OKI ML67Q4002

OKI Semiconductor
ML674001/Q4002/Q4003
FEDL674001-01
Issue Date: Dec. 15, 2003
32-bit ARM-Based General-Purpose Microcontroller
GENERAL DESCRIPTION
The ML674001, ML67Q4002, and ML67Q4003 microcontrollers (MCUs) are the members of an extensive and
growing family of 32-bit ARM®-based standard products for general-purpose applications that require 32-bit
CPU performance and low cost afforded by MCU integrated features.
ML674001/67Q4002/67Q4003 provide built-in 32Kbyte SRAM, built-in 4Kbyte boot ROM, and a host of other
useful peripherals such as auto-reload timers, watchdog timer (WDT), pulse-width modulators (PWM), A-to-D
converter, expanded UARTs, synchronous serial port, I2C serial interface, GPIOs, DMA controller, external
memory controller, and boundary scan capability. In addition, the ML67Q4002 and ML67Q4003 offer 256
Kbytes and 512 Kbytes of built-in Flash memory respectively. The ML674001, ML67Q4002 and ML67Q4003
are pin-to-pin compatible with each other for easy performance updates.
Oki’s ML674K Family MCUs are capable of executing both the 32-bit ARM instruction set for
high-performance applications as well as the 16-bit Thumb® instruction set for high code-density,
power-efficient applications. With an ARM7TDMI® core operating at 33 MHz maximum frequency, ARM
Thumb™ capabilities, and robust feature sets, the ML674001 Series MCUs are suitable for an array of
applications including high performance industrial controllers and instrumentation, telecom, PC peripherals,
security/surveillance, test equipment, and a variety of consumer electronics devices.
The ARM7TDMI® Advantage
Oki’s ML674K Family of low-cost ARM-based MCUs offers system designers a bridge from 8- and 16-bit
proprietary MCU architectures to ARM’s higher-performance, affordable, widely-accepted industry standard
architecture and its industry-wide support infrastructure. The ARM industry infrastructure offers the system
developers many advantages including software compatibility, many ready-to-use software applications, large
choices among hardware and software development tools. These ARM-based advantages allow Oki’s
customers to better leverage engineering resources, lower development costs, minimize project risks, and reduce
their product time to market. In addition, migration of a design with an Oki standard MCU to an Oki custom
solution is easily facilitated with its award-winning uPLAT™ product development architecture.
FEATURES
• CPU
32-bit RISC CPU (ARM7TDMI)
32-bit instructions (ARM Instructions) and 16-bit instructions (Thumb Instructions) mixed
General purpose registers : 31 x 32 bits
Built-in Barrel shifter and multiplier (32 bit x 8 bit, Modified Booth’s Algorithm)
Little endian
Built-in debug function
• Internal memory
RAM
32KB (32-bit access)
FLASH (16-bit access)
ML674001
: ROM-less version
ML67Q4002
: 256Kbytes
ML67Q4003
: 512Kbytes
ARM, ARM7TDMI, Multi-ICE and AMBA are registered trademarks of ARM Ltd., UK.
µPLAT is Oki's trademark.
The contents of this data sheet are subject to change for modification without notice.
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FEDL674001-01
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ML674001/67Q4002/67Q4003
• External memory controller
ROM (FLASH): 16 Mbytes
SRAM: 16 Mbytes
DRAM: 64 Mbytes (SDRAM and EDO-DRAM support)
External IO devices: 16 Mbytes x 2 banks, 4 Chip select pins
Wait control input signal for each bank
Independent programmable wait settings for each bank
• Interrupt controller
28 sources: 23 internals and 5 externals (IRQ: 4, FIQ: 1)
• DMA controller
2 channels: Dual address mode, cycle steal and burst tranfer mode
• Timer
1 channel: 16-bit auto reload for operating system
6 channels: 16-bit auto reload for application
1 channel: 16 bit watchdog timer
• Serial interface
1 channel: UART
1 channel: UART with 16-byte FIFO
1 channel: synchronous
1 channel: I2C (single master)
• Parallel I/O Port
4 ports x 8 bits (bitwise input/output settings)
1 port x 10 bit (bitwise input/output settings)
• PWM
2 channels x 16 bits
• Analog-to-Digital Converter
4 channels x 10 bits
• Power down mechanism
Standby (all clock stop) and Halt (clock stop by each function block)
Clock gear (selectable 1/1, 1/2, 1/4, 1/8, 1/16 input clock frequency)
• JTAG interface
Connectable to JTAG ICE
• Power supply voltage
Core section: 2.25 V to 2.75 V
IO section: 3.0 V to 3.6 V
Analog section: 3.0 V to 3.6 V
• Operating frequency
1-33 MHz
• Operating temperature (ambient temperature)
–40°C to +85°C
• Package
144-pin plastic LQFP (LQFP144-P-2020-0.50)
144-pin plastic LFBGA (P-LFBGA144-1111-0.80)
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FEDL674001-01
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ML674001/67Q4002/67Q4003
BLOCK DIAGRAM
5
TDI
TDO
nTRST
TMS
TCK
Internal (MCP)
FLASH ROM
ML67Q4002 : 256KB
ML67Q4003 : 512KB
Internal RAM
32KB
µPLAT-7B
Internal &
External
Memory
controller
ARM7TDMI
TIC
DRAMC
AHB
Bridge
Boot ROM
4KB
AMBA
AHB bus
APB
Bridge
Exp.
