WINBOND W536120P

W536030P/060P/090P/120P
VOICE & MELODY CONTROLLER
(ViewTalk TM Series)
Table of Contents1.
GENERAL DESCRIPTION ......................................................................................................... 2
2.
FEATURES ................................................................................................................................. 3
3.
BLOCK DIAGRAM ...................................................................................................................... 5
4.
PAD DESCRIPTION ................................................................................................................... 6
5.
ELECTRICAL CHARACTERISTICS........................................................................................... 7
6.
7.
5.1
Absolute Maximum Ratings............................................................................................... 7
5.2
DC Characteristics............................................................................................................. 8
5.3
AC Characteristics ............................................................................................................. 9
TYPICAL APPLICATION CIRCUITS ........................................................................................ 12
6.1
Sub Clock with RC Mode................................................................................................. 12
6.2
Sub Clock with Xtal Mode................................................................................................ 13
REVISION HISTORY ................................................................................................................ 14
-1-
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
1. GENERAL DESCRIPTION
The W536XXXP, a member of ViewTalkTM family, is a high-performance 4-bit micro-controller (uC)
with built-in 8KW uC program. The 4-bit uC core contains dual clock source, 4-bit ALU, two 8-bit
timers, one 14 bits divider, maximum 32 pads for input or output, 8 interrupt sources and 8-level
nesting for subroutine/interrupt applications. Speech unit, integrated as a single chip with maximum
128 seconds (based on 6.4K sample rate with 5 bits MDPCM), is capable of expanding to 512
seconds speech addressed by external memory W55XXX with serial bus interface. It can be
implemented with Winbond Power Speech using MDPCM algorithm. Melody unit provides dual tone
output and can store up to 1k notes. Power reduction mode is also built in to minimize power
dissipation. It is ideal for educational toys, remote controllers and other application products which
incorporate both melody and speech.
BODY
Voice
I/O pad
WDT disable/Enable
(Mask Option)
W536030P
W536060P
W536090P
W536120P
30 sec
60 sec
90 sec
120 sec
8I/O, 8I
8I/O, 8I
8I/O, 12I, 12O
8I/O, 12I, 12O
(RA/RB/RC/RD)
(RA/RB/RC/RD)
(RA/RB/RC/RD/RE
/RF/RG/RH)
(RA/RB/RC/RD/RE/
RF/RG/RH)
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
Y
N
Y
Sub-clock
RC/XTAL mode
(Mask Option)
Tri-state serial bus
(Mask Option)( 1)
Cascaded Voice through
serial bus (2)
Notes:
1. Tri-state serial bus mask option can float serial bus while voice playing is no active. Let this mask option is disabled to get
minimum power consumption in general.
2. Cascaded Voice ROM user option help to expand voice up to 512 sec through serial bus by W55XXX chip.
-2-
W536030P/060P/090P/120P
2. FEATURES
• Operating voltage: 2.4 volt ~ 5.5 volt
• Watch dog disabled/enabled by mask option
• Dual clock operating system
− Main clock with Ring/Crystal (400 KHz to 4 MHz)
− Sub-clock with 32.768 KHz RC/Crystal by mask option
• Memory
− Program ROM (P-ROM): 8 K × 20 (ROM Bank0)
− Data RAM (W-RAM): 1K × 4 bit
(RAM Bank 0 is 512 nibbles from 0: 000~0: 1FF and 0:380~0:3FF are mapped to special
register.
RAM Bank F is 512 nibbles from F: 200~F: 3FF either data RAM or dedicated to script
kernel)
• Maximum 32 input/output pads
− Ports for input only: 12 pads (RC, RD and RG port; RG for W536090P/120P only)
− Ports for output only: 12 pads (RE, RF and RH port; RH for W536090P/120P only)
− Ports for Input/output: 8 pads
• Power-down mode
− Hold mode (except for 32KHz oscillator)
− Stop mode (including 32KHz oscillator and release by RD or RC port)
• Eight types of interrupts
− Five internal interrupts (Divider, Timer 0, Timer 1, Speech, Melody)
− Three external interrupts (Port RC, RD, RA)
• One built-in 14-bit clock frequency divider circuit
• Two built-in 8-bit programmable countdown timers
− Timer 0: one of two clock sources (FOSC/4 or FOSC/1024) can be selected
− Timer 1: built-in auto-reload function includes internal timer, external event counter from
RC.0
• Built-in 18/14-bit watchdog timer for system reset.
