bq27421-G1 www.ti.com SLUSB85 – MAY 2013 System-Side Impedance Track™ Fuel Gauge With Integrated Sense Resistor Check for Samples: bq27421-G1 FEATURES APPLICATIONS • • • • • 1 23 • • • Single Series Cell Li-Ion Battery Fuel Gauge – Resides on System Board – Supports Embedded or Removable Batteries – Powered Directly from Battery with Integrated LDO – Low-value Integrated Sense Resistor (7 mΩ Typical) Easy to Configure Fuel Gauging Based on Patented Impedance Track™ Technology – Reports Remaining Capacity and State of Charge (SOC) with Smoothing Filter – Automatically Adjusts for Battery Aging, Self-discharge, Temperature, and Rate Changes – Battery State of Health (aging) Estimation Microcontroller Peripheral Supports: – 400-kHz I2C™ Serial Interface – Configurable SOC Interrupt, or Battery Low Digital Output Warning – Internal Temperature Sensor, or Host Reported Temperature 9-pin 1,62 mm × 1,58 mm × 0,5 mm Pitch CSP Package Smartphones, Feature phones and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players DESCRIPTION The Texas Instruments bq27421-G1 is an easy to configure microcontroller peripheral that provides system-side fuel gauging for single-cell Li-Ion batteries. The device requires minimal user configuration and system microcontroller firmware development. The bq27421-G1 uses the patented Impedance Track™ algorithm for fuel gauging, and provides information such as remaining battery capacity (mAh), state-of-charge (%), and battery voltage (mV). Battery fuel gauging with the bq27421-G1 requires connections only to PACK+ (P+) and PACK– (P–) for a removable battery pack or embedded battery circuit. The tiny 9-pin 1,62 × 1,58 mm × 0,5 mm pitch CSP package is ideal for space constrained applications. TYPICAL APPLICATION SRX SCL I2C Bus Coulomb Counter SDA Integrated Sense Resistor CPU GPOUT BIN Battery Pack PACKP BAT ADC VDD bq27421 VSYS 1.8V LDO VSS Li-Ion Cell T Protection IC PACKN NFET NFET 0.47uF 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Impedance Track is a trademark of Texas Instruments. I2C is a trademark of NXP B.V. Corp Netherlands. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2013, Texas Instruments Incorporated bq27421-G1 SLUSB85 – MAY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE INFORMATION AVAILABLE OPTIONS PART NUMBER bq27421YZFR-G1A bq27421YZFT-G1A bq27421YZFR-G1B bq27421YZFT-G1B (1) (2) (3) BATTERY TYPE CHEM_ID (1) LiCoO2 (4.2 V max charge) FIRMWARE VERSION (2) PACKAGE (3) TA COMM. FORMAT 3000 0x128 LiMn2O4 (4.3 - 4.35 V max charge) TAPE and REEL QUANTITY 1.08 (0x0108) CSP-9 –40°C to 85°C 0x312 I2C 250 3000 250 See the CHEM_ID subcommand to confirm the battery chemistry type. See the FW_VERSION subcommand to confirm the firmware version. For the most current package and ordering information see the Package Option Addendum at the end of this document; or, see the TI website at www.ti.com. THERMAL INFORMATION THERMAL METRIC (1) bq27421-G1 YZF(9 PINS) θJA Junction-to-ambient thermal resistance θJCtop Junction-to-case (top) thermal resistance 0.7 θJB Junction-to-board thermal resistance 60.4 ψJT Junction-to-top characterization parameter 3.5 ψJB Junction-to-board characterization parameter 60.4 θJCbot Junction-to-case (bottom) thermal resistance n/a (1) 2 UNITS 107.8 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 PIN DIAGRAM AND PACKAGE DIMENSIONS (TOP VIEW) D (BOTTOM VIEW) C3 C2 C1 C1 C2 C3 B3 B2 B1 B1 B2 B3 A3 A2 A1 A1 A2 A3 Pin A1 Index Area E DIM MIN TYP MAX D 1550 1580 1610 E 1590 1620 1650 UNITS m PIN FUNCTIONS PIN NAME NO. TYPE (1) DESCRIPTION BAT C3 PI, AI LDO regulator input, battery voltage input, and coulomb counter input typically connected to the PACK+ terminal. VDD B3 PO 1.8V Regulator Output. Decouple with 0.47μF ceramic capacitor to Vss. This pin is not intended to provide power for other devices in the system. VSS B2, C1 PI Ground pins. The center pin B2 is the actual device ground pin while pin C1 is floating internally and therefore C1 may be used as a bridge to connect to the board ground