off and charging remains disabled until the input voltage falls below VOVP. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 15 bq25050 SLUSA33 – MARCH 2010 www.ti.com Under-Voltage Lockout (UVLO) The bq25050 remains in power down mode when the input voltage is below the under-voltage lockout threshold (VUVLO). During this mode, the control input (CTRL) is ignored. The LDO, the charge FET connected between IN and OUT are off and the status output (CHG) is high impedance. Once the input voltage rises above VUVLO, the internal circuitry is turned on and the normal operating procedures are followed. Input DPM Mode (VIN-DPM) The input current into the bq25050 includes all load currents, i.e. the system load, LDO load, and battery charge current. The total input current is regulated by the input current limit of the bq25050. The bq25050 utilizes the VIN-DPM mode for operation from current-limited input sources. VIN-DPM is enabled at startup and active until disabled by the CTRL interface. See the Single Input Interface (CTRL) section for more details. When VIN-DPM is enabled, the input voltage is monitored. If VIN falls to VIN-DPM, the input current limit is reduced to prevent the input voltage from falling further. This prevents the bq25050 from crashing poorly designed or incorrectly configured USB sources. Figure 24 shows the VIN-DPM behavior to a current limited source. In this figure the input source has a 200mA current limit and the device has started up with the 285mA current limit. VIMON 500 mV/div Input voltage falls due to adapter current limit VIN 2 V/div Input current limit is reduced to prevent crashing the input supply ILIM 200 mA/div 1 ms/div Figure 24. bq25050 VIN-DPM External NTC Monitoring (TS) The bq25050 provides a TS input for monitoring an external 47kΩ NTC thermistor. There are 2 temperature thresholds that are monitored; the cold battery threshold (TCOLD) and the hot battery threshold (THOT). The TS input is monitored at all times and disables charge if the temperature of the NTC falls outside of the operating range. The operating range by default is 0°C to 45°C. An extended range of 0°C to 60°C is selectable using the CTRL input. VTS is also used to monitor the battery temperature. The temperature range is based on the NTC thermistor #NCP15WB473F. The TS function remains on during battery discharge to enable the host to monitor the battery temperature. The VTS reflects the battery temperature the same as when the battery is charged. The bq25050 does not monitor this voltage, only the current source is active. Table 1 shows important temperatures and the corresponding voltage. This table can be used by the host to determine proper operation limits. The TS function is disabled if the CHG voltage falls below logic low while in battery discharge mode. 16 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 Table 1. VTS vs Temperature (47kΩ Thermistor, b=4050, NCP15WB473F) TEMPERATURE VTS –20°C 0.968 V 0°C 0.600 V 45°C 0.450 V 60°C 0.250 V 80°C 0.110 V 50mA LDO (LDO) The LDO output of the bq25050 is a low dropout linear regulator (LDO) that supplies up to 50mA while regulating to VLDO. The LDO is active whenever the input voltage is above VUVLO and below VOVP. It is not affected by the CTRL input. The LDO output is used to power circuitry such as USB transceivers in dead battery conditions. This allows the user to operate the product immediately after plugging the adapter in, instead of waiting for the battery to charge to useable levels. Charge Status Indicator (CHG) The bq25050 contains an open drain CHG output that indicates when charge cycles and faults. When charging a battery in precharge, fastcharge or CV mode, the CHG output is pulled to VSS. Once the BAT output reaches regulation and the charge current falls below the termination threshold, CHG goes high impedance to signal the battery is fully charged. The CHG output goes low during battery recharge cycles to signal the host to monitor for termination. Additionally, CHG notifies the host if a NTC temperature fault has occurred. CHG pulses with a period of 100ms and a 50% duty cycle if a TS faults occurs. Connect CHG to the required logic level voltage through a resistor to use the signal