OKI Semiconductor ML7074-001 GA FEDL7074-001DIGEST-01 Issue Date: Oct. 15, 2002 VoIP CODEC GENERAL DESCRIPTION The ML7074-001GA is a speech CODEC for VoIP. This LSI allows selection of G.729.A, G.726, or G.711 standard as a speech CODEC. The LSI is optimum for adding VoIP functions to TAs, routers, etc., since it has the functions of an echo canceller for 32 msec delay, DTMF detection, tone detection, tone generation, etc. FEATURES • Single 3.3 V power supply operation (DVDD0, 1, 2, AVDD: 3.0 to 3.6 V) • Speech CODEC: Selectable among G.729.A (8 kbps), G726 (32 kbps), G.711 (64 kbps) µ-law, and A-law Mutual conversion function between G.729.A (8 kbps) and G.726 (32 kbps). • Echo canceller for 32 ms delay • DTMF detect function • Tone detect function: 2 systems (1650 Hz, 2100 Hz: Detect frequency can be changed.) • Tone generate function • FSK generate function • Dial pulse detect function • Dial pulse transmit function • Internal 1-channel 16-bit timer • Built-in FIFO buffers (640 bytes) for transferring transmit and receive data Frame/DMA (slave) interface selectable. • Master clock frequency: 4.096 MHz (crystal oscillation or external input) • Hardware or software power down operation possible. • Analog input/output type: Two built-in input amplifiers, 10 kΩ driving Two built-in output amplifiers, 10 kΩ driving • Package: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) 1/31 CLKSEL BCLK SYNC Serial I/F P/S VREF PCMO AMP3 AMP2 S/P 10kΩ 10kΩ AMP1 10kΩ AMP0 PCMI AVREF VFRO1 VFRO0 AIN1N GSX1 AIN0P LPF BPF G.726 G.711 Encode r G.726 G.711 Decoder Codec D/A A/D Linear PCM Codec STGAIN Rout Sin OSC PLL XI 10kΩ XO LPAD ATTs CKGN ATTr AFF + GPAD MCK SYNC(8kHz) Center Clip Echo Canceller TXGAIN Power FSK_GEN Rin TONE_GEN (TONEA/B) Sout RXGAIN DPDET DPGEN TIMER DP_DET DTMF_DET DTMF_CODE[3:0] TONE0_DET TONE1_DET DP_DET CR16-B0(GPI0) CR17-B0(GPO0) G.729.A G.711 G.726 Decoder G.729.A G.729.A G.711 G.726 Encoder G.729.A INT Control Register Frame/DMA Controller RX Buffer1 RX Buffer0 TX Buffer1 TX Buffer0 Bus Control Unit DTMF_DET DTMF_CODE[3:0] DTMF_REC Speech Codec TONE1_DET TONE_DET1 TST0 TST1 TST2 TST3 GSX0 DVDD1 DVDD0 DGND0 DGND1 DVDD2 DGND2 AGND AVDD TONE0_DET GPI0 GPI1 GPO0 GPO1 AIN0N PDNB TONE_DET0 16b 8b INTB D0-D15 CSB RDB WRB FR0B FR1B ACK0B ACK1B A0-A7 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA BLOCK DIAGRAM 2/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA 33 DVDD1 34 A0 35 A1 36 A2 37 A3 38 A4 39 A5 40 A6 41 A7 42 PDNB 43 CLKSEL 44 DGND1 45 GPI0 46 GPI1 47 GPO0 48 GPO1 PIN ASSIGNMENT (TOP VIEW) AVDD 49 32 D15 AIN0P 50 31 D14 AIN0N 51 30 D13 GSX0 52 29 D12 GSX1 53 28 D11 AIN1N 54 27 D10 AVREF 55 26 D9 VFRO0 56 25 D8 ML7074-001 VFRO1 57 24 D7 DGND0 16 WRB 15 RDB 14 CSB 13 INTB 12 9 ACK1B FR1B 11 8 ACK0B FR0B 10 7 17 D0 DVDD0 TST2 64 6 18 D1 SYNC TST3 63 5 19 D2 BCLK DVDD2 62 4 20 D3 PCMI XO 61 3 21 D4 PCMO XI 60 2 22 D5 TST0 DGND2 59 1 23 D6 TST1 AGND 58 64-pin plastic QFP 3/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PIN DESCRIPTIONS Pin No. 1 2 3 4 Symbol I/O PDNB = “0” TST1 TST0 PCMO PCMI I I O I BCLK I/O “0” “0” “Hi-z” I I 5 “L” I 6 SYNC I/O “L” 7 8 9 DVDD0 ACK0B ACK1B I I I I 10 FR0B (DMARQ0B) O ”H” 11 FR1B (DMARQ1B) O “H” 12 INTB O “H” 13 14 15 16 17 18 19 20 21 22 23 24 CSB RDB WRB DGND0 D0 D1 D2 D3 D4 D5 D6 D7 I I I I/O I/O I/O I/O I/O I/O I/O I/O I I I I I I I I I I I I 25 D8 I/O I Description Test control input 1: Normally input “0”. Test control input 0: Normally input “0”. PCM data output PCM data input CLKSEL = ”0” PCM shift clock input CLKSEL = ”1” PCM shift clock output CLKSEL = ”0” PCM sync signal 8 kHz input CLKSEL = ”1” PCM sync signal 8 kHz output Digital power supply Transmit buffer DMA access acknowledge signal input Receive buffer DMA access acknowledge signal input FR0B: (CR11-B7 = ”0”) Transmit buffer frame signal output DMARQ0B: (CR11-B7 = ”1”) Transmit buffer DMA access request signal output FR1B: (CR11-B7 = ”0”) Receive buffer frame signal output DMARQ1B: (CR11-B7 = ”1”) Receive buffer DMA access request signal output Interrupt request output “L” level is output for about 1.0 µsec when an interrupt is generated. Chip select control input Read control input Write control input Digital ground (0.0 V) Data input/output Data input/output Data input/output Data input/output Data input/output Data input/output Data input/output Data input/output Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). 