FEDL7033-02 1Semiconductor ML7033 This version: Dec. 2001 Previous version: Jul. 2001 Dual-Channel Line Card CODEC GENERAL DESCRIPTION The ML7033 is a 2-channel PCM CODEC CMOS IC designed for Central Office (CO) and Customer Premise Equipment (CPE) environments. The ML7033 device contains 2-channel analog-to-digital (A/D) and digital-toanalog (D/A) converters with multiplexed PCM input and output. The ML7033 is designed for single-rail, low power applications. The high integration of the ML7033 reduces the number of external components and overall board size. The ML7033 is best suited for line card applications and provides an easy interface to subscriber line interface circuits (SLIC’s), in particular the Intersil RSLICTM series. FEATURES • • • • • • • • • • • • • • • • • • • • Seamlessly interfaces with Intersil RSLICTM series devices Single 5 volt power supply (4.75 V to 5.25 V) ∆-Σ ADC and DAC PCM format: µ-law/A-law (ITU-T G.711 compliant), 14-bit linear (2’s complement) Optional wideband filter for V.90 data modem applications Low power consumption - 2-channel operating mode: 115 mW (typical) 180 mW (max) - 1-channel operating mode: 80 mW (typical) 115 mW (max) - Power-down mode: 0.1 mW (typical) 0.25 mW (max); PDN pin = logic “0” Power-on reset Dual programmable tone generators (300 Hz to 3400 Hz; 10 Hz intervals; 0.1 dB intervals) - Call progress tone, DTMF tone Ringing tone generator (15 Hz to 50 Hz; 1Hz intervals; 0.1 dB intervals) Pulse metering tone generator (12 kHz, 16 kHz; gain level selectable) Call ID tone generator (ITU-T V.23, Bell 202) Analog and digital loop back test modes Time-slot assignment Serial MCU interface Master clock: 2.048 MHz/4.096 MHz selectable Serial PCM transmission data rate: 256 kbps to 4096 kbps Adjustable transmit/receive gain (1 dB intervals) Built-in reference voltage generator Differential or single-ended analog output selectable Package: 64-pin plastic QFP (QFP64-P-1414-0.80-BK) (Ordering Part number: ML7033GA) 1/51 CR7-B7 SG Gen. CR14-B7 RC LPF SLIC Control ∆-Σ DA CONV ∆-Σ DA CONV CR2 B0 ∆-Σ AD CONV ∆-Σ AD CONV LPF LPF CR2 B4 CR2 B6-B5 CR7 B6 CR12 B7-B4 CR5 B7-B4 MCU Control & Clock Gen. Expander Expander CR14 B4-B1 CH1TG2 Call-ID1 RingTone1 CH1TG1 TCONT RCONT Pulse Meter Gen.2 CH2TG2 CH2TG1 Call-ID2 RingTone2 Pulse Meter Gen.1 CR1 B7 CR11-B7 CR1 B1 CR16 B7-B1 CR7 B4-B1 CR1 B6 CR11-B3 CR1 B0 Compressor Compressor CR9 B7-B1 CR14 B6 CR14 B5 CR7 B5 CR12 B3-B0 CR5 B3-B0 CR2 B2-B1 BPF BPF BCLK PCMIN CR18 B7- B4, B0 RSYNC XSYNC PCMOSY PCMOUT 1Semiconductor VDDD VDDA AG DG SG SGC AOUT2P AOUT2N AOUT1P RC LPF ∆-Σ DA CONV RC LPF TOUT2 AOUT1N ∆-Σ DA CONV RC LPF RC LPF RC LPF CR18 B7, B6 CR18 B5, B4 TOUT1 AIN2N AIN2P GSX2 AIN1N AIN1P GSX1 FEDL7033-02 ML7033 BLOCK DIAGRAM PDN RESET MCK TEST CIDATA1 CIDATA2 DIO DEN EXCK INT F2_1 F1_1 F0_1 E0_1 SWC1 BSEL1 DET1 ALM1 F2_2 F1_2 F0_2 E0_2 SWC2 BSEL2 DET2 ALM2 2/51 FEDL7033-02 1Semiconductor ML7033 49 N.C 50 PDN 51 TEST 52 DG 53 BSEL1 54 ALM1 55 DET1 56 E0_1 57 F0_1 58 F1_1 59 F2_1 60 SWC1 61 VDDD 62 VDDA 63 AIN1P 64 N.C PIN CONFIGURATION (TOP VIEW) N.C 1 48 N.C AIN1N 2 47 RESET GSX1 3 46 RSYNC AOUT1P 4 45 XSYNC AOUT1N 5 44 PCMOUT TOUT1 6 43 PCMOSY AG 7 42 PCMIN SG 8 41 DG SGC 9 40 BCLK AG 10 39 MCK TOUT2 11 38 VDDD AOUT2N 12 37 DIO AOUT2P 13 36 DEN GSX2 14 35 EXCK AIN2N 15 34 INT N.C 16 N.C 32 CIDATA2 31 CIDATA1 30 DG 29 SWC2 28 F2_2 27 F1_2 26 F0_2 25 E0_2 24 DET2 23 ALM2 22 VDDD 20 BSEL2 21 VDDA 19 AIN2P 18 N.C 17 33 N.C 64-Pin Plastic QFP 3/51 FEDL7033-02 1Semiconductor ML7033 PIN DESCRIPTIONS Pin Symbol Type Description 1 N.C — 2 AIN1N I CH1 Transmit Op-amp Input Negative 3 GSX1 O CH1 Transmit Op-amp Output (Leave unconnected) 4 AOUT1P O CH1 Receive Output Positive 5 AOUT1N O CH1 Receive Output Negative 6 TOUT1 O CH1 Tone Output 7 AG — Analog Ground 8 SG O Signal Ground for External Circuit 9 SGC O Signal Ground for Internal Circuit 10 AG — Analog Ground 11 TOUT2 O CH2 Tone Output 12 AOUT2N O CH2 Receive Output Negative 13 AOUT2P O CH2 Receive Output Positive 14 GSX2 O CH2 Transmit Op-amp Output 15 AIN2N I 16 N.C — (Leave unconnected) 17 N.C — (Leave unconnected) 18 AIN2P I 19 VDDA — Power Supply for Internal Analog Circuit 20 VDDD — Power Supply for Internal Digital Circuit 21 BSEL2 O Output for SLIC2 Battery Select 22 ALM2 I Input from SLIC2 Thermal Shut Down Alarm Detector CH2 Transmit Op-amp Input Negative CH2 Transmit Op-amp Input Positive 23 DET2 I Input from SLIC2 Switch Hook, Ground Key or Ring Trip Detector 24 E0_2 O Output for SLIC2 Detector Mode Selection 25 F0_2 O Mode Control Output to SLIC2 F0 26 F1_2 O Mode Control Output to SLIC2 F1 27 F2_2 O Mode Control Output to SLIC2 F2 28 SWC2 O Output for SLIC2 Uncommitted Switch Control 29 DG — Digital Ground 30 CIDATA1 I 31 CIDATA2 I 32 N.C — (Leave unconnected) 33 N.C — (Leave unconnected) 34 INT O Interrupt Output (from SLIC status) 35 EXCK I MCU Interface Data Clock Input MCU Interface Data Enable Input 36 DEN I 37 DIO I/O Call ID Data Input for CH1 Call ID Data Input for CH2 MCU Interface Control Data Input/Output 4/51 FEDL7033-02 1Semiconductor Pin ML7033 Symbol Type Description 38 VDDD — 39 MCK I Master Clock (2.048/4.096 MHz) 40 BCLK I PCM Data Shift Clock 41 DG — 42 PCMIN I PCM Data Input 43 PCMOSY O PCM Data Output Indicator for Time-Slot Assignment 44 PCMOUT O PCM Data Output 45 XSYNC I Transmit Synchronizing Clock Input 46 RSYNC I Receive Synchronizing Clock Input 47 RESET I Reset for Control Register 48 N.C — (Leave unconnected) 49 N.C — (Leave unconnected) 50 PDN I Power-down Control 51 TEST I LSI Manufacturer’s Test Input (keep logic “0”) 52 DG — Digital Ground 53 BSEL1 O Output for SLIC1 Battery Select 54 ALM1 I Input from SLIC1 Thermal Shut Down Alarm Detector 55 DET1 I Input from SLIC1 Switch Hook, Ground Key or Ring Trip Detector 56 E0_1 O Output for SLIC1 Detector Mode Selection 57 F0_1 O Mode Control Output to SLIC1 F0 58 F1_1 O Mode Control Output to SLIC1 F1 59 F2_1 O Mode Control Output to SLIC1 F2 60 SWC1 O Output for SLIC1 Uncommitted Switch Control 61 VDDD — Power Supply for Internal Digital Circuit 62 VDDA — Power Supply for Internal Analog Circuit 63 AIN1P I Power Supply for Internal Digital Circuit Digital Ground CH1 Transmit Op-amp Input Positive 64 N.C — (Leave unconnected) Note: In this datasheet, “1” and “2” in names for pins which respectively exist for CH1 and CH2 are often substituted by “n” (in a small letter). Ex) GSX1, GSX2 AOUT1N, AOUT2N DET1, DET2 → GSXn → AOUTnN → DETn 5/51 FEDL7033-02 1Semiconductor ML7033 Control Register Assignment Register Address Data A4 A3 A2 A1 A0 B1 B0 R/W B7 B6 B5 B4 B3 B2 Filter1 SEL MCK SEL SHORT LIN ALAW MODE1 MODE0 R/W CID FMT CID CID R/W CH2ON CH1ON CR0 0 0 0 0 0 Filter2 SEL CR1 0 0 0 0 1 CH2TG CH1TG ON ON CR2 0 0 0 1 0 PMG2 FRQ PMG2 LV1 PMG2 LV0 PMG2 TOUT2 PMG1 FRQ PMG1 LV1 PMG1 LV0 CR3 0 0 0 1 1 TSAE TSAC TSA5 TSA4 TSA3 TSA2 TSA1 TSA0 W CR4 0 0 1 0 0 DET2 TIM3 DET2 TIM2 DET2 TIM1 DET2 TIM0 DET1 TIM3 DET1 TIM2 DET1 TIM1 DET1 TIM0 R/W CR5 0 0 1 0 1 LV1R3 LV1R2 LV1R1 LV1R0 LV1X3 LV1X2 LV1X1 LV1X0 R/W CR6 0 0 1 1 0 F2_1 F1_1 F0_1 SWC1 BSEL1 E0_1 DET1* ALM1* R/W CR7 0 0 1 1 1 AOUT1 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 R/W LV3 LV2 LV1 LV0 _8 SEL TX TOUT1 CR8 0 1 0 0 0 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 R/W _7 _6 _5 _4 _3 _2 _1 _0 CR9 0 1 0 0 1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 R/W LV6 LV5 LV4 LV3 LV2 LV1 LV0 _8 CR10 0 1 0 1 0 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 R/W _7 _6 _5 _4 _3 _2 _1 _0 CR11 0 1 0 1 1 CR12 0 1 1 0 0 CR13 0 1 1 0 1 CH2 RING LV2R3 F2_2 PMG1 R/W TOUT1 CH2TG1 CH2TG1 CH2TG1 CH1 CH1TG1 CH1TG1 CH1TG1 R/W TRP2 TRP1 TRP0 RI NG TRP2 TRP1 TRP0 LV2R2 F1_2 LV2R1 F0_2 LV2R0 SWC2 LV2X3 BSEL2 LV2X2 E0_2 LV2X1 DET2* LV2X0 ALM2* R/W R/W CR14 0 1 1 1 0 AOUT2 CH2TG CH2TG CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 R/W SEL TX TOUT2 LV3 LV2 LV1 LV0 _8 CR15 0 1 1 1 1 CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 R/W _7 _6 _5 _4 _3 _2 _1 _0 CR16 1 0 0 0 0 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 R/W LV6 LV5 LV4 LV3 LV2 LV1 LV0 _8 CR17 1 0 0 0 1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 R/W _7 _6 _5 _4 _3 _2 _1 _0 CR18 1 0 0 1 0 CH2 LOOP1 CH1 LOOP1 CH1 LOOP0 TEST3 TEST2 TEST1 TEST0 R/W CR19 1 0 0 1 1 TEST11 TEST10 TEST9 TEST8 TEST7 TEST6 TEST5 TEST4 R/W CH2 LOOP0 *: Read only bit Note: In this datasheet, numbers in names for control register bits are often substituted by “n” (in a small letter). In the case, the “n” does not always refer to a channel number. Ex) MODE0, MODE1 CH1TG2_7, CH1TG2_6 PMG2FRQ, PMG1FRQ → MODEn → CH1TG2_n → PMGnFRQ 6/51 FEDL7033-02 1Semiconductor ML7033 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power Supply Voltage VDD Analog Input Voltage VAIN VDDD, VDDA –0.3 to +7.0 V — –0.3 to VDD+0.3 V Digital Input Voltage VDIN — –0.3 to VDD+0.3 V Storage Temperature TSTG — –55 to +150 °C RECOMMENDED OPERATING CONDITIONS Symbol Condition Min. Typ. Max. Unit Power Supply Voltage Parameter VDD Voltage to be fixed; VDDD, VDDA 4.75 5.0 5.25 V Operating Temperature TOP — –40 — +85 °C High Level Input Voltage VIH 2.2 — VDD V Low Level Input Voltage VIL 0 — 0.8 V MCK = 2.048 MHz MCKSEL (CR0-B5) bit = “0” –0.01% 2048 +0.01% kHz MCK = 4.096 MHz MCKSEL (CR0-B5) bit = “1” –0.01% 4096 +0.01% kHz — 4096 kHz MCK Frequency FMCK All digital input pins BCLK Frequency FBCLK BCLK 256 Sync Pulse Frequency FSYNC XSYNC, RSYNC –0.01% 