with a microprocessor. The sink current ICHG must be below 5mA. The IC monitors the CHG pin when no input is connected to verify if the phone circuitry is active. If the voltage at CHG is logic low when no driven low, the TS current source is turned off for a low quiescent current state. Once the voltage at CHG increases above logic high, the current source is turned on to allow the host to sense battery temperature. Single Input Interface (CTRL) CTRL is used to enable/disable the device as well as select the input current limit, enable/disable charge, extend the TS operation range and disable VIN-DPM mode. CTRL is pulled low to enable the device. After the deglitch tCTRL_DGL expires, the IC enters the 32ms WAIT state. CTRL may be used to program the bq25050 during this time. Once tWAIT expires, the IC starts up. If no command is sent to CTRL during tWAIT, the IC starts up with a default 285mA current limit, termination enabled and VIN-DPM enabled. Programming the different modes is done by pulsing the CTRL input. See Table 2 for a map of the different modes. The width of the CTRL pulses is unimportant as long as they are between 50µs and 1000µs long. The time between pulses must be between 50ms and 1000µs to be properly read. Once CTRL is held low for 2ms, the number of pulses is passed to the control logic and decoded and then the mode changes. To ensure proper operation, more than 16 pulses are not recommended. See Figure 26 for a flow diagram of the CTRL interface. Table 2. Pulse Counting Map for CTRL Interface # OF PULSES BGATE CONTROL CURRENT LIMIT TS RANGE VIN-DPM 1 Force Termination No Change No Change No Change 2 Force On Disable No Change No Change No Change 3 Force On Enable No Change No Change No Change 4 No Change 93 mA No Change No Change 5 No Change 187 mA No Change No Change 6 No Change 280 mA No Change No Change 7 No Change 374 mA No Change No Change 8 No Change 467 mA No Change No Change Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 17 bq25050 SLUSA33 – MARCH 2010 www.ti.com Table 2. Pulse Counting Map for CTRL Interface (continued) # OF PULSES BGATE CONTROL CURRENT LIMIT TS RANGE VIN-DPM 9 No Change 654 mA No Change No Change 10 No Change 794 mA No Change No Change 11 No Change 935 mA No Change No Change 12 No Change No Change 0°C to 60°C No Change 13-16 No Change No Change No Change Disabled If, at any time, the CTRL input is held high for more than 2ms, the IC is disabled. When disabled, charging is suspended and the bq25050 input quiescent current is reduced. IC disabled if CTRL pulled high for >2.0 ms # of pulses decoded once CTRL pulled low for 2.0 ms IC can be programmed during tWAIT tHI CTRL tCTRL-LATCH tCTRL-LATCH 2.0 ms 2.0 ms 2.0 ms tCTRL-LATCH tCTRL-DGL tLO Power up with default 285 mA current limit 475 mA current limit programmed 190 mA current limit programmed IIN Figure 25. CTRL Timing Diagram 18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 Any State IC Enabled CTRL Rising Edge Detected? NO YES Send Pulse Counter Info to Decode Block Begin 1.5ms OFF Timer NO #PULSE = 1? Falling Edge Detected? NO Has 1.5ms OFF Timer Expired? YES Force Charge Termination NO #PULSE = 2? YES Force BGATE On Disabled YES Force BGATE On Enabled YES 100mA Mode ICHARGE = 95mA (100mA) YES 200mA Mode ICHARGE = 190mA (200mA) YES 300mA Mode ICHARGE = 285mA (300mA) YES 400mA Mode ICHARGE = 380mA (400mA) YES 500mA Mode ICHARGE = 475mA (500mA) YES 700mA Mode ICHARGE = 665mA (700mA) YES 850mA Mode ICHARGE = 807.5mA (850mA) YES YES NO Disable IC Turn off Charge Turn ON BGATE /CHG = Hi-Z #PULSE = 3? NO Go to IC Disabled Routine #PULSE = 4? NO #PULSE = 5? Increment Pulse Counter NO #PULSE = 6? NO Begin 1.5ms LATCH Timer #PULSE = 7? NO NO YES CTRL Rising Edge Detected? NO Has 1.5ms LATCH Timer Expired? YES #PULSE = 8? NO #PULSE = 9? NO IC Disabled #PULSE = 10? CTRL = 0? NO YES 300mA Mode ICHARGE = 285mA VIN-DPM Enabled #PULSE = 11? YES 1A Mode ICHARGE = 950mA (1A) NO #PULSE = 12? YES TS Range = 0C to 60C NO Begin Battery Charging Disable VIN_DPM Figure 26. CTRL Flow Diagram Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 19 bq25050 SLUSA33 – MARCH 2010 www.ti.com Thermal Regulation and Thermal Shutdown The bq25050 contains a thermal regulation loop