4/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA 26 D9 I/O I 27 D10 I/O I 28 D11 I/O I 29 D12 I/O I 30 D13 I/O I 31 D14 I/O I 32 D15 I/O I 33 34 35 36 37 38 39 40 41 DVDD1 A0 A1 A2 A3 A4 A5 A6 A7 I I I I I I I I I I I I I I I I 42 PDNB I “0” 43 CLKSEL I I 44 DGND1 45 GPI0 I I 46 GPI1 I I 47 GPO0 O “L” 48 GPO1 O “L” 49 50 51 52 53 54 55 AVDD AIN0P AIN0N GSX0 GSX1 AIN1N AVREF I I O O I O I I “Hi-z” “Hi-z” I “L” Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Data input/output Fix to input state when using in 8-bit bus access (CR11-B5 = “1”). Digital power supply Address input Address input Address input Address input Address input Address input Address input Address input Power down input “0”: Power down reset “1”: Normal operation SYNC and BCLK I/O control input “0”: SYNC and BCLK become inputs “1”: SYNC and BCLK become outputs Digital ground (0.0 V) General-purpose input pin 0 (5 V tolerant input) /Secondary function: Dial pulse detect input pin General-purpose input pin 1 (5 V tolerant input) General-purpose output pin 0 (5 V tolerant output, can be pulled up externally) /Secondary function: Dial pulse transmit pin General-purpose output pin 1 (5 V tolerant output, can be pulled up externally) Analog power supply AMP0 non-inverted input AMP0 inverted input AMP0 output (10 kΩ driving) AMP1 output (10 kΩ driving) AMP1 inverted input Analog signal ground (1.4 V) 5/31 FEDL7074-001DIGEST-01 OKI Semiconductor 56 57 58 59 60 61 62 63 64 VFRO0 VFRO1 AGND DGND2 XI XO DVDD2 TST3 TST2 ML7074-001 GA O O I O I I “Hi-z” “Hi-z” I “H” “0” “0” AMP2 Output (10 kΩ driving) AMP3 Output (10 kΩ driving) Analog ground (0.0 V) Digital ground (0.0 V) 4.096 MHz crystal oscillator I/F, 4.096 MHz clock input 4.096 MHz crystal oscillator I/F Digital power supply Test control input 3: Normally input “0”. Test control input 2: Normally input “0”. 6/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA ABSOLUTE MAXIMUM RATINGS Parameter Analog power supply voltage Digital power supply voltage Analog input voltage Digital input voltage Storage temperature range Symbol Conditions Rating Unit VDA −0.3 to 5.0 V VDD VAIN VDIN1 VDIN2 Tstg Analog pins Normal digital pins 5 V tolerant pins −0.3 to 5.0 −0.3 to VDD + 0.3 −0.3 to VDD + 0.3 −0.3 to 6.0 −55 to +150 V V V V °C RECOMMENDED OPERATING CONDITIONS (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Analog power supply voltage VDA 3.0 3.3 3.6 Digital power supply voltage VDD 3.0 3.3 3.6 Operating temperature range Ta 60 −20 VDD+ VIH1 Digital input pins 2.0 0.3 Digital high level input voltage VIH2 GPI0 and GPI1 pins 2.0 5.5 Digital low level input voltage VIL Digital pins 0.8 −0.3 Digital input rise time tIR Digital pins 2 20 Digital input fall time tIF Digital pins 2 20 Digital output load capacitance CDL Digital pins 50 Capacitance of bypass capacitor Cvref Between AVREF and AGND 2.2+0.1 4.7+0.1 for AVREF Master clock frequency Fmck MCK −0.01% 4.096 +0.01% PCM shift clock frequency Fbclk BCLK (at input) 64 2048 PCM sync signal frequency Fsync SYNC (at input) 8.0 Clock duty ratio DRCLK MCK, BCLK (at input) 40 50 60 BCLK to SYNC tBS 100 (at input) PCM sync timing SYNC to BCLK tSB 100 (at input) PCM sync signal width tWS SYNC (at input) 1BCLK 100 Unit V V °C V V V ns ns pF µF MHz kHz kHz % ns ns µs 7/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA ELECTRICAL CHARACTERISTICS DC Characteristics (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Standby state ISS 5.0 20.0 (PDNB = ”0”, VDD = 3.3 V, Ta = 25°C) Operating state 1 In the PCM/IF mode (SC_EN = “1”, PCMIF_EN = “1”, IDD1 45.0 55.0 AFE_EN = “1”, TRANS_EN = “1”) Connect a 4.096 MHz crystal oscillator Power supply current between XI and XO. Operating state 2 When operating the whole system (SC_EN = “1”, PCMIF_EN = “0”, IDD2 50.0 65.0 TRANS_EN = “0”, AFE_EN = “0”) Connect a 4.096 MHz crystal oscillator between XI and XO. Digital input pin IIH Vin = DVDD 0.01 1.0 input leakage current IIL Vin = DGND −1.0 −0.01 Digital I/O pin IOZH Vout = DVDD 0.01 1.0 output leakage current IOZL Vout = DGND −1.0 −0.01 Digital output pins, I/O pins High level output IOH = 4.0 mA VOH 2.2 voltage IOH = 1.0 mA (XO pin) Digital output pins, I/O pins Low level output VOL IOL = −4.0 mA 0.4 voltage IOL = −1.0 mA (XO pin) Input capacitance *1 CIN Input pins 8 12 Unit µA mA mA µA µA µA µA V V pF Note: *1 Guaranteed design value 8/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA Analog Interface (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Input resistance *1 RIN AIN0N, AIN0P, AIN1N 10 MΩ Output load resistance RL GSX0, GSX1, VFRO0, VFRO1 10 kΩ Output load capacitance CL Analog output pins 50 pF Offset voltage VOF VFRO0, VFRO1 40 mV −40 GSX0, GSX1, VFRO0, VFRO1 Output voltage level *2 VO 1.3 Vpp RL = 10 kΩ Notes: *1 Guaranteed design value *2 −7.7 dBm (600Ω) = 0 dBm0, +3.17 dBm0 = 1.3 Vpp 9/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA AC Characteristics CODEC (Speech CODEC in G.711 (µ-law) Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Conditions Parameter Symbol Min. Typ. Max. Unit Frequency (Hz) Level (dBm0) 0 to 60 25 dB LT1 300 to 3000 0.20 dB LT2 −0.15 1020 Reference value LT3 Transmit frequency 0 characteristics 3300 0.80 dB LT4 −0.15 3400 0 0.80 dB LT5 3968.75 13 dB LT6 0 to 3000 0.20 dB LR2 −0.15 1020 Reference value LR3 Receive frequency 3300 0.80 dB 0 LR4 −0.15 characteristics 3400 0 0.80 dB LR5 3968.75 13 dB LR6 3 35 dBp SDT1 0 35 dBp SDT2 Transmit signal to noise 35 dBp 1020 SDT3 −30 ratio [*1] 28 dBp SDT4 −40 23 dBp SDT5 −45 3 35 dBp SDR1 0 35 dBp SDR2 Receive signal to noise 35 dBp 1020 SDR3 −30 ratio [*1] 28 dBp SDR4 −40 23 dBp SDR5 −45 3 0.2 dB GTT1 −0.2 Reference value GTT2 −10 Transmit inter-level 0.2 dB 1020 GTT3 −40 −0.2 loss error 0.6 dB GTT4 −50 −0.6 1.2 dB GTT5 −55 −1.2 3 0.2 dB GTR1 −0.2 Reference value GTR2 −10 Receive inter-level loss 0.2 dB 1020 GTR3 −40 −0.2 error 0.6 dB GTR4 −50 −0.6 1.2 dB GTR5 −55 −1.2 Analog input = NIDLT dBm0p −68 Idle channel noise AVREF [*1] PCMI = ”1” dBm0p NIDLR −72 Transmit absolute level AVT 1020 0 0.285 0.320 0.359 Vrms [*2] Receive absolute level AVR 1020 0 0.285 0.320 0.359 Vrms [*2] Noise frequency 30 dB PSRRT Power supply noise range: 0 to 50 kHz reject ratio PSRRR 30 dB Noise level: 50mVpp Notes: *1 Using P-message filter *2 0.320 Vrms = 0 dBm0 = −7.7 dBm (600Ω) 10/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA Gain Setting (Speech CODEC in G.711 (µ-law) Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Transmit and receive GAC 1.0 dB −1.0 gain setting accuracy Tone Output (Speech CODEC in G.711 (µ-law) Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Frequency deviation Relative to set frequency 1.5 % fDFT −1.5 Output level Relative to set gain 2.0 dB oLEV −2.0 DTMF Detector, Other Detectors (Speech CODEC in G.711 (µ-law) Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Detect level accuracy dLAC Relative to set detect level 2.5 dB −2.5 Echo Canceller (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit In the analog I/F mode 35 In the PCM I/F (16-bit linear) mode Echo attenuation eRES dB In the PCM I/F (G.711) mode 30 Erasable echo delay time tECT 32 ms Measurement method Echo Canceller ATT Sin Sout Rout Rin Level Meter E.R.L (echo return loss) Delay Echo delay time LPF 5 kHz White noise generator 11/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PDNB, XO, AVREF Timings (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Power down signal pulse tPDNB PDNB pin 1 µs width Oscillation start-up time txtal 100 ms 2+α AVREF = 1.4 (90%) AVREF rise time tAVREF 600 ms C5 = 4.7 µF, C6 = 0.1 µF (See Fig. 9.) Initialization mode start-up tINIT 1 s time * α is a value that depends on the oscillation stabilizing time when using a crystal oscillator. VDD DVDD, AVDD 0V VDD PDNB 0V tPDNB VDD XO 0V txtal About 1.4 V AVREF 0V tAVREF CR5-B7 (READY) "1" Initialization mode "0" tINIT Fig. 1 PDNB, XO, and AVREF timings 12/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PCM I/F Mode (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Bit clock frequency fBCLK CDL = 20pF(at output) 64 +0.1% kHz −0.1% Bit clock duty ratio dBCLK CDL = 20pF(at output) 45 50 55 % CDL = 20pF(at output) 8 +0.1% kHz Sync signal frequency fSYNC −0.1% CDL = 20pF(at output) dSYNC1 12.4 12.5 12.6 % At 64 kHz output Sync signal duty ratio CDL = 20pF(at output) dSYNC2 6.24 6.25 6.26 % At 128 kHz output BCLK to SYNC tBS 100 ns Transmit/receive signal sync (at output) timing SYNC to BCLK tSB 100 ns (at output) Input setup time tDS 100 — ns Input hold time tDH 100 — ns tSDX 100 ns Digital output delay time PCMO pin tXD1 100 ns Pull-up, pull-down resistors tXD2 100 ns RDL = 1 kΩ, CDL = 50 pF Digital output hold time tXD3 100 ns BCLK 0 1 tBS 2 3 4 5 6 7 8 - 16 tSB tWS SYNC tDS tDH MSB PCMI LSB LSB LSB G.726 G.711 16-bit linear Fig. 2 PCM I/F mode input timing (long frame) BCLK 0 1 tBS 2 3 4 5 6 7 8 9 - 17 tSB tWS SYNC tDS PCMI tDH MSB LSB LSB LSB G.726 G.711 16-bit linear Fig. 3 PCM I/F mode input timing (short frame) 13/31 FEDL7074-001DIGEST-01 OKI Semiconductor BCLK 0 ML7074-001 GA 1 tBS 2 3 4 5 6 7 8 9 - 17 tSB tWS SYNC tSDX PCMO tXD2 tXD1 Hi-z MSB tXD3 LSB G.726 tXD3 LSB LSB G.711 16-bit linear Fig. 4 PCM I/F mode output timing (long frame) BCLK 0 1 tBS 2 3 4 5 6 7 8 9 10 - 18 tSB tWS SYNC tXD1 tXD2 tXD3 tXD3 Hi-z PCMO MSB LSB LSB LSB G.726 G.711 16-bit linear Fig. 5 PCM I/F mode output timing (short frame) 14/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA Control Register Interface (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit Address setup time tAS 10 ns Address hold time tAH 10 ns Write data setup time tWDS 10 ns Write data hold time tWDH 10 ns CSB setup time tCS 10 ns CSB hold time tCH 10 ns CL = 50 pF WRB pulse width tWW 10 ns Read data output delay time tRDD 20 ns Read data output hold time tRDH 3 ns RDB pulse width tRW 25 ns CSB disable time tCD 10 ns A7-A0 Input A2 A1 tAS tAH D7-D0 I/O tAS tAH D1 Input D2 Output tWDS tWDH tCS tCH tRDD tRDH CSB Input tCD tCS tCH WRB Input tRW tWW RDB Input Write timing Read timing Fig. 6 Control register interface 15/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA Transmit and Receive Buffer Interface (in Frame Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit FR1B setup time tF1S 3 ns FR1B output delay time tF1D 20 ns Address setup time tAS 10 ns Address hold time tAH 10 ns Write data setup time tWDS 10 ns Write data hold time tWDH 10 ns CSB setup time tCS 10 ns CSB hold time tCH 10 ns CL = 50 pF WRB pulse width tWW 10 ns FR0B setup time tF0S 3 ns FR0B output delay time tF0D 20 ns Read data output delay time tRDD 30 ns Read data output hold time tRDH 3 ns RDB pulse width tRW 35 ns CSB disable time tCD 10 ns FR0B Output tF0S tF0D FR1B Output tF1S tF1D A7-A0 Input A2 A1 tAS tAH tAS tAH D2 Output D1 Input D15-D0 I/O tWDS tWDH tCS tCH tRDD tRDH CSB Input WRB Input tCD tCS tCH tWW tRW Write timing Read timing RDB Input Fig. 7 Transmit and receive buffer interface (in frame mode) 16/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA Transmit and Receive Buffer Interface (in DMA Mode) (Unless otherwise specified, AVDD = 3.0 to 3.6 V, DVDD0, 1, 2 = 3.0 to 3.6 V, AGND = DGND0, 1, 2 = 0.0 V, Ta = −20 to +60°C) Parameter Symbol Conditions Min. Typ. Max. Unit DMARQ1B setup time tDR1S 3 ns tDR1RD 25 ns DMARQ1B output delay time tDR1FD 25 ns Address setup time tAS 10 ns Address hold time tAH 10 ns Write data setup time tWDS 10 ns Write data hold time tWDH 10 ns ACK setup time tAKS 10 ns ACK hold time tAKH 10 ns CL = 50 pF WRB pulse width tWW 10 ns DMARQ0B setup time tDR0S 3 ns tDR0RD 20 ns DMARQ0B output delay time tDR0FD 25 ns Read data output delay time tRDD 30 ns Read data output hold time tRDH 3 ns RDB pulse width tRW 35 ns ACKB disable time tAD 10 ns DMARQ0B Output tDR0S tDR0FD tDR0RD DMARQ1B Output tDR1S tDR1FD tDR1RD A7-A0 Input A2 A1 tAS D15-D0 I/O tAH tAS tAH D1 Input tWDS D2 Output tWDH tRDD tRDH ACK0B Input tAKS tAKH ACK1B Input WRB Input tAKS tAKH tWW tAD tRW RDB Input Write timing Read timing Fig. 8 Transmit and receive buffer interface (in DMA mode) 17/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PIN FUNCTION DESCRIPTIONS AIN0N, AIN0P, GSX0, AIN1N, GSX1 These are the analog transmit input and transmit level adjust pins. Each of AIN0N and AIN1N is connected to each of the inverting input pins of the built-in transmit amplifiers AMP0 and AMP1, and AIN0P is connected to the non-inverting input pin of AMP0. In addition, GSX0 and GSX1 are connected to the output pins of AMP0 and AMP1, respectively. The selection between AMP0 and AMP1 is made by CR10-B0. See Fig. 9 for the method of making level adjustment. During the power down mode (when PDNB = “0” or CR0-B7 = “1”), the outputs of GSX0 and GSX1 go to the high impedance state. If AMP0 is not used in the specific application of this LSI, short GSX0 with AIN0N and connect AIN0P with AVREF. When AMP1 is not used, short GSX1 with AIN1N. Notice: It is recommended to select the amplifier to be used before the conversation starts, since a small amount of noise will be generated if the amplifier selection is changed while conversation is in progress. VFRO0, VFRO1 These are analog receive output pins and are connected to the output pins of the built-in receive amplifiers AMP2 and AMP3, respectively. The output signals of VFRO0 and VFRO1 can be selected using CR10-B1 and CR10-B2, respectively. When selected (“1”), the received signal will be output, and when deselected (“0”), the AVREF signal (about 1.4 V) will be output. In the power down mode, these pins will be in the high impedance state. It is recommended to use these output signals via DC coupling capacitors. Notice: It is recommended to select the amplifier to be used before the conversation starts, since a small amount of noise is generated if the output selection is changed while the conversation is in progress. At the time of resetting or releasing from the reset state, it is recommended to select the AVREF as outputs of VFRO0 and VFRO1. GSX0 R2 C1 Gain = R2/R1 <= 63(+36dB) R1 : Variable R2 : Max 500k R1 10kΩ AIN0N AIN0P AMP0 CR10-B0 A/D GSX1 Gain = R4/R3 <=63(+36dB) R1 : Variable R2 : Max 500k R4 C2 R3 10κΩ AIN1N AMP1 Out : Max 1.3Vp-p C3 VFRO0 CR10-B1 10kΩ D/A AMP2 Out : Max 1.3Vp-p C4 VFRO1 10kΩ CR10-B2 AMP3 AVREF C5 + 2.2 to 4.7µF VREF C6 0.1µF Fig. 9 Analog interface 18/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA AVREF This is the output pin for the analog signal ground potential. The output potential at this pin will be about 1.4 V. Connect a 2.2 to 4.7 µF (aluminum electrolytic type) capacitor and a 0.1 µF (ceramic type) capacitor in parallel between this pin and the GND pin as bypass capacitors. The output at the AVREF pin goes to 0.0 V in the power down mode. The voltage starts rising after the power down mode is released (PDNB = “1” and also CR0-B7 = “0”). The rise time is about 0.6 sec. XI, XO These are the pins for either connecting the crystal oscillator for the master clock or for inputting an external master clock signal. The oscillations of the master clock oscillator will be stopped during a power down due to the PDNB signal or during a software power down due to CR0-B7 (SPDN). The oscillations start when the power down condition is released, and the internal clock supply of the LSI will be started after counting up the oscillation stabilization period (of about 16 ms). Examples of crystal oscillator connection and external master clock input are shown in Fig. 10. CR0-B7 (SPDN) To internal circuits PDNB XI XO R X'tal C1 C2 CR0-B7 (SPDN) To internal circuits PDNB XI XO Open 4.096 MHz X'tal(4.096 MHz) C1 C2 R Daishinku Co., Ltd. AT-49 5pF 10pF 1MΩ Fig. 10 Examples of oscillator circuit and clock input PDNB This is the power down control input pin. The power down mode is entered when this pin goes to “0”. In addition, this pin also has the function of resetting the LSI. In order to prevent wrong operation of the LSI, carry out the initial power-down reset after switching on the power using this PDNB pin. Also, keep the PDNB pin at “0” level for 1 µs or more to initiate the power down state. Further, it is possible to carry out a power down reset of the LSI when the power is being supplied by performing control of CR0-B7 (SPDN) in the sequence “0” → “1” → “0”. The READY signal (CR5-B7) goes to “1” about 1.0 second after the power down mode is released thereby entering the mode of setting various functions (initialization mode). See Fig. 1 for the timings of PDNB and AVREF, XO, and the initialization mode. Notice: At the time of switching on the power, start from the power down mode using PDNB. DVDD0, DVDD1, DVDD2, AVDD These are power supply pins. DVDD0, 1, 2 are the power supply pins for the digital circuits while AVDD is the power supply pin for the analog circuits of the LSI. Connect these pins together in the neighborhood of the LSI and connect as bypass capacitors a 10 µF electrolytic capacitor and a 0.1 µF ceramic capacitor in parallel between the DGND and AGND pins. DGND0, DGND1, DGND2, AGND These are ground pins. GDND0, 1, 2 are the ground pins for the digital circuits and AGND is the ground pin for the analog circuits of the LSI. Connect these pins together in the neighborhood of the LSI. 19/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA TST0, TST1, TST2, TST3 These are input pins for testing purposes only. Keep the inputs to these pins at the “0” level during normal use conditions. INTB This is the interrupt request output pin. An “L” level is output for a duration of about 1.0 µsec at this pin when there is a change in state of an interrupt cause. This output will be maintained at the “H” level when there is no change in state of any of the interrupt causes. The actual interrupt cause generating the interrupt can be verified by reading CR3 and CR4. The different interrupt causes are described below. • Underflow error (CR3-B0) An interrupt is generated when an internal read from the receive buffer occurs before the writing into the receive buffer from the MCU has been completed. An interrupt is generated when a normal writing is made in the receive buffer by the MCU and the underflow error is released. • Overrun error (CR3-B1) An interrupt is generated when an internal write of the next data into the transmit buffer occurs before the transmit buffer data read out from the MCU has been completed. An interrupt is generated when a normal read out is made from the transmit buffer by the MCU and the overrun error is released. • When a dial pulse is detected (CR4-B6). • When a DTMF signal is detected (CR4-B4). • When DTMF_CODEC0, 1, 2, 3 are detected (CR4-B0, B1, B2, B3). An interrupt is generated when a DTMF signal is detected. An interrupt is generated when there is a change from the DTMF signal detected state to the no-detected state. An interrupt is generated