8 +0.01% kHz Clock Duty Ratio DCLK MCK,BCLK 40 50 60 % — — 50 ns Digital Input Rise Time tIR All digital input pins Digital Input Fall Time tIF — — 50 ns MCK to BCLK Phase Difference tMB MCK, BCLK — — 50 ns Transmit Sync Pulse Setting Time Receive Sync Pulse Setting Time Sync Pulse Width tXS BCLK to XSYNC 50 — — ns tSX XSYNC to BCLK 50 — — ns tRS BCLK to RSYNC 50 — — ns tSR RSYNC to BCLK 50 — — ns µs tWS XSYNC, RSYNC SHORT (CR0-B4) bit = “0” 1 BCLK — 125 µs – 1BCLK XSYNC, RSYNC SHORT (CR0-B4) bit = “0” 210 — 1BCLK ns PCMOUT Set-up Time tDS PCMOUT 50 — — ns PCMOUT Hold Time tDH PCMOUT 50 — — ns Digital Output Load Bypass Capacitor for SGC RDL Pull-up Resistor, PCMOUT 0.5 — — kΩ CDL1 PCMOUT — — 50 pF CDL2 Other output pins — — 50 pF CSG SGC to AG 0.1 — — µF 7/51 FEDL7033-02 1Semiconductor ML7033 ELECTRICAL CHARACTERISTICS DC and Digital Interface Characteristics (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Parameter Power Supply Current Symbol Condition Min. Typ. Max. Unit IDD1 2CH Operating Mode, No Signal — 23.0 35.0 mA IDD2 1CH Operating Mode, No Signal — 16.0 22.0 mA IDD4 Power-down Mode PDN pin = logic “0” — 25.0 50.0 µA — 0.1 5.0 µA –5.0 –0.1 — µA High Level Input Leakage Current IIH Low Level Input Leakage Current IIL Digital Output Low Voltage Digital Output High Voltage All Digital Input Pins VI = VDD All Digital Input Pins VI = 0 V VOL1 PCMOUT, Pull-up = 0.5 kΩ 0 0.2 0.4 V VOL2 Other output pins, IOL = –0.4 mA 0 0.2 0.4 V VOH IOH = 0.4 mA 2.5 — — V Digital Output Leakage Current IO PCMOUT High Impedance State — — 10 µA Input Capacitance CIN — — 5 — pF Analog Interface Characteristics (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Parameter SG, SGC Output Voltage Symbol Condition Min. Typ. Max. Unit VSG SGC to AG 0.1 µF — 2.4 — V — — 10 ms 10 — — kΩ SG, SGC Rise Time tSGC SG Output Load Resistance RLSG SGC to AG 0.1 µF Rise time to 90% of max. level SG Transmit Analog Interface Characteristics (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Parameter Input Resistance Symbol Condition Min. Typ. Max. Unit RINX AINnN, AINnP — 10 — MΩ Output Load Resistance RLGX GSXn 20 — — kΩ Output Load Capacitance CLGX (to SGC) — — 30 pF Output Amplitude VOGX *1 — — 2.226 Vpp Offset Voltage VOSGX –50 — 50 mV *1 Gain = 1 –3.0 dBm (600Ω) = 0 dBm0 8/51 FEDL7033-02 1Semiconductor ML7033 Receive Analog Interface Characteristics (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Parameter Symbol RLAO Output Load Resistance Condition AOUTnN, AOUTnP (to SGC) Min. Typ. Max. Unit 20 — — kΩ RLTO TOUTn (to SGC) 10 — — kΩ Output Load Capacitance CLAO AOUTnN, AOUTnP, TOUTn — — 50 pF Output Amplitude VOAO — — 3.4* Vpp Offset Voltage VOSAO –100 — 100 mV AOUTnN, AOUTnP, TOUTn RLAO = 20 kΩ (to SGC) AOUTnN, AOUTnP, TOUTn RLAO = 20 kΩ (to SGC) * 0.658 dBm (600Ω) = 0 dBm0 9/51 FEDL7033-02 1Semiconductor ML7033 AC Characteristics (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Condition Parameter Symbol Freq. (Hz) Min. Level (dBm0) Typ. Max. Loss T1 60 25 45 — Loss T2 300 –0.15 0.15 0.20 Transmit Loss T3 1020 Frequency Response Loss T4 3000 Loss T5 3300 Loss T6 Receive Frequency Response 0 GSXn to PCMOUT Reference –0.15 0.02 0.20 –0.15 0.1 0.80 3400 0 0.6 0.80 Loss R1 100 –0.15 0.04 0.2 Loss R2 1020 Loss R3 3000 Loss R4 3300 Loss R5 3400 (Attenuation) 0 –0.15 0.07 0.2 (Attenuation) –0.15 0.2 0.8 0 0.6 0.8 SDT1 3 36 43 — Transmit SDT2 0 36 40 — Signal to Distortion SDT3 36 38 — Ratio 1020 –30 *1 SDT4 –40 30 32 — SDT5 –45 25 29 — SDR1 3 36 42 — Receive SDR2 0 36 39 — Signal to Distortion SDR3 36 39 — Ratio Transmit Gain Tracking Receive Gain Tracking *1 –30 PCMIN to AOUTn SDR4 –40 *1 30 33 — SDR5 –45 25 30 — GTT1 3 –0.2 0.02 0.2 1020 GTT2 GTT3 –10 1020 –40 GSXn to PCMOUT 0.06 0.2 GTT4 –50 –0.6 0.4 0.6 –55 –1.2 0.4 1.2 GTR1 3 –0.2 0 0.2 GTR3 –10 1020 –40 GTR4 –50 GTR5 –55 PCMIN to AOUTn dB dB dB Reference –0.2 GTT5 GTR2 dB Reference PCMIN to AOUTn GSXn to PCMOUT Unit dB Reference –0.2 –0.02 0.2 –0.6 –0.1 0.6 –1.2 –0.2 1.2 dB C-message filter used 10/51 FEDL7033-02 1Semiconductor ML7033 AC Characteristics (Continued) (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Condition Parameter Symbol NIDLET Freq. (Hz) Level (dBm0) — — Idle Channel Noise NIDLER Absolute Level (Initial Difference) — AVT/AVR 1020 Absolute Level (Deviation of Temperature and Power) Absolute Delay Transmit Group Delay Receive Group Delay Cross Talk Attenuation — 0 AVTT Analog input = SGC*1 AINn to PCMOUT Gain = 1 (µ-law) PCMIN = ‘FF’h (µ-law) PCMIN = ‘D5’h (A-law) PCMIN = all ‘0’ (linear)*1 PCMIN to AOUTn GSXn to PCMOUT VDD = 5 V, Ta = 25°C PCMIN to AOUTn (Single-ended) VDD = 5 V, Ta = 25°C VDD = 4.75 to 5.25 V Ta = –40 to 85°C AVRT A to A Mode BCLK = 2048 kHz Typ. Max. — 9 15 Unit dBm0 — 4 10 0.511 0.548 0.587 0.806 0.835 0.864 –0.3 — 0.3 –0.3 — 0.3 — 0.58 0.6 — 0.26 0.75 — — 0.16 0.02 0.35 0.125 Vrms dB TD 1020 TGD T1 500 TGD T2 TGD T3 600 1000 TGD T4 TGD T5 2600 2800 — — 0.05 0.07 0.125 0.75 TGD R1 TGD R2 500 600 — — 0.00 0.00 0.75 0.35 TGD R3 TGD R4 1000 2600 — — 0.00 0.09 0.125 0.125 TGD R5 CRT 2800 Trans to Receive — 75 0.12 83 0.75 — CRR CRCH 1020 0 Receive to Trans Channel to Channel 75 75 80 78 — — dB 0 0 to 4 kHz 30 32 — dB 0 4.6 to 1000 kHz — –37.5 –35 dB 4.6 to 72k 300 to 3.4K 0 Min. 0 0 *2 *2 ms ms ms Discrimination DIS Out of Band Spurious OBS Signal Frequency Distortion SFDT SFDR 1020 0 0 to 4 kHz — — –50 –48 –40 –40 dBm0 Intermodulation Distortion IMDT IMDR fa = 470 fb = 320 –4 2 fa – fb — — –50 –54 –40 –40 dBm0 PSRT1 PSRT2 0 to 4k 4 to 50k 40 50 44 55 — — 40 50 45 56 — — Power Supply Noise Rejection Ratio *1 *2 *3 PSRR1 PSRR2 100 0 to 4k mVrms 4 to 50k *3 dB C-message filter used Minimum value of the group delay distortion Under idle channel noise 11/51 FEDL7033-02 1Semiconductor ML7033 AC Characteristics (Continued) (VDD = 4.75 to 5.25 V, Ta = –40 to +85°C) Parameter Digital Output Delay Time Symbol Condition Min. Typ. Max. tSD PCMOUT — — 100 tXD1 Pull-up resister = 0.5 kΩ — — 100 tXD2 CL = 50 pF and 1 LSTTL — — 100 — — 100 — — 100 tXD3 tXD4 PCMOUT Operation Delay Time AOUTn/TOUTn Signal Output Delay Time PCMOSY, CL = 50 pF EXCK Clock Frequency SLIC Interface Delay Time ns ns tDDO Time to operation after Power-down release — 4 — ms tDAO Time to baseband signal output after power-on — 4 — ms t1 50 — — ns t2 50 — — ns t3 50 — — ns t4 50 — — ns 100 — — ns 50 — — ns t7 50 — — ns t8 — — 50 ns t9 50 — — ns t10 50 — — ns t11 — — 50 ns 0.5 — 10 MHz t5 Serial Port I/O Setting Time Unit t6 fEXCK CLOAD = 50 pF EXCK t20 — — 200 ns t21 — 20 — µs t22 — — 200 ns t23 — — 200 ns t24 — — 225 ms 12/51 FEDL7033-02 1Semiconductor ML7033 TIMING DIAGRAM Transmit Timing - 8-bit PCM Mode with LIN (CR0-B3) bit = “0” Long Frame Sync Mode with SHORT (CR0-B4) bit = “0” MCK BCLK XSYNC 1 4 5 6 7 8 t SX t XS tW S t SD t XD1 PCMOUT t MB 3 2 t XD2 MSD D2 D3 D4 D5 D6 D7 D8 t XD3 PCMOSY t XD4 Short Frame Sync Mode with SHORT (CR0-B4) bit = “1” MCK BCLK 1 tSX XSYNC tXD1 MSD tXD3 PCMOSY 4 5 6 7 8 tXS tW S PCMOUT tMB 3 2 tXD2 D2 D3 D4 D5 D6 D7 D8 tXD4 Figure 1 Transmit Side Timing Diagram Receive Timing - 8-bit PCM Mode with LIN (CR0-B3) bit = “0” Long Frame Sync Mode with SHORT (CR0-B4) bit = “0” MCK 1 BCLK RSYN C t MB 3 2 t RS 4 5 6 7 8 tS R tW S PC M IN MSD t DS D2 D3 t DH D4 D5 D6 D7 D8 Short Frame Sync Mode with SHORT (CR0-B4) bit = “1” MCK 1 BCLK t MB 3 2 tSR RSYN C tW S PC M IN 4 5 6 7 8 t RS t DS MSD Figure 2 D2 t DH D3 D4 D5 D6 D7 Receive Side Timing Diagram Note: The above timings are also valid in 14-bit linear PCM Mode with the LIN (CR0-B3) bit = “1”, except that the number of data bits on the PCMIN and PCMOUT signals changes from 8 to 14. 13/51 FEDL7033-02 1Semiconductor ML7033 PCM Interface Bit Configuration 8-bit PCM Mode with LIN (CR0-B3) bit =”0” & Long Frame Sync Mode with SHORT (CR0-B4) bit = “0” 1 9 17 25 1 BCLK CH1 PCM DATA CH2 PCM DATA M SD D2 D3 M SD D2 D3 D4 D5 D6 D7 D8 PCMIN PCMOUT M SD D2 D3 D4 D5 D6 D7 D8 RSYNC PCMOSY 14-bit Linear PCM Mode with LIN (CR0-B3) bit = ”1” & Long Frame Sync Mode with SHORT (CR0-B4) bit = “0” 1 9 17 25 1 BCLK CH1 Linear DATA CH2 Linear DATA MSD D2 D3 MSD D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 PCMIN PCMOUT MSD D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 RSYNC PCMOSY 8-bit PCM Mode with LIN (CR0-B3) bit = “0” & Short Frame Sync Mode with SHORT (CR0-B4) bit = “1” BCLK 1 9 17 25 1 PCMOSY CH1 PCM DATA CH2 PCM DATA MSD D2 D3 MSD D2 D3 D4 D5 D6 D7 D8 PCMIN PCMOUT MSD D2 D3 D4 D5 D6 D7 D8 RSYNC 14-bit Linear PCM Mode with LIN (CR0-B3) bit = “1” & Short Frame Sync Mode with SHORT (CR0-B4) bit = “1” 1 9 17 25 1 BCLK CH1 Linear DATA CH2 Linear DATA MSD D2 D3 MSD D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 PCMIN PCMOUT MSD D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 RSYNC PCMOSY Figure 3 PCM Interface Bit Configuration 14/51 FEDL7033-02 1Semiconductor ML7033 Figure 4 High Impedance OFF AOUTn PCMOUT MODEn-bit High impedance SG SGC PDN GND tSGC tDDO tDAO ON SG Level SGC, PCMOUT, and AOUT Output Timing SGC, PCMOUT, and AOUT Output Timing 15/51 FEDL7033-02 1Semiconductor ML7033 MCU Serial Interface DEN t2 EXCK 1 t1 DIO (W rite) t3 3 4 t6 t4 W t 10 t5 2 A4 5 6 13 t9 t7 A3 A2 15 14 A1 A0 B1 B0 t8 DIO (Read) R A4 A3 A2 Figure 5 A1 t 11 A0 B1 B0 MCU Serial Interface SLIC Interface DEN 13 EXCK 14 15 16 t20 SLIC_I/F *5 t21 E0_n *5 SLIC_I/F = F2_n pin, F1_n pin, F0_n, SWCn pin, BSELn pin Figure 6 Either ALMn pin or