LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 PFET Buck Controller for High Power LED Drivers Check for Samples: LM3409, LM3409HV, LM3409-Q1 FEATURES DESCRIPTION • The LM3409/09N/09HV/09Q/09QHV are P-channel MosFET (PFET) controllers for step-down (buck) current regulators. They offer wide input voltage range, high-side differential current sense with low adjustable threshold voltage and fast output enable/disable function and a thermally enhanced VSSOP-10 package. These features combine to make the LM3409 family of devices ideal for use as constant current sources for driving LEDs where forward currents up to 5A are easily achievable. 1 2 • • • • • • • • • • • • LM3409Q/LM3409QHV is an Automotive Grade Product That is AEC-Q100 Grade 1 Qualified 2Ω, 1A Peak MosFET Gate Drive VIN Range: 6V to 42V (LM3409/LM3409Q/LM3409N) VIN Range: 6V to 75V (LM3409HV/LM3409QHV) Differential, High-side Current Sense Cycle-by-Cycle Current Limit No Control Loop Compensation Required 10,000:1 PWM Dimming Range 250:1 Analog Dimming Range Supports All-Ceramic Output Capacitors and Capacitor-less Outputs Low Power Shutdown and Thermal Shutdown Thermally Enhanced VSSOP-10 Package Dual Inline Package (LM3409N) APPLICATIONS • • • • LED Driver Constant Current Source Automotive Lighting General Illumination The LM3409 devices use Constant Off-Time (COFT) control to regulate an accurate constant current without the need for external control loop compensation. Analog and PWM dimming are easy to implement and result in a highly linear dimming range with excellent achievable contrast ratios. Programmable UVLO, low-power shutdown, and thermal shutdown complete the feature set. The LM3409/09Q/09N have an operational input voltage range up to 42V, while the LM3409HV/QHV are high voltage options with an input voltage range up to 75V. The LM3409/09HV/09Q/09QHV come in a thermally enhanced 10-lead VSSOP package, while the LM3409N comes in a 14-lead PDIP package. The LM3409Q/LM3409QHV are automotive grade products that are AEC-Q100 grade 1 qualified. Typical Application RUV2 RUV1 1 VIN UVLO 10 VIN CF 2 3 ROFF VCC IADJ EN LM3409/HV CSP CIN 9 8 RSNS 4 COFF COFF CSN 7 DAP 5 GND PGATE 6 Q1 L1 VO D1 ILED 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2013, Texas Instruments Incorporated LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com Connection Diagram LM3409/09Q/09HV/09QHV 1 2 3 4 5 UVLO VIN IADJ VCC EN DAP COFF GND CSP CSN PGATE LM3409N 10 1 9 2 8 3 7 4 6 5 6 7 Figure 1. 10-Lead VSSOP Package UVLO VIN NC NC IADJ VCC EN CSP COFF CSN GND NC PGATE NC 14 13 12 11 10 9 8 Figure 2. 14-Lead PDIP Package PIN DESCRIPTIONS Pins Name Description 1 UVLO Input under-voltage lockout Connect to a resistor divider from VIN and GND. Turn-on threshold is 1.24V and hysteresis for turn-off is provided by a 22µA current source. 3 2 IADJ Analog LED current adjust Apply a voltage between 0 - 1.24V, connect a resistor to GND, or leave open to set the current sense threshold voltage. 4 3 EN Logic level enable / PWM dimming Apply a voltage >1.74V to enable device, a PWM signal to dim, or a voltage <0.5V for low power shutdown. 5 4 COFF Off-time programming 6 5 GND Ground 9 6 PGATE Gate drive 10 7 CSN Negative current sense Connect to negative side of sense resistor. 11 8 CSP Positive current sense Connect to positive side of sense resistor (also to VIN). 12 9 VCC VIN- referenced linear regulator output Connect at least a 1µF ceramic capacitor to VIN. The regulator provides power for the PFET drive. PDIP VSSOP 1 14 10 VIN Input voltage DAP DAP Thermal pad on bottom of IC Application Information Connect resistor from VO, capacitor to GND to set off-time. Connect to system ground. Connect to gate of external PFET. Connect to the input voltage. Connect to GND pin. Place 4-6 vias from DAP to GND plane. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 Absolute Maximum RatingsLM3409/09N/09Q/09HV/09QHV (1) (2) VIN, EN, UVLO to GND -0.3V to 45V (76V LM3409HV/09QHV) VIN to VCC, PGATE -0.3V to 7V VIN to PGATE -2.8V for 100ns 9.5V for 100ns VIN to CSP, CSN -0.3V to 0.3V COFF to GND -0.3V to 4V COFF current ±1 mA continuous IADJ Current ±5 mA continuous Junction Temperature 150°C Storage Temperature Range ESD Rating -65°C to 125°C (3) LM3409/09N/09HV 1 kV LM3409Q/09QHV Soldering Information (1) (2) (3) 2 kV Lead Temperature (Soldering, 10sec) 260°C Infrared/Convection Reflow (15sec) 260°C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and the device should not be operated beyond such conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Operating Ratings (LM3409/09N/09Q/09HV/09QHV) (1) VIN 6V to 42V (75V LM3409HV/09QHV) −40°C to +125°C Junction Temperature Range (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Operating Ratings is not implied. The recommended Operating Ratings indicate conditions at which the device is functional and the device should not be operated beyond such conditions. Electrical Characteristics LM3409/09N/09Q/09HV/09QHV VIN = 24V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA = TJ = +25°C (1). Limits appearing in boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are specified by design, test, or statistical analysis. Symbol Parameter Conditions Min (2) Typ (1) Max (2) Units mV PEAK CURRENT COMPARATOR VCST VCSP – VCSN average peak current threshold (3) VADJ = 1.0V 188 198 208 VADJ = VADJ-OC 231 246 261 AADJ VADJ to VCSP – VCSN threshold gain 0.1 < VADJ < 1.2V VADJ = VADJ-OC VADJ-OC IADJ pin open circuit voltage IADJ IADJ pin current tDEL CSN pin falling delay CSN fall - PGATE rise IIN Operating current Not switching ISD Shutdown hysteresis current EN = 0V 0.2 V/V 1.189 1.243 1.297 V 3.8 5 6.4 µA 38 ns 2 mA 110 µA SYSTEM CURRENTS PFET DRIVER (1) (2) (3) Typical values represent most likely parametric norms at the conditions specified and are not ensured. Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Texas Instrument's Average Outgoing Quality Level (AOQL). The current sense threshold limits are calculated by averaging the results from the two polarities of the high-side differential amplifier. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 3 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com Electrical Characteristics LM3409/09N/09Q/09HV/09QHV (continued) VIN = 24V unless otherwise indicated. Typicals and limits appearing in plain type apply for TA = TJ = +25°C (1). Limits appearing in boldface type apply over full Operating Temperature Range. Datasheet min/max specification limits are specified by design, test, or statistical analysis. Symbol RPGATE Parameter Driver output resistance Min (2) Conditions Typ (1) Sourcing 50 mA 2 Sinking 50 mA 2 Max (2) Units Ω VCC REGULATOR VCC VIN pin voltage - VCC pin voltage VIN > 9V 0 < ICC < 20 mA VCC-UVLO VCC under voltage lockout threshold VCC increasing VCC-HYS VCC UVLO hysteresis VCC decreasing ICC-LIM VCC regulator current limit 5.5 6 6.5 V 3.73 V 283 mV 30 45 mA 1.122 1.243 OFF-TIMER AND ON-TIMER VOFT Off-time threshold tD-OFF COFF threshold to PGATE falling delay 25 tON-MIN Minimum on-time 115 tOFF-MAX Maximum off-time 300 1.364 V ns 211 ns µs UNDER VOLTAGE LOCKOUT IUVLO UVLO pin current VUVLO-R Rising UVLO threshold VUVLO = 1V IUVLO-HYS UVLO hysteresis current 10 1.175 1.243 nA 1.311 V 22 µA ENABLE IEN EN pin current VEN-TH EN pin threshold 10 VEN rising nA 1.74 VEN falling V .5 VEN-HYS EN pin hysteresis 420 mV tEN-R EN pin rising delay EN rise - PGATE fall 42 ns tEN-F EN pin falling delay EN fall - PGATE rise 21 ns 50 °C/W THERMAL RESISTANCE θJA Junction to Ambient VSSOP-10 Package (4) PDIP-14 Package θJC Junction to Case VSSOP-10 Package 87 (4) 15 PDIP-14 Package (4) 4 37 Measured with DAP soldered to a minimum of 2 square inches of 1oz. copper on the top or bottom PCB layer. Actual value will be different depending upon the application environment. Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 Typical Performance Characteristics TA = +25°C, VIN = 24V, and characteristics are identical for LM3409 and LM3409HV unless otherwise specified. VCC vs. Junction Temperature 6.125 248 6.100 VCC (V) VCST (mV) VCST vs. Junction Temperature 250 246 244 242 -50 6.075 6.050 -14 22 58 94 6.025 -50 130 94 TEMPERATURE (°C) Figure 4. 1.255 -5.10 1.250 -5.15 1.245 -5.20 1.240 -5.25 1.235 -5.30 22 58 94 130 IADJ vs. Junction Temperature -5.05 IADJ (#A) VADJ (V) 58 Figure 3. VADJ vs. Junction Temperature -14 22 TEMPERATURE (°C) 1.260 1.230 -50 -14 -5.35 -50 130 -14 22 58 94 TEMPERATURE (°C) TEMPERATURE (°C) Figure 5. Figure 6. VOFT vs. Junction Temperature 130 tON-MIN vs. Junction Temperature 1.26 180 160 tON-MIN (ns) VOFT (V) 1.25 1.24 140 120 100 1.23 80 1.22 -50 -14 22 58 94 130 60 -50 -14 22 58 94 TEMPERATURE (°C) TEMPERATURE (°C) Figure 7. Figure 8. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 130 Submit Documentation Feedback 5 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) TA = +25°C, VIN = 24V, and characteristics are identical for LM3409 and LM3409HV unless otherwise specified. LM3409 Efficiency vs. Input Voltage VO = 10V (3 LEDs); ILED = 2A (1) LM3409HV Efficiency vs. Input Voltage VO = 10V (3 LEDs); ILED = 2A (2) 95 95 EFFICIENCY (%) 100 EFFICIENCY (%) 100 90 85 80 90 85 80 75 75 70 0 10 20 30 40 70 0 50 20 300856b3 INPUT VOLTAGE (V) 40 60 80 INPUT VOLTAGE (V) Figure 9. Figure 10. LM3409 LED Current vs. Input Voltage VO = 17V (5 LEDs) (3) LM3409HV LED Current vs. Input Voltage VO = 17V (5 LEDs) (4) 2.40 2.5 2.35 2.4 ILED (A) ILED (A) 2.30 2.25 2.3 2.2 2.20 2.1 2.15 2.10 20 24 28 32 36 40 2.0 20 44 32 INPUT VOLTAGE (V) 68 80 Normalized Switching Frequency vs. Input Voltage Amplitude Dimming Using IADJ Pin VO = 17V (5 LEDs); VIN = 24V 1.7 2.3 1.4 1.8 1 LED 1.0 ILED (A) NORMALIZED SWITCHING FREQUENCY Figure 12. 0.7 1.4 0.9 3 LEDs 0.3 0.5 7 LEDs 0.0 0 5 LEDs 14 28 42 56 0.0 0.0 70 0.3 The measurements were The measurements were The measurements were The measurements were made made made made using the using the using the using the Submit Documentation Feedback 0.5 0.8 1.0 1.3 VADJ (V) Figure 13. 6 56 Figure 11. INPUT VOLTAGE (V) (1) (2) (3) (4) 44 INPUT VOLTAGE (V) Figure 14. Bill of Materials Bill of Materials Bill of Materials Bill of Materials from from from from Design Design Design Design #3 except the LM3409 was substituted for the LM3409HV. #3. #3 except the LM3409 was substituted for the LM3409HV. #3. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 Typical Performance Characteristics (continued) TA = +25°C, VIN = 24V, and characteristics are identical for LM3409 and LM3409HV unless otherwise specified. 2.3 Internal EN Pin PWM Dimming VO = 17V (5 LEDs); VIN = 24V External Parallel FET PWM Dimming VO = 17V (5 LEDs); VIN = 24V 2.3 1.8 1.8 20kHz 100 kHz 1.4 ILED (A) 0.9 0.9 1kHz 50 kHz 0.5 20 40 60 80 0.0 0 100 20 40 60 80 100 DUTY CYCLE (%) Figure 16. 20kHz 50% EN pin PWM dimming VO = 42V (12 LEDs); VIN = 48V (5) 100kHz 50% External FET PWM dimming VO = 42V (12 LEDs); VIN = 48V (5) 14 12 10 8 6 4 2 0 -2 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 ILED VEN ILED (A) DUTY CYCLE (%) Figure 15. VPWM2 (V) VEN (V) 0.0 0 0.5 14 12 10 8 6 4 2 0 -2 ILED VPWM2 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 ILED (A) ILED (A) 1.4 20kHz 50% EN pin PWM dimming (rising edge) VO = 42V (12 LEDs); VIN = 48V (6) 100kHz 50% External FET PWM dimming (rising edge) VO = 42V (12 LEDs); VIN = 48V (6) 7 6 5 4 3 2 1 0 -1 VEN 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 -0.4 ILED 7 6 5 4 3 2 1 0 -1 VPWM2 2.8 2.4 2.0 1.6 1.2 0.8 0.4 0.0 -0.4 ILED ILED (A) Figure 18. VPWM2 (V) Figure 17. ILED (A) 2 és/DIV VEN (V) 10 és/DIV 3.5 és 200 ns/DIV 2 és/DIV Figure 19. (5) (6) Figure 20. The waveforms were acquired using the standard evaluation board from AN-1953 (SNVA390). The waveforms were acquired using the standard evaluation board from AN-1953 (SNVA390). Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 7 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com BLOCK DIAGRAM VCC REGULATOR VIN VCC VIN OFF TIMER COFF Complete COFF VCC UVLO THERMAL SHUTDOWN PGATE Start VCC EN R CSN + LOGIC CSP R 22 #A 1.24V + UVLO 5 #A + - IADJ 1.24V GND 5R Theory of Operation The LM3409/09HV are P-channel MosFET (PFET) controllers for step-down (buck) current regulators which are ideal for driving LED loads. They have wide input voltage range allowing for regulation of a variety of LED loads. The high-side differential current sense, with low adjustable threshold voltage, provides an excellent method for regulating output current while maintaining high system efficiency. The LM3409/09HV uses a Controlled Off-Time (COFT) architecture that allows the converter to be operated in both continuous conduction mode (CCM) and discontinuous conduction mode (DCM) with no external control loop compensation, while providing an inherent cycle-by-cycle current limit. The adjustable current sense threshold provides the capability to amplitude (analog) dim the LED current over the full range and the fast output enable/disable function allows for high frequency PWM dimming using no external components. When designing, the maximum attainable LED current is not internally limited because the LM3409/09HV is a controller. Instead it is a function of the system operating point, component choices, and switching frequency allowing the LM3409/09HV to easily provide constant currents up to 5A. This simple controller contains all the features necessary to implement a high efficiency versatile LED driver. BUCK CURRENT REGULATORS The buck regulator is unique among non-isolated topologies due to the direct connection of the inductor to the load during the entire switching cycle. An inductor will control the rate of change of current that flows through it, therefore a direct connection to the load is excellent for current regulation. A buck current regulator, using the LM3409/09HV, is shown in the Typical Application section. During the time that the PFET (Q1) is turned on (tON), the input voltage charges up the inductor (L1). When Q1 is turned off (tOFF), the re-circulating diode (D1) becomes forward biased and L1 discharges. During both intervals, the current is supplied to the load keeping the LEDs forward biased. Figure 21 shows the inductor current (iL(t)) waveform for a buck converter operating in CCM. 8 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 The average inductor current (IL) is equal to the average output LED current (ILED), therefore if IL is tightly controlled, ILED will be well regulated. As the system changes input voltage or output voltage, duty cycle (D) is varied to regulate IL and ultimately ILED. For any buck regulator, D is simply the conversion ratio divided by the efficiency (η): D= VO x VIN (1) iL (t) IL-MAX üiL- IL PP IL-MIN 0 tON = DTS tOFF = (1-D)TS t TS Figure 21. Ideal CCM Buck Converter Inductor Current iL(t) CONTROLLED OFF-TIME (COFT) ARCHITECTURE The COFT architecture is used by the LM3409/09HV to control ILED. It is a combination of peak current detection and a one-shot off-timer that varies with output voltage. D is indirectly controlled by changes in both tOFF and tON, which vary depending on the operating point. This creates a variable switching frequency over the entire operating range. This type of hysteretic control eliminates the need for control loop compensation necessary in many switching regulators, simplifying the design process and providing fast transient response. Adjustable Peak Current Control At the beginning of a switching period, PFET Q1 is turned on and inductor current increases. Once peak current is detected, Q1 is turned off, the diode D1 forward biases, and inductor current decreases. Figure 22 shows how peak current detection is accomplished using the differential voltage signal created as current flows through the current setting resistor (RSNS). The voltage across RSNS (VSNS) is compared to the adjustable current sense threshold (VCST) and Q1 is turned off when VSNS exceeds VCST, providing that tON is greater than the minimum possible tON (typically 115ns). Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 9 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com V IN LM3409/09HV R CSP + V CST + + R SNS - t ON ENDS - VSNS CSN R IT PGATE 5V Q1 L1 IL LED+ 5 #A IADJ + - + 1.24 V VADJ - R EXT Optional D1 LED- GND 5R Figure 22. Peak Current Control Circuit There are three different methods to set the current sense threshold (VCST) using the multi-function IADJ pin: 1. IADJ pin left open: 5µA internal current source biases the Zener diode and clamps the IADJ pin voltage (VADJ) at 1.24V causing the maximum threshold voltage: V V VCST = ADJ x R = ADJ = 1.24V = 248 mV 5xR 5 5 (2) 2. External voltage (VADJ) of 0V to 1.24V: Apply to the IADJ pin to adjust VCST from 0V to 248mV. If the VADJ voltage is adjustable, analog dimming can be achieved. 3. External resistor (REXT) placed from IADJ pin to ground: 5µA current source sets the VADJ voltage and corresponding threshold voltage: V 5#A x REXT VCST = ADJ = = 1#A x REXT 5 5 (3) Controlled Off-Time Once Q1 is turned off, it remains off for a constant time (tOFF) which is preset by an external resistor (ROFF), an external capacitor (COFF), and the output voltage (VO) as shown in Figure 23. Since ILED is tightly regulated, VO will remain nearly constant over widely varying input voltage and temperature yielding a nearly constant tOFF. 10 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 VO LM3409/09HV ROFF + tOFF Control Logic - to PGATE Drive COFF 1.24V COFF + vCOFF - Figure 23. Off-Time Control Circuit At the start of tOFF, the voltage across COFF (vCOFF(t)) is zero and the capacitor begins charging according to the time constant provided by ROFF and COFF. When vCOFF(t) reaches the off-time threshold (VOFT = 1.24V), then the off-time is terminated and vCOFF(t) is reset to zero. tOFF is calculated as follows: · § t OFF = - R OFF x (COFF + 20 pF) x ln ¨¨1 - 1.24V¸¸ VO ¹ © (4) In reality, there is typically 20 pF parasitic capacitance at the off-timer pin in parallel with COFF, which is accounted for in the calculation of tOFF. Also, it should be noted that the tOFF equation has a preceding negative sign because the result of the logarithm should be negative for a properly designed circuit. The resulting tOFF is a positive value as long as VO > 1.24V. If VO < 1.24V, the off-timer cannot reach VOFT and an internally limited maximum off-time (typically 300µs) will occur. vCOFF(t) VO dvCOFF dt 1.24 t 0 tOFF ROFF x COFF Figure 24. Exponential Charging Function vCOFF(t) Although the tOFF equation is non-linear, tOFF is actually very linear in most applications. Ignoring the 20pF parasitic capacitance at the COFF pin, vCOFF(t) is plotted in Figure 24. The time derivative of vCOFF(t) can be calculated to find a linear approximation to the tOFF equation: § t OFF · ¸ -¨ VO dvCOFF (t) R xC ¸ e © OFF OFF¹ = dt R OFF x COFF (5) When tOFF << ROFF x COFF (equivalent to when VO >> 1.24V), the slope of the function is essentially linear and tOFF can be approximated as a current source charging COFF: 1. 24V x R OFF x COFF t OFF | VO (6) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 11 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com Using the actual tOFF equation, the inductor current ripple (ΔiL-PP) of a buck current regulator operating in CCM is: § 1. 24V · ¸ - VO x R OFF x (COFF + 20 pF) x ln ¨¨1 VO ¸¹ © ' iL - PP = L1 (7) Using the tOFF approximation, the equation is reduced to: 'iL - PP | 1. 24 x ROFF x COFF L1 (8) ΔiL-PP is independent of both VIN and VO when in CCM! The ΔiL-PP approximation only depends on ROFF, COFF, and L1, therefore the ripple is essentially constant over the operating range as long as VO >> 1.24V (when the tOFF approximation is valid). An exception to the tOFF approximation occurs if the IADJ pin is used to analog dim. As the LED/inductor current decreases, the converter will eventually enter DCM and the ripple will decrease with the peak current threshold. The approximation shows how the LM3409/09HV achieves constant ripple over a wide operating range, however tOFF should be calculated using the actual equation first presented. AVERAGE LED CURRENT For a buck converter, the average LED current is simply the average inductor current. vSNS (t) VCST 0 tON tOFF t Figure 25. Sense Voltage vSNS(t) Using the COFT architecture, the peak transistor current (IT-MAX) is sensed as shown in Figure 25, which is equal to the peak inductor current (IL-MAX) given by the following equation: V VADJ IL- MAX = IT - MAX = CST = RSNS 5 x RSNS (9) Because IL-MAX is set using peak current control and ΔiL-PP is set using the controlled off-timer, IL and correspondingly ILED can be calculated as follows: ILED = IL = IL - MAX - V xt VADJ 'iL - PP - O OFF = 5 x RSNS 2 x L1 2 (10) The threshold voltage VCST seen by the high-side sense comparator is affected by the comparator’s input offset voltage, which causes an error in the calculation of IL-MAX and ultimately ILED. To mitigate this problem, the polarity of the comparator inputs is swapped every cycle, which causes the actual IL-MAX to alternate between two peak values (IL-MAXH and IL-MAXL), equidistant from the theoretical IL-MAX as shown in Figure 26. ILED remains accurate through this averaging. 12 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 iL(t) IL-MAX-H IL-MAX IL-MAX-L 0 tOFF 0 t tOFF Figure 26. Inductor Current iL(t) Showing IL-MAX Offset INDUCTOR CURRENT RIPPLE Because the LM3409/09HV swaps the polarity of the differential current sense comparator every cycle, a minimum inductor current ripple (ΔiL-PP) is necessary to maintain accurate ILED regulation. Referring to Figure 26, the first tON is terminated at the higher of the two polarity-swapped thresholds (corresponding to IL-MAXH). During the following tOFF, iL decreases until the second tON begins. If tOFF is too short, then as the second tON begins, iL will still be above the lower peak current threshold (corresponding to IL-MAXL) and a minimum tON pulse will follow. This will result in degraded ILED regulation. The minimum inductor current ripple (ΔiL-PP-MIN) should adhere to the following equation in order to ensure accurate ILED regulation: 24 mV 'iL - PP - MIN > RSNS (11) SWITCHING FREQUENCY The switching frequency is dependent upon the actual operating point (VIN and VO). VO will remain relatively constant for a given application, therefore the switching frequency will vary with VIN (frequency increases as VIN increases). The target switching frequency (fSW) at the nominal operating point is selected based on the tradeoffs between efficiency (better at low frequency) and solution size/cost (smaller at high frequency). The off-time of the LM3409/09HV can be programmed for switching frequencies up to 5 MHz (theoretical limit imposed by minimum tON). In practice, switching frequencies higher than 1MHz may be difficult to obtain due to gate drive limitations, high input voltage, and thermal considerations. At CCM operating points, fSW is defined as: § V · 1 - ¨¨ O ¸¸ ©K x VIN ¹ 1- D fSW = = t OFF t OFF (12) At DCM operating points, fSW is defined as: fSW = 1 1 = t ON + tOFF §IL - MAX x L1· ¸¸ + t OFF ¨ © VIN - VO ¹ (13) In the CCM equation, it is apparent that the efficiency (η) factors into the switching frequency calculation. Efficiency is hard to estimate and, since switching frequency varies with input voltage, accuracy in setting the nominal switching frequency is not critical. Therefore, a general rule of thumb for the LM3409/09HV is to assume an efficiency between 85% and 100%. When approximating efficiency to target a nominal switching frequency, the following condition must be met: VO > VIN (14) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 