IRC
IRC
AMBA
APB bus
DMAC
APB
Bridge
PIOC[6:2] / XA[23:19]
XA[18:0]
XD[15:0]
PIOC[7] / XWR
XOE_N
XWE_N
XBWE_N[1:0]
XROMCS_N
XRAMCS_N
XIOCS_N[3:0]
XBS_N[1:0]
PIOD[0] / XWAIT
PIOD[1] / XCAS_N
PIOD[2] / XRAS_N
PIOD[3] / XSDCLK
PIOD[4] / XSDCS_N
PIOD[5] / XSDCKE
PIOD[6] /
XDQM[1]/XCAS_N[1]
PIOD[7] /
XDQM[0]/XCAS_N[0]
2
PIOB[0] / DREQ[0]
PIOB[2] / DREQ[1]
2
PIOB[1] / DREQCLR[0]
PIOB[3] / DREQCLR[1]
2
PIOB[4] / TCOUT[0]
PIOB[5] / TCOUT[1]
APB bus
System
TMR
UART
System
Control
TMR
16 bit x 6ch
PWM
RESET_N
PIOB[6] / STXD
PIOB[7] / SRXD
OSC0
OSC1_N
WDT
UART
(16550)
CGB
CKOE_N
CKO
PIOE[8:5] / EXINT[3:0]
PIOE[9] / EFIQ_N
SSIO
8
A/D
GPIO
PIOC[1:0] / PWMOUT[1:0]
PIOA[0] / SIN
PIOA[1] / SOUT
PIOA[2] / CTS
PIOA[3] / DSR
PIOA[4] / DCD
PIOA[5] / DTR
PIOA[6] / RTS
PIOA[7] / RI
3
PIOE[0] / SCLK
PIOE[1] / SDI
PIOE[2] / SDO
2
PIOE[3] / SDA
PIOE[4] / SCL
5
AIN[3:0]
VREF
5
I2C
VDD_CORE
VDD_IO
GND
AVDD
AGND
DRAME_N
TEST
BSEL[1:0]
FWR
JSEL
2
16 bit x 2ch
42
PIOA[7:0]
PIOB[7:0]
PIOC[7:0]
PIOD[7:0]
PIOE[9:0]
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OKI Semiconductor
ML674001/67Q4002/67Q4003
PIN CONFIGURATION (TOP VIEW)
144-Pin Plastic LFBGA
5
4
3
2
1
N
PIOD[6]/
XIOCS_ XIOCS_ XRAMC XBWE_
PIOC[4]/
XDQM[1
XOE_N
XA[16]
N[3]
N[1]
S_N
N[0]
XA[21]
]
13
12
XA[14]
XA[11]
XA[9]
XA[7]
XA[6]
M
PIOD[7]/
XIOCS_ XIOCS_
PIOC[7]/ PIOC[6]/ PIOC[2]/
XWE_N
XA[17]
XDQM[0
N[2]
N[0]
XWR
XA[23] XA[19]
]
XA[15]
XA[13]
XA[10]
XA[4]
XA[5]
L
PIOB[1]/
PIOB[2]/ PIOB[0]/ XROMC XBWE_ PIOC[5]/ PIOC[3]/
DREQC
XA[18]
DREQ[1] DREQ[0] S_N
N[1]
XA[22] XA[20]
LR[0]
XA[12]
VDD_IO
XA[8]
XA[2]
GND
K
PIOB[3]/ PIOB[5]/
DREQC TCOUT[ VDD_IO
1]
LR[1]
GND
XA[3]
XA[0]
XD[13]
XA[1]
J
PIOC[0]/
PWMOU
T[0]
VDD_IO XD[15]
XD[11]
XD[14]
H
XBS_N[ XBS_N[ PIOD[0]/ VDD_C
0]
1]
XWAIT
ORE
G
PIOD[2]/ PIOD[1]/
VDD_IO
XRAS_N XCAS_N
F
GND
11
10
GND
9
VDD_IO
8
7
VDD_C
VDD_IO
ORE
6
GND
PIOB[4]/ PIOC[1]/
TCOUT[ PWMOU
T[1]
0]
VDD_C
ORE
XD[10]
NC
XD[12]
VDD_IO
XD[8]
NC
XD[9]
PIOD[4]/
PIOD[5]/
PIOD[3]/
XSDCS_
BSEL[1] XSDCK
XSDCLK
N
E
GND
XD[7]
XD[6]
XD[5]
E
PIOE[7]/
PIOE[8]/ PIOE[5]/
BSEL[0]
EXINT[2]
EXINT[3] EXINT[0]
GND
XD[2]
NC
XD[4]
D
PIOE[0]/ PIOE[6]/ PIOE[9]/ PIOE[2]/
PIOA[1]/
OSC1_N
SCLK EXINT[1] EFIQ_N SDO
SOUT
GND
VDD_IO
XD[3]
XD[1]
FWR
XD[0]
RESET_
N
144pin LFBGA
(TOP VIEW)
GND
AIN[0]
NC
C
TDI
PIOE[1]/
SDI
CKO
TMS
CKOE_
N
AVDD
AIN[1]
AIN[3]
B
nTRST
TDO
TCK
GND
VDD_IO
PIOA[0]/
SIN
VREF
AGND
A
NC
NC
JSEL
DRAME
_N
OSC0
TEST
AIN[2]
13
12
11
10
9
8
7
Notes:
VDD_IO
VDD_C PIOA[5]/
ORE
DTR
GND
PIOA[3]/ PIOA[7]/ PIOE[4]/ PIOB[7]/
DSR
RI
SCL
SRXD
PIOA[2]/ PIOA[4]/ PIOA[6]/ PIOE[3]/ PIOB[6]/
CTS
DCD
RTS
SDA
STXD
6
5
4
3
2
NC
1
NC pins are electrically unconnected in the package.
NC pins can be connected to Vdd or GND.
