GENERAL DESCRIPTION TM The W536XXXK, a member of ViewTalk family, is a high-performance 4-bit micro-controller (uC) with built-in speech unit, melody unit and 40seg * 8 com LCD driver unit which includes internal regulator, pump circuit and dedicated one page LCD RAM. The 4-bit uC core contains dual clock source, 4-bit ALU, two 8-bit timers, one 14 bits divider, maximum 24 pads for input or output, 8 interrupt sources and 8-level nesting for subroutine/interrupt applications. Speech unit, integrated as a single chip with maximum 128 seconds (based on 6.4K sample rate with 5 bits MDPCM) , is capable of expanding to 512 seconds speech addressed by external memory W55XXX with serial bus interface. It can be implemented with Winbond Power Speech using MDPCM algorithm. Melody unit provides dual tone output and can store up to 1k notes. Power reduction mode is also built in to minimize power dissipation. It is ideal for games, educational toys, remote controllers, watches, clocks and other application products which incorporate both LCD display and speech. Body W536020K W536030K W536090K Voice I/O pad 20 sec 4I/O,8I (RA/RC/RD) 30 sec 4I/O, 8I (RA/RC/RD) 90 sec 120 sec 8I/O, 8I, 8O 8I/O, 8I, 8O (RA/RB/RC/RD/RE/RF) (RA/RB/RC/RD/RE/RF) W536120K WDT disable/Enable Y Y Y Y (Mask Option) Sub-clock RC/XTAL mode Y Y Y Y (Mask Option) RD port shared as serial bus N Y(1) N N (2) (Mask Option) Tri-state serial bus Y Y Y Y (Mask Option) ( 3) Cascaded Voice ROM through N Y(1) N Y serial bus (2) (1) Share 3 pads of RD port (RD1/RDP, RD2/SPDATA and RD3/WRP) (2) Dedicate serial bus 3 pads (RDP, SPDATA and WRP) to interface with W55XXX. Cascaded Voice ROM can help to expand voice up to 512 sec by W55XXX chip. (3) Tri-state serial bus mask option can float serial bus while voice playing is no active. Let this mask option is disabled to get minimum power consumption in general. FEATURES • Operating voltage: 2.4 volt ~ 5.5 volt • Watch dog disabled/enabled by mask option • Dual clock operating system − Main clock with RC/Crystal (400 KHz to 4 MHz) − Sub-clock with 32.768 KHz RC/Crystal by mask option • Memory -1- Publication Release Date: Nov 2000 Revision A1 • • • • • • • • • • • • • • • − Program ROM (P-ROM): 16K × 20 (ROM Bank0) − Data RAM (W-RAM): 1K × 4 bit (RAM Bank 0 is 512 nibbles from 0:000 ~0:1FF and 0:380~0:3FF are mapped to special register. RAM Bank F is 512 nibbles from F:200 ~F:3FF either data RAM or dedicated to script kernel ) − LCD RAM (L-RAM): 80× 4 bit (RAM Bank1 from 200~24F) Maximum 24 input/output pads − Ports for input only: 8 pads (RC, RD port; RD1~3 can share as serial bus for external memory W55XXX interface @W536030K) − Ports for output only: 8 pads (RE & RF port; W536090K/120K available only) − Ports for Input/output: 8 pads (RA and RB port; RB port is available for W536090K/120K only) Power-down mode − Hold mode (except for 32kHz oscillator) − Stop mode (including 32kHz oscillator and release by RD or RC port) Eight types of interrupts − Five internal interrupts (Divider, Timer 0, Timer 1, Speech, Melody) − Three external interrupts (Port RC, RD, RA) One built-in 14-bit clock frequency divider circuit Two built-in 8-bit programmable countdown timers − Timer 0: one of two clock sources (FOSC/4 or FOSC/1024) can be selected − Timer 1: built-in auto-reload function includes internal timer, external event counter from RC.0 Built-in 18/14-bit watchdog timer for system reset. Powerful instruction sets 8-level subroutine (including interrupt) nesting LCD driver unit capability − VLCD higher than (VDD-0.5V) − Built-in voltage regulator to V2 pad − 40 seg × 8 com − 1/8 or 1/4 duty, 1/4 or 1/3 bias, internal pump circuit option by special register − COM 4~ 7 and SEG16~39 can be shared as general input/output by special register − Either uC ROM or voice ROM used as LCD picture Speech function − Provided 640K / 1M/ 3M/ 4M bits Voice ROM for W536020K/030K/090K/120K based on 5 bits MDPCM algorithm − Voice ROM (V-ROM) available for uC data or LCD picture data. − Maximum 8*256 Label/Interrupt vector (voice section number) available − Provide two types of speech busy flag to either each GO or each trigger − Maximum up to 16M bits speech address capability interface with external memory W55XXX through serial bus. Melody function − Provide 1K notes (22bits/note) dedicated melody ROM − Provide two types of melody busy flag to uC either each note or each song − Provide 6 kinds of beat, 16 kinds of tempo, and pitch range from G3# to C7 − Tremolo, triple frequency and 3 kinds of percussion available − Maximum 31 songs available Can mix speech with melody Multi-engine controller Direct driving speaker/buzzer or DAC output Chip On Board available -2- Publication Release Date:Nov 2000 Revision A1 BLOCK DIAGRAM V3,V5,V6 COM0~7 SEG0~39 LCD DRIVER RAM 1K*4Bit VHI V2 DH1,DH2 VLCD PUMP & REGULATOR VDD TEST PORT RA ACC ROM RA0~3 TONE PORT RB 16K*20Bit RB0~3 ALU PORT RC RC0~3 RD0~3 PORT RD PC Special Register IEF STACK (8 Levels) HEF HCF SPC PEF EVF MLD FLAG0 FLAG1 PM0 MR0 PSR0 LPX0 LPX1 LPX2 LPX3 LPX4 LPX5 LPY0 LPY1 Timer 1 Interrupt ,Hold & Stop Control MLD_busy Timing Generator Divide PORT RF RF0~3 WRP RDP SPDATA to Serial MLD_play Watch Dog RE0~3 Parallel SPC_bus y SPC_pla y Timer 0 PORT RE ROSC MDPCM Speech Voice ROM (640K/1M/3M/4 M) Dual Tone Melody PWM/ DAC MIX Block PWM1/DAC PWM2 VSS VDDP VSSP RES XIN XOUT X32I X32O -3- Publication Release Date:Nov 2000 Revision A1 PAD DESCRIPTION SYMBOL XIN/RXIN I/O I FUNCTION Input pad for main clock oscillator. It can be connected to crystal when crystal mode is selected (SCR0.2=1), otherwise connect a resistor to VDD to generate main system clock while RC mode is selected (SCR0.2=0 and default). Oscillator can be enabled or stopped by set SCR0.1 to 1 or clear to 0 separately. External capacitor connects to start oscillation while crystal mode XOUT O Output pad for oscillator which is connected to another crystal pad when in crystal mode. External capacitor connects to start oscillation when in crystal mode. X32I/RSUB1 I 32.768 KHz crystal input pad or external resistor node 1 by mask option. External 15~20pF capacitor connects to get more accurate clock when in crystal mode. X32O/RSUB2 O 32.768 KHz crystal output pad or external resistor node 2 by mask option. External 15~20pF capacitor connects to get more accurate clock when in crystal mode. RA0 ~ RA3/TONE I/O General Input/Output port specified by PM1 register. If output mode is selected, PM0 register bit 0 can be used to specify CMOS/NMOS driving capability option. Initial state is input mode. RA3 may be uses as TONE if bit 0 of MR0 special register is set to logic 1. An interrupt source. RB0 ~ RB3 I/O General Input/Output port specified by PM2 register. If output mode is selected, PM0 register bit 1 can be used to specify CMOS/NMOS driving capability option. Initial state is input mode (W536090K/120K only.) RC0 ~ RC3 I 4-bit schmitter input with internal pull high option specified by PM3 register bit 2. Each pad has an independent interrupt capability specified by PEFL special register. Interrupt and STOP mode wake up source. RC0 is also the external event counter source of Timer1. RD0 RD1/RDP RD2/SPDATA RD3/WRP (4) I 4-bit schmitter input port with internal pull high option specified by PM3 register bit 3. Each pad has an independent interrupt capability specified by PEFH special register. Interrupt and STOP mode wake up source. RD1~3 will be shared as the external memory W55XXX interface pads while RD port shared as serial bus mask option is enabled @W536030K. For W536030A/060A only, "Tri-state serial bus" mask option can use to float WRP/RDP/SPDATD while "RD port shared as serial bus" mask option is enabled. RE0~RE3 O Output port only. PM3 register bit 0 can be used to specify CMOS/NMOS driving capability option. (W536090K/120K only) RF0~RF3 O Output port only. PM3 register bit 1 can be used to specify CMOS/NMOS driving capability option. (W536090K/120K only) I System reset pad, active low with internal pull-high resistor. I Test pad. Active high with internal pull low resistor. RES TEST -4- Publication Release Date:Nov 2000 Revision A1 ROSC I Connect resistor to VDD pad to generate speech or melody playing clock source. PWM1/DAC O While speech or melody is active, PWM1/DAC is speaker direct driving output or DAC output controlled by voice output file. PWM2 O While speech or melody is active, PWM2 is another speaker direct driving output. WRP (5) O External serial memory address write clock for voice extension (W536120K only). RDP (5) O External serial memory address read clock for voice extension. (W536120K only). SPDATA (5) I/O External serial memory data in/out for voice extension (W536120K only). SEG0−SEG15 O Dedicated LCD segment output pads. SEG16/PORTN.0 SEG19/PORTN.3 SEG20/PORTM.0 SEG23/PORTM.3 O/O LCD segment output pads, and can be shared as general output by register LCDM3 bit 1. Default function is segment pad. O/I LCD segment output pads, and can be shared as general input by register LCDM3 bit 0. Default function is segment pad and PM5.1=0 to inhibit LCD waveform abnormal. SEG24/PORTL.0 SEG27/PORTL.3 SEG28/PORTK.0 SEG31/PORTK.3 O/O LCD segment output pads, and can be shared as general output by register LCDM2 bit 0. Default function is segment pad. O/I LCD segment output pads, and can be shared as general input by register LCDM2 bit 1. Default function is segment pad and PM5.0=0 to inhibit LCD waveform abnormal. SEG32/PORTJ.0 SEG35/PORTJ.3 O/IO LCD segment output pads, and can be shared as general input/output by register LCDM2 bit 2. PM4 register is used to select input or output while shared I/O function is active. Default function is segment pad and PM4.3=0 to inhibit LCD waveform abnormal. SEG36/PORTI.0 SEG39/PORTI.3 O/IO LCD segment output pads, and can be shared as general input/output by register LCDM2 bit 3. PM4 register is used to select input or output while shared I/O function is active. Default function is segment pad and PM4.2=0 to inhibit LCD waveform abnormal. COM0−COM3 O LCD common signal output pads either 1/8 duty or 1/4duty. The LCD frame rate is controlled by LCDM1 register, and default value LCDM1=0111b with 64Hz frame rate. COM4/PORTO.0 COM7/PORTO.3 O/I LCD common signal output pads, or shared as general input by register LCDM3.2 when in 1/4 duty mode. Default function is common function and PM5.2=0 to inhibit LCD waveform abnormal. DH1, DH2 (6) O Connection terminal for voltage double capacitor with 0.1uF. The DH2 connects to capacitor positive node and DH1 negative node if polar capacitor is used. VHI I Connect to V6 (LCD's VLCD) or