SECOS SSE90N04-03P

SSE90N04-03P
90A , 40V , RDS(ON) 5 mΩ
Ω
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
TO-220P
DESCRIPTION
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low RDS(on)
and to ensure minimal power loss and heat dissipation.
D
C
B
R
T
E
FEATURES
A
S
Low RDS(on) provides higher efficiency and
extends battery life.
Low thermal impedance copper leadframe
TO-220P saves board space.
Fast Switch Speed.
High performance trench technology.
G
F
I
H
J
K
L
U
M
X
P
N
APPLICATION
O
DC-DC converters and power management such as
computers, printers, and power supplies .
Q
V
W
Q
1 2 3
N-Channel
D2
G1
S3
REF.
A
B
C
D
E
F
G
H
I
J
K
L
Millimeter
Min.
Max.
7.90
8.10
9.45
9.65
9.87
10.47
11.50
1.06
1.46
2.60
3.00
6.30
6.70
8.35
8.75
14.7
15.3
1.60 Typ.
1.10
1.30
1.17
1.37
REF.
M
N
O
P
Q
R
S
T
U
V
W
X
Millimeter
Min.
Max.
1.50
0.75
0.95
0.66
0.86
13.50
14.50
2.44
3.44
3.50
3.70
1.15
1.45
4.30
4.70
2.7
1.89
3.09
0.40
0.60
2.60
3.60
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Drain-Source Voltage
VDS
40
V
Gate-Source Voltage
VGS
±20
V
ID
90
A
IDM
240
A
IS
90
A
PD
300
W
TJ, TSTG
-55~175
°C
Continuous Drain Current
Pulsed Drain Current
1
TC=25°C
2
Continuous Source Current (Diode Conduction)
Power Dissipation
1
1
TC=25°C
Operating Junction and Storage Temperature Range
Thermal Resistance Rating
Maximum Junction to Ambient
1
RθJA
62.5
RθJC
0.5
°C / W
Maximum Junction to Case
Notes:
1 Package Limited.
2 Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
22-Sep-2011 Rev. A
Any changes of specification will not be informed individually.
Page 1 of 4
SSE90N04-03P
90A , 40V , RDS(ON) 5 mΩ
Ω
N-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Symbol
Parameter
Min.
Typ.
Max.
Unit
Teat Conditions
Static
Gate-Threshold Voltage
VGS(th)
1
-
-
V
VDS=VGS, ID=250µA
Gate-Body Leakage
IGSS
-
-
±100
nA
VDS=0, VGS=20V
-
-
1
Zero Gate Voltage Drain Current
IDSS
On-State Drain Current
1
ID(on)
Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
1
1
RDS(ON)
µA
-
-
25
120
-
-
-
-
5
VDS=5V, VGS=10V
VGS=10V, ID=30A
-
7.5
gfs
-
30
-
S
VDS=15V, ID=30A
VSD
-
1.1
VGS=4.5V, ID=20A
-
V
IS=34A, VGS=0
2
Qg
-
4
-
Gate-Source Charge
Qgs
-
1.1
-
Gate-Drain Charge
Qgd
-
1.4
-
Turn-on Delay Time
Td(on)
-
16
-
Tr
-
5
-
Td(off)
-
23
-
Tf
-
3
-
Fall Time
A
-
Total Gate Charge
Turn-off Delay Time
VDS=32V, VGS=0, TJ=55°C
mΩ
Dynamic
Rise Time
VDS=32V, VGS=0
nC
VDS=15V,
VGS=4.5V,
ID=90A
nS
VDD=25V, VGEN=10V,
RL=25Ω, ID=34A
Notes:
1 Pulse test:PW ≦ 300 µs duty cycle ≦ 2%.
2 Guaranteed by design, not subject to production testing.
http://www.SeCoSGmbH.com/
22-Sep-2011 Rev. A
Any changes of specification will not be informed individually.
Page 2 of 4
SSE90N04-03P
Elektronische Bauelemente
90A , 40V , RDS(ON) 5 mΩ
Ω
N-Channel Enhancement Mode MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
22-Sep-2011 Rev. A
Any changes of specification will not be informed individually.
Page 3 of 4
SSE90N04-03P
Elektronische Bauelemente
90A , 40V , RDS(ON) 5 mΩ
Ω
N-Channel Enhancement Mode MOSFET
CHARACTERISTIC CURVES
http://www.SeCoSGmbH.com/
22-Sep-2011 Rev. A
Any changes of specification will not be informed individually.
Page 4 of 4