DETn pin,or DEN pin (CR6 and CR13) ALMn, DETn INT (from ALMn) SLIC Interface 1 (to SLIC) t23 t22 t23 INT (from DETn) t24 Figure 7 SLIC Interface 2 (from SLIC) * The INT pin driven to a logic “1” in either of the following cases; (1) (PDN pin = logic “1”) Any of the ALMn or DETn pins (maximum 4 pins concerned) in a logic “0” state go to logic “1”. (2) (PDN pin = logic “0”) All of the ALMn or DETn pins (maximum 4 pins concerned) in a logic “0” state go to logic “1”. (3) Both SLIC 1 control (CR6) and SLIC 2 control (CR13) are read by the MCU. 16/51 FEDL7033-02 1Semiconductor ML7033 FUNCTIONAL DESCRIPTION Pin Functional Description AIN1N, AIN1P, AIN2N, AIN2P, GSX1, GSX2 The AINnN and AINnP pins are the transmit path analog inputs for Channel-n, where n equals channel 1 or channel 2. The AINnN pin is the inverting input, and the AINnP pin is the non-inverting input for the op-amp. The GSXn pin functions as the transmit path level adjustment for Channel-n and is connected to the output of the op-amp. It is used to adjust the output level as shown in Figure 8 below. When the AINnN or AINInP pins are not in use, connect the AINnN pin to the GSXn pin and the AINnP pin to the SGC pin. During power-down mode, the GSXn output is in a high impedance state. In the case of the analog input 2.226 Vpp at the GSXn pin, the digital output will be +3.00 dBm0. GSX1 CH1 Analog Input R2 C1 AIN1N AIN1P R1 SGC GSX2 CH2 Analog Input R4 C2 AIN2N AIN1P R3 CH1 Gain Gain = R2/R1 ≤ 10 R1: Variable R2 > 20 kΩ C1 > 1/(2 × 3.14 × 30 × R1) CH2 Gain Gain = R4/R3 ≤ 10 R3: Variable R4 > 20 kΩ C2 > 1/(2 × 3.14 × 30 × R3) SGC Figure 8 Example of Analog Input Setting Schematic AOUT1P, AOUT1N, AOUT2P, AOUT2N The AOUTnN and AOUTnP pins are the receive path analog outputs from Channel-n, where n equals channel 1 or channel 2. These pins can drive a load of 20 kΩ or more. When the AOUTnSEL register bit (CR7-B7/CR14B7) is cleared (0), the AOUTnP pin is a single-ended output from Channel-n and the AOUTnN pin is at high impedance. When the AOUTnSEL bit is set (1), the AOUTnN and AOUTnP pins are differentials outputs from the corresponding channel. The output signal from each of these pins has an amplitude of 3.4 Vpp above and below the signal ground voltage (SG). Hence, when the maximum PCM code (+3.00 dBm0) is input to the PCMIN pin, the maximum amplitude between the AOUTnN pin and the AOUTnP pin will be 6.8 Vpp. While the device is in power-down mode, or the corresponding channel (1 or 2) is in power saving mode, the related outputs are high impedance. Refer to Table 5 for more information. 17/51 FEDL7033-02 1Semiconductor ML7033 TOUT1, TOUT2 TOUTn is the tone analog output for the corresponding channel. The output signal has an amplitude of 2.5 Vpp above and below the signal ground voltage (SG). While the device is in power-down mode, or the corresponding channel is in power-save mode, the related outputs are high impedance. VDDA, VDDD +5 V power supply for analog and digital circuits. The VDDA pin is the power pin for the analog circuits. The VDDD pin is the power pin for the digital circuits. If these signals are connected together externally, The VDDA pin must be connected to the VDDD pin in the shortest distance on the printed circuit board. Internal to the ML7033, the VDDA plane is separate from the VDDD plane. To minimize power supply noise, a 0.1 µF bypass capacitor (with excellent high frequency characteristics) and a 10 µF electrolytic capacitor should be connected between the VDDA pin and the AG pin. In addition, the same capacitive network should also be connected between the VDDD pin and the DG pin. If the AG and DG pins are connected together externally, only one capacitive network is required. AG, DG The AG pin is a ground for the analog circuits. The DG pin is a ground for the digital circuits. The analog ground and the digital ground are separated internally within the device. The AG pin and DG pins must be connected in the shortest distance on the printed circuit board, and then to system ground with a low impedance. SGC The SGC pin used is to internally generate the signal ground voltage level by connecting a bypass capacitor. The output impedance is approximately 50 kΩ. Connect a 0.1 µF bypass capacitor with excellent high frequency characteristics between the SGC pin and the AG pin. During power-down mode, the SGC output is at the voltage level of the AG pin. SG The SG pin is the signal ground level output for the system circuits. The output voltage is 2.4 V, the as same as the SGC pin in a normal operating state. During power-down mode, this output is high impedance. MCK Master clock input. Input either 2.048 or 4.096 MHz clock. After turning on the power, the appropriate value must be written into the MCKSEL bit (CR0-B5) depending upon the desired master clock frequency. If the supplied master clock frequency and the value of the MCKSEL bit (CR0-B5) do not match, the powerdown control circuit and the MCU interface circuit will continue to operate properly. Access to the control registers can also occur. However, other circuits may not operate properly. As for the power-on sequence, please refer to “Power-On Sequence” in the later page. 18/51 FEDL7033-02 1Semiconductor ML7033 BCLK Shift clock signal input for the PCMIN and the PCMOUT signals. The clock frequency, equal to the data rate, is 256 kHz to 4096 kHz. This signal must be generated from the same clock source as the master clock and synchronized in phase with the master clock. Please refer to Figures 1 and 2 for more information about the phase difference between MCK and BCLK. RSYNC Receive synchronizing clock input. The PCMIN signals are received in synchronization with this clock. The 8 kHz input clock is generated from the identical clock source as MCK and must be synchronized in phase with the master clock. XSYNC Transmit synchronizing clock input. The PCMOUT signals are transmitted in synchronization with this clock. The 8 kHz input clock is generated from the identical clock source as MCK and must be synchronized in phase with the master clock. PCMIN Serial PCM data input. The serial PCM data input on the PCMIN pin is converted to analog signals and output from the AOUTnP pin (or from the AOUTnN pin and the AOUTnP pin) in synchronization with the RSYNC clock and the BCLK clock. When in Long Frame Sync Mode (CR0-B4 = “0”), the first bit of the serial PCM data (MSD of channel 1) is identified at the rising edge of the RSYNC clock. When in Short Frame Sync Mode (CR0-B4 = “1”), the first bit of the serial PCM data (MSD of channel 1) is identified at the falling edge of the RSYNC clock. PCMOUT Serial PCM data output. Channel 1 data is output in sequential order, from most significant data (MSD) to least significant data (LSD). Data is synchronized with the rising edge of BCLK. When in Long Frame Sync Mode (CR0-B4 = “0”), the first bit of PCM data may be output at the rising edge of the XSYNC signal, depending on the timing between BCLK and XSYNC. When in Short Frame Sync Mode (CR0-B4 = “1”), the first bit of PCM data may be output at the falling edge of the XSYNC signal, depending on the timing between BCLK and XSYNC. This pin is in a high impedance state during power-down. A pull-up resistor must be connected to this pin since it is an open drain output. PCMOSY PCMOSY is asserted to a logic 0 when PCM data is valid on the PCMOUT pin. This includes both normal mode and power-save mode. When PCM data is not being output from the PCMOUT pin (including during power-down mode), this pin goes a logic “1”. This signal is used to control the TRI-STATE Enable of a backplane line-driver. 19/51 FEDL7033-02 1Semiconductor ML7033 Table 1 PCM Codes in 8-bit PCM Mode with the LIN (CR0-B3) bit = “0” PCMIN/PCMOUT INPUT/OUTPUT Level ALAW (CR0-B2) bit = “0” (µ-law ) MSD D2 ALAW (CR0-B2) bit = “1” (A-law ) D3 D4 D5 D6 D7 D8 MSD D2 D3 D4 D5 D6 D7 D8 +Full scale 1 0 0 0 0 0 0 0 1 0 1 0 1 0 1 0 +0 1 1 1 1 1 1 1 1 1 1 0 1 0 1 0 1 –0 0 1 1 1 1 1 1 1 0 1 0 1 0 1 0 1 –Full scale 0 0 0 0 0 0 0 0 0 0 1 0 1 0 1 0 Table 2 PCM Codes in 14-bit Linear PCM Mode with the LIN (CR0-B3) bit = “1” PCMIN/PCMOUT INPUT/OUTPUT Level MSD D2 D3 D4 D5 D6 D7 D8 D12 D13 D14 +Full scale 0 1 1 1 1 1 1 1 1 1 1 1 1 1 +1 0 0 0 0 0 0 0 0 0 0 0 0 0 1 D9 D10 D11 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 –1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 –Full scale 1 0 0 0 0 0 0 0 0 0 0 0 0 0 PDN Power-down control signal. When PDN is a asserted (logic “0”), both the channel 1 and channel 2 circuits enter the power-down state. However, even in power-down mode, the state of the control registers is maintained. Reads and writes to the registers are also possible, and the state of the INT pin also changes in accordance with inputs from the SLIC devices. This pin is deasserted (logic “1”) by external logic during normal operation. This power-down function is available even in power saving mode by the MODEn (CR0-B1/CR0-B0) bit. RESET An input to reset control registers. By asserting the RESET pin (applying a logic “0”), all control registers are initialized. During a normal operation mode, set this pin logic “1”. Table 3 State of PCMOUT in 8-bit PCM Mode with LIN (CR0-B3) bit = “0” PDN pin MODE1 bit MODE0 bit ALAW bit 0 0/1 0/1 0/1 Hi-Z *1 Hi-Z *1 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 1 0 1 0 1 1 1 0 1 0 1 0 1 0 1 1 1 1 1 1 1 1 Operate 1 