that monitors the die temperature continuously. If the temperature exceeds TJ(REG), the device automatically reduces the charging current to prevent the die temperature from increasing further. In some cases, the die temperature continues to rise despite the operation of the thermal loop, particularly under high VIN conditions. If the die temperature increases to TJ(OFF), the IC is turned off. Once the device die temperature cools by TJ(OFF-HYS), the device turns on and returns to thermal regulation. Continuous over-temperature conditions result in the pulsing of the load current. If the junction temperature of the device exceeds TJ(OFF), the charge FET is turned off. The FET is turned back on when the junction temperature falls below TJ(OFF) – TJ(OFF-HYS). Note that these features monitor the die temperature of the bq25050. This is not synonymous with ambient temperature. Self heating exists due to the power dissipated in the IC because of the linear nature of the battery charging algorithm. 20 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 bq25050 www.ti.com SLUSA33 – MARCH 2010 APPLICATION INFORMATION Selection of Input/ Output Capacitors In most applications, all that is needed is a high-frequency decoupling capacitor on the input power pin. For normal charging applications, a 0.1µF ceramic capacitor, placed in close proximity to the IN pin and GND pad works best. In some applications, depending on the power supply characteristics and cable length, it may be necessary to increase the input filter capacitor to avoid exceeding the OVP voltage threshold during adapter hot plug events where the ringing exceeds the deglitch time. The charger in the bq25050 requires a capacitor from OUT to GND for loop stability. Connect a 1µF ceramic capacitor from OUT to GND close to the pins for best results. More output capacitance may be required to minimize the output droop during large load transients. Connect a 0.1µF ceramic capacitor from BAT to GND to eliminate the potential ESD strike. The LDO also requires an output capacitor for loop stability. Connect a 0.1µF ceramic capacitor from LDO to GND close to the pins. For improved transient response, this capacitor may be increased. bq25050 Charger Design Example The following sections provide an example for determining the component values for use with the bq25050. Requirements Refer to Figure 1 and Figure 2 for Schematics of the Design Example • Supply voltage = 4.35~10.2V • Fast charge current is set by CTRL - pin 7 • Input current monitoring output - pin 2 • Set 0°C~45°C operating range Calculations Program the Fast Charge Current (CTRL): Programming the different input currents, BGATE option, temperature operating range, and VIN-DPM is done by pulsing the CTRL input. See table 2 for details. If, at any time, the CTRL input is held high for more than 2ms, the IC is disabled. After CTRL is pulled low for more than 2ms, the charger resumes. See Figure 26 for details. Program the input current monitoring output (IMON): Connect a resistor from IMON to VSS to monitor the input current. The voltage of IMON pin is determined by: VIMON = KIMON × RIMON × ICHG The maximum IMON pin voltage is typically 1.2V. If the VIMON is programmed to be higher than VIMON(MAX), the VIMON will be clamped on VIMON(MAX). But, ICHG is controlled by the CTRL pin separately and is not affected by VIMON. Set charger operating temperature range (TS): The operating range is 0°C to 45°C by a default NTC thermistor NCP15WB473F (47kΩ Thermistor, b=4050). 12 qualified CTRL pulses can set VHOT_60 as TS hot threshold and set 0°C to 60°C as the operating range. The following conditions will reset temperature operating range back to 0°C to 45°C. • Input voltage is lower than UVLO • The CTRL input is held high for more than 2ms In battery discharge mode, the TS function is disabled if the CHG voltage falls below logic low. External FET Controller (BGATE): On Figure 1, BGATE drives an external P-channel FET that connects the battery to the system output. When power is first applied to either VBAT or VIN, the device sources a typical 50µA small current out of BGATE and monitors the voltage. If BGATE voltage is higher than logic high in first 1ms and stays high for at least 2ms, the external power path control feature is enabled and VLOWV is set to 2.9V. The OUT pin maintains voltage at VOUT(REG). In Figure 2, BGATE is connected to Vss. The external power path control feature is disabled and VLOWV is set to 2.5V. The OUT pin shorts to BAT. Status Indicators (CHG): The CHG pin is open drain output. If used, CHG pin should be pulled up via a resistor and possibly a LED to a power source. If monitored by a host, the host pull-up power source should be used. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 21 bq25050 SLUSA33 – MARCH 2010 www.ti.com Thermal Considerations The bq25050 is packaged in a thermally enhanced QFN package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB). Full PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application Note (SLUA271). The most common measure of package thermal performance is thermal impedance (qJA ) measured (or modeled) from the chip junction to the air surrounding the package surface (ambient). The mathematical expression for qJA is: T - TA qJA = J PD (1) Where: TJ = chip junction temperature TA = ambient temperature PD = device power dissipation Factors that can greatly influence the measurement and calculation of qJA include: • Whether or not the device is board mounted • Trace size, composition, thickness, and geometry • Orientation of the device (horizontal or vertical) • Volume of the ambient air surrounding the device under test and airflow • Whether other surfaces are in close proximity to the device being tested The device power dissipation, PD, is a function of the charge rate and the voltage drop across the internal PowerFET. It can be calculated from the following equation when a battery pack is being charged: P D = (VIN - VO UT ) ´ IOUT (2) Due to the charge profile of Li-Ion batteries the maximum power dissipation is typically seen at the beginning of the charge cycle when the battery voltage is at its lowest. See the charging profile, Figure 22. If the board thermal design is not adequate the programmed fast charge rate current may not be achieved under maximum input voltage and minimum battery voltage, as the thermal loop can be active, effectively reducing the charge current to avoid excessive IC junction temperature PCB Layout Considerations It is important to pay special attention to the PCB layout. The following provides some guidelines: • To obtain optimal performance, the decoupling capacitor from IN to GND (thermal pad) and the output filter capacitors from OUT to GND (thermal pad) should be placed as close as possible to the bq25050, with short trace runs to both IN, OUT and GND (thermal pad). • All low-current GND connections should be kept separate from the high-current charge or discharge paths from the battery. Use a single-point ground technique incorporating both the small signal ground path and the power ground path. • The high current charge paths into IN pin and from the OUT pin must be sized appropriately for the maximum charge current in order to avoid voltage drops in these traces. • The bq25050 is packaged in a thermally enhanced SON package. The package includes a thermal pad to provide an effective thermal contact between the IC and the printed circuit board (PCB); this thermal pad is also the main ground connection for the device. Connect the thermal pad to the PCB ground connection. Full PCB design guidelines for this package are provided in the application note entitled: QFN/SON PCB Attachment Application Note (SLUA271). 22 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): bq25050 PACKAGE OPTION ADDENDUM www.ti.com 25-Jul-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ25050DQCR ACTIVE WSON DQC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ25050DQCT ACTIVE WSON DQC 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ25050DQCR WSON DQC 10 3000 330.0 12.4 2.3 3.3 0.85 4.0 12.0 Q1 BQ25050DQCT WSON DQC 10 250 180.0 12.4 2.3 3.3 0.85 4.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 25-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25050DQCR WSON DQC 10 3000 346.0 346.0 29.0 BQ25050DQCT WSON DQC 10 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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