OKI MSM5052-XXXGS-2K

E2E0008-38-94
¡ Semiconductor
MSM5052
¡ Semiconductor
This version: Sep.
1998
MSM5052
Previous version: Mar. 1996
Built-in Temperature Circuit and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM5052 is a low-power microcontroller manufactured in complementary metal-oxide
semiconductor technology. Integrated into a single chip are ROM, RAM, crystal oscillator, voltage
doubler, timer, LCD driver, input port, output port, and thermistor-based temperature measuring
circuit.
Using an on-chip ROM reduces power consumption.
The MSM5052 is widely used in electronic products requiring low-power operation, for
example, thermometer and clinical thermometer.
FEATURES
• Low power consumption
• Internal ROM
• Internal RAM
• I/O port
Input port
Output port
: 1280 ¥ 14 bits
: 62 ¥ 4 bits
: 2 ports ¥ 4 bits
: 1 port ¥ 4 bits
1 port ¥ 1 bit
• 4 ¥ 4 key matrix input is available by using K1 to K4 and M1 to M4
• 26 LCD drivers (1/2 duty, 1/2 bias, 52 segments)
• 42 instructions
• Minimum instruction execution time
: 122.1 ms (Display instruction cycle: 244.2 ms)
• 1.5 V operating voltage (Built-in LCD drive voltage doubler)
• Buzzer function
• Built-in thermistor-based temperature measuring circuit
• Crystal oscillator
: 32.768 kHz
• Package options:
56-pin plastic QFP (QFP56-P-910-0.65-K) : (Product name : MSM5052-¥¥¥GS-K)
56-pin plastic QFP (QFP56-P-910-0.65-2K) : (Product name : MSM5052-¥¥¥GS-2K)
80-pin plastic QFP (QFP80-P-1420-0.80-BK): (Product name : MSM5052-¥¥¥GS-BK)
Chip (Chip size 4.77 mm ¥ 4.36 mm)
: (Product name : MSM5052-¥¥¥)
¥¥¥ indicates a code number.
1/12
BD
MPX
DATA RAM
62 ¥ 4 bits
DOUT0
to
DOUT3
ACC
A6 to A4
A3 to A0
¡ Semiconductor
BUZZER
DRIVER
BLOCK DIAGRAM
DIN0
to
DIN3
MPX
LD
OUTPUT
PORT
M1 to M4
OUTPUT
PORT
(M1-M4)
K1 to K4
INPUT
PORT
(K1-K4)
S1 to S4
INPUT
PORT
(S1-S4)
C
Z
P
REGISTER
ALU
MPX
MPX
FMT
REGISTER
DISPLAY
LATCH
and
DRIVER
PROGRAM
COUNTER
DOUT13 to DOUT0
A0
to
A10
PROGRAM ROM
1280 ¥ 14 bits
SEGMENT
OUT 1
to
SEGMENT
OUT 26
COM 1
COM 2
INSTRUC
-TION
DECODER
COUNTER
XT
XT
TIMING
GENERATOR
2/12
OSC OSC OSC OSC
TH R C IN
VDD VSS1VSS2 VCP VCM
RESET T1 T2 T3 T4 T5
MSM5052
RC
OSCILLATOR
¡ Semiconductor
MSM5052
43 NC
44 VSS1
45 VSS2
46 BD
47 T5
48 T4
49 VDD
51 T1
50 T2
52 T3
53 COM1
54 SEG1
55 SEG2
56 SEG3
PIN CONFIGURATION (TOP VIEW)
SEG4
1
42 NC
SEG6
2
41 OSC TH
SEG8
3
40 OSC R
SEG18
10
33 LD
SEG20
11
32 M4
SEG21
12
31 M3
SEG22
13
30 M2
SEG23
14
29 M1
S4 28
34 K1
S3 27
SEG15
S2 26
35 K2
9
S1 25
8
VCM 24
36 K3
VCP 23
SEG13
SEG14
VDD 21
RESET 22
37 K4
7
XT 20
6
NC 19
SEG12
XT 18
38 OSC C
COM2 17
39 OSC IN
5
SEG25 16
4
SEG24 15
SEG9
SEG10
NC: No-connection pin
56-Pin Plastic QFP
Note: SEG5, SEG7, SEG11, SEG16, SEG17, SEG19, and SEG26 are not connected to package
pins.
