ZMD-Standard November 1995 Package SOP28 (300 mil) MDS 715 Supersedes Edition 06.92 1. Amendment 09.93 Dimensions in millimetres Based on IEC 191-2Q: Type 075E06 B A2 X A 1 Dimensions View X k x 45 1 Z bp e ° LP HE E A1 28 c 0,1 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,65 Amin 2,35 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 2,25 HEmin 10,00 A2max 2,45 HEmax 10,65 cmin 0,23 LPmin 0,40 cmax 0,32 Zmax 0,81 Dmin* 17,70 Dmax* 18,10 2 Weight 0,8 g Emin* 7,40 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating °min 0 6 Lead Form Z-bends °max 8 * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 13.11.95 Check: signed Wilde Quality: signed Lorenz Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Doc-No. QS-000715-HD-02 Proprietary data, company confidential. All rights reserved.