• Powerful instruction sets.
• 8-level subroutine (including interrupt) nesting
-3-
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
• Speech function
− Provided 1M / 2M/ 3M/ 4M bits Voice ROM for W536030P/060P/090P/120P based on 5
bits MDPCM algorithm
− Voice ROM (V-ROM) available for uC data.
− Maximum 8*256 Label/Interrupt vector (voice section number) available
− Provide two types of speech busy flag to either each GO or each trigger
− Maximum up to 16M bits speech address capability interface with external memory
W55XXX through serial bus.
• Melody function
− Provide 1K notes (22bits/note) dedicated melody ROM
− Provide two types of melody busy flag to uC either each note or each song
− Provide 6 kinds of beat, 16 kinds of tempo, and pitch range from G3# to C7
− Tremolo, triple frequency and 3 kinds of percussion available
− Maximum 31 songs available
• Can mix speech with melody
• Multi-engine controller
• Direct driving speaker/buzzer or DAC output
• Chip On Board available
-4-
W536030P/060P/090P/120P
3. BLOCK DIAGRAM
Data R AM
1K* 4Bit
PORT RA
RA0~3
PORT RB
RB0~3
PORT RC
R C 0~3
PORT RD
R D 0~3
P OR T R E
PO
RE0~3
PORT RF
R F0~3
PO R T R G
R G 0~3
TO NE
ACC
ROM
8K*20Bit
ALU
PC
S TAC K
(8
Levels)
Special Register
IE F
HEF
P EF
EV F
HCF
SP C
M LD
FLAG 0
LPX 0
MR
PM
0
0
LPX 1 LP X 2
LPX 4
LPX 5 LP Y 0
FLAG 1
PO R T R H
Parallel
to
Serial
PS R0
LP X 3
SP C_busy
S PC _play
LP Y 1
LP XY
S hared_RO M Data
Speech
M DPC M
core
R H 0~3
AD D R
CLK
D ATA
VD D A
R O SC
VSSA
VSSP
Tim er 0
(8 Bit)
Tim er 1
(8 Bit)
Interrupt ,H old
& Stop C ontrol
M LD _busy
V oice RO M
(1M /2M /3M /4M
bits)
M LD_play
W atch Dog Tim er
(18/14 Bit)
D ivide
r
(14/10 Bit)
Tim ing G enerator
XIN
XO U T
Dual Tone
M elody
(1K notes)
PW M 1/D AC
PW M /D AC
M ix
Block
PW M 2
VD DP
VD D
VSS
TES T
R ES
X32I X32O
-5-
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
4. PAD DESCRIPTION
SYMBOL
I/O
FUNCTION
XIN/RXIN
I
Input pad for main clock oscillator. It can be connected to crystal when
crystal mode is selected (SCR0.2=1), otherwise connect a resistor to
VDD to generate main system clock while Ring mode is selected
(SCR0.2=0 and default). Oscillator can be enabled or stopped by set
SCR0.1 to 1 or clear to 0 separately. External capacitor connects to
start oscillation and get more accurate clock when crystal mode
XOUT
O
Output pad for oscillator which is connected to another crystal pad
when in crystal mode. External capacitor connects to start oscillation
when in crystal mode.
X32I/RSUB1
I
32.768 KHz crystal input pad or external resistor node 1 by mask
option. External 15~20pF capacitor connects to start oscillation and
get more accurate clock when in crystal mode.
X32O/RSUB2
O
32.768 KHz crystal output pad or external resistor node 2 by mask
option. External 15~20pF capacitor connects to start oscillation when
in crystal mode.
I/O
General Input/Output port specified by PM1 register. If output mode is
selected, PM0 register bit 0 can be used to specify CMOS/NMOS
driving capability option. Initial state is input mode. RA3 may be uses
as TONE if bit 0 of MR0 special register is set to logic 1. An interrupt
source.
