FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J 8M–Word × 32–Bit or 16M–Word × 16–Bit Page Mode FEATURES ·8,388,608-word × 32-bit/16,777,216-word × 16-bit electrically switchable configuration ·Page size of 8-word x 32-Bit or 16-word x 16-Bit · 3.0 V to 3.6 V power supply ·Random Access time 120 ns MAX ·Page Access time 35 ns MAX · Operating current 100 mA MAX · Standby current 50 µA MAX · Input/Output TTL compatible · Three-state output Issue Date: Jul. 9, 2004 P2ROM PIN CONFIGURATION (TOP VIEW) A0 1 70 A22 A1 2 69 A21 A2 3 68 A20 A3 4 67 WORD# A4 5 66 OE# A5 6 65 CE# Vcc 7 64 Vss D0 8 D16 9 D1 10 PACKAGES · MR26V25655J-xxxMB 70-pin plastic SSOP (P-SSOP70-500-0.80-K-MC) 63 D31/A-1 62 D15 61 D30/A-1 D17 11 60 D14 Vss 12 59 Vss Vcc 13 58 Vcc D2 14 57 D29 D18 15 56 D13 D3 16 55 D28 D19 17 54 D12 D4 18 53 D27 D20 19 52 D11 D5 20 51 D26 D21 21 50 D10 Vss 22 49 Vss Vcc 23 48 Vcc D6 24 47 D25 D22 25 D7 26 46 D9 45 D24 D23 27 44 D8 Vss 28 43 Vcc A6 29 42 A19 A7 30 41 A18 A8 31 40 A17 A9 32 39 A16 A10 33 38 A15 A11 34 37 A14 A12 35 36 A13 1/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM BLOCK DIAGRAM A–1(D30/A-1[61] AND D31/A-1[63]) CE# OE# CE OE WORD# Memory Cell Matrix 8M × 32-Bit or 16M × 16-Bit Column Decoder Address Buffer A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 Row Decoder × 16/× 32 Switch Multiplexer Output Buffer D0 D2 D4 D6 D8 D10 D12 D14 D16 D18 D20 D22 D24 D26 D28 D30 D1 D3 D5 D7 D9 D11 D13 D15 D17 D19 D21 D23 D25 D27 D29 D31 In16-bit output mode, these pins are placed in a high-Z state and pin D31,D30 functions as the A-1 address pin. PIN DESCRIPTIONS Pin name D31 / A–1,D30/A-1 Functions Data output / Address input A0 to A22 Address inputs D0 to D29 Data outputs CE# Chip enable input OE# Output enable input WORD# Word -Byte select input VCC Power supply voltage VSS Ground 2/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM FUNCTION TABLE Mode CE# OE# WORD# Read (32-Bit) L L H Read (16Bit) L L Output disable L H Standby H ∗ VCC D0 to D15 D16 to D29 D30/A–1,D31/A-1 DOUT L DOUT H Hi–Z Hi–Z 3.3 V L L/H H ∗ Hi–Z L ∗ ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Operating temperature under bias Ta Storage temperature Condition — Tstg Input voltage VI relative to VSS Value Unit 0 to 70 °C –55 to 125 °C –0.5 to VCC+0.5 V –0.5 to VCC+0.5 V –0.5 to 5 V Output voltage VO Power supply voltage VCC Power dissipation per package PD Ta = 25°C 1.0 W Output short circuit current IOS — 10 mA RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol VCC power supply voltage VCC Input “H” level VIH Input “L” level VIL Condition Min. Typ. Max. Unit 3.0 — 3.6 V 2.2 — VCC+0.5∗ V –0.5∗∗ — 0.6 V VCC = 3.0 to 3.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE (VCC = 3.3 V, Ta = 25°C, f = 1 MHz) Parameter Symbol Input CIN1 WORD# CIN2 Output COUT Condition VI = 0 V VO = 0 V Min. Typ. Max. — — 30 — — 400 — — 20 Unit pF 3/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) Symbol Condition Min. Typ. Max. Unit Input leakage current Parameter ILI VI = 0 to VCC — — 20 µA Output leakage current ILO VO = 0 to VCC — — 20 µA VCC power supply current ICCSC CE# = VCC — — 50 µA (Standby) ICCST CE# = VIH — — 1 mA — — 100 mA VCC power supply current (Read) CE# = VIL ICCA1 OE# = VIH tc = 200 ns Input “H” level VIH — 2.2 — VCC+0.5∗ V Input “L” level VIL — –0.5∗∗ — 0.6 V Output “H” level VOH IOH = –2 mA 2.4 — — V Output “L” level VOL IOL = 2 mA — — 0.4 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C) Parameter Symbol Address cycle time Condition Min. Max. Unit tC — 120 — ns Address access time tACC CE# = OE# = VIL — 120 ns Page cycle time tPC — 35 — ns Page access time tPAC CE# = OE# = VIL — 35 ns CE# access time tCE OE# = VIL — 120 ns OE# access time tOE CE# = VIL — 30 ns Output disable time Output hold time tCHZ OE# = VIL 0 20 ns tOHZ CE# = VIL 0 20 ns tOH CE# = OE# = VIL 0 — ns Measurement conditions Input signal level-------------------------------- 0 V/3 V Input timing reference level ------------------ 1/2Vcc Output load -------------------------------------- 50 pF Output timing reference level---------------- 1/2Vcc Output load Output 50 pF (Including scope and jig) 4/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM TIMING CHART (READ CYCLE) Random Access Mode Read Cycle tC tC Address tOH tACC tCE CE# tCHZ tOE tOH OE# tOHZ tACC Dout Valid Data Valid Data Hi-Z Hi-Z Page Access Mode Read Cycle tC A3 to A22 tPC tPC A-1 to A2 (x16 mode) A0 to A2 (x32 mode) tCE tOH CE# tOE tCHZ OE# tACC tPAC tPAC tOHZ Dout Hi-Z Hi-Z 5/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM PACKAGE DIMENSIONS (Unit: mm) P-SSOP70-500-0.80-K-MC 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 2.15 TYP. 1/Nov. 13, 2002 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 6/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM REVISION HISTORY Document No. FEDR26V25655J-02-01 FEDR26V25655J-02-02 Page Date May. 2003 Jun., 2003 Description Previous Edition Current Edition – – 1, 4 4 4 4 1, 4 4 4 4 5 5 Change Timing Chart description Final edition 1 Change tPAC to 30ns from 35ns Change VOH Condition to IOH = –2 mA Change tOE, tCHZ to 30ns from 40ns Change tOHZ, to 25ns from 35ns FEDR26V25655J-02-03 Jan.15, 2004 4 4 Change tCHZ, tOHZ to 20ns FEDR26V25655J-02-04 Mar.26, 2004 1, 4 1, 4 Change tPC, tPAC to 35ns FEDR26V25655J-02-05 Jun. 8, 2004 3 3 Change CIN1, COUT to 30pF,20pF FEDR26V25655J-02-06 Jul. 9, 2004 3 3 Add PD condition and IOS = 10mA 7/8 FEDR26V25655J-02-06 OKI Semiconductor MR26V25655J / P2ROM NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 8/8