TSC TSM35N03CPRO

TSM35N03
25V N-Channel MOSFET
TO-252
PRODUCT SUMMARY
VDS (V)
RDS(on)(mΩ)
Pin Definition:
1. Gate
2. Drain
3. Source
25
Features
●
●
ID (A)
8.5 @ VGS = 10V
30
13 @ VGS = 4.5V
30
Block Diagram
Advance Trench Process Technology
High Density Cell Design for Ultra Low On-resistance
Application
●
●
Load Switch
Dc-DC Converters and Motors Drivers
Ordering Information
Part No.
TSM35N03CP RO
Package
Packing
TO-252
2.5Kpcs / 13” Reel
N-Channel MOSFET
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
25V
V
Gate-Source Voltage
Continuous Drain Current, VGS @4.5V.
VGS
ID
±20
35
V
A
Pulsed Drain Current, VGS @4.5V
a,b
Continuous Source Current (Diode Conduction)
IDM
IS
150
20
A
A
Single Pulse Drain to Source Avalanche Energy
(VDD = 100V, VGS=10V, IAS=2A, L=10mH, RG=25Ω)
EAS
300
mJ
o
Maximum Power Dissipation
Ta = 25 C
o
Ta = 70 C
PD
Operating Junction Temperature
TJ
Operating Junction and Storage Temperature Range
57
23
+150
TJ, TSTG
-55 to +150
Symbol
Limit
10
W
o
C
o
C
Thermal Performance
Parameter
Lead Temperature (1/8” from case)
Junction to Case Thermal Resistance
TL
RӨJC
Junction to Ambient Thermal Resistance (PCB mounted)
Notes:
a. Maximum DC current limited by the package
b. Surface Mounted on 1” x 1” FR4 Board, t ≤ 10 sec.
1/6
RӨJA
Unit
S
1.8
o
C/W
40
o
C/W
Version: A07
TSM35N03
25V N-Channel MOSFET
Electrical Specifications (Ta = 25oC unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250uA
BVDSS
25
--
--
V
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
1.0
1.6
3.0
V
Gate Body Leakage
VGS = ±20V, VDS = 0V
IGSS
--
--
±100
nA
Zero Gate Voltage Drain Current
VDS = 24V, VGS = 0V
IDSS
--
--
1.0
uA
On-State Drain Current
VDS ≥5V, VGS = 10V
ID(ON)
35
--
--
A
--
9.5
13
--
6.5
8.5
Drain-Source On-State Resistance
VGS = 4.5V, ID = 30A
VGS = 10V, ID = 30A
RDS(ON)
mΩ
Forward Transconductance
VDS = 10V, ID = 35A
gfs
--
12
--
S
Diode Forward Voltage
IS = 20A, VGS = 0V
VSD
--
0.87
1.5
V
Qg
--
10
25
Qgs
--
3.6
10
Qgd
--
3
65
Ciss
--
1180
--
Coss
--
270
--
Crss
--
145
--
td(on)
--
12
--
tr
--
4
--
td(off)
--
32
--
--
6
--
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
VDS = 15V, ID = 35A,
VGS = 10V
VDS = 15V, VGS = 0V,
f = 1.0MHz
nC
pF
c
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
VDD = 15V, RL = 15Ω,
ID = 1A, VGEN = 10V,
RG = 24Ω
Turn-Off Fall Time
tf
Notes:
a. pulse test: PW ≤300µS, duty cycle ≤2%
b. For DESIGN AID ONLY, not subject to production testing.
b. Switching time is essentially independent of operating temperature.
2/6
nS
Version: A07
TSM35N03
25V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/6
Version: A07
TSM35N03
25V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Maximum Safe Operating Area
Normalized Thermal Transient Impedance, Junction-to-Ambient
4/6
Version: A07
TSM35N03
25V N-Channel MOSFET
SOT-252 Mechanical Drawing
TO-252 DIMENSION
DIM
MILLIMETERS
MIN
MAX
INCHES
MIN
MAX
A
2.3BSC
0.09BSC
A1
4.6BSC
0.18BSC
B
6.80
7.20
0.268
0.283
C
5.40
5.60
0.213
0.220
D
6.40
6.65
0.252
0.262
E
2.20
2.40
0.087
0.094
F
0.00
0.20
0.000
0.008
G
5.20
5.40
0.205
0.213
G1
0.75
0.85
0.030
0.033
G2
0.55
0.65
0.022
0.026
H
0.35
0.65
0.014
0.026
I
0.90
1.50
0.035
0.059
J
2.20
2.80
0.087
0.110
K
0.50
1.10
0.020
0.043
L
0.90
1.50
0.035
0.059
M
1.30
1.70
0.051
0.67
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug,
I=Sep, J=Oct, K=Nov, L=Dec)
L = Lot Code
5/6
Version: A07
TSM35N03
25V N-Channel MOSFET
Notice
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assumes no responsibility or liability for any errors or inaccuracies.
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6/6
Version: A07