LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LDBK3333/H0/TBS DATA SHEET DOC. NO : QW0905- LDBK3333/H0/TBS REV. : C DATE : 11 - Aug - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 1/5 Package Dimensions P2 ΔH H2 W2 H1 L W0 W1 W3 D P1 F P T LDBK3333/H0 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN □0.5 TYP 2.54TYP 1.0MIN + Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/5 PART NO. LDBK3333/H0/TBS Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT DBK Forward Current IF 30 mA Peak Forward Current Duty 1/10@10KHz IFP 100 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 150 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted LDBK3333/H0/TBS InGaN/GaN Blue Lens Water Clear Luminous Dominant Spectral Forward voltage intensity wave halfwidth length △λnm @20mA(V) @20mA(mcd) λDnm Typ. Max. Min. Typ. 470 30 3.5 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 4.0 1500 2700 Viewing angle 2 θ 1/2 (deg) 26 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 3/5 •Dimension Symbol Information mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-5 22.5 0.89 23.5 0.93 TBS-6 19.9 0.78 20.9 0.82 24.0 0.94 25.0 0.98 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 ------- 36 1.42 11 0.43 Feed Hole To Bottom Of Component TBS-7 H1 TBS-8 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 •REMARK:TBS = Tape And Box Straight Leads •Dimensions Symbol Information •Package Dimensions Specification Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Part No. Quantity/Box LDBK3333/H0 2000PCS W L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LDBK3333/H0/TBS Page 4/5 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 2.5 2.0 1.5 1.0 01 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature(℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directivity Radiation 0° 1.0 -30° 30° -60° 60° 0.5 100% 75% 50% 0.0 400 450 500 Wavelength (nm) 550 25% 0 25% 50% 75% 100% 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LLDBK3333/H0/TBS Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11