3/12
¡ Semiconductor
MSM5052
65 VSS1
66 VSS2
67 VDD
68 BD
69 T5
70 T4
71 T2
72 NC
73 T1
74 T3
75 NC
76 NC
77 NC
78 COM1
79 SEG1
80 SEG2
PIN CONFIGURATION (TOP VIEW) (continued)
SEG3
1
64
NC
SEG4
2
63
NC
SEG5
3
62
OSC TH
SEG6
4
61
NC
SEG7
5
60
OSC R
SEG8
6
59
NC
SEG20 19
46
M2
SEG21 20
45
NC
SEG22 21
44
M1
SEG23 22
43
NC
SEG24 23
42
NC
SEG25 24
41
S4
40
M3
S3
47
S2
SEG19 18
39
M4
38
48
S1
SEG18 17
37
LD
NC
K1
49
36
50
SEG17 16
VCM
SEG16 15
NC
NC
35
51
34
SEG15 14
VCP
K2
33
52
RESET
SEG14 13
32
K3
VDD
NC
53
NC
54
NC 12
31
SEG13 11
30
K4
NC
55
29
SEG12 10
XT
OSC C
28
56
NC
9
XT
SEG11
27
NC
26
OSC IN
57
COM2
58
8
25
7
SEG26
SEG9
SEG10
NC: No-connection pin
80-Pin Plastic QFP
4/12
¡ Semiconductor
MSM5052
PAD CONFIGURATION
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG13
SEG12
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG21
SEG20
SEG22
SEG23
Pad Layout
SEG24
SEG3
SEG25
SEG2
SEG26
SEG1
COM2
COM1
XT
NC
XT
T3
VDD
T1
RESET
VCP
T2
T4
T5
VCM
S1
BD
VDD
S2
VSS2
S3
VSS1
S4
M1
M2 M3
M4 LD
K1
K2 K3
K4
OSC
C
OSC
IN
OSC
R
OSC
TH
Chip size 4.77 ¥ 4.36 (mm)
5/12
¡ Semiconductor
MSM5052
PIN DESCRIPTIONS
Symbol
Description
VDD
Ground.
VSS1
Power source (–1.5 V).
VSS2
Power source for LCD driver (–3.0 V). This pin is connected to the VDD pin through a 0.1 mF
capacitor.
VCP, VCM
Booster capacitor connection pins. VCP pin is connected to the VCM pin through a 0.1 mF capacitor.
XT, XT
Input and output pins of oscillator inverter. A 32.768 kHz crystal is connected to these pins.
T1 to T5
RESET
BD
Pins to test internal logic. T1, T2, T4, and T5 are pulled down to VSS1. T3 is the output. Test pins
are normally open.
Pin to clear internal logic, pulled down to VSS1. After power is turned on, the MSM5052
can be reset by this pin.
Buzzer output.
OSC TH, OSC R, Pins to RC oscillation circuit for temperature detection. These are the fundamental resistor,
OSC C, OSC IN
thermistor, and capacitor connection pins.
6/12
¡ Semiconductor
MSM5052
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rating
Unit
Power Supply Voltage
VSS1-VDD
Ta = 25°C
–2.0 to +0.3
V
Input Voltage
VIN
Ta = 25°C
VSS1 – 0.3 to +0.3
V
Storage Temperature
TSTG
—
–55 to +125
°C
Operating Temperature
Top
—
–20 to +75
°C
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 0 V, VSS1 = –1.55 V, VSS2 = –3.0 V, C1 = 30 pF, Ta = 25°C)
Parameter
VSS1 Operating Voltage
Symbol
VSS1
Power Supply Current 1
IDD1
Power Supply Current 2
IDD2
Oscillation Start Voltage
VOSC
Condition
Min.