I/O
General Input/Output port specified by PM2 register. If output mode is
selected, PM0 register bit 1 can be used to specify CMOS/NMOS
driving capability option. Initial state is input mode.
I
4-bit schmitter input with internal pull high option specified by PM3
register bit 2. Each pad has an independent interrupt capability
specified by PEFL special register. Interrupt and STOP mode wake up
source. RC0 is also the external event counter source of Timer1.
I
4-bit schmitter input port with internal pull high option specified by PM3
register bit 3. Each pad has an independent interrupt capability
specified by PEFH special register. Interrupt and STOP mode wake up
source.
O
Output port only. PM3 register bit 0 can be used to specify
CMOS/NMOS driving capability option.
O
Output port only. PM3 register bit 1 can be used to specify
CMOS/NMOS driving capability option.
I
Input port with internal pull high option specified by PM6 register bit 0.
(W536090P/W536120P only)
O
Output port only. PM6 register bit 1 can be used to specify
CMOS/NMOS driving capability option. (W536090P/W536120P only)
I
System reset pad, active low with internal pull-high resistor.
RA0 ~ RA3/TONE
(4)
RB0 ~ RB3
(4)
RC0 ~ RC3
RD0 ~ RD3
RE0~RE3
(4)
RF0~RF3
(4)
RG0 ~ RG3
RH0 ~ RH3
(4)
RES
-6-
W536030P/060P/090P/120P
PAD Description, continued
SYMBOL
I/O
FUNCTION
TEST
I
Test pad. Active high with internal pull low resistor.
ROSC
I
Connect resistor to VDD pad to generate speech or melody playing
clock source.
PWM1/DAC
O
While speech or melody is active, PWM1/DAC is speaker direct driving
output or DAC output controlled by voice output file.
PWM2
O
While speech or melody is active, PWM2 is another speaker direct
driving output.
ADDR
O
External serial memory address write clock for voice extension.
CLK
O
External serial memory address read clock for voice extension.
DATA
I/O
External serial memory data in/out for voice extension.
VSS
I
Chip ground.
VSSP
I
Chip ground for PWM or DAC playing output.
VSSA (3)
I
Chip ground. (W536090P/120P only)
VDD
I
Power source.
VDDP
I
Power source for PWM or DAC playing output.
VDDA (3)
I
Power source. (W536090P/120P only)
Notes:
(3). VDDA, VSSA for W536090P/120P only. To sure chip operation properly, please bond all VDD, VDDA, VDDP, VSS, VSSA
and VSSP pads, and connect VSS, VSSP form chip external PCB circuit.
(4). When working at NMOS open drain mode, external pull high voltage can't higher than VDD to avoid leakage current.
5. ELECTRICAL CHARACTERISTICS
5.1 Absolute Maximum Ratings
PARAMETER
RATING
UNIT
Supply Voltage to Ground Potential
-0.3 to +7.0
V
Applied Input/Output Voltage
-0.3 to +7.0
V
120
mW
0 to +70
°C
-55 to +150
°C
Power Dissipation
Ambient Operating Temperature
Storage Temperature
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
-7-
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
5.2 DC Characteristics
(VDD−VSS = 3.0V, No load, FM = 4 MHz with Ring mode, Fs = 32.768 KHz, with Xtal mode, TA = 25° C unless otherwise
specified)
PARAMETER
SYM.
Op. Voltage
VDD
Op. Current
IOP1
CONDITIONS
MIN
TYP
MAX
UNIT
5.5
V
400
500
µA
2.4
Dual clock with crystal
-
(No Load, no Voice, no
Dual clock with Ring type
400
500
Melody)
Sub-clock only
15
30
Sub-clock active only
4
6
µA
1
µA
Hold Mode Current
IOP2
Stop Mode Current
IOP3
CLK/ADDR Output High
Current
IoH1
Vout = 2.7V
-0.8
mA
CLK/ADDR Output low
Current
IoL1
Vout = 0.4V
0.8
mA
Input Low Voltage
VIL
-
VSS
-
0.3
VDD
Input High Voltage
VIH
-
0.7
-
1
VDD
Port RA, RB, RE, RF and RH
Output Low Voltage
VABL
IOL = 2.0 mA
-
-
0.4
V
Port RA, RB, RE, RF and RH
Output High Voltage
VABH
IOH = -2.0 mA
2.4
-
-
V
Pull-up Resistor
RCD
Port RC, RD, RG
200
300
400
KΩ
RES Pull-up Resistor
RRES
-
50
100
200
KΩ
PWM1/2 Source Current (4)
ISPH
Volume Option = 00
-20
(RLOAD = 8Ω between PWM1
Volume Option = 01
-70
And PWM2)
Volume Option = 10
-110
Volume Option = 11
-135
Volume Option = 00
20
(RLOAD = 8Ω between PWM1
Volume Option = 01
70
And PWM2)
Volume Option = 10
110
Volume Option = 11
135
PWM1/2 Sink Current (4)
DAC output Current
ISPL
IDAC
VDD = 3V, RL = 100ohm
Notes:
(4). PWM current deviation will be ±20%.
-8-
-4
-5
mA
mA
-6
mA
W536030P/060P/090P/120P
5.3 AC Characteristics
(VDD−VSS = 3.0V, No load, FM = 4 MHz with Ring mode, Fs = 32.768 KHz, with Xtal mode, TA = 25° C unless otherwise
specified)
PARAMETER
SYM.
CONDITIONS
Sub-clock Frequency
FSUB
Crystal type and X32IN
and X32O with 17pF
external cap.
Main-clock Frequency
FM
Ring type/Crystal type
Chip Operation Frequency
FOSC
MIN.
TYP.
MAX.
32768
400K
SCR0.0 = 1, FSYS = FSUB
-
Hz
4M
32768
SCR0.0 = 0; FSYS = FMAIN
UNIT
Hz
Hz
400K
-
4M
Instruction Cycle Time
TCYC
One machine cycle
-
4/FOSC
-
S
Reset Active Width
TRAW
FOSC = 32.768 KHz
1
-
-
µS
Interrupt Active Width
TIAW
FOSC = 32.768 KHz
1
-
-
µS
Main clock Ring frequency
FRXIN
RXIN = 680KΩ
1M
RXIN = 330K Ω
2M
RXIN = 200KΩ
3M
RXIN = 130KΩ
4M
32
Sub-Clock RC Oscillator
FRSUB
RSUB = 680KΩ
Sub-Clock Oscillation
Stable Time @ Cold Start
FSTOP
RSUB = 680KΩ
Frequency Deviation of
main-clock FRXIN ≤ 2 MHz
∆f
Frequency Deviation of
main-clock FRXIN = 3 MHz
∆f
Frequency Deviation of
main-clock FRXIN = 4 MHz
∆f
ROSC Frequency
Frequency Deviation of
FROSC = 3MHz
f
f
f
FROS
C
∆f
f
0.8
Hz
KHz
1
S
f(3V) − f(2.4V)
f(3V)
10
%
f(3V) − f(2.4V)
f(3V)
15
%
f(3V) − f(2.4V)
f(3V)
20
%
3
ROSC = 680KΩ
f(3V) − f(2.4V)
f(3V)
MHz
7.5
%
Notes:
(5). The deviation will be +20% while VDD drops from 5.5V to 2.4V based on same resistor
-9-
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
Iop Vs. Main clock RC mode
800
600
3V
4.5V
400
Iop (uA) 200
0
1
2
3
4
Freq (MhZ)
Oscillation Freq Vs. Sub-Clock
44
40
36
3V
4.5V
Fsub (KhZ) 32
28
24
20
560
620
680
750
Rsub (Kohm)
- 10 -
820
1K
W536030P/060P/090P/120P
Main Freq Vs. Rxin
6
5
2.4V
3v
4.5V
5.5V
4
Fmain
3
(MhZ)
2
1
0
130 150 160 200 330 680 2K
3K
RXIN (Kohm)
Voice Operating Freq. Vs. ROSC
Freq (MhZ)
4.5
4
3.5
3
2.5
2
3V
4.5V
470
560
680
910
ROSC (Kohm)
- 11 -
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
6. TYPICAL APPLICATION CIRCUITS
6.1 Sub Clock with RC Mode
VDDP
(*1)
VDDP
R5
SWITCH
SPEAKER
Q1
___
RES
C4
8050
VDDP
VDDA
C1
R4
VDD
470
(*3)
W536XXXP
Rosc
C2 C3
Battery
PWM1/DAC
R1
SPEAKER
C6
XIN
(*2)
R3
VDDP
PWM2
(*2) C5
ADDR
W55MXX
CLK
X32IN
DATA
R2
X32IO
C2~C4
Value
4.7uF
0.1uF
C5~C6
100pF
VSS
C1
VSSA
VSSP
COMPONENT
(*4)
C7~C8
R1
R2
R3
R4
-
680KΩ
680KΩ
650KΩ/1MHz
350KΩ/2MHz
225KΩ/3MHz
160KΩ/4MHz
100Ω
Notes:
1. Option R5 equals to 100Ω if high noise immunity is needed.
2. For DAC option application.
3. To ensure that three batteries function well in W536F20 demo board. C6 should stay close to pad PWM/PWM2 at its best.
Under the mask ROM version, C5 and C6 can be skipped.
4. Sure chip operation properly, please bond all VDDP, VDDA, VDD, VSSP, VSSA and VSS; and connect VSSP pad to VSS from external
PCB circuit. VDDA, VSSA are only for W536090P/120P.
- 12 -
W536030P/060P/090P/120P
6.2 Sub Clock with Xtal Mode
VDDP
(*1)
R5
VDDP
SWITCH
___
RES
C4
SPEAKER
Q1
8050
VDDP
VDDA
R4
C1
C2
Battery
VDD
470
W536XXXP
(*3)
Rosc
R1
C3
PWM1/DAC
XIN
SPEAKER
(*2)
R3
C6
PWM2
C5
(*2)
ADDR
X32IN
CLK
VDDP
W55MXX
DATA
C7
32K
X32IO
C8
VSS
VSSA
VSSP
(*4)
COMPONENT
Value
C1
4.7uF
C2~C4
0.1uF
C5~C6
100pF
C7~C8
R1
15~30PF
680KΩ
R2
R3
R4
-
650KΩ/1MHz
350KΩ/2MHz
225KΩ/3MHz
160KΩ/4M/Hz
100Ω
Notes:
1. Option R5 equals to 100Ω if high noise immunity is needed.
2. For DAC option application.
3. To ensure that three batteries function well in W536F20 demo board. C6 should stay close to pad PWM/PWM2 at its best.
Under the mask ROM version, C5 and C6 can be skipped.
4. Sure chip operation properly, please bond all VDDP, VDDA, VDD, VSSP, VSSA and VSS; and connect VSSP pad to VSS from external
PCB circuit. VDDA, VSSA are only for W536090P/120P.
- 13 -
Publication Release Date: May 21, 2003
Revision A4
W536030P/060P/090P/120P
7. REVISION HISTORY
VERSION
DATE
WRITER
DESCRIPTION
A1
April 19, 2000
Judy Kuo
(10) W536060A to 12io only, and external speech
shared RD port except W536120X Part No
A2
Aug. 7, 2000
Jimmy Chen
• Speech Function Modify
A3
Jun. 1, 2001
Jimmy Chen
• Speech Function Modify
A4
May 21, 2003
Jimmy Chen
• Modify some errors and add "Tri-state serial bus"
mask option and cascaded voice ROM function
Headquarters
Winbond Electronics Corporation America
Winbond Electronics (Shanghai) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
TEL: 86-21-62365999
FAX: 86-21-62365998
Taipei Office
Winbond Electronics Corporation Japan
Winbond Electronics (H.K.) Ltd.
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: 81-45-4781881
FAX: 81-45-4781800
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
Information contained in this publication regarding device applications and the like is intended for suggestion
only and may be superseded updates. No representation or warranty is given and no liability is assumed by
Winbond Electronics Corp. with respect to the accuracy or use of such information, or infringement of patents
or other intellectual property.
- 14 -