1 1 0 1 0 1 0 1 Operate 1 0 0 1 0 1 1 1 0 1 1 1 CH2 PCM Data CH1 PCM Data 0 Operate 1 1 1 1 1 1 1 1 1 Operate 1 1 0 1 0 1 0 1 0 Operate Operate 1 Operate Operate 20/51 FEDL7033-02 1Semiconductor Table 4 ML7033 State of PCMOUT in 14-bit Linear PCM Mode with LIN (CR0-B3) bit = “1” PDN pin MODE1 bit MODE0 bit 0 0/1 0/1 Hi-Z *1 Hi-Z *1 1 0 0 ALL “0” ALL “0” 1 0 1 ALL “0” Operate 1 1 0 Operate ALL “0” 1 1 1 Operate Operate 0/1 Table 5 PDN MODE1 MODE0 pin bit bit *1 *2 0/1 ALAW bit CH2 PCM Data CH1 PCM Data State of Analog Output Pins GSX1 pin GSX2 pin AOUT1 pin AOUT2 pin SG pin SGC pin MCU Interface Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z AG level *2 Operate 0 0/1 1 0 0 Hi-Z Hi-Z Hi-Z Hi-Z Hi-Z AG level *2 Operate 1 0 1 Operate Hi-Z Operate Hi-Z Operate Operate Operate 1 1 0 Hi-Z Operate Hi-Z Operate Operate Operate Operate 1 1 1 Operate Operate Operate Operate Operate Operate Operate The data will be ‘H’ by an external pull-up resistor. Output impedance = about 50 kΩ F2_1, F1_1, F0_1, F2_2, F1_2, F0_2 The F2_n, F1_n and F0_n pins are data outputs used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series device. The output levels from the F2_n, the F1_n and F0_n pins are determined by the F2_n, F1_n, and F0_n register bits (CR6-B7 to B5 and CR13-B7 to B5). By inputting these outputs directly into the corresponding input pin of the SLIC device, the SLIC operating mode selection is possible. Even in the power-down state with the PDN pin is asserted, these pins remain functional. E0_1, E0_2 The E0_n pins are the detector mode selection data outputs. These pins are used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series device. Though the output level from the E0_n pin is determined by the E0_n bit (CR6-B2/CR13-B2), the output level changes in 20 µs (= hold timer) in the poweron mode with the PDN pin = logic “1” and in 200 ns in the power-down mode with the PDN pin = logic “0” after the change of E0_n bit (CR6-B2 /CR13-B2). Refer to Figure 6 for information. What event is actually detected by the SLIC is determined by the combination of the F2_n, F1_n, F0_n and E0_n pins. Refer to Table 6 for more information. By connecting the output directly into the corresponding input pin of the SLIC device, detector mode selection in the SLIC is possible. Even in the power-down state with the PDN pin = logic “0”, this pin remains functional. However, the hold timer is ignored in this state. 21/51 FEDL7033-02 1Semiconductor ML7033 Table 6 Operating Mode SLIC Device Operation Mode and Detector Mode F2_n F1_n F0_n E0_n = 1 E0_n = 0 Low Power Standby 0 0 0 SHD GKD Standby mode Description Forward Active 0 0 1 SHD GKD Forward battery loop feed Unbalanced Ringing 0 1 0 RTD RTD Unbalanced ringing mode Reverse Active 0 1 1 SHD GKD Reverse battery loop feed Ringing 1 0 0 RTD RTD Balanced ringing mode Forward Loop Back 1 0 1 SHD GKD Test mode Tip Open 1 1 0 SHD GKD For PBX type application Power Denial 1 1 1 n/a n/a Device shutdown SHD: Switch Hook Detection RTD: Ring Trip Detection GKD:Ground Key Detection BSEL1, BSEL2 The BSELn pin is the battery mode selection data output. This pin is used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series SLIC device. A logic “0” on this pin selects the low battery mode, and the logic “1” selects the high battery mode within the SLIC device. The output levels from the BSELn pins are determined by the BSELn register bits (CR6-B3/CR13-B3). By connecting these outputs directly to the corresponding SLIC device input pins, battery mode selection of the SLIC is possible. This pin remains functional even in power-down mode. SWC1, SWC2 The SWCn pin is the uncommitted switch control data output. This pin is used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series SLIC device. By connecting this pin directly to the corresponding input pin of the SLIC device, the uncommitted switch control can be made. The uncommitted switch is located between the SW+ pin and the SW- pin. A logic “0” on this pin enables the SLIC internal switch on, and a logic “1” disables the switch. The output levels from the SWC1 and SWC2 pins are determined by the SWCn register bits (CR6-B4/CR13B4). This pin remains functional even in power-down mode with the PDN pin is a logic “0”. DET1, DET2 The DETn pins are the SLIC’s detection signal (switch hook, ring trip or ground key detection) inputs. These pins are used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series device. A logic “0” on this pin clears the corresponding DETn register bit (CR6-B1/CR13-B1). A logic ‘1’ on this pin input sets the register bit. The Intersil RSLICTM series SLIC device is equipped with a function to switch the output on its DET pin from a logic “1” state to a logic “0” state when it detects an assigned event of either off-hook, ring trip or ground key. Therefore, by connecting these pins to the corresponding pins on the SLIC device and reading the DETn register bit (CR6-B1/CR13-B1), the occurrence of an assigned event can be detected. 22/51 FEDL7033-02 1Semiconductor ML7033 The event detected by the SLIC is determined by the F2_n, F1_n, and F0_n register bits (CR6-B7 to B5/CR13B7 to B5), and the E0_n register bits (CR6-B2 /CR13-B2). To avoid the unintended detection of these conditions due to glitches on the DETn signal of the SLIC, the ML7033 is equipped with a debounce timer to hold the DET register bit (CR6-B1/CR13-B1) and the output of the INT pin for a set period, even when an input to the DETn pin changes from a logic “1” to a logic “0”. For more information on the debounce timer, refer to the DETnTIM3 through DETnTIM0 register bit descriptions (CR4-B7 to B0). This pin remains functional in power-down mode (PDN pin low). However, while in the power-down state, the debounce timer is disabled. When this pin is not used, it should be tied to VDDD. ALM1, ALM2 The ALMn pins are the thermal shut down alarm signals. These pins are used when the SLIC connected to the corresponding channel is an Intersil RSLICTM series device. A logic “0” on the ALMn input pin clears the corresponding ALM register bit (CR6-B0/CR13-B0). A logic “1” on this pin sets the bit. The Intersil RSLICTM series device is equipped with a function that allows it to automatically enter power-down mode and toggle its ALMn pin from a logic “1” to a logic “0” state when the SLIC die temperature exceeds a safe operating temperature. Hence, by connecting the corresponding pin of the SLIC device to the ALM1 and ALM2 pins and reading the ALM register bit (CR6-B0/CR13-B0), it is possible to know whether the concerned SLIC device is operating normally, or is in a thermal shutdown state. This pin remains functional in power-down mode. However, while in the power-down state, the debounce timer is disabled. When this pin is not used, it should be tied to VDDD. INT The ML7033 asserts the INT interrupt pin when either the DETn pin or the ALMn pin are asserted by the SLIC device when the device is an Intersil RSLICTM series SLIC device. The Intersil RSLICTM series device is equipped with detector and thermal shut down alarm functions to notify a change of SLIC state by driving a logic 0 onto the output pins connected to DETn and ALMn. Refer to the DETn and ALMn pin descriptions above. By monitoring the state of the INT pin and reading the DETn (CR6-B0/CR13-B0) and ALMn (CR6B0/CR13-B0) register bits, it is possible to know that a change of a state occurred within the SLIC device. The INT pin transitions from a logic “1” to a logic “0” in the following cases; (1) (PDN pin = logic “0”) Any of the ALMn or DETn pins in the logic “1” state transition to the logic “0” state. (2) (PDN pin = logic “1”) Any of the ALMn or DETn pins transition from the logic “1” state to the logic “0” state when all the four pins (ALM1, ALM2, DET1, and DET2) have been in the logic “1” state. Note that the debounce timer with the DETn pin is not valid while in power-down mode (PDN pin = logic “0”). 23/51 FEDL7033-02 1Semiconductor ML7033 The INT pin is released to the logic “1” state in either of the following cases; (1) (PDN pin = logic “1”) Any one of the ALMn or DETn pins in the logic “0” state transition to the logic “1” state. (2) (PDN pin = logic “0”) All of the ALMn or DETn pins in the logic “0” state transition to the logic “1” state. (3) Both SLIC 1 control (CR6 register) and SLIC 2 control (CR13 register) are read by the MCU. Note that the debounce timer, which works when the DETn pin changes from a logic “1” state to a to logic “0” state, does not work when the pin changes from logic “0” to logic “1”. DEN, EXCK, DIO Serial control ports for the MCU interface. These pins are used by an external MCU to access the internal control registers of the ML7033. The DEN pin is the data enable input. The EXCK pin is the data shift clock input. The DIO pin is the address and data input/output. Figure 9 shows the MCU interface input/output timing diagram. Note that EXCK must be a continuous clock of at least 15 pulses or more. DEN EXCK DIO (I) W A4 A3 A2 A1 A0 B7 B6 B5 B4 B3 B2 B1 B0 B6 Output B5 B4 B3 B2 B1 B0 Write timing DEN EXCK DIO (O) R A4 Input A3 A2 A1 A0 B7 Read timing Figure 9 MCU Interface Timing Diagram CIDATA1, CIDATA2 The CIDATA1 and CDATA2 data inputs are used for Caller ID generation. While in a Caller ID tone generation mode with the CIDCHnON register bit set, (CR1-B1/CR1-B0), signals on the CIDATAn pins are modulated in either the ITU-T V.23 or Bell 202 schemes. The scheme is determined by the CIDFMT register bit (CR1-B2), and output from the analog output pin(s). The analog output pins for modulated Caller ID data can be selected by the CHnTG2TX (CR7-B6/CR14-B6), the CHnTGTOUTn (CR7-B5/CR14-B5), and the AOUTnSEL (CR7-B7/CR14-B7) register bits. The output level for the modulated Caller ID data can be tuned by the CHnTG1LVn (CR9-B7 to B1/CR16-B7 to B1) register bits. TEST The TEST input is used for testing purposes only during the manufacturing process and has no function once the testing process is completed. This pin is not used during normal operation of the device and should be kept at a logic “0” state. 