E2E0008-38-94 ¡ Semiconductor MSM5052 ¡ Semiconductor This version: Sep. 1998 MSM5052 Previous version: Mar. 1996 Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller GENERAL DESCRIPTION The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring circuit. Using an on-chip ROM reduces power consumption. The MSM5052 is widely used in electronic products requiring low-power operation, for example, thermometer and clinical thermometer. FEATURES • Low power consumption • Internal ROM • Internal RAM • I/O port Input port Output port : 1280 ¥ 14 bits : 62 ¥ 4 bits : 2 ports ¥ 4 bits : 1 port ¥ 4 bits 1 port ¥ 1 bit • 4 ¥ 4 key matrix input is available by using K1 to K4 and M1 to M4 • 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments) • 42 instructions • Minimum instruction execution time : 122.1 ms (Display instruction cycle: 244.2 ms) • 1.5 V operating voltage (Built-in LCD drive voltage doubler) • Buzzer function • Built-in thermistor-based temperature measuring circuit • Crystal oscillator : 32.768 kHz • Package options: 56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K) 56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K) 80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK) Chip (Chip size 4.77 mm ¥ 4.36 mm) : (Product name : MSM5052-¥¥¥) ¥¥¥ indicates a code number. 1/12 BD MPX DATA RAM 62 ¥ 4 bits DOUT0 to DOUT3 ACC A6 to A4 A3 to A0 ¡ Semiconductor BUZZER DRIVER BLOCK DIAGRAM DIN0 to DIN3 MPX LD OUTPUT PORT M1 to M4 OUTPUT PORT (M1-M4) K1 to K4 INPUT PORT (K1-K4) S1 to S4 INPUT PORT (S1-S4) C Z P REGISTER ALU MPX MPX FMT REGISTER DISPLAY LATCH and DRIVER PROGRAM COUNTER DOUT13 to DOUT0 A0 to A10 PROGRAM ROM 1280 ¥ 14 bits SEGMENT OUT 1 to SEGMENT OUT 26 COM 1 COM 2 INSTRUC -TION DECODER COUNTER XT XT TIMING GENERATOR 2/12 OSC OSC OSC OSC TH R C IN VDD VSS1VSS2 VCP VCM RESET T1 T2 T3 T4 T5 MSM5052 RC OSCILLATOR ¡ Semiconductor MSM5052 43 NC 44 VSS1 45 VSS2 46 BD 47 T5 48 T4 49 VDD 51 T1 50 T2 52 T3 53 COM1 54 SEG1 55 SEG2 56 SEG3 PIN CONFIGURATION (TOP VIEW) SEG4 1 42 NC SEG6 2 41 OSC TH SEG8 3 40 OSC R SEG18 10 33 LD SEG20 11 32 M4 SEG21 12 31 M3 SEG22 13 30 M2 SEG23 14 29 M1 S4 28 34 K1 S3 27 SEG15 S2 26 35 K2 9 S1 25 8 VCM 24 36 K3 VCP 23 SEG13 SEG14 VDD 21 RESET 22 37 K4 7 XT 20 6 NC 19 SEG12 XT 18 38 OSC C COM2 17 39 OSC IN 5 SEG25 16 4 SEG24 15 SEG9 SEG10 NC: No-connection pin 56-Pin Plastic QFP Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package pins. 3/12 ¡ Semiconductor MSM5052 65 VSS1 66 VSS2 67 VDD 68 BD 69 T5 70 T4 71 T2 72 NC 73 T1 74 T3 75 NC 76 NC 77 NC 78 COM1 79 SEG1 80 SEG2 PIN CONFIGURATION (TOP VIEW) (continued) SEG3 1 64 NC SEG4 2 63 NC SEG5 3 62 OSC TH SEG6 4 61 NC SEG7 5 60 OSC R SEG8 6 59 NC SEG20 19 46 M2 SEG21 20 45 NC SEG22 21 44 M1 SEG23 22 43 NC SEG24 23 42 NC SEG25 24 41 S4 40 M3 S3 47 S2 SEG19 18 39 M4 38 48 S1 SEG18 17 37 LD NC K1 49 36 50 SEG17 16 VCM SEG16 15 NC NC 35 51 34 SEG15 14 VCP K2 33 52 RESET SEG14 13 32 K3 VDD NC 53 NC 54 NC 12 31 SEG13 11 30 K4 NC 55 29 SEG12 10 XT OSC C 28 56 NC 9 XT SEG11 27 NC 26 OSC IN 57 COM2 58 8 25 7 SEG26 SEG9 SEG10 NC: No-connection pin 80-Pin Plastic QFP 4/12 ¡ Semiconductor MSM5052 PAD CONFIGURATION SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG13 SEG12 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG21 SEG20 SEG22 SEG23 Pad Layout SEG24 SEG3 SEG25 SEG2 SEG26 SEG1 COM2 COM1 XT NC XT T3 VDD T1 RESET VCP T2 T4 T5 VCM S1 BD VDD S2 VSS2 S3 VSS1 S4 M1 M2 M3 M4 LD K1 K2 K3 K4 OSC C OSC IN OSC R OSC TH Chip size 4.77 ¥ 4.36 (mm) 5/12 ¡ Semiconductor MSM5052 PIN DESCRIPTIONS Symbol Description VDD Ground. VSS1 Power source (–1.5 V). VSS2 Power source for LCD driver (–3.0 V). This pin is connected to the VDD pin through a 0.1 mF capacitor. VCP, VCM Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor. XT, XT Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins. T1 to T5 RESET BD Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins are normally open. Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052 can be reset by this pin. Buzzer output. OSC TH, OSC R, Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor, OSC C, OSC IN thermistor, and capacitor connection pins. 6/12 ¡ Semiconductor MSM5052 ABSOLUTE MAXIMUM RATINGS Parameter Symbol Condition Rating Unit Power Supply Voltage VSS1-VDD Ta = 25°C –2.0 to +0.3 V Input Voltage VIN Ta = 25°C VSS1 – 0.3 to +0.3 V Storage Temperature TSTG — –55 to +125 °C Operating Temperature Top — –20 to +75 °C ELECTRICAL CHARACTERISTICS DC Characteristics (VDD = 0 V, VSS1 = –1.55 V, VSS2 = –3.0 V, C1 = 30 pF, Ta = 25°C) Parameter VSS1 Operating Voltage Symbol VSS1 Power Supply Current 1 IDD1 Power Supply Current 2 IDD2 Oscillation Start Voltage VOSC Condition Min. Typ. Max. Unit VSS1 pin –1.65 –1.55 –1.25 V — 3.0 *1 — mA — 100 *2 — mA — — –1.45 V — –4 Temperature sampling off (Refer to measuring circuit) Temperature sampling on (Refer to measuring circuit) Within 10 seconds, VSS1 pin (Refer to measuring circuit) IOH1 VOH1 = –0.2 V — IOM1 VOM1 = VSS1 ±0.2 V –4 — +4 IOL1 VOL1 = –2.8 V 4 — — Output Current 2 IOH2 VOH2 = –0.2 V — — –0.4 SEGMENT IOL2 VOL2 = –2.8 V 0.4 — — Output Current 3 IOH3 VOH3 = –0.4 V — — –400 C, R, TH IOL3 VOL3 = –1.15 V 400 — — Output Current 4 IOH4 VOH4 = –0.4 V — — –100 M1-M4, LD IOL4 VOL4 = –1.15 V 10 — — Output Current 5 IOH5 VOH5 = –0.4 V –200 — –50 BD IOL5 VOL5 = –1.15 V 3 — — Input Current IIH VIN = 0 V 3 — 30 S1-S4, K1-K4 IIL VIN = –1.55 V –0.2 — — Built-in CD Capacitance CD — — 25 — Output Current 1 COM mA mA mA mA mA mA pF *1 The typ. value varies depending on the application program. *2 The typ. value varies depending on the application program and RC thermistor to be used. 7/12 ¡ Semiconductor MSM5052 Measuring circuit C4 VCP OSC IN VCM OSC C R1 R2 MSM5052 OSC R C2 XT OSC TH Crystal 32.768 kHz XT C1 VSS1 VDD VSS2 C1 C2, C3 C4 R1, R2 : 20 pF : 0.1 mF : 3000 pF : 10 kW C3 A V 8/12 ¡ Semiconductor MSM5052 APPLICATION CIRCUIT LCD TH COM2 OSC TH SEGMENTS COM1 OSC R R1 R2 C1 OSC IN OSC C MSM5052 C2 32.768 kHz C3 C4 HI Alarm output LO M4 LD Data Serial data Latch BD XT (CD = 25 pF) XT VCP VCM VSS2 S4 S2 M1 M2 VSS1 VDD S1 RESET K2 K3 K1 S4 Piezo *1 *2 C/F S2 S1 *1 Inner switch or pad on PCB *2 Bonding option 1 2 3 4 R1 : 33 kW R2 : 20 kW TH : 40BT-5 40 kW ±10% at 25°C B = 3550 ±2% C1 C2 C3 C4 5 : : : : 680 pF 5 to 35 pF 0.1 mF 0.1 mF 1 Thermometer one-second sampling 2 Thermometer 10-second sampling 3 The highest temperature alarm 4 The lowest temperature alarm 5 Clock 9/12 ¡ Semiconductor MSM5052 PACKAGE DIMENSIONS (Unit : mm) QFP56-P-910-0.65-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.36 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/12 ¡ Semiconductor MSM5052 (Unit : mm) QFP56-P-910-0.65-2K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.43 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 11/12 ¡ Semiconductor MSM5052 (Unit : mm) QFP80-P-1420-0.80-BK Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Epoxy resin 42 alloy Solder plating 5 mm or more Package weight (g) 1.27 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 12/12