HMC578LC3B SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Typical Applications Features 7 The HMC578LC3B is suitable for: High Output Power: +15 dBm • Clock Generation Applications: SONET OC-192 & SDH STM-64 Low Input Power Drive: 0 to +6 dBm FREQ. MULTIPLIERS - ACTIVE - SMT v01.1208 • Point-to-Point & VSAT Radios Fo Isolation: >20 dBc @ Fout= 28 GHz 100 KHz SSB Phase Noise: -132 dBc/Hz • Test Instrumentation Single Supply: +5V@ 81 mA • Military & Space RoHS Compliant 3x3 mm SMT Package Functional Diagram General Description The HMC578LC3B is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a leadless RoHS compliant SMT package. When driven by a +3 dBm signal, the multiplier provides +15 dBm typical output power from 24 to 33 GHz. The Fo and 3Fo isolations are >20 dBc and >30 dBc respectively at 28 GHz. The HMC578LC3B is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -129 dBc/Hz at 100 kHz offset helps maintain good system noise performance. The RoHS packaged HMC578LC3B eliminates the need for wire bonding, and allows the use of surface mount manufacturing techniques. Electrical Specifi cations, TA = +25° C, Vdd1, Vdd2 = +5V, 3 dBm Drive Level Parameter Min. Frequency Range, Input Frequency Range, Output Max. Units GHz 24 - 33 GHz 15 dBm Fo Isolation (with respect to output level) 20 dBc 3Fo Isolation (with respect to output level) 30 dBc Input Return Loss 10 dB Output Return Loss 12 dB -132 dBc/Hz 81 mA Output Power 10 SSB Phase Noise (100 kHz Offset) Supply Current (Idd1 & Idd2) 7 - 112 Typ. 12 - 16.5 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC578LC3B v01.1208 SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Output Power vs. Temperature @ 3 dBm Drive Level Output Power vs. Drive Level 6 dBm 16 OUTPUT POWER (dBm) OUTPUT POWER (dBm) 20 12 8 +25C +85C -40C 4 4 dBm 15 10 5 0 -5 -10 -15 -6 dBm -2 dBm 2 dBm -4 dBm 0 dBm -20 -25 0 -30 20 22 24 26 28 30 32 34 36 20 22 24 OUTPUT FREQUENCY (GHz) 26 28 30 32 34 36 34 36 OUTPUT FREQUENCY (GHz) Output Power vs. Supply Voltage @ 3 dBm Drive Level Isolation @ 3 dBm Drive Level 20 20 OUTPUT POWER (dBm) 16 12 Vdd=4.5V Vdd=5.0V Vdd=5.5V 8 4 10 Fo 2Fo 3Fo 0 -10 -20 -30 0 -40 20 22 24 26 28 30 32 34 20 36 22 24 OUTPUT FREQUENCY (GHz) 26 28 30 32 OUTPUT FREQUENCY (GHz) Output Power vs. Input Power 20 15 OUTPUT POWER (dBm) OUTPUT POWER (dBm) 7 25 FREQ. MULTIPLIERS - ACTIVE - SMT 20 10 5 0 -5 24.0 GHz 28.5 GHz 33.0 GHz -10 -15 -20 -10 -8 -6 -4 -2 0 2 4 6 8 10 INPUT POWER (dBm) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 113 HMC578LC3B v01.1208 SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Output Return Loss vs. Temperature Input Return Loss vs. Temperature 7 - 114 0 +25C +85C -40C -4 +25C +85C -40C -5 RETURN LOSS (dB) RETURN LOSS (dB) FREQ. MULTIPLIERS - ACTIVE - SMT 7 0 -10 -15 -8 -12 -16 -20 -20 10 11 12 13 14 15 FREQUENCY (GHz) 16 17 18 20 22 24 26 28 30 32 FREQUENCY (GHz) For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 34 36 HMC578LC3B Absolute Maximum Ratings SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Typical Supply Current vs. Vdd RF Input (Vdd = +5V) +13 dBm Vdd (Vdc) Idd (mA) Supply Voltage (Vdd) +6.0 Vdc 4.5 81 Channel Temperature 175 °C 5.0 81 5.5 81 Continuous Pdiss (T= 85 °C) (derate 7.4 mW/°C above 85 °C) 670 mW Thermal Resistance (channel to ground paddle) 135 °C/W Storage Temperature -65 to +150 °C Operating Temperature -40 to +85 °C Note: Multiplier will operate over full voltage range shown above. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing 7 FREQ. MULTIPLIERS - ACTIVE - SMT v01.1208 NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL. 3. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1. For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 115 HMC578LC3B v01.1208 SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Pin Description FREQ. MULTIPLIERS - ACTIVE - SMT 7 7 - 116 Pin Number Function Description 1, 3, 7, 9 GND Package bottom must also be connected to RF/DC ground. 2 RFIN Pin is AC coupled and matched to 50 Ohms. 4 - 6, 11 N/C These pins are internally not connected; however, this product was specified with these pins connected to RF/ DC ground. 8 RFOUT Pin is AC coupled and matched to 50 Ohms. 10, 12 Vdd2, Vdd1 Supply voltage 5V ± 0.5V. External bypass capacitors of 100 pF, 1,000 pF and 2.2 μF are required. Interface Schematic Application Circuit Component Value C1, C2 100 pF C3, C4 1,000 pF C5, C6 2.2 μF For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC578LC3B v01.1208 SMT GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 24 - 33 GHz OUTPUT Evaluation PCB FREQ. MULTIPLIERS - ACTIVE - SMT 7 List of Materials for Evaluation PCB 112409 [1] Item Description J1, J2 PCB Mount SRI K Connector J3 - J5 DC Pin C1, C2 100 pF Capacitor, 0402 Pkg. C3, C4 1,000 pF Capacitor, 0603 Pkg. C5, C6 2.2 μF Tantalum Capacitor U1 HMC578LC3B x2 Active Multiplier PCB [2] 111173 Eval Board [1] Reference this number when ordering complete evaluation PCB The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Hittite upon request. [2] Circuit Board Material: Rogers 4350 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com 7 - 117