13 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com iLED (t) ILED-MAX ILED IDIM-LED DDIM x TDIM t 0 tOFF TDIM Figure 27. LED Current iLED(t) During EN Pin PWM Dimming PWM DIMMING USING THE EN PIN The enable pin (EN) is a TTL compatible input for PWM dimming of the LED. A logic low (below 0.5V) at EN will disable the internal driver and shut off the current flow to the LED array. While the EN pin is in a logic low state the support circuitry (driver, bandgap, VCC regulator) remains active in order to minimize the time needed to turn the LED array back on when the EN pin sees a logic high (above 1.74V). Figure 27 shows the LED current (iLED(t)) during PWM dimming where duty cycle (DDIM) is the percentage of the dimming period (TDIM) that the PFET is switching. For the remainder of TDIM, the PFET is disabled. The resulting dimmed average LED current (IDIM-LED) is: IDIM- LED = DDIM x ILED (15) The LED current rise and fall times (which are limited by the slew rate of the inductor as well as the delay from activation of the EN pin to the response of the external PFET) limit the achievable TDIM and DDIM. In general, dimming frequency should be at least one order of magnitude lower than the steady state switching frequency in order to prevent aliasing. However, for good linear response across the entire dimming range, the dimming frequency may need to be even lower. HIGH VOLTAGE NEGATIVE BIAS REGULATOR The LM3409/09HV contains an internal linear regulator where the steady state VCC pin voltage is typically 6.2V below the voltage at the VIN pin. The VCC pin should be bypassed to the VIN pin with at least 1µF of ceramic capacitance connected as close as possible to the IC. INPUT UNDER-VOLTAGE LOCKOUT (UVLO) Under-voltage lockout is set with a resistor divider from VIN to GND and is compared against a 1.24V threshold as shown in Figure 28. Once the input voltage is above the preset UVLO rising threshold (and assuming the part is enabled), the internal circuitry becomes active and a 22µA current source at the UVLO pin is turned on. This extra current provides hysteresis to create a lower UVLO falling threshold. The resistor divider is chosen to set both the UVLO rising and falling thresholds. 14 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 LM3409/09HV VIN 22 #A RUV2 + - ON/OFF UVLO 1.24V RUV1 Figure 28. UVLO Circuit The turn-on threshold (VTURN-ON) is defined as follows: VTURN-ON = 1. 24V x (RUV1 + RUV2) RUV1 (16) The hysteresis (VHYS) is defined as follows: VHYS = RUV2 x 22 PA (17) LOW POWER SHUTDOWN The LM3409/09HV can be placed into a low power shutdown (typically 110µA) by grounding the EN terminal (any voltage below 0.5V) until VCC drops below the VCC UVLO threshold (typically 3.73V). During normal operation this terminal should be tied to a voltage above 1.74V and below absolute maximum input voltage rating. THERMAL SHUTDOWN Internal thermal shutdown circuitry is provided to protect the IC in the event that the maximum junction temperature is exceeded. The threshold for thermal shutdown is 160°C with 15°C of hysteresis (both values typical). During thermal shutdown the PFET and driver are disabled. Design Considerations OPERATION NEAR DROPOUT Because the power MosFET is a PFET, the LM3409/09HV can be operated into dropout which occurs when the input voltage is approximately equal to output voltage. Once the input voltage drops below the nominal output voltage, the switch remains constantly on (D=1) causing the output voltage to decrease with the input voltage. In normal operation, the average LED current is regulated to the peak current threshold minus half of the ripple. As the converter goes into dropout, the LED current is exactly at the peak current threshold because it is no longer switching. This causes the LED current to increase by half of the set ripple current as it makes the transition into dropout. Therefore, the inductor current ripple should be kept as small as possible (while remaining above the previously established minimum) and output capacitance should be added to help maintain good line regulation when approaching dropout. LED RIPPLE CURRENT Selection of the ripple current through the LED array is analogous to the selection of output ripple voltage in a standard voltage regulator. Where the output voltage ripple in a voltage regulator is commonly ±1% to ±5% of the DC output voltage, LED manufacturers generally recommend values for ΔiLED-PP ranging from ±5% to ±20% of ILED. For a nominal system operating point, a larger ΔiLED-PP specification can reduce the necessary inductor size and/or allow for smaller output capacitors (or no output capacitors at all) which helps to minimize the total solution size and cost. On the other hand, a smaller ΔiLED-PP specification would require more output inductance, a higher switching frequency, or additional output capacitance. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 15 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com BUCK CONVERTERS W/O OUTPUT CAPACITORS Because current is being regulated, not voltage, a buck current regulator is free of load current transients, therefore output capacitance is not needed to supply the load and maintain output voltage. This is very helpful when high frequency PWM dimming the LED load. When no output capacitor is used, the same design equations that govern ΔiL-PP also apply to ΔiLED-PP. BUCK CONVERTERS WITH OUTPUT CAPACITORS A capacitor placed in parallel with the LED load can be used to reduce ΔiLED-PP while keeping the same average current through both the inductor and the LED array. With an output capacitor, the inductance can be lowered, making the magnetics smaller and less expensive. Alternatively, the circuit can be run at lower frequency with the same inductor value, improving the efficiency and increasing the maximum allowable average output voltage. A parallel output capacitor is also useful in applications where the inductor or input voltage tolerance is poor. Adding a capacitor that reduces ΔiLED-PP to well below the target provides headroom for changes in inductance or VIN that might otherwise push the maximum ΔiLED-PP too high. Figure 29. Calculating Dynamic Resistance rD Output capacitance (CO) is determined knowing the desired ΔiLED-PP and the LED dynamic resistance (rD). rD can be calculated as the slope of the LED’s exponential DC characteristic at the nominal operating point as shown in Figure 29. Simply dividing the forward voltage by the forward current at the nominal operating point will give an incorrect value that is 5x to 10x too high. Total dynamic resistance for a string of n LEDs connected in series can be calculated as the rD of one device multiplied by n. The following equations can then be used to estimate ΔiLEDPP when using a parallel capacitor: 'i 'iLED- PP = L - PP rD 1+ ZC (18) 1 ZC = 2 x S x fSW x CO (19) In general, ZC should be at least half of rD to effectively reduce the ripple. Ceramic capacitors are the best choice for the output capacitors due to their high ripple current rating, low ESR, low cost, and small size compared to other types. When selecting a ceramic capacitor, special attention must be paid to the operating conditions of the application. Ceramic capacitors can lose one-half or more of their capacitance at their rated DC voltage bias and also lose capacitance with extremes in temperature. Make sure to check any recommended deratings and also verify if there is any significant change in capacitance at the operating voltage and temperature. 