ZMD-Standard February 2000 Package SSOP16 (5,3 mm) MDS 753 Dimensions in millimetres Supersedes Edition 06.98 Based on JEDEC JEP95: MO-150 A2 X A 1 Dimensions View X 0,15 G A1 bp e HE E 1 LP c 0,1 16 Z k x 45° M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,99 Amin 1,73 bPmin 0,25 A1min 0,05 bPmax 0,38 A1max 0,21 enom 0,65 A2min 1,68 HEmin 7,65 A2max 1,78 HEmax 7,90 cmin 0,09 LPmin 0,63 cmax 0,20 Zmax 0,89 Dmin* 6,07 Dmax* 6,33 2 Weight £ 0,3 g Emin* 5,20 3 Package Body Material Low Stress Epoxy Emax* 5,38 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 10° * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.03.1998 Check: signed Marx Quality: signed Lorenz Doc-No. QS-000753-HD-02