when there is a change in the detected code (CR4-B0, B1, B2, B3) in the condition in which a DTMF signal is being detected. • When TONE0 is detected (CR3-B3). An interrupt is generated when a 1650 Hz tone signal is detected. An interrupt is generated when there is a change to the non-detection condition in the tone signal detection condition. • When TONE1 is detected (CR3-B4). An interrupt is generated when a 2100 Hz tone signal is detected. An interrupt is generated when there is a change to the non-detection condition in the tone signal detection condition. • When FGEN_RQ is generated (CR3-B6). An interrupt is generated when the FSK generator makes a request for the next data to be transmitted. An interrupt is generated when there is a change from the condition in which the FSK generator is requesting for transmission data to the condition in which there is no request for internal fetch of the data to be transmitted next. • When DSP_ERR is detected (CR3-B7). An interrupt is generated when any error occurs in the DSP inside the LSI. 20/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA A0 to A7 These are the address input pins for use during an access of the frame, DMA, or control registers. The different addresses will be the following. Transmit buffer (TX Buffer) A7 to A0 = 10xxxxxxb (the lower 6 bits are not valid) Receive buffer (RX Buffer) A7 to A0 = 01xxxxxxb (the lower 6 bits are not valid) Control register (CR) A7 to A0 = 00xxxxxxb D0 to D15 These are the data input/output pins for use during an access of the frame, DMA, or control registers. Connect pull-up resistors to these pins since they are I/O pins. When the 8-bit bus access method is selected by CR11-B5, only D0 to D7 become valid. Since the higher 8 bits D8 to D15 will always be in the input state when the 8-bit bus access method is selected (CR11-B5 = “1”), tie them to “0” or “1” inputs. CSB This is the chip select input pin for use during a frame or control register access. RDB This is the read enable input pin for use during a frame, DMA, or control register access. WRB This is the write enable input pin for use during a frame, DMA, or control register access. 21/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA FR0B (DMARQ0B) • FR0B (In frame mode, CR11-B7 = “0”) This is the transmit frame output pin which outputs the signal when the transmit buffer is full during frame access. This pin outputs an “L” level when the transmit buffer becomes full, and maintains that “L” level output until a specific number of words are read out from the MCU. • DMARQ0B (In DMA mode, CR11-B7 = “1”) This is the DMA request output pin which outputs the signal when the transmit buffer is full during DMA access. This output becomes “L” when the transmit buffer becomes full, and returns to the “H” level automatically on the falling edge of the read enable signal (RDB = “1” → “0”) when there is an acknowledgement signal (ACK0B = “0”) from the MCU. This relationship is repeated until a specific number of words are read out from the MCU. FR1B (DMARQ1B) • FR1B (In frame mode, CR11-B7 = “0”) This is the receive frame output pin which outputs the signal when the receive buffer is empty during frame access. This pin outputs an “L” level when the receive buffer becomes empty, and maintains that “L” level output until a specific number of words are written from the MCU. • DMARQ1B (In DMA mode, CR11-B7 = “1”) This is the DMA request output pin which outputs the signal when the receive buffer is empty during DMA access. This output becomes “L” when the receive buffer becomes empty, and returns to the “H” level automatically on the falling edge of the write enable signal (WRB = “1” → “0”) when there is an acknowledgement signal (ACK1B = “0”) from the MCU. This relationship is repeated until a specific number of words are written from the MCU. ACK0B This is the DMA acknowledgement input pin for the DMARQ0B signal during DMA access of the transmit buffer and becomes valid in the DMA mode (CR11-B7 = “1”). Tie this pin to “1” when using this LSI in the frame access mode (CR11-B7 = “0”). ACK1B This is the DMA acknowledgement input pin for the DMARQ1B signal during DMA access of the receive buffer and becomes valid in the DMA mode (CR11-B7 = “1”). Tie this pin to “1” when using this LSI in the frame access mode (CR11-B7 = “0”). GPI0, GPI1 These are general-purpose input pins. The state (“1” or “0”) of each of these GPI0 and GPI1 pins can be read out respectively from CR16-B0 and CR16-B1. Further, GPI0 becomes the input pin for the dial pulse detector (DPDET) in the secondary functions. GPO0, GPO1 These are general-purpose output pins. The values set in CR17-B0 and CR17-B1 are output at these pins GPO0 and GPO1, respectively. Further, GPO0 becomes the output pin for the dial pulse generator (DPGEN) in the secondary functions. 