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FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
CTS
DSR
DCD
DTR
RTS
RI
SDA
SCL
STXD
XDQM[0]/XCAS_N[0]
XDQM[1]/XCAS_N[1]
DREQCLR[0]
DREQ[0]
PWMOUT[1]
PWMOUT[0]
TCOUT[1]
TCOUT[0]
DREQCLR[1]
DREQ[1]
XCAS_N
XWAIT
XSDCKE
XSDCS_N
XSDCLK
XRAS_N
(Primary functi (Secondary f
74
73
75
77
76
79
78
80
82
81
84
83
85
87
86
89
88
90
92
91
94
93
95
97
96
101
100
99
98
102
104
103
106
105
107
(Primary f
SIN
SOUT
NC
NC
CKO
JSEL
TMS
TCK
DRAME_N
CKOE_N
GND
OSC0
OSC1_N
VDD_IO
TEST
PIOA[0]
PIOA[1]
AVDD
VREF
AIN[0]
AIN[1]
AIN[2]
AIN[3]
NC
AGND
GND
PIOA[2]
VDD_IO
PIOA[3]
PIOA[4]
VDD_CORE
PIOA[5]
PIOA[6]
PIOA[7]
GND
PIOE[3]
PIOE[4]
PIOB[6]
108
(Secondary fun(Primary function)
nTRST
TDO
TDI
PIOE[2]
PIOE[1]
PIOE[0]
PIOE[9]
PIOE[8]
PIOE[7]
PIOE[6]
PIOE[5]
BSEL[1]
BSEL[0]
PIOD[5]
PIOD[4]
PIOD[3]
PIOD[2]
VDD_IO
GND
PIOD[1]
PIOD[0]
VDD_CORE
XBS_N[1]
XBS_N[0]
GND
PIOC[1]
PIOC[0]
PIOB[5]
PIOB[4]
PIOB[3]
PIOB[2]
VDD_IO
PIOB[1]
PIOB[0]
PIOD[7]
PIOD[6]
(Seconda
SDO
SDI
SCLK
EFIQ_N
EXINT[3]
EXINT[2]
EXINT[1]
EXINT[0]
144-Pin Plastic LQFP
109
72
110
111
71
70
112
113
69
68
114
115
67
66
116
65
117
118
64
63
119
120
62
61
121
60
122
123
59
58
144pin LQFP
(TOP VIEW)
124
125
126
57
56
55
127
128
54
53
129
130
52
51
131
50
132
133
49
48
134
135
47
46
136
45
137
138
44
43
139
140
42
41
141
142
40
39
143
38
144
37
XIOCS_N[3]
XIOCS_N[2]
XIOCS_N[1]
GND
XIOCS_N[0]
XRAMCS_N
XROMCS_N
XBWE_N[1]
XBWE_N[0]
XWE_N
VDD_IO
XOE_N
PIOC[7]
PIOC[6]
VDD_CORE
PIOC[5]
PIOC[4]
PIOC[3]
VDD_IO
PIOC[2]
XA[18]
GND
XA[17]
XA[16]
XA[15]
GND
XA[14]
XA[13]
XA[12]
XA[11]
XA[10]
VDD_IO
XA[9]
XA[8]
XA[7]
XA[6]
XWR
XA[23]
XA[22]
XA[21]
XA[20]
XA[19]
SRXD
(Primary f
(Seconda
Notes:
NC
PIOB[7]
FWR
RESET_N
VDD_IO
XD[0]
XD[1]
XD[2]
XD[3]
XD[4]
GND
NC
XD[5]
XD[6]
GND
XD[7]
NC
VDD_IO
XD[8]
XD[9]
XD[10]
VDD_CORE
NC
XD[11]
XD[12]
VDD_IO
XD[13]
XD[14]
XD[15]
XA[0]
XA[1]
XA[2]
XA[3]
GND
XA[4]
XA[5]
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36
NC pins are electrically unconnected in the package.
NC pins can be connected to Vdd or GND.
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ML674001/67Q4002/67Q4003
LIST OF PINS
Pin
Primary Function
Symbol
Secondary Function
Description
I/O
Symbol
LQFP
BGA
1
A1
NC
—
NC
2
B1
PIOB[7]
I/O
General port (with interrupt function)
SRXD
3
C3
FWR
I
Test mode
—
—
4
C1
RESET_N
I
Reset input
—
—
5
D3
VDD_IO
VDD
IO power supply
—
—
6
C2
XD[0]
I/O
External data bus
—
—
7
D1
XD[1]
I/O
External data bus
—
—
8
E3
XD[2]
I/O
External data bus
—
—
9
D2
XD[3]
I/O
External data bus
—
—
10
E1
XD[4]
I/O
11
E4
GND
GND
12
E2
NC
13
F1
14
F2
15
16
—
I/O
—
I
External data bus
—
—
GND
—
—
—
NC
—
—
XD[5]
I/O
External data bus
—
—
XD[6]
I/O
External data bus
—
—
F4
GND
GND
GND
—
—
F3
XD[7]
I/O
External data bus
—
—
17
G2
NC
—
NC
—
—
18
G4
VDD_IO
VDD
I/O power supply
—
—
19
G3
XD[8]
I/O
External data bus
—
—
20
G1
XD[9]
I/O
External data bus
—
—
21
H3
XD[10]
22
H4
VDD_CORE
23
H2
NC
—
NC
—
—
24
J2
XD[11]
I/O
External data bus
—
—
25
H1
XD[12]
I/O
External data bus
—
—
26
J4
VDD_IO
VDD
I/O power supply
—
—
27
K2
XD[13]
I/O
External data bus
—
—
28
J1
XD[14]
I/O
External data bus
—
—
29
J3
XD[15]
I/O
External data bus
—
—
30
K3
XA[0]
O
External address output
—
—
31
K1
XA[1]
O
External address output
—
—
32
L2
XA[2]
O
External address output
—
—
33
K4
XA[3]
O
External address output
—
—
34
L1
GND
GND
GND
—
—
35
M2
XA[4]
O
External address output
—
—
36
M1
XA[5]
O
External address output
—
—
37
N1
XA[6]
O
External address output
—
—
38
N2
XA[7]
O
External address output
—
—
39
L3
XA[8]
O
External address output
—
—
40
N3
XA[9]
O
External address output
—
—
I/O
VDD
Description
External data bus
—
—
CORE power supply
—
—
SIO receive signal
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FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
Pin
LQFP
Primary Function
BGA
Symbol
Description
I/O
VDD
Secondary Function
Symbol
41
L4
VDD_IO
I/O power supply
—
—
42
M3
XA[10]
O
External address output
—
—
43
N4
XA[11]
O
External address output
—
—
44
L5
XA[12]
O
External address output
—
—
45
M4
XA[13]
O
External address output
—
—
46
N5
XA[14]
47
K5
GND
48
M5
XA[15]
O
GND
O
External address output
—
—
GND
—
—
External address output
—
—
49
N6
XA[16]
O
External address output
—
—
50
M6
XA[17]
O
External address output
—
—
51
K6
GND
GND
—
—
GND
Description
I/O
52
L6
XA[18]
O
External address output
—
—
53
M7
PIOC[2]
I/O
General port (with interrupt function)
XA[19]
O
54
K7
VDD_IO
VDD
I/O power supply
—
—
55
L7
PIOC[3]
I/O
General port (with interrupt function)
XA[20]
O
External address output
56
N7
PIOC[4]
I/O
General port (with interrupt function)
XA[21]
O
External address output
External address output
57
L8
PIOC[5]
58
K8
VDD_CORE
59
M8
PIOC[6]
60
M9
61
I/O
External address output
General port (with interrupt function)
XA[22]
O
CORE power supply
—
—
I/O
General port (with interrupt function)
XA[23]
O
External address output
PIOC[7]
I/O
General port (with interrupt function)
XWR
O
Transfer direction of
external bus
N8
XOE_N
O
Output enable (excluding SDRAM)
—
—
62
K9
VDD_IO
VDD
I/O power supply
—
—
63
M10
XWE_N
O
Write enable
—
—
64
N9
XBWE_N[0]
O
Byte write enable (LSB)
—
—
65
L9
XBWE_N[1]
O
Byte write enable (MSB)
—
—
66
L10
XROMCS_N
O
External ROM chip select
—
—
67
N10
XRAMCS_N
O
External RAM chip select
—
—
68
M11
XIOCS_N[0]
69
K10
GND
70
N11