VDD which has higher voltage, to make sure there is no any abnormal leakage current appearance. -5- Publication Release Date:Nov 2000 Revision A1 V3 O LCD COM/SEG output driving voltage. Need an external 0.1uF capacitor when 1/4 bias. (LCDM0.1=1) V5 V6 (6) O LCD COM/SEG output driving voltage. Need an external 0.1uF capacitor to every pad terminal. V2 (6) I/O Voltage regulator output pad. An external capacitor is a must. Output level can be controlled from 0~Fh by LCDM4 register. If internal pump is enabled (LCDM3.3=0 and default value), LCD operating voltage (VLCD) will be 3*V2 or 4*V2 depending on 1/3 bias or 1/4 bias. A limitation should be noted that VLCD must be higher than (VDD-0.5v) to avoid chip leakage current. While external reference voltage is selected (LCDM3.3=1), V2 pad input voltage can not be over 1.5 Volt to inhibit chip damage. VSSP (7) I Power ground for PWM or DAC playing output. VSS (7) I Power ground VDDP (7) I Power source for PWM or DAC playing output. VDD (7) I Power Source (4) RD1~3 are shared as RDP/SPDATA/WRP to interface with W55XXX @W536030K. (5) @W536120K only (6) 0.1uF is default value, and capacitor value should be larger than 0.1uF if LCD dot size over 0.5mm * 0.5mm. (7) External application circuit should connect together, please refer to APPLICATION CIRCUIT. To sure chip operation properly, please bond all VDD, VDDP, VSS and VSSP pads and connect VSS and VSSP from chip outside PCB circuit. (8) VHI pad is bonded to V6 or VDD. -6- Publication Release Date:Nov 2000 Revision A1 ABSOLUTE MAXIMUM RATINGS PARAMETER Supply Voltage to Ground Potential Applied Input/Output Voltage Power Dissipation Ambient Operating Temperature Storage Temperature RATING -0.3 to +7.0 -0.3 to +7.0 120 0 to +70 -55 to +150 UNIT V V mW °C °C Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. DC CHARACTERISTICS (VDD−VSS = 3.0V, no load, FM = 4 MHz with RC mode, Fs = 32.768 KHz, with Xtal mode, TA = 25° C, STN LCD panel on with dot size 0.5mm*0.5mm; unless otherwise specified) PARAMETER Op. Voltage Op. Current (No Load, no Voice, no ) Melody) SYM. VDD IOP1 MAX 5.5 700 700 50 90 5 UNIT V uA Hold Mode Current (No Load, LCD OFF) Hold Mode Current (No load, LCD ON) Stop Mode Current RDP/WRP Output High Current RDP/WRP Output low Current Input Low Voltage Input High Voltage Port RA, RB Output Low Voltage Port RA, RB Output High Voltage Pull-up Resistor RES Pull-up Resistor PWM1/2 Source Current (8) IOP2 Dual clock with crystal Dual clock with RC type Sub-clock only, LCD off Sub-clock only, LCD on Sub-clock active only IOP3 Sub-clock active only 35 uA IOP4 IoH1 LCD auto off Vout=2.7V 1 -0.8 uA mA IoL1 Vout=0.4V 0.8 mA VIL VIH VABL IOL = 2.0 mA VSS 0.7 - - 0.3 1 0.4 VDD VDD V VABH IOH = -2.0 mA 2.4 - - V RCD RRES ISPH Port RC, RD Volume Option =00 Volume Option =01 200 50 300 100 -20 -70 400 200 KΩ KΩ mA (RLOAD =8Ω between PWM1 And PWM2 ) PWM1/2 Sink Current (8) (RLOAD =8Ω between PWM1 And PWM2 ) ISPL CONDITIONS MIN 2.4 - TYP 600 600 40 70 3 Volume Option =10 Volume Option =11 Volume Option =00 Volume Option =01 -110 -135 20 70 Volume Option =10 Volume Option =11 110 135 -7- uA mA Publication Release Date:Nov 2000 Revision A1 VRR VDD=3v, RL=100ohm No Load, All Seg. ON IOH = ± 50 µA Depended on LCDM4 V2 Pad Output Deviation (9) VD1 No Load V2 Pad Voltage Step VR2 VLCD LCDM4 increased 1 DAC output Current LCD Supply Current COM/SEG On Resistor V2 Pad Output Voltage V6 Pad Output Voltage (LCD's VLCD depended on LCDM4 register) (9) IDAC ILCD RON 1/3 Bias & no load 1/4 Bias & no load -4 - -5 50 5K 0.7 -6 10K 1.45 mA µA Ω V ±5 % 50 2.85 * V2 3.8 * V2 2.9 * V2 3.85 * V2 mV 2.95 * V2 3.9 * V2 1.5 V V2 input voltage VEXT LCDM3.3=1 V (8) PWM current deviation will be ±20%. (9) Deviation is governed by LCD dot size. More larger LCD dot will get larger deviation.. AC CHARATERISTICS (VDD−VSS = 3.0V, no load, FM = 4 MHz with RC mode, Fs = 32.768 KHz, with Xtal mode, TA = 25° C, STN LCD on with dot size 0.5mm*0.5mm; unless otherwise specified) PARAMETER SYM. CONDITIONS MIN. TYP. MAX. UNIT Sub-clock Frequency FSUB Crystal type and X32IN 32768 Hz and X32O with 17pF external cap. Main-clock Frequency FM RC type/Crystal type 400K 4M Hz Chip Operation Frequency FOSC 32768 Hz SCR0.0=1,FSYS=FSUB 4M SCR0.0=0;FSYS= FMAIN 400K Instruction Cycle Time TCYC One machine cycle 4/FOSC S Reset Active Width TRAW FOSC = 32.768 KHz 1 µS Interrupt Active Width TIAW FOSC = 32.768 KHz 1 µS Main clock RC frequency FRXIN 1M Hz RXIN =680KΩ 2M (10) RXIN =330K Ω 3M RXIN =200KΩ 4M RXIN =130KΩ Sub-Clock Ring Oscillator FRSUB 32 KHz RSUB=680KΩ Sub-Clock Oscillation 0.8 1 S FSTOP RSUB=680KΩ Stable Time @ Cold Start 10 % Frequency Deviation of f(3V) − f(2.4V) ∆f f main-clock FRXIN ≤ 2MHz f(3V) 15 % Frequency Deviation of f(3V) − f(2.4V) ∆f main-clock FRXIN = 3 MHz f f(3V) 20 % Frequency Deviation of f(3V) − f(2.4V) ∆f main-clock FRXIN =4 MHz f f(3V) ROSC Frequency FROSC 3 MHz ROSC=680KΩ 7.5 % Frequency Deviation of f(3V) − f(2.4V) ∆f FROSC = 3MHz f f(3V) Frame frequency FLCD LCDM1=0111 b(default) 64 Hz (10) The deviation will be +20% while VDD drops from 5.5V to 2.4V based on same resistor Publication Release Date:Nov 2000 -8Revision A1 Iop Vs. Main clock RC mode 1000 800 600 3V 4.5V 400 Iop (uA) 200 0 1 2 3 4 Freq (MhZ) Oscillation Freq Vs. Sub-Clock 44 40 36 3V 4.5V Fsub (KhZ) 32 28 24 20 560 620 680 750 820 1K Rsub (Kohm) -9- Publication Release Date:Nov 2000 Revision A1 Main Freq Vs. Rxin 6 5 2.4V 3v 4.5V 5.5V 4 Fmain 3 (MhZ) 2 1 0 130 150 160 200 330 680 2K 3K RXIN (Kohm) Voice Operating Freq. Vs. ROSC Freq (MhZ) 4.5 4 3.5 3 2.5 2 3V 4.5V 470 560 680 910 ROSC (Kohm) - 10 - Publication Release Date:Nov 2000 Revision A1 APPLICATION CIRCUIT--1: Sub clock with RC mode 1/4 bias, VLCD=4.5V 40SEG x 8COM LCD panel SEG0~39 COM0~7 VDDP RA0~3 RC0~3 RD0~3 470 VDD (* 2) (*3) R5 RES C6 PWM1 Battery VDDP C8 R4 PWM2 W536xxxK DH1 C1 DH2 VDD C7 C5 V6 R1 ROSC C4 V5 R3 XIN VHI X32IN (*1) V6 VDD V3 R2 C3 C2 V2 X32O Value VSS2 VSS1 Component C1~C6 C7,C8 C9,C10 C11 R1 R2 R3 R4 0.1uF 20pF 0.1uF 1uF 680K - 680Kohm/1Mhz 330Kohm/2Mhz 200Kohm/3Mhz 130Kohm/4Mhz 100 Note: (1) C1~C5 depends on LCD panel dot size. (2) Option R5 equals to 100Ω if high noise immunity is needed. (3) For DAC option application. (4) To sure chip operation properly, please bond all VDDP, VDD, VSSP and VSS . - 11 - Publication Release Date:Nov 2000 Revision A1 APPLICATION CIRCUIT---2 : Sub clock with Crystal mode 1/3 bias, VLCD=3V 40SEG x 8COM LCD panel SEG0~39 COM0~7 VDDP RA0~3 RC0~3 RD0~3 470 VDD ( *2) (*3) R5 RES C6 PWM1 Battery VDDP C8 W536xxxK PWM2 DH1 R4 C1 DH2 VDD C7 C5 V6 R1 ROSC C4 V5 R3 XIN (*1) V6 VHI C9 X32IN VDD 32.768kHz C2 V2 C10 X32O Value VSS2 VSS1 Component C1~C6 C7,C8 C9,C10 C11 R1 R2 R3 R4 0.1uF 20pF 0.1uF 1uF 680K - 680Kohm/1Mhz 330Kohm/2Mhz 200Kohm/3Mhz 130Kohm/4Mhz 100 Note: (1) C1~C5 depends on LCD panel dot size. (2) Option R5 equals to 100Ω if high noise immunity is needed. (3) For DAC option application. (4) To sure chip operation properly, please bond all VDDP, VDD, VSSP and VSS. - 12 - Publication Release Date:Nov 2000 Revision A1