SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 D Military Operating Temperature Range D D D D D D D D D D D D −55°C to 125°C, QML Processing Fast Instruction Cycle Time of 50 ns and 40 ns Two 1K-Word × 32-Bit Single-Cycle Dual-Access On-Chip RAM Blocks 32-Bit Instruction and Data Words, 24-Bit Addresses Integer, Floating-Point, and Logical Operations 40- or 32-Bit Floating-Point / Integer Multiplier and Arithmetic Logic Unit (ALU) 24 × 24-Bit Integer Multiplier, 32-Bit Product 32 × 32-Bit Floating-Point Multiplier, 40-Bit Product Parallel ALU and Multiplier Execution in a Single Cycle 32-Bit Barrel Shifter Eight Extended-Precision Registers (Accumulators) Circular and Bit-Reversed Addressing Capabilities Two Independent Bidirectional Serial Ports With Support for 8 -, 16-, 24 -, or 32-Bit Transfers D Two 32-Bit Timers With Control and D D D D D D D D D D D D Counter Registers Validated Ada Compiler 64-Word × 32-Bit Instruction Cache On-Chip Direct Memory Access (DMA) Controller for Concurrent I / O and CPU Operation One 4K × 32-Bit Single-Cycle Dual-Access On-Chip ROM Block Two 32-Bit External Ports (24- and 13-Bit Addresses) Two Address Generators With Eight Auxiliary Registers and Two Auxiliary Register Arithmetic Units (ARAUs) Zero-Overhead Loops With Single-Cycle Branches Interlocked Instructions for Multiprocessing Support Two- and Three-Operand Instructions Conditional Calls and Returns Block-Repeat Capability Fabricated Using Enhanced Performance Implanted CMOS (EPIC) Technology by Texas Instruments description The SMJ320C30KGDB digital signal processor (DSP) is a high-performance, 32-bit floating-point processor manufactured in 0.72-µm, double-level metal CMOS technology. The SMJ320C30KGDB internal busing and special digital-signal-processing instruction set have the speed and flexibility to execute up to 50 million floating-point operations per second (MFLOPS). The SMJ320C30KGDB optimizes speed by implementing functions in hardware that other processors implement through software or microcode. This hardware-intensive approach provides performance previously unavailable on a single chip. The SMJ320C30KGDB can perform parallel multiply and ALU operations on integer or floating-point data in a single cycle. Each processor also possesses a general-purpose register file, a program cache, dedicated ARAUs, internal dual-access memories, one DMA channel supporting concurrent I / O, and a short machine-cycle time. High performance and ease of use are results of these features. The large address space, multiprocessor interface, internally and externally generated wait states, two external interface ports, two timers, two serial ports, and multiple interrupt structure enhanced general-purpose applications. The SMJ320C30KGDB supports a wide variety of system applications from host processor to dedicated coprocessor. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC is a trademark of Texas Instruments Incorporated. Copyright 2007, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 1443 &)$#!" #&(! ! 0112 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!"2 &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* • HOUSTON, TEXAS 77251−1443 1 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 description (Continued) High-level language support is easily implemented through a register-based architecture, large address space, powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic. For additional information when designing for cold temperature operation, please see Texas Instruments application report 320C3x, 320C4x and 320MCM42x Power-up Sensitivity