16 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 OUTPUT OVER-VOLTAGE PROTECTION Because the LM3409/09HV controls a buck current regulator, there is no inherent need to provide output overvoltage protection. If the LED load is opened, the output voltage will only rise as high as the input voltage plus any ringing due to the parasitic inductance and capacitance present at the output node. If a ceramic output capacitor is used in the application, it should have a minimum rating equal to the input voltage. Ringing seen at the output node should not damage most ceramic capacitors, due to their high ripple current rating. INPUT CAPACITORS Input capacitors are selected using requirements for minimum capacitance and RMS ripple current. The PFET current during tON is approximately ILED, therefore the input capacitors discharge the difference between ILED and the average input current (IIN) during tON. During tOFF, the input voltage source charges up the input capacitors with IIN. The minimum input capacitance (CIN-MIN) is selected using the maximum input voltage ripple (ΔvIN-MAX) which can be tolerated. ΔvIN-MAX is equal to the change in voltage across CIN during tON when it supplies the load current. A good starting point for selection of CIN is to use ΔvIN-MAX of 2% to 10% of VIN. CIN-MIN can be selected as follows: CIN - MIN = ILED x t ON 'vIN - MAX · §1 - t OFF¸¸ ILED x ¨¨ f ¹ © SW = 'vIN - MAX (20) An input capacitance at least 75% greater than the calculated CIN-MIN value is recommended. To determine the RMS input current rating (IIN-RMS) the following approximation can be used: IIN - RMS = ILED x D x (1 - D) = ILED x fSW x t ON x t OFF (21) Since this approximation assumes there is no inductor ripple current, the value should be increased by 10-30% depending on the amount of ripple that is expected. Ceramic capacitors are the best choice for input capacitors for the same reasons mentioned in the BUCK CONVERTERS WITH OUTPUT CAPACITORS section. Careful selection of the capacitor requires checking capacitance ratings at the nominal operating voltage and temperature. P-CHANNEL MosFET (PFET) The LM3409/09HV requires an external PFET (Q1) as the main power MosFET for the switching regulator. Q1 should have a voltage rating at least 15% higher than the maximum input voltage to ensure safe operation during the ringing of the switch node. In practice all switching converters have some ringing at the switch node due to the diode parasitic capacitance and the lead inductance. The PFET should also have a current rating at least 10% higher than the average transistor current (IT): IT = D x ILED (22) The power rating is verified by calculating the power loss (PT) using the RMS transistor current (IT-RMS) and the PFET on-resistance (RDS-ON): 2· § 1 §¨ 'i L-PP ·¸ ¸ ¨ IT- RMS = ILED x D x ¨1+ x ¨ ¨ 12 © ILED ¸¹ ¸¸ © ¹ (23) 2 PT = IT- RMS x R DSON (24) It is important to consider the gate charge of Q1. As the input voltage increases from a nominal voltage to its maximum input voltage, the COFT architecture will naturally increase the switching frequency. The dominant switching losses are determined by input voltage, switching frequency, and PFET total gate charge (Qg). The LM3409/09HV has to provide and remove charge Qg from the input capacitance of Q1 in order to turn it on and off. This occurs more often at higher switching frequencies which requires more current from the internal regulator, thereby increasing internal power dissipation and eventually causing the LM3409/09HV to thermally cycle. For a given range of operating points the only effective way to reduce these switching losses is to minimize Qg. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 17 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com A good rule of thumb is to limit Qg < 30nC (if the switching frequency remains below 300kHz for the entire operating range then a larger Qg can be considered). If a PFET with small RDS-ON and a high voltage rating is required, there may be no choice but to use a PFET with Qg > 30nC. When using a PFET with Qg > 30nC, the bypass capacitor (CF) should not be connected to the VIN pin. This will ensure that peak current detection through RSNS is not affected by the charging of the PFET input capacitance during switching, which can cause false triggering of the peak detection comparator. Instead, CF should be connected from the VCC pin to the CSN pin which will cause a small DC offset in VCST and ultimately ILED, however it avoids the problematic false triggering. In general, the PFET should be chosen to meet the Qg specification whenever possible, while minimizing RDS-ON. This will minimize power losses while ensuring the part functions correctly over the full operating range. RE-CIRCULATING DIODE A re-circulating diode (D1) is required to carry the inductor current during tOFF. The most efficient choice for D1 is a Schottky diode due to low forward voltage drop and near-zero reverse recovery time. Similar to Q1, D1 must have a voltage rating at least 15% higher than the maximum input voltage to ensure safe operation during the ringing of the switch node and a current rating at least 10% higher than the average diode current (ID): ID = (1- D) x ILED (25) The power rating is verified by calculating the power loss through the diode. This is accomplished by checking the typical diode forward voltage (VD) from the I-V curve on the product datasheet and calculating as follows: PD = ID x VD (26) In general, higher current diodes have a lower VD and come in better performing packages minimizing both power losses and temperature rise. iLED (t) ILED-MAX ILED IDIM-LED DDIM x TDIM t 0 TDIM tOFF Figure 30. Ideal LED Current iLED(t) During Parallel FET Dimming EXTERNAL PARALLEL FET PWM DIMMING Any buck topology LED driver is a good candidate for parallel FET dimming because high slew rates are achievable, due to the fact that no output capacitance is required. This allows for much higher dimming frequencies than are achievable using the EN pin. When using external parallel FET dimming, a situation can arise where maximum off-time occurs due to a shorted output. To mitigate this situation, capacitive coupling to the enable pin can be employed. 18 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 LM3409/09HV VDD > 1.6V REXT EN CEXT ILED VDD Dim FET PWM Gate Driver Figure 31. External Parallel FET Dimming Circuit As shown in Figure 31, a small capacitor (CEXT) is connected from the gate drive signal of the parallel Dim FET to the EN pin and a pull-up resistor (REXT) is placed from the EN pin to the external VDD supply for the Dim FET gate driver. This forces the on-timer to restart corresponding to every rising edge of the LED voltage, ensuring that the unwanted maximum off-time condition does not occur. With this type of dimming, the EN pin does not control the dimming; it simply resets the controller. A good design choice is to size REXT and CEXT to give a time constant smaller than tOFF: t OFF > REXT x CEXT (27) The ideal LED current waveform iLED(t) during parallel FET PWM dimming is very similar to the EN pin PWM dimming shown previously. The LED current does not rise and fall infinitely fast as shown in Figure 30 however with this method, only the speed of the parallel Dim FET ultimately limits the dimming frequency and dimming duty cycle. This allows for much faster PWM dimming than can be attained with the EN pin. CIRCUIT LAYOUT The performance of any switching converter depends as much upon the layout of the PCB as the component selection. Following a few simple guidelines will maximimize noise rejection and minimize the generation of EMI within the circuit. Discontinuous currents are the most likely to generate EMI, therefore care should be taken when routing these paths. The main path for discontinuous current in the LM3409/09HV buck converter contains the input capacitor (CIN), the recirculating diode (D1), the P-channel MosFET (Q1), and the sense resistor (RSNS). This loop should be kept as small as possible and the connections between all three components should be short and thick to minimize parasitic inductance. In particular, the switch node (where L1, D1 and Q1 connect) should be just large enough to connect the components without excessive heating from the current it carries. The IADJ, COFF, CSN and CSP pins are all high-impedance control inputs which couple external noise easily, therefore the loops containing these high impedance nodes should be minimized. The most sensitive loop contains the sense resistor (RSNS) which should be placed as close as possible to the CSN and CSP pins to maximize noise rejection. The off-time capacitor (COFF) should be placed close to the COFF and GND pins for the same reason. Finally, if an external resistor (REXT) is used to bias the IADJ pin, it should be placed close to the IADJ and GND pins, also. In some applications the LED or LED array can be far away (several inches or more) from the LM3409/09HV, or on a separate PCB connected by a wiring harness. When an output capacitor is used and the LED array is large or separated from the rest of the converter, the output capacitor should be placed close to the LEDs to reduce the effects of parasitic inductance on the AC impedance of the capacitor. Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 19 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com Design Guide TYPICAL APPLICATION RUV2 RUV1 1 VIN UVLO 10 VIN CF 2 3 ROFF VCC IADJ EN LM3409/HV CSP CIN 9 8 RSNS 4 COFF COFF CSN 7 DAP 5 GND PGATE 6 Q1 L1 VO D1 ILED SPECIFICATIONS Nominal input voltage: VIN Maximum input voltage: VIN-MAX Nominal output voltage (# of LEDs x forward voltage): VO LED string dynamic resistance: rD Switching frequency (at nominal VIN, VO): fSW Average LED current: ILED Inductor current ripple: ΔiL-PP LED current ripple: ΔiLED-PP Input voltage ripple: ΔvIN-PP UVLO characteristics: VTURN-ON and VHYS Expected efficiency: η 1. NOMINAL SWITCHING FREQUENCY Calculate switching frequency (fSW) at the nominal operating point (VIN and VO). Assume a COFF value (between 470pF and 1nF) and a system efficiency (η). Solve for ROFF: 20 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com R OFF = SNVS602J – MARCH 2009 – REVISED MAY 2013 § VO · ¸ - ¨¨1¸ © K x VIN ¹ · § (COFF + 20 pF) x fSW x ln ¨¨1 - 1.24V ¸¸ V O ¹ © (28) 2. INDUCTOR RIPPLE CURRENT Set the inductor ripple current (ΔiL-PP) by solving for the appropriate inductor (L1): V xt L1 = O OFF 'iL- PP (29) 3. AVERAGE LED CURRENT Set the average LED current (ILED) by first solving for the peak inductor current (IL-MAX): 'i IL- MAX = ILED + L- PP 2 (30) Peak inductor current is detected across the sense resistor (RSNS). In most cases, assume the maximum value (VADJ = 1.24V) at the IADJ pin and solve for RSNS: VADJ RSNS = 5 x IL - MAX (31) If the calculated RSNS is far from a standard value, the beginning of the process can be iterated to choose a new ROFF, L1, and RSNS value that is a closer fit. The easiest way to approach the iterative process is to change the nominal fSW target knowing that the switching frequency varies with operating conditions anyways. Another method for finding a standard RSNS value is to change the VADJ value. However, this would require an external voltage source or a resistor from the IADJ pin to GND as explained in the Theory of Operation section of this datasheet. 4. OUTPUT CAPACITANCE A minimum output capacitance (CO-MIN) may be necessary to reduce ΔiLED-PP below ΔiL-PP. With the specified ΔiLED-PP and the known dynamic resistance (rD) of the LED string, solve for the required impedance (ZC) for COMIN: r x 'iLED - PP ZC = D 'iL - PP - 'iLED - PP (32) Solve for CO-MIN: CO - MIN = 1 2 x S x fSW x Z C (33) 5. INPUT CAPACITANCE Set the input voltage ripple (ΔvIN-PP) by solving for the required minimum capacitance (CIN-MIN): · § 1 - t OFF¸¸ ILED x ¨¨ f I xt ¹ © SW CIN- MIN = LED ON = 'vIN - PP 'vIN - PP (34) The necessary RMS input current rating (IIN-RMS) is: IIN - RMS = ILED x fSW x t ON x t OFF Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 (35) Submit Documentation Feedback 21 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com 6. PFET The PFET voltage rating should be at least 15% higher than the maximum input voltage (VIN-MAX) and current rating should be at least 10% higher than the average PFET current (IT): IT = D x ILED (36) Given a PFET with on-resistance (RDS-ON), solve for the RMS transistor current (IT-RMS) and power dissipation (PT): 2· § 1 §¨ 'i L-PP ·¸ ¸ ¨ IT- RMS = ILED x D x ¨1+ x ¨ ¨ 12 © ILED ¸¹ ¸¸ © ¹ (37) 2 PT = IT- RMS x R DSON (38) 7. DIODE The Schottky diode needs a voltage rating similar to the PFET. Higher current diodes with a lower forward voltage are suggested. Given a diode with forward voltage (VD), solve for the average diode current (ID) and power dissipation (PD): ID = (1- D) x ILED (39) PD = ID x VD (40) 8. INPUT UVLO Input UVLO is set with the turn-on threshold voltage (VTURN-ON) and the desired hysteresis (VHYS). To set VHYS, solve for RUV2: V RUV2 = HYS 22 PA (41) To set VTURN-ON, solve for RUV1: RUV1 = 1.24V x RUV2 VTURN - ON - 1.24V (42) 9. IADJ CONNECTION METHOD The IADJ pin controls the high-side current sense threshold in three ways outlined in the Theory of Operation section. Method #1: Leave IADJ pin open and ILED is calculated as in the 3. AVERAGE LED CURRENT section of the Design Guide. Method #2: Apply an external voltage (VADJ) to the IADJ pin between 0 and 1.24V to analog dim or to reduce ILED as follows: 'i VADJ ILED = - L - PP 5 x RSNS 2 (43) Keep in mind that analog dimming will eventually push the converter in to DCM and the inductor current ripple will no longer be constant causing a divergence from linear dimming at low levels. A 0.1µF capacitor connected from the IADJ pin to GND is recommended when using this method. It may also be necessary to have a 1kΩ series resistor with the capacitor to create an RC filter. The filter will help remove high frequency noise created by other connected circuitry. Method #3: Connect an external resistor or potentiometer to GND (REXT) and the internal 5µA current source will set the voltage. Again, a 0.1µF capacitor connected from the IADJ pin to GND is recommended. To set ILED, solve for REXT: 22 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 'i · § ¨ILED + L-PP¸ x RSNS 2 ¹ REXT = © 1 PA (44) 10. PWM DIMMING METHOD There are two methods to PWM dim using the LM3409/09HV: Method #1: Apply an external PWM signal to the EN terminal. Method #2: Perform external parallel FET shunt dimming as detailed in the EXTERNAL PARALLEL FET PWM DIMMING section. Design Example #1 EN PIN PWM DIMMING APPLICATION FOR 10 LEDS RUV2 RUV1 1 VIN UVLO 10 VIN = 48V CF 2 PWM ROFF 3 VCC IADJ EN LM3409HV CSP CIN1 CIN2 9 VO = 35V 8 RSNS 4 COFF COFF CSN 7 ILED = 2A DAP 5 GND PGATE 6 Q1 L1 D1 SPECIFICATIONS fSW = 525kHz VIN = 48V; VIN-MAX = 75V VO = 35V ILED = 2A ΔiLED-PP = ΔiL-PP = 1A ΔvIN-PP = 1.44V VTURN-ON = 10V; VHYS = 1.1V η = 0.95 1. NOMINAL SWITCHING FREQUENCY Assume COFF = 470pF and η = 0.95. Solve for ROFF: Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 23 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 ROFF = www.ti.com § VO · ¸ - ¨¨1¸ © K x VIN ¹ § 1.24V· ¸ (COFF + 20 pF) x fSW x ln ¨¨1¸ © VO ¹ § 35V · - ¨1¸ © 0.95 x 48V¹ ROFF = = 25.1 k: § 1.24V· 490 pF x 525 kHz x ln ¨1¸ © 35V ¹ (45) The closest 1% tolerance resistor is 24.9 kΩ therefore the actual tOFF and target fSW are: § 1.24V· ¸ t OFF = - (COFF + 20 pF) x ROFF x ln ¨¨1VO ¸¹ © § 1.24V· ¸¸ = 440 ns t OFF = - 490 pF x 24.9 k: x ln ¨¨1© 35V ¹ (46) § V · § · 1 - ¨¨ O ¸¸ 1 - ¨ 35V ¸ ©0.95 x 48V¹ 528 kHz ©K x VIN ¹ fSW = t = = 440 ns OFF (47) The chosen components from step 1 are: COFF = 470 pF R OFF = 24.9 k: (48) 2. INDUCTOR RIPPLE CURRENT Solve for L1: L1 = VO x t OFF 35V x 440 ns = = 15.4 PH 'iL - PP 1A (49) The closest standard inductor value is 15 µH therefore the actual ΔiL-PP is: V xt 35V x 440 ns 'iL- PP = O OFF = = 1.027A L1 15 PH (50) The chosen component from step 2 is: L1 = 15 PH (51) 3. AVERAGE LED CURRENT Determine IL-MAX: IL- MAX = ILED + 'iL - PP 1.027A = 2A + = 2.51A 2 2 (52) Assume VADJ = 1.24V and solve for RSNS: VADJ 1.24V RSNS = = = 0.099: 5 x IL- MAX 5 x 2.51A (53) The closest 1% tolerance resistor is 0.1 Ω therefore the ILED is: 24 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 ILED = VADJ 'i - L- PP 5 x RSNS 2 ILED = 1.027A 1.24V = 1.97A 2 5 x 0.099: (54) The chosen component from step 3 is: RSNS = 0.1: (55) 4. OUTPUT CAPACITANCE No output capacitance is necessary. 5. INPUT CAPACITANCE Determine tON: 1 1 t ON = - t OFF = - 440 ns = 1.45 Ps 528 kHz fSW (56) Solve for CIN-MIN: I xt 1. 97A x 1.45 Ps CIN - MIN = LED ON = = 1.98 PF 'vIN - PP 1.44V (57) Choose CIN: CIN = CIN - MIN x 2 = 3.96 PF (58) Determine IIN-RMS: IIN - RMS = ILED x fSW x t ON x t OFF IIN- RMS = 1.97A x 528 kHz x 1.45 Ps x 440 ns = 831 mA (59) The chosen components from step 5 are: CIN1 = CIN2 = 2.2 PF (60) 6. PFET Determine minimum Q1 voltage rating and current rating: VT- MAX = VIN - MAX = 75V IT = D x ILED = (61) VO x ILED 35V x 1.97A = = 1.51A 48V x 0.95 VIN x K (62) A 100V, 3.8A PFET is chosen with RDS-ON = 190mΩ and Qg = 20nC. Determine IT-RMS and PT: 2· § 1 § 'i · IT- RMS = ILED x D x ¨¨1+ x ¨¨ L-PP ¸¸ ¸¸ ¨ 12 © ILED ¹ ¸ © ¹ 2 § 1 §1.027A · ·¸ 35V ¨ x 1+ x ¨ IT- RMS = 1.97A x ¸ 48V x 0.95 ¨ 12 ¨© 1.97A ¸¹ ¸ ¹ © IT- RMS = 1.74A 2 (63) 2 PT = IT- RMS x R DSON = 1.74 A x 190 m: = 577 mW Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 (64) Submit Documentation Feedback 25 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com The chosen component from step 6 is: Q1o 3.8 A ,100V, DPAK (65) 7. DIODE Determine minimum D1 voltage rating and current rating: VD - MAX = VIN - MAX = 75V (66) § VO · ¸ x ILED ID = (1- D) x ILED = ¨¨1¸ © VIN x K ¹ § 35V · ID = ¨¨1¸ x 1.97A = 457 mA 48 V x 0.95¸¹ © (67) A 100V, 3A diode is chosen with VD = 750mV. Determine PD: PD = ID x VD = 457 mA x 750 mV = 343 mW (68) The chosen component from step 7 is: D1 o 3 A,100V, SMC (69) 8. INPUT UVLO Solve for RUV2: RUV2 = VHYS 1.1V 50 k: = = 22 PA 22 PA (70) The closest 1% tolerance resistor is 49.9 kΩ therefore VHYS is: VHYS = RUV2 x 22 PA = 49.9 k: x 22 PA = 1.1V (71) Solve for RUV1: RUV1 = 1. 24V x RUV2 1.24V x 49.9 k: = = 7.06 k: 10V - 1.24V VTURN - ON - 1.24V (72) The closest 1% tolerance resistor is 6.98 kΩ therefore VTURN-ON is: VTURN-ON = VTURN-ON = 1. 24V x (RUV1 + RUV2) RUV1 1. 24V x (6.98 k: + 49.9 k:) 6.98 k: = 10.1V (73) The chosen components from step 8 are: RUV1 = 6.98 k: RUV2 = 49.9 k: (74) 9. IADJ CONNECTION METHOD The IADJ pin is left open forcing VADJ = 1.24V. 10. PWM DIMMING METHOD PWM dimming signal pair is applied to the EN pin and GND at fDIM = 1 kHz. 26 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 Design #1 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3409HV/LM3409QHV Buck controller TI LM3409HVMY/LM3409QHVMY 2 CIN1, CIN2 2.2µF X7R 10% 100V MURATA GRM43ER72A225KA01L 1 CF 1.0µF X7R 10% 16V TDK C1608X7R1C105K 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 Q1 PMOS 100V 3.8A ZETEX ZXMP10A18KTC 1 D1 Schottky 100V 3A VISHAY SS3H10-E3/57T 1 L1 15 µH 20% 4.2A TDK SLF12565T-150M4R2 1 ROFF 24.9kΩ 1% VISHAY CRCW060324K9FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.1Ω 1% 1W VISHAY WSL2512R1000FEA Design Example #2 ANALOG DIMMING APPLICATION FOR 4 LEDS RUV2 RUV1 RF2 VADJ 1 VIN UVLO 10 VIN = 24V CF 2 VCC IADJ CIN1 9 CF2 3 ROFF EN LM3409 CSP 8 RSNS 4 COFF CSN COFF VO = 14V 7 DAP 5 GND PGATE 6 Q1 ILED = 1A L1 D1 CO SPECIFICATIONS fSW = 500kHz VIN = 24V; VIN-MAX = 42V VO = 14V ILED = 1A ΔiL-PP = 450mA; ΔiLED-PP = 50mA ΔvIN-PP = 1V VTURN-ON = 10V; VHYS = 1.1V Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 27 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com η = 0.90 1. NOMINAL SWITCHING FREQUENCY Assume COFF = 470pF and η = 0.90. Solve for ROFF: § VO · - ¨¨1 ¸ K x VIN ¸¹ © ROFF = § 1.24V· ¸ COFF + 20 pF x fSW x ln ¨¨1 VO ¸¹ © § 14V · - ¨1 ¸ 0 . 90 x 24V¹ © ROFF = = 15.5 k: § 1. 24V· 490 pF x 500 kHz x ln ¨1¸ © 14V ¹ (75) The closest 1% tolerance resistor is 15.4 kΩ therefore the actual tOFF and target fSW are: § 1.24V· ¸ t OFF = - (COFF + 20 pF) x R OFF x ln ¨¨1VO ¸¹ © § 1.24V · t OFF = - 490 pF x 15.4 k: x ln ¨¨1¸¸ = 700 ns © 14V ¹ fSW = § VO · ¸ 1- ¨¨ ¸ ©K x VIN ¹ t OFF (76) § 14V · 1- ¨ ¸ ©0. 90 x 24V¹ = 503 kHz = 700 ns (77) The chosen components from step 1 are: COFF = 470 pF R OFF = 15.4 k: (78) 2. INDUCTOR RIPPLE CURRENT Solve for L1: L1 = VO x t OFF 14V x 700 ns = = 21.8 PH 'iL - PP 450 mA (79) The closest standard inductor value is 22 µH therefore the actual ΔiL-PP is: 'iL - PP = VO x t OFF L1 = 14V x 700 ns = 445 mA 22 PH (80) The chosen component from step 2 is: L1 = 22 PH (81) 3. AVERAGE LED CURRENT Determine IL-MAX: IL - MAX = ILED + 'iL - PP 445 mA = 1A + = 1. 22 A 2 2 (82) Assume VADJ = 1.24V and solve for RSNS: 28 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 RSNS = VADJ 1.24V = = 0.203: 5 x IL - MAX 5 x 1.22A (83) The closest 1% tolerance resistor is 0.2 Ω therefore ILED is: 'i VADJ 1.24V 445 mA ILED = - L - PP = = 1.02 A 2 5 x RSNS 2 5 x 0.2: (84) The chosen component from step 3 is: RSNS = 0.2: (85) 4. OUTPUT CAPACITANCE Assume rD = 2 Ω and determine ZC: r x 'iLED- PP 2: x 50 mA ZC = D = = 250 m: 'iL- PP - 'iLED- PP 450 mA - 50 mA (86) Solve for CO-MIN and : 1 2 x S x fSW x Z C CO - MIN = CO - MIN = 1 2 x S x 503 kHz x 250 m: = 1.27 PF (87) Choose CO: CO = CO- MIN x 1.75 = 2.2 PF (88) The chosen component from step 5 is: CO = 2.2 PF (89) 5. INPUT CAPACITANCE Determine tON: t ON = 1 1 -t - 700 ns = 1.29 Ps = fSW OFF 503 kHz (90) Solve for CIN-MIN: I xt 1.02A x 1.29 Ps CIN - MIN = LED ON = = 1.82 PF 'vIN- PP 720 mV (91) Choose CIN: CIN = CIN - MIN x 2 = 3.64 PF (92) Determine IIN-RMS: IIN- RMS = ILED x fSW x t ON x t OFF IIN- RMS = 1.02A x 503 kHz x 1. 29 Ps x 700 ns = 486 mA (93) The chosen component from step 5 is: CIN = 4.7 PF (94) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 29 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com 6. PFET Determine minimum Q1 voltage rating and current rating: VT- MAX = VIN - MAX = 42V IT = D x ILED = (95) VO x ILED 14V x 1.02A = = 660 mA VIN x K 24V x 0.90 (96) A 70V, 5.7A PFET is chosen with RDS-ON = 190mΩ and Qg = 20nC. Determine IT-RMS and PT: 2· § 1 §¨ 'i L-PP ·¸ ¸ ¨ IT- RMS = ILED x D x ¨1+ x ¨ ¨ 12 © ILED ¸¹ ¸¸ © ¹ § 1 §445 mA·2· 14V x ¨1+ x ¨ ¸¸ IT- RMS = 1.02A x 24V x 0.90 ¨ 12 ¨© 1.02A ¸¹ ¸ ¹ © IT- RMS = 830 mA 2 PT = IT- RMS (97) 2 x RDSON = 830 mA x190 m: = 129 mW (98) The chosen component from step 6 is: Q1o 5.7A, 70V, DPAK (99) 7. DIODE Determine minimum D1 voltage rating and current rating: VD- MAX = VIN - MAX = 42V (100) VO · § ¸ x ILED ID = (1- D) x ILED = ¨¨1¸ © VIN xK ¹ 14V · § ¸ x 1.02A = 358 mA ID = ¨124 V x 0.90¹ © (101) A 60V, 5A diode is chosen with VD = 750mV. Determine PD: PD = ID x VD = 358 mA x 750 mV = 268 mW (102) The chosen component from step 7 is: D1 o 5A, 60V, SMC (103) 8. INPUT UVLO Solve for RUV2: RUV2 = VHYS 1.1V 50 k: = = 22 PA 22 PA (104) The closest 1% tolerance resistor is 49.9 kΩ therefore VHYS is: VHYS = RUV2 x 22 PA = 49.9 k: x 22 PA = 1.1V (105) Solve for RUV1: RUV1 = 30 1. 24V x RUV2 1.24V x 49.9 k: = = 7.06 k: 10V - 1.24V VTURN - ON - 1.24V Submit Documentation Feedback (106) Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 The closest 1% tolerance resistor is 6.98 kΩ therefore VTURN-ON is: VTURN-ON = VTURN-ON = 1. 24V x (RUV1 + RUV2) RUV1 1. 24V x (6.98 k: + 49.9 k:) 6.98 k: = 10.1V (107) The chosen components from step 8 are: RUV1 = 6.98 k: RUV2 = 49.9 k: (108) 9. IADJ CONNECTION METHOD The IADJ pin is connected to an external voltage source and varied from 0 – 1.24V to dim. An RC filter (RF2 = 1 kΩ and CF2 = 0.1µF) is used as recommended. 