54F258A,74F258A 54F258A 74F258A Quad 2-Input Multiplexer with TRI-STATE(RM) Outputs Literature Number: SNOS181A 54F/74F258A Quad 2-Input Multiplexer with TRI-STATEÉ Outputs General Description Features The ’F258A is a quad 2-input multiplexer with TRI-STATE outputs. Four bits of data from two sources can be selected using a common data select input. The four outputs present the selected data in the complement (inverted) form. The outputs may be switched to a high impedance state with a HIGH on the common Output Enable (OE) input, allowing the outputs to interface directly with bus-oriented systems. Y Y Multiplexer expansion by tying outputs together Inverting TRI-STATE outputs Guaranteed 4000V minimum ESD protection e Commercial Y Package Number Military Package Description 16-Lead (0.300× Wide) Molded Dual-In-Line 16-Lead Ceramic Dual-In-Line 74F258ASC (Note 1) M16A 16-Lead (0.150× Wide) Molded Small Outline, JEDEC 74F258ASJ (Note 1) M16D 16-Lead (0.300× Wide) Molded Small Outline, EIAJ 54F258AFM (Note 2) W16A 16-Lead Cerpack 54F258ALL (Note 2) E20A 20-Lead Ceramic Leadless Chip Carrier, Type C bs ol 54F258ADM (Note 2) et N16E J16A 74F258APC Note 1: Devices also available in 13× reel. Use suffix e SCX and SJX. Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB. Logic Symbols Connection Diagrams Pin Assignment for DIP, SOIC and Flatpak Pin Assignment for LCC TL/F/9508–3 O IEEE/IEC TL/F/9508 – 1 TL/F/9508 – 2 TL/F/9508–5 TRI-STATEÉ is a registered trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/9508 RRD-B30M75/Printed in U. S. A. 54F/74F258A Quad 2-Input Multiplexer with TRI-STATE Outputs November 1994 Unit Loading/Fan Out 54F/74F Pin Names S OE I0a – I0d I1a – I1d Za – Zd Description U.L. HIGH/LOW Input IIH/IIL Output IOH/IOL Common Data Select Input TRI-STATE Output Enable Input (Active LOW) Data Inputs from Source 0 Data Inputs from Source 1 TRI-STATE Inverting Data Outputs 1.0/1.0 1.0/1.0 1.0/1.0 1.0/1.0 150/40 (33.3) 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA 20 mA/b0.6 mA b 3 mA/24 mA (20 mA) Functional Description When the Output Enable input (OE) is HIGH, the outputs are forced to a high impedance OFF state. If the outputs of the TRI-STATE devices are tied together, all but one device must be in the high impedance state to avoid high currents that would exceed the maximum ratings. Designers should ensure that Output Enable signals to TRI-STATE devices whose outputs are tied together are designed so there is no overlap. Output Enable Select Input Data Inputs OE S I0 I1 H L L L L X H H L L X X X L H X L H X X et Truth Table e The ’F258A is a quad 2-input multiplexer with TRI-STATE outputs. It selects four bits of data from two sources under control of a common Select input (S). When the Select input is LOW, the I0x inputs are selected and when Select is HIGH, the I1x inputs are selected. The data on the selected inputs appears at the outputs in inverted form. The ’F258A is the logic implementation of a 4-pole, 2-position switch where the position of the switch is determined by the logic levels supplied to the Select input. The logic equation for the outputs is shown below: Zn e OE # (I1n # S a I0n # S) Output Z H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance bs ol Z H L H L O Logic Diagram TL/F/9508 – 4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays. 2 Absolute Maximum Ratings (Note 1) Recommended Operating Conditions If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. Storage Temperature b 65§ C to a 150§ C Ambient Temperature under Bias Junction Temperature under Bias Plastic b 55§ C to a 125§ C Free Air Ambient Temperature Military Commercial b 55§ C to a 125§ C 0§ C to a 70§ C Supply Voltage Military Commercial b 55§ C to a 175§ C b 55§ C to a 150§ C a 4.5V to a 5.5V a 4.5V to a 5.5V VCC Pin Potential to Ground Pin b 0.5V to a 7.0V b 0.5V to a 7.0V Input Voltage (Note 2) b 30 mA to a 5.0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0.5V to VCC Standard Output b 0.5V to a 5.5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) 4000V e ESD Last Passing Voltage (Min) Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. DC Electrical Characteristics Symbol Parameter et Note 2: Either voltage limit or current limit is sufficient to protect inputs. 