XIOCS_N[1]
71
M12
72
N12
73
N13
VDD
O
IO chip select 0
—
—
GND
—
—
O
IO chip select 1
—
—
XIOCS_N[2]
O
IO chip select 2
—
—
XIOCS_N[3]
O
IO chip select 3
—
—
PIOD[6]
I/O
General port (with interrupt function)
XDQM[1]/XCAS
O
GND
_N[1]
INPUT/OUTPUT
mask/CAS (MSB)
74
M13
PIOD[7]
I/O
General port (with interrupt function)
XDQM[0]/XCAS
_N[0]
O
INPUT/OUTPUT
mask/CAS (LSB)
75
L11
PIOB[0]
I/O
General port (with interrupt function)
DREQ[0]
I
DMA request signal (CH0)
76
L13
PIOB[1]
I/O
General port (with interrupt function)
DREQCLR[0]
O
DREQ Clear Signal
(CH0)
77
K11
VDD_IO
VDD
78
L12
PIOB[2]
I/O
I/O power supply
—
General port (with interrupt function)
DREQ[1]
—
I
DMA request signal
(CH1)
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ML674001/67Q4002/67Q4003
Pin
Primary Function
LQFP
BGA
79
K13
Symbol
PIOB[3]
I/O
Description
I/O
General port (with interrupt function)
Secondary Function
Symbol
DREQCLR[1]
Description
I/O
O
DREQ Clear Signal
(CH1)
80
J11
PIOB[4]
I/O
General port (with interrupt function)
TCOUT[0]
O
81
K12
PIOB[5]
I/O
General port (with interrupt function)
TCOUT[1]
O
DMAC Terminal Count
(CH0)
DMAC Terminal Count
(CH1)
82
J13
PIOC[0]
I/O
General port (with interrupt function)
PWMOUT[0]
O
PWM output (CH0)
83
J10
PIOC[1]
I/O
General port (with interrupt function)
PWMOUT[1]
O
PWM output (CH1)
84
J12
GND
GND
—
—
85
H13
XBS_N[0]
O
External bus byte select (LSB)
—
—
86
H12
XBS_N[1]
O
External bus byte select (MSB)
—
—
CORE power supply
—
—
General port (with interrupt function)
XWAIT
87
H10
VDD_CORE
88
H11
PIOD[0]
GND
VDD
I/O
I
Wait input signal for I/O
Banks
89
G12
PIOD[1]
I/O
90
G10
GND
GND
GND
—
—
91
G11
VDD_IO
VDD
I/O power supply
—
—
92
G13
PIOD[2]
I/O
General port (with interrupt function)
XRAS_N
O
Row address strobe
(SDRAM/EDO)
93
F11
PIOD[3]
I/O
General port (with interrupt function)
XSDCLK
O
Clock for SDRAM
94
F10
PIOD[4]
I/O
General port (with interrupt function)
XSDCS_N
O
Chip select for SDRAM
95
F12
PIOD[5]
I/O
General port (with interrupt function)
XSDCKE
O
Clock enable (SDRAM)
96
E12
BSEL[0]
I
Select boot device
—
—
97
F13
BSEL[1]
I
Select boot device
—
—
98
E10
PIOE[5]
I/O
General port (with interrupt function)
EXINT[0]
I
Interrupt input
99
D12
PIOE[6]
I/O
General port (with interrupt function)
EXINT[1]
I
Interrupt input
100
E13
PIOE[7]
I/O
General port (with interrupt function)
EXINT[2]
I
Interrupt input
101
E11
PIOE[8]
I/O
General port (with interrupt function)
EXINT[3]
I
Interrupt input
102
D11
PIOE[9]
I/O
General port (with interrupt function)
EFIQ_N
I
FIQ input
103
D13
PIOE[0]
I/O
General port (with interrupt function)
SCLK
104
C12
PIOE[1]
I/O
General port (with interrupt function)
SDI
I
SSIO Serial Data In
105
D10
PIOE[2]
I/O
General port (with interrupt function)
SDO
O
SSIO Serial Data Out
106
C13
TDI
I
JTAG data Input
—
—
107
B12
TDO
O
JTAG data out
—
—
I
General port (with interrupt function)
XCAS_N
O
I/O
108
B13
nTRST
JTAG reset
—
—
109
A13
NC
—
NC
—
—
110
A12
NC
—
NC
—
—
111
C11
CKO
O
Clock output
—
—
112
A11
JSEL
I
JTAG select
—
—
113
C10
TMS
I
JTAG mode select
—
—
114
B11
TCK
I
JTAG clock
—
—
115
A10
DRAME_N
I
DRAM enable
—
—
Column address strobe
(SDRAM)
SSIO clock
8/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
Pin
LQFP
Primary Function
BGA
Symbol
Description
I/O
116
C9
CKOE_N
117
B10
GND
GND
I
118
A9
OSC0
I
119
D9
OSC1_N
O
120
B9
VDD_IO
VDD
I
Secondary Function
Symbol
I/O
Clock out enable
—
—
GND
—
—
Oscillation input pin
—
—
Oscillation output pin
—
—
IO power supply
—
—
—
Description
121
A8
TEST
Test mode input
—
122
B8
PIOA[0]
I/O
General port (with interrupt function)
SIN
I
UART Serial Data In
123
D8
PIOA[1]
I/O
General port (with interrupt function)
SOUT
O
UART Serial Data Out
124
C8
AVDD
VDD
A/D CONVERTER power supply
—
—
125
B7
VREF
I
A/D CONVERTER Reference
—
—
voltage
126
D7
AIN[0]
I
A/D CONVERTER
analog input port
—
—
127
C7
AIN[1]
I
A/D CONVERTER
—
—
—
—
A/D CONVERTER
analog input port
—
—
NC
—
—
GND for A/D CONVERTER
—
—
—
analog input port
128
A7
AIN[2]
I
A/D CONVERTER
analog input port
129
C6
AIN[3]
I
130
D6
NC
131
B6
AGND
GND
132
B5
GND
GND
133
A6
PIOA[2]
I/O
134
D5
VDD_IO
VDD
—
GND
—
General port (with interrupt function)
CTS
IO power supply
—
I
UART Clear To Send
—
135
B4
PIOA[3]
I/O
General port (with interrupt function)
DSR
I
UART Set Ready
136
A5
PIOA[4]
I/O
General port (with interrupt function)
DCD
I
UART Carrier Detect
137
C5
VDD_CORE
CORE power supply
—
—
138
C4
PIOA[5]
I/O
General port (with interrupt function)
DTR
O
UART Data Terminal
Ready
139
A4
PIOA[6]
I/O
General port (with interrupt function)
RTS
O
UART Request To Send
I/O
General port (with interrupt function)
RI
I
UART Ring Indicator
GND
—
—
General port (with interrupt function)
SDA
I/O
140
B3
PIOA[7]
141
D4
GND
142
A3
PIOE[3]
VDD
GND
I/O
I2C Data In/Out
143
B2
PIOE[4]
I/O
General port (with interrupt function)
SCL
O
I2C Clock out
144
A2
PIOB[6]
I/O
General port (with interrupt function)
STXD
O
SIO send data output
9/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
PIN DESCRIPTION
Pin Name
Description
I/O
Primary/
Logic
Secondary
System
RESET_N
I
Reset input
BSEL[1:0]
I
Boot device select signal
BSEL[1]
BSEL[0]
—
Negative
—
Positive
—
—
—
—
Boot device
0
0
Internal Flash (External ROM for ML674001)
0
1
External ROM
1
*
Boot mode
The selected device is mapped to BANK0 (0x0000_0000 - 0x07FF_FFFF)
after reset.