10. PWM DIMMING METHOD No PWM dimming is necessary. Design #2 Bill of Materials Qty Part ID Part Value Manufacturer Part Number 1 LM3409/LM3409Q Buck controller TI LM3409MY/LM3409QMY 2 CIN1 4.7µF X7R 10% 50V MURATA GRM55ER71H475MA01L 1 CF 1.0µF X7R 10% 16V TDK C1608X7R1C105K C1608X7R1C104K 1 CF2 0.1µF X7R 10% 16V TDK 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 CO 2.2µF X7R 10% 50V MURATA GRM43ER71H225MA01L 1 Q1 PMOS 70V 5.7A ZETEX ZXMP7A17KTC 1 D1 Schottky 60V 5A COMCHIP CDBC560-G 1 L1 22 µH 20% 4.2A TDK SLF12575T-220M4R0 1 RF2 1.0kΩ 1% VISHAY CRCW06031K00FKEA 1 ROFF 15.4kΩ 1% VISHAY CRCW060315K4FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.2Ω 1% 1W VISHAY WSL2512R2000FEA Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 31 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com APPLICATIONS INFORMATION DESIGN #3: EXTERNAL PARALLEL FET PWM DIMMING APPLICATION FOR 10 LEDS RUV2 RUV1 1 UVLO VIN IADJ VCC 10 VIN = 48V CF 2 REXT 3 5V EN LM3409HV CSP CIN1 CIN2 9 VO = 35V 8 RSNS CEXT 4 COFF CSN COFF 7 DAP 5 GND PGATE 6 Q1 L1 Q3 R3 ILED = 2A max D1 ROFF R2 Q2 PWM R1 30085623 Design #3 Bill of Materials 32 Qty Part ID Part Value Manufacturer Part Number 1 LM3409HV/LM3409QHV Buck controller TI LM3409HVMY/LM3409QHVM Y 2 CIN1, CIN2 2.2µF X7R 10% 100V MURATA GRM43ER72A225KA01L C1608X7R1C105K 1 CF 1.0µF X7R 10% 16V TDK 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 C1 2200pF X7R 10% 50V MURATA GRM188R71H222KA01D 1 Q1 PMOS 100V 3.8A ZETEX ZXMP10A18KTC 1 Q2 CMOS 30V 2A FAIRCHILD FDC6333C 1 Q3 NMOS 100V 7.5A FAIRCHILD FDS3672 1 D1 Schottky 100V 3A VISHAY SS3H10-E3/57T 1 L1 15 µH 20% 4.2A TDK SLF12565T-150M4R2 2 R1, R2 1Ω 1% VISHAY CRCW06031R00FNEA 1 R3 10kΩ 1% VISHAY CRCW060310K0FKEA 1 REXT 100Ω 1% VISHAY CRCW0603100RFKEA 1 ROFF 24.9kΩ 1% VISHAY CRCW060324K9FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.1Ω 1% 1W VISHAY WSL2512R1000FEA Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 DESIGN #4: SINGLE POTENTIOMETER ANALOG DIMMING APPLICATION FOR 6 LEDS RUV2 RUV1 RADJ 1 VIN UVLO 10 VIN = 36V CF 2 VCC IADJ CIN1 CIN2 9 CF2 3 ROFF EN LM3409 CSP VO = 24V 8 RSNS 4 COFF COFF CSN 7 DAP 5 GND PGATE 6 ILED = 700 mA maximum Q1 L1 D1 CO Design #4 Bill of Materials Qty Part ID Part Value Manufacturer 1 LM3409/LM3409Q Buck controller TI LM3409MY/LM3409QMY 2 CIN1, CIN2 2.2µF X7R 10% 50V MURATA GRM43ER71H225MA01L 1 CF 1.0µF X7R 10% 16V TDK C1608X7R1C105K 1 CF2 0.1µF X7R 10% 16V TDK C1608X7R1C104K 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 CO 1.0µF X7R 10% 50V MURATA GRM32RR71H105KA01L 1 Q1 PMOS 60V 3A ZETEX ZXMP6A17GTA 1 D1 Schottky 60V 2A ST-MICRO STPS2L60A 1 L1 68 µH 20% 2A TDK SLF12565T-680M2R0 1 ROFF 25.5kΩ 1% VISHAY CRCW060325K5FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.3Ω 1% 1W VISHAY WSL2512R3000FEA 1 RADJ 250kΩ potentiometer BOURNS 3352P-1-254 Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Part Number Submit Documentation Feedback 33 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com DESIGN #5: 75°C THERMAL FOLDBACK APPLICATION FOR 16 LEDS RUV2 RUV1 1 VIN UVLO 10 VIN = 65V CF 2 U1 VCC IADJ CIN1 CIN2 9 CF2 3 ROFF LM3409HV EN CSP VO = 56V 8 RSNS 4 COFF COFF CSN 7 DAP 5 GND PGATE 6 ILED = 3A maximum Q1 L1 D1 Design #5 Bill of Materials *U2 could be replaced with a 500kΩ NTC thermistor connected from IADJ to GND. Qty Part ID Part Value Manufacturer Part Number 1 LM3409HV/LM3409QHV Buck controller TI LM3409HVMY/LM3409QHVMY 1 U1 Analog Temperature Sensor TI LM94022 2 CIN1, CIN2 2.2µF X7R 10% 100V MURATA GRM43ER72A225KA01L 1 CF 1.0µF X7R 10% 16V TDK C1608X7R1C105K 1 CF2 0.1µF X7R 10% 16V TDK C1608X7R1C104K 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 Q1 PMOS 100V 3.8A ZETEX ZXMP10A18KTC 1 D1 Schottky 100V 3A COMCHIP SS3H10-E3/57T 1 L1 15 µH 20% 4.7A TDK SLF12575T-150M4R7 1 ROFF 24.9kΩ 1% VISHAY CRCW060324K9FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.07Ω 1% 1W VISHAY WSL2512R0700FEA 34 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 LM3409, LM3409HV, LM3409-Q1 www.ti.com SNVS602J – MARCH 2009 – REVISED MAY 2013 DESIGN #6: HIGH CURRENT APPLICATION FOR 4 LEDS RUV2 RUV1 RF2 VADJ 1 VIN UVLO 10 VIN = 24V CF 2 VCC IADJ CIN1 9 CF2 3 ROFF LM3409 EN CSP 8 RSNS 4 COFF CSN COFF VO = 14V 7 DAP 5 GND PGATE 6 Q1 ILED = 4.5A L1 D1 CO Design #6 Bill of Materials *U2 could be replaced with a 500kΩ NTC thermistor connected from IADJ to GND. Qty Part ID Part Value Manufacturer Part Number 1 LM3409/LM3409Q Buck controller TI LM3409MY/LM3409QMY 2 CIN1 10µF X7R 10% 50V TDK C5750X7R1H106K 1 CF 1.0µF X7R 10% 16V TDK C1608X7R1C105K C1608X7R1C104K 1 CF2 0.1µF X7R 10% 16V TDK 1 COFF 470pF X7R 10% 50V TDK C1608X7R1H471K 1 CO 1.0µF X7R 10% 50V MURATA GRM32RR71H105KA01L 1 Q1 PMOS 30V 24A ST-MICRO STD30PF03LT4 1 D1 Schottky 30V 5A VISHAY SSC53L-E3/57T 1 L1 15 µH 20% 7.5A COILCRAFT DO5022P-153ML 1 RF2 1.0kΩ 1% VISHAY CRCW06031K00FKEA 1 ROFF 23.2kΩ 1% VISHAY CRCW060323K2FKEA 1 RUV1 6.98kΩ 1% VISHAY CRCW06036K98FKEA 1 RUV2 49.9kΩ 1% VISHAY CRCW060349K9FKEA 1 RSNS 0.05Ω 1% 1W VISHAY WSL2512R0500FEA Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 Submit Documentation Feedback 35 LM3409, LM3409HV, LM3409-Q1 SNVS602J – MARCH 2009 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision I (May 2013) to Revision J • 36 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 35 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated Product Folder Links: LM3409 LM3409HV LM3409-Q1 PACKAGE OPTION ADDENDUM www.ti.com 2-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM3409HVMY/NOPB ACTIVE MSOPPowerPAD DGQ 10 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SYHB LM3409HVMYX/NOPB ACTIVE MSOPPowerPAD DGQ 10 3500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SYHB LM3409MY/NOPB ACTIVE MSOPPowerPAD DGQ 10 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SXFB LM3409MYX/NOPB ACTIVE MSOPPowerPAD DGQ 10 3500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SXFB LM3409N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM LM3409QHVMY/NOPB ACTIVE MSOPPowerPAD DGQ 10 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SZEB LM3409QHVMYX/NOPB ACTIVE MSOPPowerPAD DGQ 10 3500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SZEB LM3409QMY/NOPB ACTIVE MSOPPowerPAD DGQ 10 1000 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SZDB LM3409QMYX/NOPB ACTIVE MSOPPowerPAD DGQ 10 3500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 125 SZDB LM3409N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (3) 2-May-2013 MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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OTHER QUALIFIED VERSIONS OF LM3409, LM3409-Q1 : • Catalog: LM3409 • Automotive: LM3409-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM3409HVMY/NOPB MSOPPower PAD DGQ 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409HVMYX/NOPB MSOPPower PAD DGQ 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409MY/NOPB MSOPPower PAD DGQ 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409MYX/NOPB MSOPPower PAD DGQ 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409QHVMY/NOPB MSOPPower PAD DGQ 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409QHVMYX/NOPB MSOPPower PAD DGQ 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409QMY/NOPB MSOPPower PAD DGQ 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM3409QMYX/NOPB MSOP- DGQ 10 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant Power PAD *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM3409HVMY/NOPB MSOP-PowerPAD DGQ 10 1000 213.0 191.0 55.0 LM3409HVMYX/NOPB MSOP-PowerPAD DGQ 10 3500 367.0 367.0 35.0 LM3409MY/NOPB MSOP-PowerPAD DGQ 10 1000 213.0 191.0 55.0 LM3409MYX/NOPB MSOP-PowerPAD DGQ 10 3500 367.0 367.0 35.0 LM3409QHVMY/NOPB MSOP-PowerPAD DGQ 10 1000 213.0 191.0 55.0 LM3409QHVMYX/NOPB MSOP-PowerPAD DGQ 10 3500 367.0 367.0 35.0 LM3409QMY/NOPB MSOP-PowerPAD DGQ 10 1000 213.0 191.0 55.0 LM3409QMYX/NOPB MSOP-PowerPAD DGQ 10 3500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFF0014A N0014A N14A (Rev G) www.ti.com MECHANICAL DATA DGQ0010A MUC10A (Rev A) BOTTOM VIEW www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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