TI 74F109SC

54F109,74F109
Dual JK (Note: Overbar Over the K) Positive Edge-Triggered Flip-Flop
Literature Number: SNOS149A
LOW input to CD sets Q to LOW level
Clear and Set are independent of clock
Simultaneous LOW on CD and SD makes both Q and Q
HIGH
General Description
The ’F109 consists of two high-speed, completely independent transition clocked JK flip-flops. The clocking operation
is independent of rise and fall times of the clock waveform.
The JK design allows operation as a D flip-flop (refer to ’F74
data sheet) by connecting the J and K inputs.
Asynchronous Inputs:
LOW input to SD sets Q to HIGH level
n Guaranteed 4000V minimum ESD protection.
See Section 0
Commercial
Military
Package
Number
N16E
54F109DM (Note 2)
74F109SC (Note 1)
74F109SJ (Note 1)
Package Description
16-Lead (0.300" Wide) Molded Dual-in-Line
ol
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74F109PC
te
Ordering Code:
Features
J16A
16-Lead Ceramic Dual-in-Line
M16A
16-Lead (0.150" Wide) Molded Small Outline,
JEDEC
M16D
16-Lead (0.300" Wide) Molded Small Outline,
EIAJ
54F109FM (Note 2)
W16A
16-Lead Cerpack
54F109LM (Note 2)
E20A
16-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13" reel. Use suffix = SCX and SJX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix = DMQB, FMQB and LMQB.
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bs
Logic Symbols
DS009471-3
54F/74F109
54F/74F109
Dual JK Positive Edge-Triggered Flip-Flop
54F/74F109 Dual JK Positive Edge-Triggered Flip-Flop
November 1994
DSXXX
IEEE/IEC
DS009471-4
DS009471-6
FAST ® and TRI-STATE ® are registered trademarks of National Semiconductor Corporation.
© 1997 National Semiconductor Corporation
www.national.com
DS009471
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1
Connection Diagrams
Pin Assignment
for DIP, SOIC and Flatpak
Pin Assignment
for LCC
DS009471-1
DS009471-2
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Unit Loading/Fan Out
See Section 0 for U.L. definitions
DSXXX
54F/74F
Pin Names
Description
Data Inputs
Clock Pulse Inputs (Active Rising Edge)
CD1, CD2
Direct Clear Inputs (Active LOW)
SD1, SD2
Q1, Q2, Q1, Q2
20 µA/−0.6 mA
1.0/1.0
20 µA/−0.6 mA
20 µA/−1.8 mA
Direct Set Inputs (Active LOW)
1.0/3.0
20 µA/−1.8 mA
Outputs
50/33.3
−1 mA/20 mA
Inputs
SD
CD
CP
L
H
X
H
L
X
X
Outputs
J
K
Q
X
X
H
Q
L
X
X
L
H
X
X
H
H
bs
L
1.0/1.0
1.0/3.0
Truth Table
L
Input IIH/IIL
Output IOH/IOL
ol
e
J1, J2, K1, K2
CP1, CP2
U.L.
HIGH/LOW
H
H
N
l
l
L
H
H
H
N
h
l
H
H
N
l
h
Q0
H
H
N
h
h
H
L
H
H
L
X
X
Q0
Q0
Toggle
Q0
O
H (h) = HIGH Voltage Level
L (l) = LOW Voltage Level
N = LOW-to-HIGH Transition
X = Immaterial
Q0 (Q0) = Before LOW-to-HIGH Transition of Clock
Lower case letters indicate the state of the referenced output one setup time prior to the LOW-to-HIGH clock transition.
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(One Half Shown)
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Logic Diagram
DS009471-5
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Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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3
Absolute Maximum Ratings
Current Applied to Output
in LOW State (Max)
ESD Last Passing Voltage (Min)
(Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
VCC Pin Potential to
Ground Pin
Input Voltage (Note 4)
Input Current (Note 4)
Voltage Applied to Output
in HIGH State (with VCC = 0V)
Standard Output
TRI-STATE ® Output
−65˚C
−55˚C
−55˚C
−55˚C
to
to
to
to
Recommended Operating
Conditions
+150˚C
+125˚C
+175˚C
+150˚C
Free Air Ambient Temperature
Military
Commercial
Supply Voltage
Military
Commercial
−0.5V to +7.0V
−0.5V to +7.0V
−30 mA to +5.0 mA
Note 4: Either voltage limit or current limit is sufficient to protect inputs.
54F/74F
Min
+4.5V to +5.5V
+4.5V to +5.5V
te
Parameter
−55˚C to +125˚C
0˚C to +70˚C
Note 3: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired. Functional operation under these
conditions is not implied.