Typ.
Max.
Unit
VSS1 pin
–1.65
–1.55
–1.25
V
—
3.0 *1
—
mA
—
100 *2
—
mA
—
—
–1.45
V
—
–4
Temperature sampling off
(Refer to measuring circuit)
Temperature sampling on
(Refer to measuring circuit)
Within 10 seconds, VSS1 pin
(Refer to measuring circuit)
IOH1
VOH1 = –0.2 V
—
IOM1
VOM1 = VSS1 ±0.2 V
–4
—
+4
IOL1
VOL1 = –2.8 V
4
—
—
Output Current 2
IOH2
VOH2 = –0.2 V
—
—
–0.4
SEGMENT
IOL2
VOL2 = –2.8 V
0.4
—
—
Output Current 3
IOH3
VOH3 = –0.4 V
—
—
–400
C, R, TH
IOL3
VOL3 = –1.15 V
400
—
—
Output Current 4
IOH4
VOH4 = –0.4 V
—
—
–100
M1-M4, LD
IOL4
VOL4 = –1.15 V
10
—
—
Output Current 5
IOH5
VOH5 = –0.4 V
–200
—
–50
BD
IOL5
VOL5 = –1.15 V
3
—
—
Input Current
IIH
VIN = 0 V
3
—
30
S1-S4, K1-K4
IIL
VIN = –1.55 V
–0.2
—
—
Built-in CD Capacitance
CD
—
—
25
—
Output Current 1
COM
mA
mA
mA
mA
mA
mA
pF
*1 The typ. value varies depending on the application program.
*2 The typ. value varies depending on the application program and RC thermistor to be used.
7/12
¡ Semiconductor
MSM5052
Measuring circuit
C4
VCP
OSC IN
VCM
OSC C
R1
R2
MSM5052
OSC R
C2
XT
OSC TH
Crystal
32.768 kHz
XT
C1
VSS1
VDD
VSS2
C1
C2, C3
C4
R1, R2
: 20 pF
: 0.1 mF
: 3000 pF
: 10 kW
C3
A
V
8/12
¡ Semiconductor
MSM5052
APPLICATION CIRCUIT
LCD
TH
COM2
OSC TH
SEGMENTS
COM1
OSC R
R1
R2
C1
OSC IN
OSC C
MSM5052
C2
32.768 kHz
C3
C4
HI
Alarm output
LO
M4
LD
Data
Serial data
Latch
BD
XT
(CD = 25 pF)
XT
VCP
VCM
VSS2 S4 S2
M1
M2
VSS1
VDD
S1
RESET
K2 K3 K1
S4
Piezo
*1
*2
C/F S2
S1
*1 Inner switch or pad on PCB
*2 Bonding option
1
2
3
4
R1 : 33 kW
R2 : 20 kW
TH : 40BT-5
40 kW ±10% at 25°C
B = 3550 ±2%
C1
C2
C3
C4
5
:
:
:
:
680 pF
5 to 35 pF
0.1 mF
0.1 mF
1 Thermometer one-second sampling
2 Thermometer 10-second sampling
3 The highest temperature alarm
4 The lowest temperature alarm
5 Clock
9/12
¡ Semiconductor
MSM5052
PACKAGE DIMENSIONS
(Unit : mm)
QFP56-P-910-0.65-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.36 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
10/12
¡ Semiconductor
MSM5052
(Unit : mm)
QFP56-P-910-0.65-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.43 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
11/12
¡ Semiconductor
MSM5052
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Epoxy resin
42 alloy
Solder plating
5 mm or more
Package weight (g)
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
12/12