22/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA CLKSEL This is the input/output control input pin of SYNC and BCLK. The pin becomes input at “0” level and output at “1” level. SYNC This is the 8 kHz sync signal input/output pin of PCM signals. When CLKSEL is “0”, input continuously an 8 kHz clock synchronous with BCLK. Further, when CLKSEL is “1”, this pin outputs an 8 kHz clock synchronous with BCLK. Long frame synchronization is used when CR0-B1 (LONG/SHORT) is “0” and short frame synchronization is used when it is “1”. BCLK This is the shift clock input/output pin for the PCM signal. When CLKSEL is “0”, it is necessary to input to this pin a clock signal that is synchronous with SYNC. Input a 64 to 2048 kHz clock when the G.711 mode or the G.726 mode has been selected, and input a 128 to 2048 kHz clock when the 16-bit linear mode has been selected. When CLKSEL is “1”, this pin outputs a clock that is synchronous with SYNC. This pin outputs a 64 kHz clock when the G.711 mode or the G.726 mode has been selected, and outputs an 128 kHz clock when the 16-bit linear mode or G.729.A mode has been selected. Note: The input/output control and frequencies of the above SYNC and BLCK signals will be as shown in Table 1 below. Table 1 Input/output control of SYNC and BCLK CLKSEL SYNC “0” Input (8 kHz) “1” Output (8 kHz) BCLK Remarks Input a continuous clock after starting the power supply. Input Input a 64 to 2048 kHz clock when G.711 or G.726 is (64 kHz to 2048 kHz) selected. Input a 128 to 2048 kHz clock when 16-bit linear mode is selected. An “L” level is output during the power down mode. A 64 kHz clock is output when G.711 or G.726 is Output selected. (64 kHz or 128 kHz) A 128 kHz clock is output when G.729.A or 16-bit linear mode is selected. PCMO This is the PCM signal output pin for the transmitting section. The PCM signal is output in synchronization with the rising edges of SYNC and BCLK. The PCMO outputs the data only during the valid data segment in the selected coding format and goes to the high impedance state during all other segments. The basic timing chart of the PCM I/F mode is shown in Fig. 11. The PCMO output will be in the high impedance state when the mutual conversion function is not used (CR11-B0 = “0”) or when the PCM I/F mode is not used (CR12-B0 = “0”). PCMI This is the PCM signal input pin for the receiving section. The data is entered starting from the MSB by shift on the falling edge of BCLK. The basic timing chart of the PCM I/F mode is shown in Fig. 11. Fix input with “0” or “1” when the mutual conversion function is not used (CR11-B0 = “0”) or when the PCM I/F mode (CR12-B0 = “0”) is not used. 23/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA 16-Bit linear Long frame synchronization mode (CR0-B1 = "0") SYNC (IN/OUT) Hi-z Hi-z : PCMO D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 PCMI : D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 BCLK (IN/OUT) 16-Bit linear Short frame synchronization mode (CR0-B1 = "1") SYNC (IN/OUT) Hi-z Hi-z : PCMO D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 PCMI : D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 BCLK (IN/OUT) G.711 (µ-law, A-law) Long frame synchronization mode (CR0-B1 = "0") SYNC (IN/OUT) PCMO Hi-z D7 D6 D5 D4 D3 D2 D1 D0 Hi-z D7 D6 D5 D4 D3 D2 D1 D0 PCMI D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 BCLK (IN/OUT) Hi-z G.711 (µ-law, A-law) Short frame synchronization mode (CR0-B1 = "1") SYNC (IN/OUT) PCMO Hi-z D7 D6 D5 D4 D3 D2 D1 D0 Hi-z D7 D6 D5 D4 D3 D2 D1 D0 PCMI D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 BCLK (IN/OUT) Hi-z G.726 (32 kbps) Long frame synchronization mode (CR0-B1 = "0") SYNC (IN/OUT) PCMO Hi-z D3 D2 D1 D0 Hi-z D3 D2 D1 D0 PCMI D3 D2 D1 D0 D3 D2 D1 D0 BCLK (IN/OUT) Hi-z G.726 (32 kbps) Short frame synchronization mode (CR0-B1 = "1") SYNC (IN/OUT) PCMO Hi-z D3 D2 D1 D0 Hi-z D3 D2 D1 D0 PCMI D3 D2 D1 D0 D3 D2 D1 D0 BCLK (IN/OUT) Hi-z Fig. 11 PCM I/F mode timing diagram 24/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA example of Configuration Analog I/F mode GSX0 TONE_DET0 TONE0_DET TONE_DET1 TONE1_DET DTMF_REC DTMF_DET DTMF_CODE[3:0] Speech Codec 10kΩ Linear PCM Codec AIN0N Echo Canceller AMP0 AIN0P A/D Bus Control Unit Encoder G.729.A TXGAIN BPF Sin GSX1 LPAD + - 10kΩ G.726 Sout ATTs Center Clip GPAD G.711 TX Buffer0 TX Buffer1 AIN1N G.729.A AMP1 TONE_GEN (TONEA/B) STGAIN AFF Decoder G.729.A 10kΩ D/A VFRO0 Rout LPF Rin ATTr