54F/74F Min Input HIGH Voltage VIL Input LOW Voltage VCD Input Clamp Diode Voltage VOH VOL Units Max 2.0 VCC V 0.8 V b 1.2 V Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC 2.5 2.4 2.5 2.4 2.7 2.7 Conditions Recognized as a HIGH Signal Recognized as a LOW Signal Min IIN e b18 mA V Min IOH IOH IOH IOH IOH IOH IOL e 20 mA IOL e 24 mA bs ol VIH Typ e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA Output LOW Voltage 54F 10% VCC 74F 10% VCC 0.5 0.5 V Min Input HIGH Current 54F 74F 20.0 5.0 mA Max VIN e 2.7V Input HIGH Current Breakdown Test 54F 74F 100 7.0 mA Max VIN e 7.0V Output HIGH Leakage Current 54F 74F 250 50 mA Max VOUT e VCC Input Leakage Test 74F V 0.0 IID e 1.9 mA All Other Pins Grounded IOD Output Leakage Circuit Current 74F 3.75 mA 0.0 VIOD e 150 mV All Other Pins Grounded IIL Input LOW Current b 0.6 mA Max VIN e 0.5V IOZH Output Leakage Current 50 mA Max VOUT e 2.7V IOZL Output Leakage Current b 50 mA Max VOUT e 0.5V IOS Output Short-Circuit Current b 150 mA Max VOUT e 0V IZZ Bus Drainage Test 500 mA 0.0V VOUT e VCC ICCH Power Supply Current 6.2 9.5 mA Max VO e HIGH ICCL Power Supply Current 15.1 23 mA Max VO e LOW ICCZ Power Supply Current 11.3 17 mA Max VO e HIGH Z IIH IBVI ICEX O VID 4.75 b 60 3 AC Electrical Characteristics Symbol Parameter 54F 74F TA, VCC e Mil CL e 50 pF TA, VCC e Com CL e 50 pF Typ Units Max Min Max Min Max tPLH tPHL Propagation Delay In to Zn 2.5 1.0 5.3 4.0 2.0 1.0 7.5 6.0 2.0 1.0 6.0 5.0 ns tPLH tPHL Propagation Delay S to Zn 3.0 2.5 7.5 7.0 3.0 2.5 9.5 9.0 3.0 2.5 8.5 8.0 ns tPZH tPZL Output Enable Time 2.0 2.5 6.0 7.0 2.0 2.5 8.0 9.0 2.0 2.5 7.0 8.0 tPHZ tPLZ Output Disable Time 2.0 2.0 6.0 6.0 1.5 2.0 7.0 8.5 2.0 2.0 7.0 7.0 ns O bs ol et e Min 74F TA e a 25§ C VCC e a 5.0V CL e 50 pF 4 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows: 74F 258A S Temperature Range Family 74F e Commercial 54F e Military C X Special Variations X e Devices shipped in 13× reels QB e Military grade with environmental and burn-in processing shipped in tubes Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Ceramic Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ Temperature Range C e Commercial (0§ C to a 70§ C) M e Military (b55§ C to a 125§ C) O bs ol et e Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 e Physical Dimensions inches (millimeters) (Continued) O bs ol et 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 16-Lead (0.150× Wide) Molded Small Outline Package, JEDEC (S) NS Package Number M16A 6 et e Physical Dimensions inches (millimeters) (Continued) O bs ol 16-Lead (0.300× Wide) Molded Small Outline Package, EIAJ (SJ) NS Package Number M16D 16-Lead (0.300× Wide) Molded Dual-In-Line Package (P) NS Package Number N16E 7 e et 16-Lead Ceramic Flatpak (F) NS Package Number W16A bs ol 54F/74F258A Quad 2-Input Multiplexer with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) LIFE SUPPORT POLICY O NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052-8090 Tel: 1(800) 272-9959 TWX: (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str. 10 D-82256 F4urstenfeldbruck Germany Tel: (81-41) 35-0 Telex: 527649 Fax: (81-41) 35-1 National Semiconductor Japan Ltd. Sumitomo Chemical Engineering Center Bldg. 7F 1-7-1, Nakase, Mihama-Ku Chiba-City, Ciba Prefecture 261 Tel: (043) 299-2300 Fax: (043) 299-2500 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductores Do Brazil Ltda. Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel: (55-11) 212-5066 Telex: 391-1131931 NSBR BR Fax: (55-11) 212-1181 National Semiconductor (Australia) Pty, Ltd. Building 16 Business Park Drive Monash Business Park Nottinghill, Melbourne Victoria 3168 Australia Tel: (3) 558-9999 Fax: (3) 558-9998 National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications. IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated