ZMD MDS768

ZMD-Standard
February 2004
MDS
768
Package TSOP32 (I/8x13,4)
Dimensions in millimetres
1 Dimensions
Detail Z
bp
e
0,1 M
E
32
1
A1
LP
D
HD
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
−
Amax
1,20
Amin
bPmin
0,17
A1min
0,05
bPmax
0,27
A1max
0,15
enom
0,50
A2min
0,90
HDmin
13,20
A2max
1,05
HDmax
13,60
cmin
0,10
LPmin
0,50
cmax
0,21
Dmin*
11,70
2 Weight
≤ 0,3 g
Dmax*
11,90
3 Package Body Material
Low Stress Epoxy
Emin*
7,90
4 Lead Material
FeNi-Alloy or Cu-Alloy
Emax*
8,10
5 Lead Finish
solder plating
θmin
0°
6 Lead Form
Z-bends
θmax
5°
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Date: 18.02.2004
Check: signed Marx
Quality: signed Tina Kochan
Doc-No.
QS-000768-HD-01
θ
0,1
c
A
A2
Z