OSC0
I
Crystal connection or external clock input.
Connect a crystal (16 MHz to 33 MHz), if used, to OSC0 and OSC1_N.
It is also possible to input a direct clock.
OSC1_N
O
Crystal connection.
When not using a crystal, leave this pin unconnected.
CKO
O
Clock out
—
—
CKOE_N
I
Clock out enable
—
Negative
TCK
I
Debugging pin. Normally connect to ground level.
—
—
TMS
I
Debugging pin. Normally drive at High level.
—
Positive
nTRST
I
Debugging pin. Normally connect to ground level.
—
Negative
TDI
I
Debugging pin. Normally drive at High level.
—
Positive
TDO
O
Debugging pin. Normally leave open.
—
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Primary
Positive
Debugging support.
General-purpose I/O ports
PIOA[7:0]
I/O
General-purpose port.
Not available for use as port pins when secondary functions are in use.
PIOB[7:0]
I/O
General-purpose port.
Not available for use as port pins when secondary functions are in use.
PIOC[7:0]
I/O
PIOD[7:0]
I/O
General-purpose port.
Not available for use as port pins when secondary functions are in use.
General-purpose port.
Not available for use as port pins when secondary functions are in use.
Note that enabling DRAM controller with DRAME_N inputs permanently
configures PIOD[7:0] for their secondary functions, making them
unavailable for use as port pins.
PIOE[9:0]
I/O
General-purpose port.
Not available for use as port pins when secondary functions are in use.
10/24
FEDL674001-01
OKI Semiconductor
Pin Name
ML674001/67Q4002/67Q4003
Description
I/O
Primary /
Secondary
Logic
External Bus
XA[23:19]
O
Address bus to external RAM, external ROM, external I/O banks, and
Secondary
Positive
—
Positive
—
Positive
external DRAM. After a reset, these pins are configured for their primary
function (PIOC[6:2]).
XA[18:0]
O
Address bus to external RAM, external ROM, external I/O banks, and
external DRAM.
XD[15:0]
I/O
Data bus to external RAM, external ROM, external I/O banks, and external
DRAM.
External bus control signals (ROM/SRAM/IO)
XROMCS_N
O
ROM bank chip select
—
Negative
XRAMCS_N
O
SRAM bank chip select
—
Negative
XIOCS_N[0]
O
IO chip select 0
—
Negative
XIOCS_N[1]
O
IO chip select 1
—
Negative
XIOCS_N[2]
O
IO chip select 2
—
Negative
XIOCS_N[3]
O
IO chip select 3
—
Negative
XOE_N
O
Output enable/ Read enable
—
Negative
XWE_N
O
Write enable
—
Negative
XBS_N[1:0]
O
Byte select: XBS_N[1] is for MSB, XBS_N[0] is for LSB
—
Negative
XBWE_N[0]
O
LSB Write enable
—
Negative
XBWE_N[1]
O
MSB Write enable
XWR
O
Data transfer direction for external bus, used when connecting to Motorola
I/O devices. This represent the secondary function of pin PIOC[7].
L: read , H: write.
XWAIT
I
—
Negative
Secondary
—
Secondary
Positive
Available for I/O bank 0/1.
External I/O bank 0/1, 2/3 WAIT signal.
This input permits access to devices slower than register settings.
External bus control signals (DRAM)
XRAS_N
O
Row address strobe. Used for both EDO DRAM and SDRAM
Secondary
Negative
XCAS_N
O
Column address strobe signal (SDRAM)
Secondary
Negative
XSDCLK
O
SDRAM clock (same frequency as internal HCLK)
Secondary
—
XSDCKE
O
Clock enable (SDRAM)
Secondary
—
XSDCS_N
O
Chip select (SDRAM)
Secondary
Negative
XDQM[1]/XCAS_N[1]
O
Connected to SDRAM: DQM (MSB)
Secondary
Connected to EDO DRAM: column address strobe signal (MSB)
XDQM[0]/XCAS_N[0]
O
Connected to SDRAM: DQM (LSB)
Connected to EDO DRAM: column address strobe signal (LSB)
Positive/
Negative
Secondary
Positive/
Negative
11/24
FEDL674001-01
OKI Semiconductor
Pin Name
ML674001/67Q4002/67Q4003
I/O
Primary /
Description
Secondary
Logic
DMA control signals
DREQ[0]
I
Ch 0 DMA request signal, used when DMA controller configured for
Secondary
Positive
Secondary
Positive
DREQ type
DREQCLR[0]
O
Ch 0 DREQ signal clear request. The DMA device responds to this
output by negating DREQ.
TCOUT[0]
O
Indicates to Ch 0 DMA device that last transfer has started.
Secondary
Positive
DREQ[1]
I
Ch 1 DMA request signal, used when DMA controller configured for
Secondary
Positive
Secondary
Positive
DREQ type
DREQCLR[1]
O
Ch 1 DREQ signal clear request. The DMA device responds to this
output by negating DREQ.
TCOUT[1]
O
Indicates to Ch 1 DMA device that last transfer has started
Secondary
Positive
SIN
I
SIO receive signal
Secondary
Positive
SOUT
O
SIO transmit signal
Secondary
Positive
CTS
I
Clear To Send.
Secondary
Negative
Secondary
Negative
Secondary
Negative
Secondary
Negative
Secondary
Negative
Secondary
Negative
UART
Indicates that modem or data set is ready to transfer data.
Bit 4 in
modem status register reflects this input.
