ZMD-Standard February 2004 MDS 768 Package TSOP32 (I/8x13,4) Dimensions in millimetres 1 Dimensions Detail Z bp e 0,1 M E 32 1 A1 LP D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 − Amax 1,20 Amin bPmin 0,17 A1min 0,05 bPmax 0,27 A1max 0,15 enom 0,50 A2min 0,90 HDmin 13,20 A2max 1,05 HDmax 13,60 cmin 0,10 LPmin 0,50 cmax 0,21 Dmin* 11,70 2 Weight ≤ 0,3 g Dmax* 11,90 3 Package Body Material Low Stress Epoxy Emin* 7,90 4 Lead Material FeNi-Alloy or Cu-Alloy Emax* 8,10 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 5° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 18.02.2004 Check: signed Marx Quality: signed Tina Kochan Doc-No. QS-000768-HD-01 θ 0,1 c A A2 Z