HITTITE HMC578LC3B

HMC578LC3B
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Typical Applications
Features
7
The HMC578LC3B is suitable for:
High Output Power: +15 dBm
• Clock Generation Applications:
SONET OC-192 & SDH STM-64
Low Input Power Drive: 0 to +6 dBm
FREQ. MULTIPLIERS - ACTIVE - SMT
v01.1208
• Point-to-Point & VSAT Radios
Fo Isolation: >20 dBc @ Fout= 28 GHz
100 KHz SSB Phase Noise: -132 dBc/Hz
• Test Instrumentation
Single Supply: [email protected] 81 mA
• Military & Space
RoHS Compliant 3x3 mm SMT Package
Functional Diagram
General Description
The HMC578LC3B is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology in a
leadless RoHS compliant SMT package. When driven
by a +3 dBm signal, the multiplier provides +15 dBm
typical output power from 24 to 33 GHz. The Fo and
3Fo isolations are >20 dBc and >30 dBc respectively
at 28 GHz. The HMC578LC3B is ideal for use in LO
multiplier chains for Pt to Pt & VSAT Radios yielding
reduced parts count vs. traditional approaches. The
low additive SSB Phase Noise of -129 dBc/Hz at
100 kHz offset helps maintain good system noise
performance. The RoHS packaged HMC578LC3B
eliminates the need for wire bonding, and allows the
use of surface mount manufacturing techniques.
Electrical Specifi cations, TA = +25° C, Vdd1, Vdd2 = +5V, 3 dBm Drive Level
Parameter
Min.
Frequency Range, Input
Frequency Range, Output
Max.
Units
GHz
24 - 33
GHz
15
dBm
Fo Isolation (with respect to output level)
20
dBc
3Fo Isolation (with respect to output level)
30
dBc
Input Return Loss
10
dB
Output Return Loss
12
dB
-132
dBc/Hz
81
mA
Output Power
10
SSB Phase Noise (100 kHz Offset)
Supply Current (Idd1 & Idd2)
7 - 112
Typ.
12 - 16.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC578LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Output Power vs.
Temperature @ 3 dBm Drive Level
Output Power vs. Drive Level
6 dBm
16
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
20
12
8
+25C
+85C
-40C
4
4 dBm
15
10
5
0
-5
-10
-15
-6 dBm
-2 dBm
2 dBm
-4 dBm
0 dBm
-20
-25
0
-30
20
22
24
26
28
30
32
34
36
20
22
24
OUTPUT FREQUENCY (GHz)
26
28
30
32
34
36
34
36
OUTPUT FREQUENCY (GHz)
Output Power vs.
Supply Voltage @ 3 dBm Drive Level
Isolation @ 3 dBm Drive Level
20
20
OUTPUT POWER (dBm)
16
12
Vdd=4.5V
Vdd=5.0V
Vdd=5.5V
8
4
10
Fo
2Fo
3Fo
0
-10
-20
-30
0
-40
20
22
24
26
28
30
32
34
20
36
22
24
OUTPUT FREQUENCY (GHz)
26
28
30
32
OUTPUT FREQUENCY (GHz)
Output Power vs. Input Power
20
15
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
7
25
FREQ. MULTIPLIERS - ACTIVE - SMT
20
10
5
0
-5
24.0 GHz
28.5 GHz
33.0 GHz
-10
-15
-20
-10
-8
-6
-4
-2
0
2
4
6
8
10
INPUT POWER (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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HMC578LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Output Return Loss vs. Temperature
Input Return Loss vs. Temperature
7 - 114
0
+25C
+85C
-40C
-4
+25C
+85C
-40C
-5
RETURN LOSS (dB)
RETURN LOSS (dB)
FREQ. MULTIPLIERS - ACTIVE - SMT
7
0
-10
-15
-8
-12
-16
-20
-20
10
11
12
13
14
15
FREQUENCY (GHz)
16
17
18
20
22
24
26
28
30
32
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
34
36
HMC578LC3B
Absolute Maximum Ratings
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Typical Supply Current vs. Vdd
RF Input (Vdd = +5V)
+13 dBm
Vdd (Vdc)
Idd (mA)
Supply Voltage (Vdd)
+6.0 Vdc
4.5
81
Channel Temperature
175 °C
5.0
81
5.5
81
Continuous Pdiss (T= 85 °C)
(derate 7.4 mW/°C above 85 °C)
670 mW
Thermal Resistance
(channel to ground paddle)
135 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Note:
Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
7
FREQ. MULTIPLIERS - ACTIVE - SMT
v01.1208
NOTES:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER
50 MICROINCHES MINIMUM NICKEL.
3. DIMENSIONS ARE IN INCHES [MILLIMETERS].
4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
7. CLASSIFIED AS MOISTURE SENSITIVITY LEVEL (MSL) 1.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
7 - 115
HMC578LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Pin Description
FREQ. MULTIPLIERS - ACTIVE - SMT
7
7 - 116
Pin Number
Function
Description
1, 3, 7, 9
GND
Package bottom must also be connected
to RF/DC ground.
2
RFIN
Pin is AC coupled and matched to 50 Ohms.
4 - 6, 11
N/C
These pins are internally not connected; however,
this product was specified with these pins connected
to RF/ DC ground.
8
RFOUT
Pin is AC coupled and matched to 50 Ohms.
10, 12
Vdd2, Vdd1
Supply voltage 5V ± 0.5V. External bypass capacitors
of 100 pF, 1,000 pF and 2.2 μF are required.
Interface Schematic
Application Circuit
Component
Value
C1, C2
100 pF
C3, C4
1,000 pF
C5, C6
2.2 μF
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC578LC3B
v01.1208
SMT GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 24 - 33 GHz OUTPUT
Evaluation PCB
FREQ. MULTIPLIERS - ACTIVE - SMT
7
List of Materials for Evaluation PCB 112409 [1]
Item
Description
J1, J2
PCB Mount SRI K Connector
J3 - J5
DC Pin
C1, C2
100 pF Capacitor, 0402 Pkg.
C3, C4
1,000 pF Capacitor, 0603 Pkg.
C5, C6
2.2 μF Tantalum Capacitor
U1
HMC578LC3B x2 Active Multiplier
PCB [2]
111173 Eval Board
[1] Reference this number when ordering complete evaluation PCB
The circuit board used in the final application should
be generated with proper RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed
paddle should be connected directly to the ground
plane similar to that shown. A sufficient number of
via holes should be used to connect the top and
bottom ground planes. The evaluation circuit board
shown is available from Hittite upon request.
[2] Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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