DSR
I
Data Set Ready.
Indicates that modem or data set is ready to establish a
communications link with UART.
Bit 5 in modem status register reflects this input.
DCD
I
Data Carrier Detect.
Indicates that modem or data set has detected data carrier signal.
7 in modem status register reflects this input.
Bit
Data Carrier Detect
DTR
O
Data Terminal Ready.
Indicates that UART is ready to establish a communications link with
modem or data set.
output.
RTS
O
Bit 0 in modem control register controls this
Request To Send.
Indicates that UART is ready to transfer data to modem or data set. Bit
1 in modem control register controls this output.
RI
I
Ring Indicator.
Indicates that modem or data set has received
telephone ring indicator. Bit 6 in modem status register reflects this
input.
12/24
FEDL674001-01
OKI Semiconductor
Pin Name
ML674001/67Q4002/67Q4003
I/O
Description
Primary /
Secondary
Logic
SIO
STXD
O
SIO transmit signal
Secondary
Positive
SRXD
I
SIO receive signal
Secondary
Positive
I2C Data.
Secondary
Positive
Secondary
—
I2C
SDA
I/O
This pin operates as NMOS Open drain. Connect pull-up
resistor.
SCL
O
I2C Clock.
resistor.
This pin operates as NMOS Open drain. Connect pull-up
Synchronous SIO
SCLK
Serial clock
Secondary
—
SDI
I/O
I
Serial receive data
Secondary
Positive
SDO
O
Serial transmit data
Secondary
Positive
PWMOUT[0]
O
PWM output of CH0
Secondary
Positive
PWMOUT[1]
O
PWM output of CH1
Secondary
Positive
PWM signals
Analog-to-digital converter
AIN[0]
I
Ch0 analog input
—
—
AIN[1]
I
Ch1 analog input
—
—
AIN[2]
I
Ch2 analog input
—
—
AIN[3]
I
Ch3 analog input
—
—
VREF
I
Analog-to-digital converter convert reference voltage
—
—
AVDD
Analog-to-digital converter power supply
—
—
AGND
Analog-to-digital converter ground
—
—
External interrupt input signals.
Secondary
Positive /
Negative
External fast interrupt input signal.
Secondary
Negative
—
Negative
Interrupt signals
EXINT[3:0]
I
EFIQ_N
I
Interrupt controller connects this to CPU FIQ input.
MODE configuration
DRAME_N
I
DRAM enable mode
TEST
I
Test mode
—
Positive
FWR
I
Test mode
—
Positive
JSEL
I
JTAG select signal.
—
—
L: On-board debug, H: Boundary scan.
Power supplies
VDD_CORE
Core power supply
—
—
VDD_IO
I/O power supply
—
—
GND
GND for core and I/O
—
—
13/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
DESCRIPTION OF FUNCTIONS
CPU
CPU core:
Operating frequency:
Byte ordering:
Instructions:
General register bank:
Built-in barrel shifter:
Multiplier:
Built-in debug function:
ARM7TDMI
1 MHz to 33 MHz
Little endian
ARM instruction (32-bit length) and Thumb instruction (16-bit length) can be mixed.
31 × 32 bits
ALU and barrel shift operations can be executed by one instruction.
32 bits × 8 bits (Modified Booth’s Algorithm)
JTAG interface, break point register
Built-in Memory
FLASH ROM:
ML674001 : ROM-less version
ML67Q4002 : 256Kbytes (128K x 16 bits)
ML67Q4003 : 512Kbytes (256K x 16 bits)
Access timing of this FLASH memory is configured by the ROM bank control register
of the external memory controller.
RAM:
32KB (8K x 32bits)
Read access(8/16/32bit): 1 cycle,
Write access(32bit): 1 cycle,
Write aceess(8/16bit): 2 cycle,
Interrupt Controller
Fast interrupt request (FIQ) and interrupt request (IRQ) are employed as interrupt input signals. The interrupt
controller controls these interrupt signals going to ARM core.
(1) Interrupt sources
FIQ: 1 external source (external pin: EFIQ_N)
IRQ: total of 27 sources. 23 internal sources, and 4 external sources (external pins: EXINT[3:0])
(2) Interrupt priority level
Configurable, 8-level priority for each source
(3) External interrupt pin input
EXINT[3:0] can be set as Level or Edge sensing.
Configurable High or Low when Level sensing. Configurable Rise or Falling edge triggering when Edge
sensing.
EFIQ_N is set as Falling edge triggering.
Timers
7 channels of 16-bit reload timers are employed. Of these, 1 channel is used as system timer for OS.
The timers of other 6 channels are used in application software.
(1) System timer: 1 channel
16-bit auto reload timer: Used as system timer for OS. Interrupt request by timer overflow.
(2) Application timer: 6 channels
16-bit auto reload timer. Interrupt request by compare match.
One shot, interval
Clock can be independently set for each channel
14/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
WDT
Functions as an interval timer or a watch dog timer.
(1)
(2)
(3)
(4)
16-bit timer
Watch dog timer or interval timer mode can be selected
Interrupt or reset generation.
Maximum period: longer than 200 msec
PWM
This LSI contains two channels of PWM (Pulse Width Modulation) function which can change the duty cycle of
a waveform with a constant period. The PWM output resolution is 16 bits for each channel.
Serial Interface
This LSI contains four serial interface.
(1) UART without FIFO
: 1 channel
This is the serial port which performs data transmission, taking a synchronization per character.
Selection of various parameters, such as addition of data length, a stop bit, and a parity bit, is possible.
- Asynchronous full duplex operation
- Sampling Rate = Baud rate x 16sample
- Character Length
: 7, 8 bit
- Stop Bit Length
: 1, 2 bit
- Parity
: Even, Odd, none
- Error Detection
: Parity, Framing, Over run
- Loop Back Function
: ON/OFF, Parity, framing, Over run Compulsive addition
- Baud Rate Generation
: Exclusive baud rate generator built-in (8bit counter)
Independent from a bus clock
- Internal-Baud-Rate-Clock-Stop at the time of HALT Mode.
(2) UART with 16bytes FIFO
: 1channel
Features 16bytes FIFO in both send and receive. Uses the industry standard 16550A ACE
(Asynchronous Communication Element).
- Asynchronous full duplex operation
- Reporting function for all status
- 16 Byte Transmission and reception FIFO
- Transmission, reception, interrupt of line status Data set and Independent FIFO control.