at Cold Temperature, literature number SGUA001. known good die (KGD) technology KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe process. This process uses standard probed product that is tested in wafer form at speed and elevated temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for shipment. electrical specifications For electrical and timing specifications, see the SMJ320C30 Digital Signal Processor data sheet, literature number SGUS014. SMJ PREFIX SMJ = 320 C 30 KGD M 40 C DIE REVISION ’C30 C = Revision 8.0 MIL-PRF-38535 SPEED RANGE 40 = 40 MHz 50 = 50 MHz DEVICE FAMILY 320 = DSP Family TECHNOLOGY C = CMOS TEMPERATURE RANGE M = − 55°C to 125°C L = 0°C to 70°C DEVICE 30 = Floating-Point DSP PACKAGE TYPE KGD = Known Good Die Figure 1. SMJ320C30KGDB Device Nomenclature 2 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 JEDEC STANDARD D D D D D D D D D D D D D D D Die thickness is approximately 15 mils "1 mil. Backside surface finish is silicon. Maximum allowable die junction operating temperature is 175°C. Glassivation material is compressive nitride. Bond pad metal is composed of copper-doped aluminum. Percent defective allowed for burned-in die is 5%. Life test data is available. Configuration control notification Group A attribute summary is available (SMJ only). Suggested die-attach material is Silverglass (QMI 3555). Suggested bond wire size is 1.25 mil. ESD rating is Class II. Minimum allowable peak process temperature for die attach is 325°C (for QMI 3555). Saw kerf is dependent on blade size used. Die backside potential is grounded. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 3 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 SMJ320C30KGDB (rev 7.x) known good die pad information Figure 2 shows the SMJ320C30KGDB die-numbering format. See Table 1 for SMJ320C30KGDB die pad information. Figure 2. ’320C30KGD Die-Numbering Format (See Table 1) Table 1 provides a reference for the following: D The ’C30 signal identities in relation to the pad numbers D The ’C30 X,Y coordinates, where bond pad 52 serves as the origin (0,0) In addition, significant specifications include: D X,Y coordinate data is in microns. D Coordinate origin is at (0,0) (center of bond pad 52). D The active silicon dimensions are 7 779.60 µm × 9 453.10 µm (306.28 mils × 372.17 mils). D The die size is approximately 7 950.20 µm × 9 779.00 µm (313.00 mils × 385.00 mils). D Bond pad dimensions are 103.50 µm × 103.50 µm (4.07 mils × 4.07 mils). 4 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 Table 1. 320C30KGD Die Pad Information PAD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 NAME DVSS VSS VSS VSS X2/CLKIN X1 VSUBS EMU5 XRDY MSTRB IOSTRB XR/W HOLDA HOLD DVDD DVDD RDY STRB R/W RESET XF1 XF0 IACK INT0 VDD VDD VSS VSS INT1 INT2 INT3 RSV0 RSV1 RSV2 RSV3 RSV4 RSV5 RSV6 RSV7 RSV8 RSV9 RSV10 DR1 FSR1 CLKR1 CLKX1 FSX1 DX1 VSS VSS X−COORDINATE Y−COORDINATE 6778.43 617.99 745.13 869.15 986.15 1125.31 1272.26 1476.77 2146.17 2283.29 2420.42 2537.42 2654.42 2771.42 2908.54 3045.67 3162.67 3299.79 3436.91 3553.91 3691.04 3828.16 3945.16 4062.16 4199.29 4336.41 4453.41 4574.47 4699.42 4838.57 4988.49 5145.74 5295.34 5444.95 5594.55 5744.15 5893.76 6037.12 6154.12 6271.12 6388.12 6505.12 6622.12 6739.12 6856.12 7129.12 7264.84 7400.56 7536.28 7672.00 7807.88 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 PAD PITCH 127 124 117 139 147 205 669 137 137 117 117 117 137 137 117 137 137 117 137 137 117 117 137 137 117 121 125 139 150 157 150 150 150 150 150 143 117 117 117 117 117 117 117 273 136 136 136 136 136 5 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 Table 1. 