DF005 THRU DF10 GLASS PASSIVATED CHIP SINGLE-PHASE BRIDGE RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere Features Ideal for printed circuit board Glass passivated chip junction High temperature soldering guaranteed: 260 /10 seconds at 5 lbs tension Mechanical Data Terminals: Plated leads, solderable per MIL-STD-202, method 208 Case: Molded with UL-94Class V-0 recognized flame retartant epoxy Polarity: Polarity symbol marked on body Mounting Position: Any Maximum Ratings and Electrical Characteristics Single-phase, half-wave, 60Hz, resistive or inductive load. Ratings at 25 unless otherwise stated. For capacitive load, Derate current by 20%. Characteristic Symbols DF005 DF01 DF02 DF04 DF06 DF08 DF10 Units Volts Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current at TA=40 I(AV) 1.0 Amp Peak forward surge current 8.3mS single half sine-wave superimposed on rated load IFSM 50.0 Amps Maximum forward voltage at forward current perelement 1.0A VF 1.1 Volts I t-rating for fusion (t<8.3mS) 2 It 10.0 A 2S IR 10.0 500.0 A CJ 25.0 F 40.0 /W 2 Maximum DC reverse current at rated DC blocking voltage Typical junction capacitance (Note 1) Typical thermal resistance (Note 2) Operating temperature range Storage temperature range TA=25 TA=125 R JA TJ -55 to +125 TSTG -55 to +150 Notes: (1) Measured at 1.0MHz and applied reverse voltage of 4.0 VDC (2) Thermal resistance from junction to ambient on P.C. Board Mounted 1 RATINGS AND CHARACTERISTIC CURVES 2