24/51 FEDL7033-02 1Semiconductor ML7033 Power-On Sequence While in the power-on state, the following chart is recommended. <NOTE> POWER OFF Power supply on <Recommendation> PDN pin = logic “0”, RESET pin= “0” RESET pin = “0” to “1” (or Power-on Reset Function) Control Register Setting (CH1/CH2) PDN pin = “1” As the ML7033 is equipped with a power-on reset function, initialization of the control registers automatically occurs as the power is turned on, even with the RESET pin = logic “1”. However, if any of input pins are not in a high impedance state, the power-on reset may not function properly. Keep the input to the RESET pin in the logic “0” state for 100ns or longer before changing to a logic “1”. Even during power-down mode with the PDN pin = logic “0”, the SLIC interface registers (CR6, CR13) and the INT pin are working. Data set in other registers becomes valid after the PDN pin is driven to a logic “1” state. Normal Operation Figure 10 Power-on Sequence Flow Chart 25/51 FEDL7033-02 1Semiconductor ML7033 Control Registers Functional Description CR0 (Basic operating mode) B7 B6 B5 B4 B3 B2 B1 B0 CR0 FILTER1SEL FILTER2SEL MCKSEL SHORT LIN ALAW MODE1 MODE0 default 0 0 0 0 0 0 0 0 B7 … Transmit and receive filter select for CH1 0 : ITU-T G.714 filter 1 : wideband filter for V.90 data modem application B6 … Transmit and receive filter select for CH2 0 : ITU-T G.714 filter 1 : wideband filter for V.90 data modem application B5 … MCK frequency select B4 … Frame synchronizing scheme select Refer to Figure 3. B3 … PCM companding law select 0 : 8-bit PCM mode 1 : 14-bit linear PCM (2’s complement) mode “1” is selected, a setting with the ALAW (CR0-B2) bit is ignored. B2 … PCM companding law select 0 : µ-law 1 : A-law When the LIN (CR0-B3) is “1”, a setting with this bit is ignored. B1, B0 … Power saving control 0 : Power saving mode 1 : Normal operation The MODE1 (CR0-B1) bit is for channel 2, and the MODE0 (CR0-B0) bit is for channel 1. In power saving mode, power for the corresponding channel is turned off except for the last output stage of the PCMOUT pin. The power saving mode differs from the power-down mode controlled by the PDN pin in the following aspects; - 0 : 2.048 MHz 1 : 4.096 MHz 0 : Long frame SYNC 1 : Short frame SYNC Possible to control a state for an individual channel independently The last stage of the PCMOUT pin is operational, and outputs ‘positive zero’ PCM code in the 8-bit PCM mode or ‘zero’ PCM code in the 14-bit Linear PCM mode during the assigned time slot. Debounce timer and hold timer are valid. As in power-down mode, the power saving mode does not initialize control registers and read and write of control registers are possible in the power saving mode. The power-down mode setting by the PDN pin takes precedence over the power saving mode. Table 7 Mode Settings for CH1 and CH2 MODE1 bit MODE0 bit PDN pin RESET pin 0*1 0*1 0 0 *1 *1 0 0 1 Power of Channel 0 CH2 CH1 OFF OFF OFF *2 OFF *2 Register Initialized to default Initialized to default 0/1 0/1 0 1 OFF OFF Read/Write possible 0 0 1 1 OFF*2 OFF*2 Read/Write possible 0 1 1 1 OFF*2 ON Read/Write possible 1 0 1 1 ON OFF*2 Read/Write possible 1 1 1 1 ON ON Read/Write possible *1 forced to be default by the RESET pin = logic “0”. *2 The last output stage is powered. 26/51 FEDL7033-02 1Semiconductor ML7033 CR1 (Tone generator and Call ID tone control) B7 B6 CR1 CH2TG ON CH1TG ON default 0 0 B5 0 B4 0 B3 0 B2 B1 B0 CIDFMT CID CH2ON CID CH1ON 0 0 0 B7 … State control for a tone generator on CHl 0 : disabled 1 : enabled B6 … State control for a tone generator on CH2 0 : disabled 1 : enabled B5, B4, B3 … Reserved (The default alternation is prohibited.) When a write action is executed for CR1, set these bits to “0”. B2 … Caller ID generator modulation scheme select 0 : ITU-T V.23 scheme (1: 1300 Hz, 0: 2100 Hz) 1 : Bell 202 format (1: 1200 Hz, 0: 2200 Hz) B1 … State control for Caller ID generator on CH2 0 : OFF 1 : ON Regardless of how the CH2TGON bit (CR1-B7) is set, signals input into the CIDATA2 pin are modulated and output as Caller ID tones. When this bit is set, the level setting by the CH2TG1LVn (CR16-B7 to B1) bits is valid, but the CH2TG1_n (CR16-B0/CR17-B7 to B0) bits, CH2RING (CR11-B7) bit, and CH2TG1TRPn (CR11-B6 to B4) bits are invalid. B0 … State control for Caller ID generator on CH1 0 : OFF 1 : ON Regardless of how the CH1TGON bit (CR1-B6) is set, signals input into the CIDATA1 pin are modulated and output as Caller ID tones. When this bit is set, the level set by the CH1TG1LVn (CR9-B7 to B1) bits is valid, but the CH1TG1_n (CR9-B0/CR11-B7 to B0) bits, the CH1RING (CR11-B3) bit, and the CH1TG1TRPn (CR11-B2 to B0) bits are invalid. 27/51 FEDL7033-02 1Semiconductor ML7033 CR2 (Pulse metering tone generator control) B7 B6 B5 B4 B3 B2 B1 B0 CR2 PMG2 FRQ PMG2 LV1 PMG2 LV0 PMG2 TOUT2 PMG1 FRQ PMG1 LV1 PMG1 LV0 PMG1 TOUT1 default 0 0 0 0 0 0 0 0 B7 … Pulse metering tone frequency select for CH2 0 : 12 kHz 1 : 16 kHz B6, B5 … Pulse metering tone level setting for CH2 (B6, B5) (0, 0) = OFF (0, 1) = 0.5 Vpp (1, 0) = 1.0 Vpp (1, 1) = 1.5 Vpp The level of the pulse metering tone, as shown in Figure 11, reaches the assigned level in 10 ms and gradually fades out over 10 ms. The ramp-up and ramp-down times also apply when a tone is cancelled by writing (0,0) into these register bits. Once the register bits are set, the tone begins to fade out and completely fades out after 10 ms. In addition, subsequent writes to these bits are prohibited for 10 ms. Ramp down time=10ms Ramp up time=10ms Figure 11 Pulse Metering Tone Waveform B4 … Pulse metering tone output pin select for CH2 0 : AOUT2 pin (added to voice signals) 1 : TOUT2 pin B3 … Pulse metering tone frequency select for CH2 B2, B1 … Pulse metering tone level setting for CH1 (B2, B1) (0,0) = OFF (0, 1) = 0.5 Vpp (1, 0) = 1.0 Vpp (1, 1) = 1.5 Vpp The level of the pulse metering tone, as shown in Figure 11, reaches the assigned level in 10 ms and gradually fades over 10 ms. 0 : 12 kHz 1 : 16 kHz The ramp-up and ramp-down times also apply when a tone is cancelled by writing (0,0) into these register bits. In this case the tone fades out after 10 ms. In addition, subsequent writes to these bits are prohibited for 10 ms. B0 … Pulse metering tone frequency select for CH1 0 : 12 kHz 1 : 16 kHz 28/51 FEDL7033-02 1Semiconductor ML7033 CR3 (Time slot assignment control) B7 B6 B5 B4 B3 B2 B1 B0 CR3 TSAE TSAC TSA5 TSA4 TSA3 TSA2 TSA1 TSA0 default 0 0 0 0 0 0 0 0 * CR3 is a write only register. B7 … Time slot assignment customization enable 0 : Default time slot assignment 1 : Customized time slot assignment The default time slot assignment is CH1 for Slot 0 and CH2 for Slot 2. B6 … Time slot assignment channel select 0 : CH1 1 : CH2 This bit is used to specify the channel for which the accompanied TSAn (CR3-B5 to B0) bits are going to assign a time slot. Hence, when a customized time slot assignment is enabled, CR3 should be written twice; once for CH1 and another for CH2. B5 to B0 … Assigned time slot select Each time slot consists of 8 BCLK cycles. The number of time slots available for time slot assignment depends upon the applied BCLK frequency, and can be calculated in the following equations; Number of time slots available for time slot assignment = (BCLK frequency)/(SYNC frequency)/8 = (BCLK frequency)/64k For instance, when the BCLK frequency is 4096 kHz, time slots that can be assigned are from 0 (000000) to 63 (111111). The specification of a time slot beyond 63 is prohibited. Note that in 14-bit linear PCM (2’s complement) mode, specified when the LIN bit (CR0B3) is set, only even numbered time slots (0, 2, 4, … 62) can be assigned. In any mode, the assigned time slot for a channel is common both for transmit and receive, and different time slots cannot be assigned for transmit and receive. When the TSAE bit (CR3-B7) is cleared, the time slot assignment specified by these bits is ignored, and the default time slots are assigned (CH1 for Time Slot 0 and CH2 for Time Slot 2). Figure 12 shows an example of how CH1 is assigned for Time Slot 0 (000000) and CH2 is assigned for Time Slot 3 (000011) in 8-bit PCM mode. 1 BCLK 9 17 25 33 MSD D2 D3 D4 D5 D6 D7 D8 PCMOUT/ PCMIN MSD D2 D3 D4 D5 D6 D7 D8 XSYNC CH1 PCM DATA CH2 PCM DATA PCMOSY Slot 0 Figure 12 Slot 1 Slot 2 Slot 3 Example of Time Slot Assignment: CH1 = Slot 0, CH2 = Slot 3 29/51 FEDL7033-02 1Semiconductor ML7033 CR4 (Debounced timer setting) B7 B6 B5 B4 B3 B2 B1 B0 CR4 DET2 TIM3 DET2 TIM2 DET2 TIM1 DET2 TIM0 DET1 TIM3 DET1 TIM2 DET1 TIM1 DET1 TIM0 default 0 0 0 0 0 0 0 0 B7 to B4 B3 to B0 … Debounce timer setting for CH2 … Debounce timer setting for CH1 To avoid the unintended