FUJI 2SK3985-01

2SK3985-01
FUJI POWER MOSFET
200511
Super FAP-G Series
N-CHANNEL SILICON POWER MOSFET
Outline Drawings [mm]
TO-220AB
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Drain-source voltage
Continuous drain current
Pulsed drain current
Gate-source voltage
Repetitive or non-repetitive
Non-repetitive
Maximum avalanche energy
Repetitive
Maximum avalanche energy
Maximum drain-source dV/dt
Peak diode recovery dV/dt
Maximum power dissipation
Symbol
V DS
VDSX
ID
ID(puls]
VGS
IAR
Ratings
500
500
3.6
±14.4
±30
3.6
227.9
EAS
EAR
dV DS /dt
dV/dt
PD
6.0
20
5
60
2.02
+150
Unit
V
V
A
A
V
A
Remarks
VGS=-30V
Note *1
mJ
Note *2
mJ
kV/μs
kV/μs
W
W
°C
°C
Note *3
VDS <
= 500V
Note *4
Equivalent circuit schematic
Drain(D)
Tc=25°C
Ta=25°C
Operating and storage
Tch
temperature range
Tstg
-55 to +150
<
Note *1 Tch=150°C
Note *2 Starting Tch=25°C, IAS=1.5A, L=186mH, VCC=50V, RG=50Ω
EAS limited by maximum channel temperrature and avalanche current.
See to ‘Avalanche Energy’ graph.
Note *3 Repetitve rating : Pulse width limited by maximum channel temperature.
See to ‘Transient Thermal impedance’ graph.
<
Note *4 IF <
= -ID, -di/dt=50A/μs, Vcc <
= BVDSS, Tch = 150°C
Gate(G)
Source(S)
Electrical characteristics (Tc =25°C unless otherwise specified)
Item
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on time ton
Turn-off time toff
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
Symbol
BVDSS
VGS(th)
IDSS
IGSS
RDS(on)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
QG
QGS
QGD
V SD
trr
Qrr
Min.
Test Conditions
ID= 250μA
VGS=0V
ID= 250μA
VDS=VGS
VDS=500V VGS=0V
VDS=400V VGS=0V
VGS=±30V VDS=0V
ID=1.8A VGS=10V
Typ.
500
3.0
Tch=25°C
Tch=125°C
ID=1.8A VDS=25V
VDS =25V
VGS=0V
f=1MHz
VCC=300V ID=1.8A
VGS=10V
1.7
RGS=10 Ω
VCC =250V
ID=3.6A
VGS=10V
IF=3.6A VGS=0V Tch=25°C
IF=3.6A VGS=0V
-di/dt=100A/μs Tch=25°C
1.84
3.4
330
50
2.5
11
5.0
23
6
13
5.5
2.5
1.00
0.5
2.3
Max.
5.0
25
250
100
2.30
500
75
5.0
18
7.5
35
9
20
8.5
3.8
1.50
Units
V
V
μA
nA
Ω
S
pF
ns
nC
V
μs
μC
Thermalcharacteristics
Item
Thermal resistance
http://www.fujielectric.co.jp/fdt/scd/
Symbol
Rth(ch-c)
Rth(ch-a)
Test Conditions
channel to case
channel to ambient
Min.
Typ.
Max.
2.083
62.0
Units
°C/W
°C/W
1
2SK3985-01(500V/3.6A/2.3Ω)
FUJI POWER MOSFET
Characteristics
2
2SK3985-01(500V/3.6A/2.3Ω)
FUJI POWER MOSFET
3
2SK3985-01(500V/3.6A/2.3Ω)
FUJI POWER MOSFET
http://www.fujielectric.co.jp/fdt/scd/
4