For assistance or to order, call (800) 531-5782 PT5120 Series • • • • • Low Voltage Input (7V) 85% Efficiency Internal Short-Circuit Protection Over-Temperature Protection Laser-Trimmed Output Voltage Pin-Out Information Standard Application Vin 1 PT5120 C1 Pin Function 1 Vin 2 GND Vout 3 C2 GND (Revised 6/4/98) The PT5120 series is a low voltage input (typically 7V) version of Power Trends’ easy-to-use, 1A positive stepdown, 3-terminal Integrated Switching Regulators (ISRs). These ISRs are designed with premium low-threshold FETs for those power regulation applications requiring very low input/output voltage differentials such as battery powered equipment. Ordering Information PT Series Suffix (PT1234X) PT5121! = + 5 Volts PT5123! = + 3.3 Volts Case/Pin Configuration N A C Vertical Through-Hole Horizontal Through-Hole Horizontal Surface Mount Vout 3 2 SLTS080 1 AMP LOW VOLTAGE INPUT INTEGRATED SWITCHING REGULATOR Pkg Style 100 + GND PT5120 C1 = Optional 1µF ceramic C2 = Required 100µF electrolytic Specifications PT5120 SERIES Characteristics (Ta =25°C unless noted) Symbols Conditions Min Typ Max Output Current Io Over Vin range 0.1* — 1.0 A Short Circuit Current Isc Vin = Vin min — 3.5 — Apk Input Voltage Range Vin 0.1 ≤ Io ≤ 1.0 A 7 7 — 26 38 V V Output Voltage Tolerance ∆Vo Over Vin Range, Io = 1.0 A Ta = 0°C to +60°C — ±1.5 ±3.0 %Vo Line Regulation Regline Over Vin range — ±0.5 ±1.0 %Vo Load Regulation Regload 0.1 ≤ Io ≤ 1.0 A — ±0.5 ±1.0 %Vo Vo Ripple/Noise Vn Vin=Vin min, Io=1.0 A — ±2 — %Vo Transient Response with Co = 100µF ttr Vos 25% load change Vo over/undershoot — — 100 5.0 200 — µSec %Vo Efficiency η Vin=9V, Io=0.5A, Vo=3.3V Vin=9V, Io=0.5A, Vo=5V — — 82 85 — — % % Switching Frequency ƒo Over Vin and Io ranges, Vo= 3.3V Vo = >5V 575 500 725 650 875 800 kHz Absolute Maximum Operating Temperature Range Ta -20 — +85 °C Recommended Operating Temperature Range Ta Free Air Convection, (40-60LFM) Vo= 3.3V Vo= 5V -20 -20 — — +80** +80** °C Thermal Resistance θja Free Air Convection (40-60LFM) Vo = 3.3V Vo = 5V — — 45 50 — — °C/W Storage Temperature Ts Vo = 3.3V Vo = 5V Units -40 — +125 °C Mechanical Shock Per Mil-STD-883D, Method 2002.3 1 msec, Half Sine, mounted to a fixture — 500 — G’s Mechanical Vibration Per Mil-STD-883D, Method 2007.2 20-2000 Hz, Soldered in a PC board — 5 — G’s — 4.5 — grams Weight * ISR will operate down to no load with reduced specifications. **See Thermal Derating chart. Note: The PT5120 Series requires a 100µF electrolytic or tantalum output capacitor for proper operation in all applications. 2 Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.ti.com/powertrends (800) 531-5782 For assistance or to order, call PT5120 CHARACTERISTIC PT5123, 3.3 VDC Series DATA PT5121, 5.0 VDC (See Note 1) Efficiency vs Output Current (See Note 1) Efficiency vs Output Current 90 100 85 80 Efficiency - % Efficiency - % 90 80 Vin 70 9.0V 12.0V 18.0V 60 24.0V Vin 75 9.0V 12.0V 18.0V 24.0V 30.0V 38.0V 70 65 60 55 50 26.0V 50 45 40 40 0 0 0.2 0.4 0.6 0.8 0.2 0.4 0.6 0.8 1 1 Iout-(Amps) Iout-(Amps) Ripple vs Output Current Ripple vs Output Current 60 120 50 100 40 80 30 Vin 26.0V 24.0V 18.0V 12.0V 9.0V 20 10 Ripple-(mV) Ripple-(mV) Vin 38.0V 30.0V 24.0V 18.0V 60 1 2 .0 V 9.0V 40 20 0 0 0 0 0.2 0.4 0.6 0.8 0.2 0.4 Iout-(Amps) Thermal Derating (Ta) 0.6 0.8 1 1 Iout-(Amps) Thermal Derating (Ta) (See Note 2) 1 (See Note 2) 1 70°C 50°C 0.8 Iout-(Amps) Iout-(Amps) 0.8 85°C 0.6 0.4 0.2 60°C 70°C 0.6 85°C 0.4 0.2 0 0 7 9 11 13 15 17 19 21 23 25 27 7 11 15 19 Vin-(Volts) 23 27 31 35 39 Vin-(Volts) Power Dissipation vs Output Current Power Dissipation vs Output Current 1.2 1.8 1.6 1 1.4 0.8 26.0V 24.0V 18.0V 0.6 12.0V 9.0V 0.4 Vin PD-(Watts) PD-(Watts) Vin 1.2 38.0V 30.0V 24.0V 18.0V 12.0V 9.0V 1 0.8 0.6 0.4 0.2 0.2 0 0 0 0.2 0.4 0.6 0.8 1 Iout-(Amps) 0 0.2 0.4 0.6 0.8 1 Iout-(Amps) Note 1: All data listed in the above graphs, except for derating data, has been developed from actual products tested at 25°C. This data is considered typical data for the ISR. Note 2: Thermal derating graphs are developed in free air convection cooling of 40-60 LFM. (See Thermal Application Notes.) Power Trends, Inc. 27715 Diehl Road, Warrenville, IL 60555 (800) 531-5782 Fax: (630) 393-6902 http://www.ti.com/powertrends 3 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty PT5121C NRND SIP MOD ULE EAC 3 PT5121CT NRND SIP MOD ULE EAC 3 35 Lead/Ball Finish MSL Peak Temp (3) Pb-Free (RoHS) Call TI Level-1-215C-UNLIM TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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