SKCD 61 C 060 I3 Absolute Maximum Ratings Symbol Conditions Values Unit VRRM IF(AV) Tj = 25 °C, IR = 0.2 mA 600 V Ts = 80 °C, Tj = 150 °C 75 A IFSM 10 ms sin 180° 1000 A 150 °C Tj = 25 °C A Tj = 150 °C Tjmax CAL-DIODE Electrical Characteristics Symbol Conditions IF = 100 A i2t Tj = 150 °C, 10 ms, sin 180° VRRM = 600 V IR Size: 7,8 mm x 7,8 mm SKCD 61 C 060 I3 min. typ. max. Unit 5000 A2s Tj = 25 °C, VRRM = 600 V 0.20 mA Tj = 125 °C, VRRM = 600 V 6.00 mA Tj = 25 °C, IF = 110 A 1.35 1.60 V Tj = 125 °C, IF = 110 A 1.35 1.60 V V(TO) Tj = 125 °C 0.90 V rT Tj = 125 °C 3.8 mΩ VF Features Dynamic Characteristics • low forward voltage drop combined with a low temperature dependence • easy paralleling due to a small forward voltage spread • very soft recovery behavior • small switching losses • high ruggedness • compatible to thick wire bonding • compatible to all standard solder processes Symbol Conditions trr Tj = 25 °C, 100 A, 300 V, 800 A/µs trr Tj = 125 °C, 100 A, 300 V, 800 A/µs Qrr Tj = 25 °C, 100 A, 300 V, 800 A/µs 3 µC Qrr Tj = 125 °C, 100 A, 300 V, 800 A/µs 7 µC Irrm Tj = 25 °C, 100 A, 300 V, 800 A/µs Irrm Tj = 125 °C, 100 A, 300 V, 800 A/µs Typical Applications* • freewheeling diode for IGBT min. typ. max. Unit µs ns A 60 A Thermal Characteristics Symbol Conditions min. typ. max. Unit °C Tj -40 150 Tstg -40 150 °C Tsolder 10 min. 250 °C Tsolder 5 min. 320 °C Rth(j-s) sold. on 0,38 mm DCB, reference point on copper heatsink close to the chip 0.54 K/W Values Unit 7.8 x 7.8 mm2 60.84 mm2 Mechanical Characteristics Symbol Conditions Raster size Area total Anode bondable (Al) Cathode solderable (Ag/Ni) Al, diameter ≤ 500 µm Wire bond Package wafer frame Chips / Package 156 (5" Wafer) pcs SKCD © by SEMIKRON Rev. 0 – 18.02.2010 1 SKCD 61 C 060 I3 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 0 – 18.02.2010 © by SEMIKRON