detection of glitches on the DETn signal, the ML7033 is equipped with a debounce timer to hold the DETn (CR6-B1/CR13-B1) bit and the INT output state for a set period, even when the state of the DETn pin changes from logic “1” to logic “0”. Bits B7 to B4 determine the debounce timer setting for CH2. Bits B3 to B0 determine the debounce timer setting CH1. The debounce timer is operational only in the power-on state when the PDN pin = logic “1”, and remains operational in the power-saving mode with the MODEn (CR0-B1, B0) bits = “0” as long as the device is in the power-on state. The debounce timer holding time ranges from 0 ms to 225 ms at 15 ms intervals for each individual channel. The values written into B7 to B4 (channel 2) or B3 to B0 (channel 1) determine the holding time for each channel. The timer value is calculated by the equation of [Decimal(B7,B6,B5,B4) * 15] or [Decimal(B3,B2,B1,B0) * 15]. Refer to Table 8. Table 8 Debounce Timer Setting B7/B3 B6/B2 B5/B1 B4/B0 Timer (ms) 0 0 0 0 0 0 0 0 1 15 0 0 1 0 30 0 0 1 1 45 0 1 0 0 60 : : : : : 0 1 1 1 105 1 0 0 0 120 1 0 0 1 135 : : : : : 1 1 1 1 225 30/51 FEDL7033-02 1Semiconductor ML7033 CR5 (CH1 transmit/receive level control) B7 B6 B5 B4 B3 B2 B1 B0 CR5 LV1R3 LV1R2 LV1R1 LV1R0 LV1X3 LV1X2 LV1X1 LV1X0 default 0 0 0 0 0 0 0 0 B7 to B4 … Level setting for CH1 on its receive side The LV1R3 to LV1R0 bits determine the level for the CH1 receive side as shown in Table 9. B3 to B0 … Level setting for CH1 on its transmit side The LV1X3 to LV1X0 bits determine the level for the CH1 transmit side as shown in Table 9. Table 9 Receive and Transmit Level Setting LV1R3/LV1X3 LV1R2/ LV1X2 LV1R1/LV1X1 LV1R0/LV1X0 Level (dBm0) 0 0 0 0 0.0 0 0 0 1 –1.0 0 0 1 0 –2.0 0 0 1 1 –3.0 0 1 0 0 –4.0 0 1 0 1 –5.0 0 1 1 0 –6.0 0 1 1 1 –7.0 1 0 0 0 –8.0 1 0 0 1 –9.0 1 0 1 0 –10.0 1 0 1 1 –11.0 1 1 0 0 –12.0 1 1 0 1 –13.0 1 1 1 0 –14.0 1 1 1 1 OFF 31/51 FEDL7033-02 1Semiconductor ML7033 CR6 (SLIC 1 control) CR6 B7 B6 B5 B4 B3 B2 B1 B0 F2_1 F1_1 F0_1 SWC1 BSEL1 E0_1 DET1 ALM1 default 0 0 0 0 0 0 — — * CR6-B1 and B0 are read-only bits. Though either of “0” or “1” will do for these registers when a byte-wide write action is made, the written values are ignored. * The INT pin which stays at logic “0” will be released to logic “1” when both of this control register (CR6) and SLIC 2 control register (CR13) are read. B7 to B5 … Operation mode setting for SLIC1 The F2_1 to F0_1 bits determine the output level for the Fn_1 pins. For more details, refer to Table 6. When each bit is cleared (“0”), the corresponding Fn_1 pin outputs a logic “0”. When each bit is set (“1”), the corresponding Fn_1 pin outputs a logic “1”. B4 … Uncommitted switch control for SLIC1 0 : switch on 1 : switch off This bit determines the output level for the SWC1 pin. When this bit is cleared, the SWC1 pin outputs a logic “0”. When this bit is set, the pin outputs a logic “1”. When the SLIC connected to CH1 is the Intersil RSLICTM series, the SLIC’s internal uncommitted switch, located between the SW+ pin and the SW- pin, can be controlled by inputting the output from the SWC1 pin directly into the corresponding input pin of the SLIC device. B3 … Battery mode select for SLIC1 0 : low battery mode 1 : high battery mode This bit determines the output level for the BSEL1 pin. When this bit is cleared, the BSEL1 pin outputs a logic “0”. When this bit is set, the pin outputs a logic “1”. When the SLIC connected to CH1 is from the Intersil RSLICTM series, the SLIC’s battery mode selection is possible by inputting the output from the BSEL1 pin directly into the corresponding input pin of the SLIC device. B2 … Detector mode selection for SLIC1 This bit determines the output level for the E0_1 pin. When this bit is cleared, the E0_1 pin outputs a logic “0”. When this bit is set, the pin outputs a logic “1”. When a SLIC connected to CH1 is Intersil RSLICTM series, the SLIC’s detector mode selection is possible by connecting the E0_1 pin directly to the corresponding input pin of the SLIC device. The event detected by the SLIC is determined by the combination of the F2_1, the F1_1, the F0_1 and the E0_1 pins as shown in Table 6. The output level of the E0_1 pin changes 20µs later (hold timer) in the power-on mode with the PDN pin = logic “1”, and 200ns later in the power-down mode with the PDN pin = logic “0” than a change of this bit value. Refer to Figure 6. 32/51 FEDL7033-02 1Semiconductor B1 ML7033 … Event detection indicator for SLIC1 (Read-only bit) 0 : detected 1 : not detected By reading the state of this bit, the input level to the DET1 pin can be known. If this bit is cleared it indicates that the DET1 pin is in the logic “0” state. If this bit is set it indicates that the DET1 pin is in the logic “1” state. When the SLIC connected to channel 1 is from the Intersil RSLICTM series, the DET1 pin can be connected directly to the corresponding output pin of the SLIC device. This allows an assigned event such as off-hook, ring trip, or ground key to be detected. The event detected by the SLIC detects is determined by the F2_1, F1_1, F0_1 (CR6-B7 to B5), and E0_1 (CR6-B2) bits. When the debounce timer is enabled by setting the DET1TIM3 through DET1TIM0 bits (CR4-B3 to B0), the DET1 (CR6-B1) bit is held unchanged for a set period, even when the DET1 input pin changes from logic “1” to logic “0”. B0 detect … Thermal Shutdown Alarm indicator for SLIC1 (Read-only bit) 0 : detect 1 : not By reading this bit, the input level to the ALM1 pin can be known. When this bit is cleared, the ALM1 pin is a logic “0”. When this bit is set, the pin is a logic “1”. When the SLIC connected to channel 1 is from the Intersil RSLICTM series, the ALM1 pin can be connected directly to the corresponding output pin of the SLIC device. This allows the user to know whether the SLIC1 is in the normal operating state, or in the thermal shutdown state. 33/51 FEDL7033-02 1Semiconductor ML7033 CR7 (CH1 Tone generator 2 control 1) B7 CR7 AOUT1 SEL default 0 B6 B5 B4 B3 B2 B1 B0 CH1TG 2 CH1TG 2 CH1TG2 CH1TG2 CH1TG2 CH1TG2 TX TOUT1 LV3 LV2 LV1 LV0 0 0 0 0 0 0 0 B4 B3 B2 B1 B0 CH1TG2 _8 CR8 (CH1 Tone generator 2 control 2) B7 CR8 B6 B5 CH1TG2 _7 CH1TG2 _6 CH1TG2 _5 CH1TG2 _4 CH1TG2 _3 CH1TG2 _2 CH1TG2 _1 CH1TG2 _0 CR7-B7 … AOUT1P, AOUT1N output select 0 : Single-ended output with the AOUT1P pin with the AOUT1N pin at high impedance 1 : Differential output with the AOUT1P and the AOUT1N pins B6 … CH1 tone generator output select 0 : to Rx side 1 : to Tx side B5 … CH1 tone generator Rx side output pin select 0 : AOUT1 pin 1 : TOUT1 pin B4 to B1 … CH1 Tone Generator 2 (TG2) output level setting This 4-bit field defines the output level for TG2 on CH1 as shown in Table 10. Table 10 TG2 Level Setting B4 (TG2LV3) B3 (TG2LV2) B2 (TG2LV1) B1 (TG2LV0) Level (dBm0) 0 0 0 0 OFF 0 0 0 1 –12.0 0 0 1 0 –11.0 0 0 1 1 –10.0 0 1 0 0 –9.0 0 1 0 1 –8.0 0 1 1 0 –7.0 0 1 1 1 –6.0 1 0 0 0 –5.0 1 0 0 1 –4.0 1 0 1 0 –3.0 1 0 1 1 –2.0 1 1 0 0 –1.0 1 1 0 1 0.0 1 1 1 0 +1.0 1 1 1 1 +2.0 34/51 FEDL7033-02 1Semiconductor ML7033 CR7-B0, CR8-B7 to B0 … CH1 Tone Generator 2 (TG2) Frequency Select These bits define the output frequency from TG2 on CH1. The frequency is between 300 and 3400Hz at 10Hz intervals. The values written to these bits determine the frequency as shown in the following equation. Refer to Table 11. Binary data for CR7-B0, CR8-B7 to B0 = (Output Frequency [Hz])/10 Below is an example of how these bits are programmed when the intended frequency is 1500Hz; Ex) (Output Frequency [Hz])/10 = 1500/10 = 150d = 10010110b Bits to set in CR7-B0, CR8-B7 to B0 = (0,1,0,0,1,0,1,1,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 300 and 3400 Hz. Table 11 Tone Generator Frequency Setting Frequency (Hz) decimal hex 300 30 01Eh 310 31 01Fh 320 32 020h : : : 400 40 410 41 : CR7 CR8 B0 B7 B6 B5 B4 B3 B2 B1 B0 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 1 1 1 0 0 0 1 0 0 0 0 0 : : : : : : : : : 028h 0 0 0 1 0 1 0 0 0 029h 0 0 0 1 0 1 0 0 1 : : : : : : : : : : : 1000 100 064h 0 0 1 1 0 0 1 0 0 1010 101 065h 0 0 1 1 0 0 1 0 1 : : : : : : : : : : : : 2000 200 0C8h 0 1 1 0 0 1 0 0 0 : : : : : : : : : : : : 3000 300 12Ch 1 0 0 1 0 1 1 0 0 : : : : : : : : : : : : 3390 339 153h 1 0 1 0 1 0 0 1 1 3400 340 154h 1 0 1 0 1 0 1 0 0 35/51 FEDL7033-02 1Semiconductor ML7033 CR9 (CH1 tone generator 1 control1) CR9 B7 B6 B5 B4 B3 B2 B1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 CH1TG1 LV6 LV5 LV4 LV3 LV2 LV1 LV0 0 0 0 0 0 0 0 0 B4 B3 B2 B1 B0 default B0 CH1TG1 _8 CR10 (CH1 tone generator 1 control2) B7 CR10 B6 B5 CH1TG1 _7 CH1TG1 _6 CH1TG1 _5 CH1TG1 _4 CH1TG1 _3 CH1TG1 _2 CH1TG1 _1 CH1TG1 _0 default 0 CR9-B7 to B1 0 0 0 0 0 0 0 … CH1 Tone Generator 1 (TG1) Output Level Setting This 7-bit field defines the output level of TG1 on CH1. The output level can be turned OFF or ON. When turned on, the level is between –12.1 dBm0 and +0.5 dBm0 at 0.1 dBm0 intervals as shown in Table 12. The value written to this field is calculated based on the desired output level as shown in the following equation. Binary data for CR9- B7 to B1 = [(Output Level [dBm0]) + 12.2]*10 The following is an example of how to program this field when the intended output level is –5.8 dBm0; Ex) [(Output Level [dBm0]) + 12.2]*10 = (-5.8 + 12.2)*10 = 64d = 1000000b Bits to set in CR9-B7 to B1 = (1,0,0,0,0,0,0) Table 12 Tone Generator 1 Level Setting B7 TG1LV6 B6 TG1LV5 B5 TG1LV4 B4 TG1LV3 B3 TG1LV2 B2 TG1LV1 B1 TG1LV0 Level (dBm0) 0 0 0 0 0 0 0 OFF 0 0 0 0 0 0 1 –12.1 0 0 0 0 0 1 0 –12.0 0 0 0 0 0 1 1 –11.9 0 0 0 0 1 0 0 –11.8 : : : : : : : : 0 1 1 1 1 1 1 –5.9 1 0 0 0 0 0 0 –5.8 1 0 0 0 0 0 1 –5.7 : : : : : : : : 1 1 1 1 0 1 0 0.0 1 1 1 1 0 1 1 0.1 1 1 1 1 1 0 0 0.2 1 1 1 1 1 0 1 0.3 1 1 1 1 1 1 0 0.4 1 1 1 1 1 1 1 0.5 (= 1.25 Vop) 36/51 FEDL7033-02 1Semiconductor ML7033 CR9-B0, CR10-B7 to B0 …CH1 Tone Generator 1 Output Frequency Select When the CH1RING (CR11-B3) bit is cleared (“0”), these 9 bits determine the output frequency of tone generator 1 on channel 1 to a value between 300 and 3400 Hz at 10Hz intervals. A sample list of frequencies is shown in Table 13. The value programmed into this field is calculated based on the desired frequency using the following equation. Binary data for CR9-B0, CR10-B7 to B0 = (Output Frequency [Hz])/10 The following is an example of how to program this field when the intended frequency is 1500 Hz; Ex) (Output Frequency [Hz])/10 = 1500/10 = 150d = 10010110b Bits to set in CR9-B0, CR10-B7 to B0 = (0,1,0,0,1,0,1,1,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 300 and 3400 Hz. Table 13 Tone Generator Frequency Setting (CH1RING bit = “0”) Frequency (Hz) decimal hex 300 30 310 320 CR9 CR10 B0 B7 B6 B5 B4 B3 B2 B1 B0 01Eh 0 0 0 0 1 1 1 1 0 31 01Fh 0 0 0 0 1 1 1 1 1 32 020h 0 0 0 1 0 0 0 0 0 : : : : : : : : : : : : 400 40 028h 0 0 0 1 0 1 0 0 0 410 41 029h 0 0 0 1 0 1 0 0 1 : : : : : : : : : : : : 1000 100 064h 0 0 1 1 0 0 1 0 0 1010 101 065h 0 0 1 1 0 0 1 0 1 : : : : : : : : : : : : 2000 200 0C8h 0 1 1 0 0 1 0 0 0 : : : : : : : : : : : : 3000 300 12Ch 1 0 0 1 0 1 1 0 0 : : : : : : : : : : : : 3390 339 153h 1 0 1 0 1 0 0 1 1 3400 340 154h 1 0 1 0 1 0 1 0 0 37/51 FEDL7033-02 1Semiconductor ML7033 When the CH1RING (CR11-B3) bit is set (“1”), the CH1TG1_8 (CR9-B0) bit and the CH1TG1_7 to CH1TG1_6 (CR10-B7 to B6) bits are ignored and the CH1TG1_5 to CH1TG1_0 (CR10-B5 to B0) bits are used to define the ringing tone frequency. When the CH1RING (CR11-B3) bit is set, the frequency can be set to a value between 15 Hz and 50 Hz at 1 Hz intervals. The value programmed into this field is calculated based on the desired frequency using the following equation. A partial list of frequencies is shown in Table 14. Binary data for CR10-B5 to B0 = (Output Frequency [Hz]) The following is an example of how to program this field when the intended frequency is 20Hz; Ex) Output Frequency [Hz] = 20d = 010100b Bits to set in CR10-B5 to B0 = (0,1,0,1,0,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 15 and 50Hz. Table 14 Tone Generator Frequency Setting (CH1RING bit = “1”) CR9 CR10 Frequency (Hz) decimal hex B0 B7 B6 B5 B4 B3 B2 B1 B0 15 15 0Fh — — — 0 0 1 1 1 1 16 16 10h — — — 0 1 0 0 0 0 17 17 11h — — — 0 1 0 0 0 1 18 18 12h — — — 0 1 0 0 1 0 19 19 13h — — — 0 1 0 0 1 1 20 20 14h — — — 0 1 0 1 0 0 : : : : : : : : : : : : 48 48 30h — — — 1 1 0 0 0 0 49 49 31h — — — 1 1 0 0 0 1 50 50 32h — — — 1 1 0 0 1 0 38/51 FEDL7033-02 1Semiconductor ML7033 CR11 (Ringing_ON and Trapezoid crest factors control) B7 B6 B5 B4 B3 B2 B1 B0 CR11 CH2 RING CH2TG1 TRP2 CH2TG1 TRP1 CH2TG1 TRP0 CH1 RING CH1TG1 TRP2 CH1TG1 TRP1 CH1TG1 TRP0 default 0 0 0 0 0 0 0 0 B7 … CH2 Tone Generator 1 (TG1) function select 0 : CH2TG1 works as a non-ringing tone generator (300 to 3400 Hz) 1 : CH2TG1 works as a ringing tone generator (15 to 50 Hz) The frequency and level of CH2TG1 are set by CR16 to CR17. B6 to B4 … CH2 ringing tone waveform setting This 3-bit field determines the type of ringing tone waveform for TG1 on CH2. A sinusoidal waveform, or a trapezoidal waveform with a crest factor between 1.225 V and 1.375 V at 0.025 V intervals, can be selected as shown in Table 15. For a definition of ‘crest factor’, refer to Figure 13. These bits are valid when the CH2RING (CR11-B7) bit is set. B3 … CH1 TG1 function select 0 : CH1TG1 works as a non-ringing tone generator (300 to 3400 Hz) 1 : CH1TG1 works as a ringing tone generator (15 to 50 Hz) The frequency and level of CH1TG1 are set by CR9 to CR10. B2 to B0 … CH1 ringing tone waveform setting This 3-bit field determines the type of ringing tone waveform for TG1 on CH1. A sinusoidal waveform, or a trapezoidal waveform with a crest factor between 1.225 V and 1.375 V at 0.025 V intervals, can be selected as shown in Table 15. For a definition of ‘crest factor’, refer to Figure 13. These bits are valid when the CH1RING (CR11-B3) bit is set. Vp a a CrestFactor = 1 / 1 − 4a / 3 1 Figure 13 Ringing Tone Waveform Table 15 Crest Factor Setting B6/B2 B5/B1 B4/B0 TG1 TRP2 TG1 TRP1 TG1 TRP0 0 0 0 OFF 0 0 1 1.225 0 1 0 1.250 0 1 1 1.275 1 0 0 1.300 1 0 1 1.325 1 1 0 1.350 1 1 1 1.375 Crest Factor 39/51 FEDL7033-02 1Semiconductor ML7033 CR12 (CH2 transmit/receive level control) B7 B6 B5 B4 B3 B2 B1 B0 CR12 LV2R3 LV2R2 LV2R1 LV2R0 LV2X3 LV2X2 LV2X1 LV2X0 default 0 0 0 0 0 0 0 0 B7 to B4 … Level setting for CH2 on its receive side This 4-bit field determines the level setting for the CH2 receive side. The settings range from 0 to –14 dBm0 as shown in Table 16. B3 to B0 … Level setting for CH2 on its transmit side This 4-bit field determines the level setting for the CH2 transmit side. The settings range from 0 to –14 dBm0 as shown in Table 16. Table 16 Receive and Transmit Level Setting LV2R3/ LV2X3 LV2R2/ LV2X2 LV2R1/ LV2X1 LV2R0/ LV2X0 Level (dBm0) 0 0 0 0 0.0 0 0 0 1 –1.0 0 0 1 0 –2.0 0 0 1 1 –3.0 0 1 0 0 –4.0 0 1 0 1 –5.0 0 1 1 0 –6.0 0 1 1 1 –7.0 1 0 0 0 –8.0 1 0 0 1 –9.0 1 0 1 0 –10.0 1 0 1 1 –11.0 1 1 0 0 –12.0 1 1 0 1 –13.0 1 1 1 0 –14.0 1 1 1 1 OFF 40/51 FEDL7033-02 1Semiconductor ML7033 CR13 (SLIC 2 control) CR13 B7 B6 B5 B4 B3 B2 B1 B0 F2_2 F1_2 F0_2 SWC2 BSEL2 E0_2 DET2 ALM2 default 0 0 0 0 0 0 * CR13-B1 and B0 are read-only bits. Though either of “0” or “1” will do for these registers when a byte-wide write action is made, the written values are ignored. * The INT pin which stays at logic “0” will be released to logic “1” when both of this control register (CR13) and SLIC 1 control register (CR6) are read. B7 to B5 … Operation mode setting for SLIC2 This 3-bit field determines the output level of the Fn_2 pins. For more detail, refer to Table 6. When any of these bits are cleared, the corresponding Fn_2 pin outputs a logic “0”. When any of these bits are set, the corresponding Fn_2 pin outputs a logic “1”. B4 … Uncommitted switch control for SLIC2 0 : switch on 1 : switch off This bit determines the output level of the SWC2 pin. When this bit is cleared, the SWC2 pin outputs a logic “0”. When this bit is set, the SWC2 pin outputs a logic “1”. When the SLIC connected to channel 2 is an Intersil RSLICTM series device, the internal uncommitted switch of the SLIC, located between the SW+ and the SW- pins, can be controlled by connecting the SWC2 pin directly to the corresponding input pin of the SLIC device. B3 … Battery mode select for SLIC2 0 : low battery mode 1 : high battery mode This bit determines the output level for the BSEL2 pin. When this bit is cleared, the BSEL2 pin outputs a logic “0”. When this bit is set, the BSEL2 pin outputs a logic “1”. When the SLIC connected to CH2 is an Intersil RSLICTM series device, the battery mode selection of the SLIC is possible by connecting the BSEL2 pin directly to the corresponding input pin of the SLIC device. B2 … Detector mode selection for SLIC2 This bit determines the output level of the E0_2 pin. When this bit is cleared, the E0_2 pin outputs a logic “0”. When this bit is set, the E0_2 pin outputs a logic “1”. When the SLIC connected to channel 2 is an Intersil RSLICTM series device, the detector mode selection of the SLIC is possible by connecting the E0_2 pin directly to the corresponding input pin of the SLIC device. The event detected by the SLIC is determined by the F2_2, F1_2, F0_2 and E0_2 output pins as shown in Table 6. The output level from the E0_2 pin changes 20 µs later (hold timer) in the power-on mode with the PDN pin = logic “1”, and 200 ns later in the power-down mode with the PDN pin = logic “0” than a change of this bit value. Refer to Figure 6 for more information. 41/51 FEDL7033-02 1Semiconductor B1 ML7033 … Event detection indicator for SLIC2 (Read-only bit) 0 : detected 1 : not detected By reading the state of this bit, the input level to the DET2 pin can be determined. If this bit is cleared, the DET2 pin is a logic “0”. If this bit is set, the DET2 pin is a logic “1”. When the SLIC connected to channel 2 is an Intersil RSLICTM series device, an assigned event of off-hook, ring trip or ground key can be detected by connecting the DET2 pin of the ML7033 directly to the corresponding output pin of the SLIC device. The event detected by the the SLIC is determined by the F2_2, F1_2, F0_2 (CR13-B7 to B5), and E0_2 (CR13-B2) bits. When a debounce timer is enabled by a setting with the DET2TIM3 through DET2TIM0 bits (CR4-B7 to B4), the DET2 (CR13-B1) bit is held unchanged for a set period, even when the DET2 pin changes from a logic “1” to a logic “0”. B0 detect … Thermal Shutdown Alarm indicator for SLIC2 (Read-only bit) 0 : detect 1 : not By reading the state of this bit, the input level to the ALM2 pin can be determined. If this bit is cleared, the ALM2 pin is a logic “0”. If this bit is set, the ALM2 pin is a logic “1”. When the SLIC connected to channel 2 is an Intersil RSLICTM series device, connecting the ALM2 pin directly to the corresponding output pin of the SLIC device allows the ML7033 to know whether the SLIC is in the normal operating mode, or in a thermal shutdown state. 