- Modem control signals
: CTS, DCD, DSR, DTR, RI and RTS
- Data length
: 5, 6, 7, 8 bit
- Stop bit length
: 1, 1.5, 2 bit
- parity
: Even, Odd, none
- Error Detection
: Parity, Framing, Overrun
- Baud Rate Generation
: Exclusive baud rate generator built-in
(3) Synchronous serial interface
: 1channel
It is a clock synchronous 8bit serial port
- selectable 1/8, 1/16 or 1/32 of HCLK frequency.
- Choose LSB First or MSB First.
- Choose Master / Slave Mode
- Transceiver Interruption, Transceiver buffer empty interrupt
- Loopback Test Function
(4) I2C
: 1channel
Based on the I2C BUS specifications. Operates as a single master device.
- Communication mode
: Master transmitter /master receiver
- Transmission Speed
: 100kbps (Standard mode) / 400kbps (Fast mode)
- Addressing format
: 7 bit / 10 bit
- Data buffer
: 1 Byte(1step)
- Communication Voltage : 2.7V to 3.3V
15/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
GPIO
42-bits parallel port (four 8-bit ports and one 10-bit port).
(1)
(2)
(3)
(4)
(5)
PIOA[7:0]
Combination port UART
PIOB[7:0]
Combination port DMAC, UART(uPLAT-7B),
PIOC[7:0]
Combination port PWM, XA[23:19], XWR
PIOD[7:0]
Combination port DRAM contorol signal etc.
PIOE[9:0]
Combination port SSIO, I2C, External interrupt signal
Input/output selectable at bit level.
Each bit can be used as an interrupt source.
Interrupt mask and interrupt polarity can be set for all bits.
The ports are configured as input, immediately after reset.
Primary/secondary function of each port can be set independently.
AD Converter
Successive approximation type AD converter.
(1)
(2)
(3)
(4)
(5)
10 bits × 4 channels
Sample hold function
Scan mode and select mode are supported
Interrupt is generated after completion of conversion.
Conversion time: 5 µs minimum.
DMAC
Two channels of direct memory access controller which transfers data between memory and memory, between
I/O and memory and between I/O and I/O.
(1) Number of channels: 2 channels
(2) Channel priority level: Fixed mode
Channel priority level is always fixed (channel 0 > 1).
Roundrobin
Priority level of the channel requested for transfer is kept lowest.
(3) Maximum number of transfers: 65,536 times (64K times)
(4) Data transfer size: Byte (8 bits), half-word (16 bits), word (32 bits)
(5) Bus request system:
Cycle steal mode
Bus request signal is asserted for each DMA transfer cycle.
Burst mode
Bus request signal is asserted until all transfers of transfer cycles are complete.
(6) DMA transfer request: Software request
By setting the software transfer request bit inside DMAC, the CPU starts DMA
transfer.
External request
DMA transfer is started by external request allocated to each channel.
(7) Interrupt request: Interrupt request is generated to CPU after the end of DMA transfers for the set
number of transfer cycles or after occurrence of error.
Interrupt request signal is output separately for each channel.
Interrupt request signal output can be masked for each channel.
16/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
External memory controller
Controls access of externally connected devices such as ROM (FLASH), SRAM, SDRAM (EDO DRAM), IO
devices, and internal FLASH memory.
(1) ROM (FLASH) access function
: 1 bank
Supports 16-bit devices.
Supports FLASH memory: Byte write (can be written only by IF equivalent to SRAM).
In ML67Q4002/ML67Q4003, control internal FLASH access.
Configurable access timing.
(2) SRAM access function
: 1 bank
Supports 16-bit devices.
Supports asynchronous SRAM
Configurable access timing.
(3) DRAM access function
: 1 bank
Supports 16-bit device
Supports EDO/SDRAM
: Simultaneous connections to EDO-DRAM and SDRAM cannot be
made.
Configurable access timing.
(4) External IO access function
: 2 banks
Supports 8-bit/16-bit access
: Independent configuration for each bank
Each bank has two chip selects
: XIOCS_N[3:0]
Supports external wait input
: XWAIT
Access Timing configurable for each bank independently
Power Management
HALT, STANDBY, clock gear, clock control functions are supported as power save functions.
(1) HALT mode
HALT object
CPU, internal RAM, AHB bus control
HALT mode setting: Set by the system control register.
Exit HALT mode due to: Reset, interrupt
(2) STANDBY mode
Stops the clock of entire LSI.
STANDBY mode setting: Specified by the system control register.
Exit STANDBY mode due to: Reset, external interrupt (other than EFIQ_N)
(3) Clock gear
This LSI has two clock systems, HCLK and CCLK. Configure HCLK and CCLK frequency.
HCLK: CPU, bus control, synchronous serial interface, I2C.
CCLK: Timers, PWM, UART, AD converter, etc.
(4) Clock control by each function unit
AD converter, PWM, Timers, DRAMC, DMAC, UART(FIFO), UART, Synchronous SIO, I2C.
17/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
BUILT-IN FLASH ROM PROGRAMMING
The robust features of the flash permit simple and optimized programming as well as maintaining the flash-ROM.
(1) Programming Method
• Programming via JTAG interface
• Programming using boot mode
Boot mode of this LSI is used for downloading data to be written to the FLASH through the UART
interface of the MCU from a host system. In boot mode, the program on the on-chip boot ROM
downloads a flash writing application, that will handle the serial transfer and writing of internal flash, to
internal RAM area of the MCU through the UART interface of the MCU.
• Programming via user application running from external memory
Internal flash can be programmed by executing a user flash programming application from external
memory.
(2) Single power source for Read/Program of FLASH: 3.0V to 3.6V
(3) Programming units : 2 bytes
(4) Selectable erasing size
• Sector erase: 2Kbytes/sector
• Block erase: 64Kbytes/block
• Chip erase: All memory cell
(5) Word program time: 30usec
(6) Sector/block erase time: 25msec
(7) Chip erase time: 100msec
(8) Write protection
• Block protect: top address 8Kwords can be protected
• Chip protect: all words can be protected
(9) Number of commands: 9
(10) Highly reliable read/program
• Sector programming: 1000 times
• Data hold period: 10 years
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FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
ABSOLUTE MAXIMUM RATINGS*1
Item
Symbol
Conditions
Rating
Digital power supply
voltage (core)
VDD_CORE
–0.3 to +3.6
Digital power supply
voltage (I/O)
VDD_IO
–0.3 to +4.6
Input voltage
VI
–0.3 to VDD_IO+0.3
Output voltage
VO
–0.3 to VDD_IO+0.3
Analog power supply
voltage
AVDD
Analog reference voltage
Input current
*2
Output current
3
Ta = 25°C
–0.3 to VDD_IO+0.3
–0.3 to AVDD +0.3
VAI
–0.3 to VREF
II
–10 to +10
Power losses (LFBGA)
PD
Power losses (LQFP)
Storage temperature
TSTG
mA
–20 to +20
IO
*
V
–0.3 to VDD_IO+0.3 and
VREF
Analog input voltage
Output current
GND = AGND = 0 V
Unit
–30 to +30
Ta = 85°C
680
per package
1000
—
mW
°C
–50 to +150
Note
1. These are maximum ratings not for general operation. Exceeding these maximum ratings could
cause damage or lead to permanent deterioration of the device.
