ZMD-Standard March 1998 Package SOP16 (150 mil) MDS 752 Dimensions in millimetres Based on IEC 191-2Q: Type 076E07S 1 Dimensions View X 0,1 LP A1 Z HE E 16 1 D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,73 Amin 1,55 bPmin 0,35 A1min 0,127 bPmax 0,49 A1max 0,25 enom 1,27 A2min 1,40 HEmin 5,80 A2max 1,55 HEmax 6,30 cmin 0,19 LPmin 0,40 cmax 0,25 Zmax 0,55 Dmin* 9,80 Dmax* 9,98 2 Weight £ 0,5 g Emin* 3,80 3 Package Body Material Low Stress Epoxy Emax* 4,00 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 8° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.03.1998 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000752-HD-01 G e 0,2 M c b k x 45° A A2 X