320C30KGD Die Pad Information (Continued) 6 PAD NAME X−COORDINATE 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 DVDD DVDD DR0 FSR0 CLKR0 CLKX0 FSX0 DX0 TCLK0 TCLK1 EMU6 XD0 XD1 XD2 DVDD DVDD XD3 XD4 XD5 XD6 XD7 XD8 XD9 XD10 VDD VDD DVSS VSS VSS XD11 XD12 XD13 XD14 XD15 XD16 XD17 XD18 XD19 XD20 XD21 XD22 XD23 XD24 XD25 XD26 XD27 XD28 XD29 XD30 DVDD DVDD VSS 6437.26 6320.26 6203.26 6086.26 5969.26 5852.26 5735.26 5618.26 5501.26 5384.26 5267.26 5144.02 5027.02 4910.02 4793.02 4676.02 4559.02 4442.02 4325.02 4208.02 4091.02 3974.02 3857.02 3740.02 3623.02 3506.02 3385.43 3264.07 3147.07 3030.07 2913.07 2796.07 2679.07 2562.07 2445.07 2328.07 2211.07 2094.07 1977.07 1860.07 1743.07 1626.07 1509.07 1392.07 1275.07 1158.07 1041.07 924.07 807.07 686.17 569.17 227.21 POST OFFICE BOX 1443 Y−COORDINATE 8228.77 • HOUSTON, TEXAS 77251−1443 PAD PITCH 117 117 117 117 117 117 117 117 117 117 123 117 117 117 117 117 117 117 117 117 117 117 117 117 117 121 121 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 121 117 342 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 Table 1. 320C30KGD Die Pad Information (Continued) PAD NAME 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 VSS VSS VSS XD31 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 DVDD DVDD A13 A12 A11 A10 A9 A8 A7 A6 VDD VDD DVSS VSS A5 A4 A3 A2 A1 A0 EMU0 EMU1 EMU2 EMU3 EMU4/SHZ MC/MP XA12 XA11 XA10 XA9 XA8 XA7 XA6 VSS VSS VSS VSS X−COORDINATE Y−COORDINATE PAD PITCH 227.21 7575.75 7458.59 7341.59 7168.43 7026.47 6878.27 6748.79 6531.95 6414.95 6297.95 6149.75 6032.75 5915.75 5767.55 5650.55 5533.55 5366.63 5237.15 5107.67 4978.19 4848.71 4719.23 4577.27 4460.27 4318.31 4201.31 4076.05 3950.78 3813.03 3677.15 3541.43 3405.71 3269.99 3134.27 2978.43 2802.46 2626.49 2470.65 2314.81 2138.84 2001.71 1872.23 1742.75 1613.27 1483.79 1354.31 1224.83 1014.23 884.75 755.27 625.48 117 117 173 142 148 129 217 117 117 148 117 117 148 117 117 167 129 129 129 129 129 142 117 142 117 125 125 138 136 136 136 136 136 156 176 176 156 156 176 137 129 129 129 129 129 129 211 129 129 130 625 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 7 SGUS019D − NOVEMBER 1995 − REVISED JANUARY 2007 Table 1. 320C30KGD Die Pad Information (Continued) 8 PAD NAME X−COORDINATE 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 DVDD DVDD XA5 XA4 XA3 XA2 XA1 XA0 D31 D30 D29 D28 D27 D26 DVDD DVDD D25 D24 D23 D22 D21 D20 D19 D18 VDD VDD DVSS VSS VSS D17 D16 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 H1 H3 DVDD DVDD 569.17 686.17 803.17 920.17 1037.17 1154.17 1271.17 1388.17 1511.41 1628.41 1745.41 1862.41 1979.41 2096.41 2213.41 2330.41 2447.41 2564.41 2681.41 2798.41 2915.41 3032.41 3149.41 3266.41 3383.41 3500.41 3618.50 3742.21 3859.21 3976.21 4093.21 4210.21 4327.21 4444.21 4561.21 4678.21 4795.21 4912.21 5029.21 5146.21 5263.21 5380.21 5497.21 5614.21 5731.21 5848.21 5965.21 6082.21 6199.21 6316.21 6433.21 POST OFFICE BOX 1443 Y−COORDINATE 227.21 • HOUSTON, TEXAS 77251−1443 PAD PITCH 117 117 117 117 117 117 117 123 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 118 124 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 117 PACKAGE OPTION ADDENDUM www.ti.com 8-Apr-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) 5962-9052604Q9B ACTIVE XCEPT KGD 0 36 TBD Call TI N / A for Pkg Type 5962-9052605Q9B ACTIVE XCEPT KGD 0 1 TBD Call TI N / A for Pkg Type SMJ320C30KGDM40C ACTIVE XCEPT KGD 0 36 TBD Call TI N / A for Pkg Type SMJ320C30KGDM50C ACTIVE XCEPT KGD 0 1 TBD Call TI N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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