2. All output pins except XA[15:0]
3. XA[15:0]
OPERATING CONDITIONS
(GND = 0 V)
Item
Symbol
Digital power supply voltage
(core)
VDD_CORE
Digital power supply voltage
(I/O)
VDD_IO
Analog power supply
voltage
AVDD
Analog reference voltage
VREF
Conditions
Minimum
Typical
Maximum
Unit
2.25
2.5
2.75
3.0
3.3
3.6
AVDD = VDD_IO
3.0
3.3
3.6
VREF = AVDD = VDD_IO
3.0
3.3
3.6
1
—
33.333
MHz
–40
25
+85
°C
VDD_IO ≥ VDD_CORE
Operating frequency *
fOP
Ambient temperature
Ta
VDD_CORE = 2.25 to 2.75
VDD_IO = 3.0 to 3.6
—
V
Note
Operating frequencies between 16 MHz and 33 MHz. Minimum of 2.56 MHz for external SDRAM.
Minimum of 6.4 MHz for external EDO DRAM. Minimum of 2 MHz for analog-to-digital converter.
19/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD_CORE = 2.25 to 2.75V, VDD_IO = 3.0 to 3.6V, Ta = –40 to +85°C)
Minimum
Typical
Maximum
High level input voltage
Item
Symbol
VIH
Conditions
VDD_IOx0.8
—
VDD_IO+0.3
Low level input voltage
VIL
–0.3
—
VDD_IOx0.2
—
VT+
Schmitt input buffer
threshold voltage
VT−
VHYS
High level output voltage
VOH
Low level output voltage
—
1.6
2.1
0.7
1.1
—
0.4
0.5
—
IOH = –100 µA
VDD–0.2
—
—
IOH = –4 mA
2.35
—
—
IOL = 100 µA
—
—
0.2
IOL = 4 mA
—
—
0.45
IOL = 6 mA
—
—
0.45
IIH/IIL
VI = 0 V/VDD_IO
–50
—
50
Input leak current *4
IIL
VI = 0 V
Pull-up resistance of
50 kΩ
–200
–66
–10
5
II
VI = AVDD / 0 V
–5
—
5
Output leak current
ILO
VO = 0 V/VDD_IO
–50
—
50
Input pin capacitance
CI
—
—
6
—
Output pin capacitance
CO
—
—
9
—
I/O pin capacitance
CIO
1
Low level output voltage *
VOL
Low level output voltage *2
3
Input leak current *
Input leak current *
Analog reference power
supply current
IREF
Current consumption
(STANDBY)
IDDS_CORE
Current consumption
8
(HALT) *
IDDH_CORE
Current consumption (RUN)
*9
IDD_CORE
—
—
10
—
Analog-to-digital
converter operative *6
—
320
650
Analog-to-digital
converter stopped
—
1
2
—
20
100
—
5
20
—
20
40
IDDS_IO
IDDH_IO
IDD_IO
7
Ta = 25°C *
fOP = 33 MHz
CL = 30 pF
—
5
10
—
40
70
—
18
30
Unit
V
µA
pF
µA
mA
Notes
1. All output pins except XA[15:0]
2. XA[15:0]
3. All input pins except RESET_N
4.
5.
6.
7.
8.
9.
RESET_N pin, with 50 kΩ pull-up resistance
Analog input pins (AIN0 to AIN3)
Analog-Digital Converter operation ratio is 20%
VDD_IO or 0 V for input ports; no load for other pins
DRAM controller blocks stopped by DRAME_N pin setting
External ROM used
20/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
Analog-to-Digital Converter Characteristics
(VDD_CORE = 2.50 V, VDD_IO = 3.3 V, Ta = 25°C)
Item
Symbol
Conditions
n
—
—
—
10
Analog input
source impedance
—
±3
—
—
±3
—
—
±3
—
Resolution
Linearity error
EL
Differential linearity error
ED
Zero scale error
EZS
Full scale error
Conversion time
EFS
tCONV
Throughput
Ri ≤ 1kΩ
Minimum Typical Maximum
Unit
bit
LSB
—
±3
—
—
5
—
—
µs
—
10
—
200
kHz
Notes: VDD_IO and AVDD should be supplied separately
• Definition of Terms
(1) Resolution: Minimum input analog value recognized. For 10-bit resolution, this is (VREF –
Aground) ÷ 1024.
(2) Linearity error: Difference between the theoretical and actual conversion characteristics.
(Note that it does not include quantization error.) The theoretical conversion characteristic
divides the voltage range between VREF and AGND into 1024 equal steps.
(3) Differential linearity error: Difference between the theoretical and actual input voltage
change producing a 1-bit change in the digital output anywhere within the conversion range.
This is an indicator of conversion characteristic smoothness. The theoretical value is (VREF –
Aground) ÷ 1024.
(4) Zero scale error: Difference between the theoretical and actual conversion characteristics at
the point where the digital output switches from “0x000” to “0x001.”
(5) Full scale error: Difference between the theoretical and actual conversion characteristics at
the point where the digital output switches from “0x3FE” to “0x3FF.”
21/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
22/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
REVISION HISTORY
Document
No.
Date
Page
Previous Current
Edition
Edition
Description
PEDL674001-01
Jan.15, 2003
–
–
Preliminary edition 1
PEDL674001-02
Feb.17, 2003
3
3
Preliminary edition 2
Modified PIOB[4:5] assignment of bloc diagram
FEDL674001-01
Dec. 15, 2003
–
–
Final edition 1
23/24
FEDL674001-01
OKI Semiconductor
ML674001/67Q4002/67Q4003
NOTICE
1. The information contained herein can change without notice owing to product and/or technical
improvements. Before using the product, please make sure that the information being referred to is
up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product,
please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the
specified maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained
herein. No responsibility is assumed by us for any infringement of a third party’s right which may result
from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any
system or application where the failure of such system or application may result in the loss or damage of
property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices,
aerospace equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2003 Oki Electric Industry Co., Ltd.
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