RXGAIN G.726 AMP2 G.711 RX Buffer0 RX Buffer1 10kΩ VFRO1 8b G.729.A FSK_GEN A0-A7 AMP3 16b Codec AVREF VREF Frame/DMA Controller Decoder G.711 S/P TIMER G.726 CR17-B0(GPO0) DPGEN Encoder P/S PLL CKGN CR16-B0(GPI0) MCK SYNC(8kHz) DPDET G.726 SYNC OSC BCLK Power DP_DET DTMF_DET DTMF_CODE[3:0] TONE0_DET TONE1_DET DP_DET Control Register INT INTB TST0 TST1 TST2 TST3 PDNB Function stopped Cannot be used DVDD1 DVDD0 DGND0 DGND1 DVDD2 DGND2 AGND AVDD Serial I/F XI CLKSEL G.711 XO PCMO GPI0 GPI1 GPO0 GPO1 PCMI D0-D15 CSB RDB WRB FR0B FR1B ACK0B ACK1B Example of settings in the initialization mode ⋅ CR15 = 40 ⋅ CR11 = 00h (Frame/10 ms/16B/Speech CODEC = G.729.A) ⋅ Various settings ⋅ CR0 = 09h (OPE_STAT = “1”) 25/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PCM I/F Mode GSX0 TONE_DET0 TONE0_DET TONE_DET1 TONE1_DET DTMF_REC DTMF_DET DTMF_CODE[3:0] Speech Codec 10kΩ Linear PCM Codec AIN0N Echo Canceller AMP0 AIN0P A/D Bus Control Unit Encoder G.729.A TXGAIN BPF Sin GSX1 LPAD + - 10kΩ G.726 Sout ATTs Center Clip GPAD G.711 TX Buffer0 TX Buffer1 AIN1N G.729.A TONE_GEN (TONEA/B) STGAIN AMP1 AFF Decoder G.729.A 10kΩ D/A VFRO0 Rout LPF ATTr Rin RXGAIN G.726 AMP2 G.711 RX Buffer0 RX Buffer1 10kΩ VFRO1 8b G.729.A FSK_GEN A0-A7 AMP3 16b Codec AVREF VRE F Frame/DMA Controller Decoder G.711 S/P TIMER G.726 CR17-B0(GPO0) DPGEN Encoder P/S CKGN CR16-B0(GPI0) MCK SYNC(8kHz) DPDET G.726 SYNC OSC BCLK Power DP_DET DTMF_DET DTMF_CODE[3:0] TONE0_DET TONE1_DET DP_DET Control Register INT INTB TST0 TST1 TST2 TST3 PDNB Function stopped Cannot be used DVDD1 DVDD0 DGND0 DGND1 DVDD2 DGND2 AGND AVDD Serial I/F XI CLKSEL PLL XO PCMO G.711 GPI0 GPI1 GPO0 GPO1 PCMI D0-D15 CSB RDB WRB FR0B FR1B ACK0B ACK1B Examples of settings in the initialization mode ⋅ CR15 = 40 ⋅ CR10 = 00h (VFRO1 = AVREF/VFRO0 = AVREF) ⋅ CR11 = 00h (Frame/10 ms/16B/PCMIF = 16-bit linear) ⋅ CR12 = 01h (Speech CODEC = G.729.A/PCMIF_EN = “1”) ⋅ Various settings ⋅ CR0 = 29h (AFE_EN = Power down/LONG/OPE_STAT = “1”) 26/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA G.729.A ↔ G.726 Mutual Conversion GSX0 TONE_DET0 TONE0_DET TONE_DET1 TONE1_DET DTMF_REC DTMF_DET DTMF_CODE[3:0] Speech Codec 10kΩ Linear PCM Codec AIN0N Echo Canceller AMP0 AIN0P A/D Bus Control Unit Encoder G.729.A TXGAIN BPF Sin GSX1 LPAD + - 10kΩ G.726 Sout ATTs Center Clip GPAD G.711 TX Buffer0 TX Buffer1 AIN1N G.729.A AMP1 TONE_GEN (TONEA/B) STGAIN AFF Decoder G.729.A 10kΩ D/A VFRO0 Rout LPF ATTr Rin RXGAIN G.726 AMP2 G.711 RX Buffer0 RX Buffer1 10kΩ VFRO1 8b G.729.A FSK_GEN A0-A7 AMP3 16b Codec AVREF VREF Frame/DMA Controller Decoder G.711 S/P TIMER G.726 CR17-B0(GPO0) DPGEN Encoder P/S CKGN CR16-B0(GPI0) MCK SYNC(8kHz) DPDET G.726 SYNC OSC BCLK Power DP_DET DTMF_DET DTMF_CODE[3:0] TONE0_DET TONE1_DET DP_DET Control Register INT INTB TST0 TST1 TST2 TST3 PDNB Function stopped Cannot be used DVDD1 DVDD0 DGND0 DGND1 DVDD2 DGND2 AGND AVDD Serial I/F XI CLKSEL PLL XO PCMO G.711 GPI0 GPI1 GPO0 GPO1 PCMI D0-D15 CSB RDB WRB FR0B FR1B ACK0B ACK1B Examples of settings in the initialization mode ⋅ CR15 = 40 ⋅ CR11 = 05h (Frame/10 ms/16B/G.726/TRANS_EN= “1”) ⋅ CR10 = 00h (VFRO1 = AVREF/VFRO0 = AVREF) ⋅ Various settings ⋅ CR0 = 29h (AFE_EN = Power down/LONG/OPE_STAT = “1”) 27/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA EXAMPLE OF APPLICATION CIRCUIT 1.4V 50 51 52 Analog input 53 54 55 56 Analog output 57 Generalpurpose input pins 45 46 47 48 Generalpurpose output pins AIN0N GSX0 GSX1 AIN1N AVREF VFRO0 VFRO1 GPI0 GPI1 GPO0 GPO1 +3.3V PCM I/F open open open Power down control 4.096 MHz crystal oscillator A7 A6 A5 A4 A3 A2 A1 A0 AIN0P ML7074-001 43 4 3 5 6 42 60 61 CLKSEL PCMI PCMO BCLK SYNC D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 41 40 39 38 37 36 35 34 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 MCU I/F +3.3V ACK0B ACK1B PDNB FR0B FR1B INTB XI XO CSB RDB WRB 8 9 10 11 12 13 14 15 +3.3V 7 33 62 49 16 44 59 58 DVDD0 DVDD1 DVDD2 AVDD DGND0 DGND1 DGND2 AGND TST3 TST2 TST1 TST0 63 64 1 2 Conditions: - When using analog interface - Frame mode - SYNC and BCLK are output (CLKSEL="1") 28/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA PACKAGE DIMENSIONS (Unit: mm) QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (J5µm) 0.87 TYP. 6/Feb. 23, 2001 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 29/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA REVISION HISTORY Document No. FEDL7074-001-01 Date Oct. 15, 2002 Page Previous Current Edition Edition – – Description Final edition 1 30/31 FEDL7074-001DIGEST-01 OKI Semiconductor ML7074-001 GA NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2002 Oki Electric Industry Co., Ltd. 31/31