−0.5V to VCC
−0.5V to +5.5V
DC Electrical Characteristics
Symbol
twice the rated IOL (mA)
4000V
Typ
Units
VCC
Conditions
Max
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
VCD
Input Clamp Diode Voltage
−1.2
V
Min
V
Min
V
Min
µA
Max
IOL = 20 mA
IOL = 20 mA
VIN = 2.7V
µA
Max
VIN = 7.0V
µA
Max
VOUT = VCC
V
0.0
IID = 1.9 µA
Output HIGH
Voltage
VOL
Output LOW
Voltage
IIH
Input HIGH
54F 10% VCC
2.5
74F 10% VCC
2.5
74F 5% VCC
2.7
54F 10% VCC
0.5
74F 10% VCC
0.5
54F
20.0
74F
5.0
Input HIGH Current
54F
100
Breakdown Test
74F
7.0
Output HIGH
54F
250
Leakage Current
74F
50
Input Leakage
74F
Current
bs
IBVI
V
ol
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VOH
2.0
ICEX
VID
4.75
Test
IOD
Output Leakage
74F
O
Input LOW Current
IOS
Output Short-Circuit Current
ICC
Power Supply Current
−60
11.7
Recognized as a LOW Signal
IIN = −18 mA
IOH = −1 mA
IOH = −1 mA
IOH = −1 mA
3.75
µA
0.0
All Other Pins Grounded
VIOD = 150 mV
−0.6
mA
Max
All Other Pins Grounded
VIN = 0.5V (Jn, Kn)
Circuit Current
IIL
Recognized as a HIGH Signal
−1.8
mA
Max
−150
mA
Max
VIN = 0.5V (CDn, SDn)
VOUT = 0V
17.0
mA
Max
CP = 0V
AC Electrical Characteristics
See Section 0 for Waveforms and Load Configurations
Symbol
DSXXX
74F
TA = +25˚C
VCC = +5.0V
Parameter
54F
TA, VCC = Mil
CL = 50 pF
74F
TA, VCC = Com
CL = 50 pF
Fig.
Units
No.
MHz
kk-kk
CL = 50 pF
fmax
Maximum Clock
Frequency
www.national.com
Min
Typ
100
125
Max
Min
Max
70
Min
90
Max
DSXXX
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AC Electrical Characteristics
(Continued)
See Section 0 for Waveforms and Load Configurations
Symbol
DSXXX
74F
TA = +25˚C
VCC = +5.0V
Parameter
54F
TA, VCC = Mil
CL = 50 pF
74F
TA, VCC = Com
CL = 50 pF
Fig.
Units
No.
ns
kk-kk
DSXXX
ns
kk-kk
DSXXX
CL = 50 pF
Min
Typ
Max
Min
Max
Min
Max
tPLH
Propagation Delay
3.8
5.3
7.0
3.8
9.0
3.8
8.0
tPHL
CPn to Qn or Qn
4.4
6.2
8.0
4.4
10.5
4.4
9.2
tPLH
Propagation Delay
3.2
5.2
7.0
3.2
9.0
3.2
8.0
tPHL
CDn or SDn to
3.5
7.0
9.0
3.5
11.5
3.5
10.5
te
Qn or Qn
AC Operating Requirements
See Section 0 for Waveforms
Symbol
74F
TA = +25˚C
VCC = +5.0V
Parameter
74F
TA, VCC = Com
Min
Max
Min
ts(H)
Setup Time, HIGH or LOW
3.0
3.0
3.0
ts(L)
Jn or Kn to CPn
3.0
4.0
3.0
th(H)
Hold Time, HIGH or LOW
1.0
1.0
1.0
1.0
1.0
1.0
4.0
4.0
4.0
5.0
5.0
5.0
4.0
4.0
2.0
2.0
th(L)
Jn or Kn to CPn
tw(H)
CPn Pulse Width
tw(L)
HIGH or LOW
tw(L)
CDn or SDn Pulse Width,
LOW
trec
Recovery Time
Fig.
Max
ns
kk-kk
DSXXX
ns
kk-kk
DSXXX
4.0
ns
kk-kk
DSXXX
2.0
ns
kk-kk
DSXXX
bs
CDn or SDn to CP
Units
DSXXX
No.
Max
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Min
54F
TA, VCC = Mil
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows:
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End
DS009471-7
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THIS PAGE IS IGNORED IN THE DATABOOK
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PrintDate=1997/08/28 PrintTime=11:45:31 10182 ds009471 Rev. No. 1
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inches (millimeters) unless otherwise noted
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Physical Dimensions
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20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J16A
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inches (millimeters) unless otherwise noted (Continued)
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Physical Dimensions
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16-Lead (0.150" Wide) Molded Small Outline Package, JEDEC (S)
NS Package Number M16A
16-Lead (0.300" Wide) Molded Small Outline Package, EIAJ (SJ)
NS Package Number M16D
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inches (millimeters) unless otherwise noted (Continued)
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Physical Dimensions
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16-Lead (0.300" Wide) Molded Dual-In-Line Package (P)
NS Package Number N16E
16-Lead Ceramic Flatpak (F)
NS Package Number W16A
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54F/74F109 Dual JK Positive Edge-Triggered Flip-Flop
O
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PrintDate=1997/08/28 PrintTime=11:45:33 10182 ds009471 Rev. No. 1
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