42/51 FEDL7033-02 1Semiconductor ML7033 CR14 (CH2 tone generator 2 control1) B7 CR14 default B6 AOUT2 SEL CH2TG2 TX 0 B5 B4 B3 B2 B1 CH2TG2 CH2TG2 CH2TG2 CH2TG2 CH2TG2 TOUT2 LV3 LV2 LV1 LV0 0 0 0 0 0 0 B4 B3 B2 B1 B0 0 B0 CH2TG2 _8 CR15 (CH2 tone generator 2 control2) B7 CR15 default B6 B5 CH2TG2 _7 CH2TG2 _6 CH2TG2 _5 CH2TG2 _4 CH2TG2 _3 CH2TG2 _2 CH2TG2 _1 CH2TG2 _0 0 0 0 0 0 0 0 0 CR14-B7 … AOUT2P, AOUT2N output select 0 : Single-ended output with the AOUT2P pin with the AOUT2N pin at high impedance. 1 : Differential output with the AOUT2P and the AOUT2N pins. B6 … CH2 tone generator output select 0 : to Rx side 1 : to Tx side B5 … CH2 tone generator Rx side output pin select 0 : AOUT2 pin 1 : TOUT2 pin B4 to B1 … CH2 TG2 output level setting This 4-bit field determines the output level of TG2 on CH2. The output level ranges from – 12 to +2 dBmO as shown in Table 17. Table 17 Tone Generator 2 Level Setting B4 TG2LV3 B3 TG2LV2 B2 TG2LV1 B1 TG2LV0 Level (dBm0) 0 0 0 0 OFF 0 0 0 1 –12.0 0 0 1 0 –11.0 0 0 1 1 –10.0 0 1 0 0 –9.0 0 1 0 1 –8.0 0 1 1 0 –7.0 0 1 1 1 –6.0 1 0 0 0 –5.0 1 0 0 1 –4.0 1 0 1 0 –3.0 1 0 1 1 –2.0 1 1 0 0 –1.0 1 1 0 1 0.0 1 1 1 0 +1.0 1 1 1 1 +2.0 43/51 FEDL7033-02 1Semiconductor ML7033 CR14-B0, CR15-B7 to B0… CH2 TG2 frequency select These 9 bits define the output frequency for TG2 on CH2. The frequency range is between 300 and 3400 Hz in 10 Hz intervals as shown in Table 18. The output frequency is calculated using the following formula: Binary data for CR14-B0, CR15-B7 to B0 = (Output Frequency [Hz])/10 The following example shows how to program the output frequency when the intended frequency is 1500 Hz; Ex) (Output Frequency [Hz]) / 10 = 1500/10 = 150d = 10010110b Bits to set in CR14-B0, CR15-B7 to B0 = (0,1,0,0,1,0,1,1,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 300 and 3400 Hz. Table 18 Tone Generator Frequency Setting Frequency (Hz) decimal hex 300 30 01Eh 310 31 01Fh 320 32 020h CR14 CR15 B0 B7 B6 B5 B4 B3 B2 B1 B0 0 0 0 0 1 1 1 1 0 0 0 0 0 1 1 1 1 1 0 0 0 1 0 0 0 0 0 : : : : : : : : : : : : 400 40 028h 0 0 0 1 0 1 0 0 0 410 41 029h 0 0 0 1 0 1 0 0 1 : : : : : : : : : : : : 1000 100 064h 0 0 1 1 0 0 1 0 0 1010 101 065h 0 0 1 1 0 0 1 0 1 : : : : : : : : : : : : 2000 200 0C8h 0 1 1 0 0 1 0 0 0 : : : : : : : : : : : : 3000 300 12Ch 1 0 0 1 0 1 1 0 0 : : : : : : : : : : : : 3390 339 153h 1 0 1 0 1 0 0 1 1 3400 340 154h 1 0 1 0 1 0 1 0 0 44/51 FEDL7033-02 1Semiconductor ML7033 CR16 (CH2 tone generator 1 control1) CR16 B7 B6 B5 B4 B3 B2 B1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 CH2TG1 LV6 LV5 LV4 LV3 LV2 LV1 LV0 0 0 0 0 0 0 0 0 B4 B3 B2 B1 B0 default B0 CH2TG1 _8 CR17 (CH2 tone generator 1 control2) B7 CR17 B6 B5 CH2TG1 _7 CH2TG1 _6 CH2TG1 _5 CH2TG1 _4 CH2TG1 _3 CH2TG1 _2 CH2TG1 _1 CH2TG1 _0 default 0 0 0 0 0 0 0 0 CR16-B7 to B1 … CH2 TG1 output level setting This 7-bit field defines the output level of tone generator 1 on channel 2. The output level ranges from –12.1 to +0.5 dBm0 in 0.1 dBm0 intervals as shown in Table 19. A value of 0 in this field disables the tone generator. The output level is calculated using the following formula. Binary data for CR16- B7 to B1 = [(Output Level [dBm0]) + 12.2]*10 The following example shows how to program this field when the intended output level is – 5.8 dBm0; Ex) [(Output Level [dBm0]) + 12.2]*10 = (–5.8 + 12.2)*10 = 64d = 1000000b Bits to set in CR9-B7 to B1 = (1,0,0,0,0,0,0) Table 19 Tone Generator 1 Level Setting B7 TG1LV6 B6 TG1LV5 B5 TG1LV4 B4 TG1LV3 B3 TG1LV2 B2 TG1LV1 B1 TG1LV0 Level (dBm0) 0 0 0 0 0 0 0 OFF 0 0 0 0 0 0 1 –12.1 0 0 0 0 0 1 0 –12.0 0 0 0 0 0 1 1 –11.9 0 0 0 0 1 0 0 –11.8 : : : : : : : : 0 1 1 1 1 1 1 –5.9 1 0 0 0 0 0 0 –5.8 1 0 0 0 0 0 1 –5.7 : : : : : : : : 1 1 1 1 0 1 0 0.0 1 1 1 1 0 1 1 0.1 1 1 1 1 1 0 0 0.2 1 1 1 1 1 0 1 0.3 1 1 1 1 1 1 0 0.4 1 1 1 1 1 1 1 0.5 (= 1.25 Vop) 45/51 FEDL7033-02 1Semiconductor ML7033 CR16-B0, CR17-B7 to B0 … CH2 TG1 frequency select When the CH2RING (CR11-B7) bit is cleared, this 9-bit field is valid and determines the output frequency from tone generator 1 on channel 2. The frequency range is between 300 and 3400 Hz at 10 Hz intervals as shown in Table 20. The output level is calculated using the following formula. Binary data for CR16-B0, CR17-B7 to B0 = (Output Frequency [Hz])/10 The following is an example of how to program this register field when the intended frequency is 1500 Hz; Ex) (Output Frequency [Hz]) / 10 = 1500/10 = 150d = 10010110b Bits to set in CR16-B0, CR17-B7 to B0 = (0,1,0,0,1,0,1,1,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 300 and 3400 Hz. Table 20 Tone Generator Frequency Setting (CH2RING bit = “0”) Frequency (Hz) decimal hex 300 30 310 31 320 32 CR16 CR17 B0 B7 B6 B5 B4 B3 B2 B1 B0 01Eh 0 0 0 0 1 1 1 1 0 01Fh 0 0 0 0 1 1 1 1 1 020h 0 0 0 1 0 0 0 0 0 : : : : : : : : : : : : 400 40 028h 0 0 0 1 0 1 0 0 0 410 41 029h 0 0 0 1 0 1 0 0 1 : : : : : : : : : : : : 1000 100 064h 0 0 1 1 0 0 1 0 0 1010 101 065h 0 0 1 1 0 0 1 0 1 : : : : : : : : : : : : 2000 200 0C8h 0 1 1 0 0 1 0 0 0 : : : : : : : : : : : : 3000 300 12Ch 1 0 0 1 0 1 1 0 0 : : : : : : : : : : : : 3390 339 153h 1 0 1 0 1 0 0 1 1 3400 340 154h 1 0 1 0 1 0 1 0 0 When the CH2RING (CR11-B7) bit is set, the setting of the CH2TG1_8 (CR16-B0) bit and the CH2TG1_7 to CH2TG1_6 (CR16-B7 to B6) bits are ignored, and the CH2TG1_5 to CH2TG1_0 (CR16-B5 to B0) field defines the ringing tone frequency. When the CH2RING (CR11-B7) bit is set, the frequency range is between 15 and 50 at 1 Hz intervals as shown in Table 21. The output frequency is calculated using the following formula. Binary data for CR17-B5 to B0 = (Output Frequency [Hz]) 46/51 FEDL7033-02 1Semiconductor ML7033 The following example shows how to program this register field when the intended frequency is 20 Hz; Ex) Output Frequency [Hz] = 20d = 010100b Bits to set in CR17-B5 to B0 = (0,1,0,1,0,0) Note that the operations are not guaranteed when these bits define a frequency out of a band between 15 and 50 Hz. Table 21 Tone Generator Frequency Setting (CH2RING bit = “1”) Frequency (Hz) decimal hex 15 15 16 17 CR16 CR17 B0 B7 B6 B5 B4 B3 B2 B1 B0 0Fh — — — 0 0 1 1 1 1 16 10h — — — 0 1 0 0 0 0 17 11h — — — 0 1 0 0 0 1 18 18 12h — — — 0 1 0 0 1 0 19 19 13h — — — 0 1 0 0 1 1 20 20 14h — — — 0 1 0 1 0 0 : : : : : : : : : : : : 48 48 30h — — — 1 1 0 0 0 0 49 49 31h — — — 1 1 0 0 0 1 50 50 32h — — — 1 1 0 0 1 0 47/51 FEDL7033-02 1Semiconductor ML7033 CR18 (Test control) B7 B6 B5 B4 B3 B2 B1 B0 CR18 CH2 LOOP1 CH2 LOOP0 CH1 LOOP1 CH1 LOOP0 TEST3 TEST2 TEST1 TEST0 default 0 0 0 0 0 0 0 0 B7, B6 … CH2 loop-back test mode select (B7, B6): (0, 0) = Loop-back OFF (0, 1) = Loop-back OFF (1, 0) = Channel 2 digital loop-back test. PCM data output on the PCMOUT pin during normal operation is internally looped back through the Receive path via the PCMIN pin. In digital loop-back test mode, input data on PCMIN pin is ignored, but PCM data continues to be output on the PCMOUT pin. (1, 1) = Channel 2 analog loop-back test. Analog signals output on the AOUT2P pin (or the AOUT2P and AOUT2N pins) are internally looped back to the transmit path behind a built-in feedback amplifier located after the AIN2P, AIN2N and GSX2 pins. In this mode, the AIN2P and AIN2N input pins are ignored. However, analog signals continue to be output on the AOUT2P pin (or the AOUT2P and the AOUT2N pins). A loop-back test is functional only if XSYNC and RSYNC are from the same clock source. B5, B4 … CH1 loop-back test mode select (B5, B4): (0, 0) = Loop-back OFF (0, 1) = Loop-back OFF (1, 0) = Channel 1 digital loop-back test. PCM data is output on the PCMOUT pin in normal operation is internally looped back through the Receive path via the PCMIN pin. In loop-back test mode, input data on PCMIN pin is ignored. However, PCM data can be output on the PCMOUT pin. (1, 1) = Channel 1 analog loop-back test. Analog signals output on the AOUT1P pin (or from the AOUT1P and the AOUT1N pins) are internally looped back to the transmit path via a built-in feedback amplifier located after the AIN1P, AIN1N and GSX1 pins. In this mode, the AIN1P and AIN1N input pins are ignored. However, analog signals can be output from the AOUT1P pin (or from the AOUT1P and the AOUT1N pins). A loop-back test is functional if XSYNC and RSYNC are from the same clock source. B3 to B0 … LSI test registers for an LSI manufacturer The default alternation is prohibited. When a write action is executed for CR18, set all of these bits to “0”. 48/51 FEDL7033-02 1Semiconductor ML7033 CR19 (LSI manufacturer’s test control) B7 B6 B5 B4 B3 B2 B1 B0 CR19 TEST11 TEST10 TEST9 TEST8 TEST7 TEST6 TEST5 TEST4 default 0 0 0 0 0 0 0 0 B7 to B0 … LSI test registers for an LSI manufacturer For manufacturing use only. Both reads and writes to this register are prohibited. 49/51 FEDL7033-02 1Semiconductor ML7033 PACKAGE DIMENSIONS (Unit: mm) QFP64-P-1414-0.80-BK Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (J5µm) 0.87 TYP. 6/Feb. 23, 2001 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 50/51 FEDL7033-02 1Semiconductor ML7033 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-todate. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2001 Oki Electric Industry Co., Ltd. 51/51