plane without requiring a via under the device package. Recommend routing the center pin B2 to the corner pin C1 using a top-layer metal trace on the board. Then route the corner pin C1 to the board ground plane. SRX C2 AI Integrated high-side sense resistor and coulomb counter input typically connected to system power rail VSYS. GPOUT A1 DO General Purpose open-drain output. May be configured as a Battery Low indicator or perform SOC interrupt (SOC_INT) function. SDA A2 DIO SCL A3 DIO BIN B1 DI (1) Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external 10kΩ pull-up resistors (typical) for each pin. If the external pull-up resistors will be disconnected from these pins during normal operation, recommend using external 1MΩ pull-down resistors to VSS at each pin to avoid floating inputs. Battery-insertion detection input. A logic high to low transition is detected as a battery insertion event. Recommend using a pull-up resistor >1MΩ (1.8 MΩ typical) to VCC for reduced power consumption. An internal pull-up resistor option is also available. I/O = Digital input/output, IA = Analog input, P = Power connection Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 3 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) PARAMETER VBAT BAT pin input voltage range (1) VALUE UNIT –0.3 to 6.0 V VSRX SRX pin input voltage range VBAT ± 0.03 V VDD VDD pin supply voltage range (LDO ouptut) –0.3 to 2.0 V VIOD Open-drain I/O pins (SDA, SCL, GPOUT ) –0.3 to 6.0 V VIOPP Push-Pull I/O pins (BIN ) –0.3 to VDD + 0.3 V TA Operating free-air temperature range –40 to 85 °C TSTG Storage temperature range –65 to 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER External input capacitor for internal LDO between BAT and VSS CBAT (1) CLDO18 VPU (1) (1) (1) External output capacitor for internal LDO between VCC and VSS TEST CONDITIONS MIN Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. External pull-up voltage for opendrain pins (SDA, SCL, GPOUT ) TYP MAX UNIT 0.1 μF 0.47 μF 1.62 3.6 V Specified by design. Not production tested. SUPPLY CURRENT TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted) PARAMETER ICC (1) NORMAL mode current TEST CONDITIONS ILOAD > Sleep Current (2) (2) ISLP (1) SLEEP mode current ILOAD < Sleep Current IHIB (1) HIBERNATE mode current ILOAD < Hibernate Current SHUTDOWN mode current Fuel gauge in host commanded SHUTDOWN mode. (LDO Regulator Output Disabled.) ISD (1) (2) 4 (1) (2) MIN TYP MAX UNIT 93 μA 21 μA 9 μA 0.6 μA Specified by design. Not production tested. Wake Comparator Disabled. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 DIGITAL INPUT AND OUTPUT DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS VIH(OD) Input voltage, high (2) VIH(PP) Input voltage, high (3) VIL Input voltage, low VOL Output voltage, low V V 0.6 V (2) 0.6 V 0.5 mA -3 mA 5 pF 1 μA Output sink current, low (1) (2) (3) Input capacitance UNIT VPU * 0.7 (2) (3) Ilkg MAX (2) (3) IOL(OD) (1) (2) (3) TYP 1.4 Output source current, high IOH CIN External pullup resistor to VPU MIN (2) Input leakage current (I/O pins) (2) (3) Specified by design. Not production tested. Open Drain pins: (SCL, SDA, GPOUT ) Push Pull pin: (BIN ) LDO REGULATOR, WAKE-UP AND AUTO-SHUTDOWN DC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP UNIT VBAT BAT pin regulator input VDD Regulator output voltage 1.8 V UVLOIT+ VBAT Under Voltage Lock Out LDO Wake-Up Rising Threshold (2) 2.0 V UVLOIT- VBAT Under Voltage Lock Out LDO Auto-Shutdown Falling Threshold (2) 1.95 V VWU+ (1) (2) (1) GPOUT (input) LDO Wake-Up rising edge threshold (2) 2.45 MAX LDO Wake-up from SHUTDOWN mode 4.5 1.2 V V Specified by design. Not production tested. If the device is commanded to SHUTDOWN via I2C with VBAT > UVLOIT+ , a wake-up rising edge trigger is required on GPOUT . Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 5 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com LDO REGULATOR, WAKE-UP AND AUTO-SHUTDOWN AC CHARACTERISTICS TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER tSHDN (1) tSHUP (1) tVDD (1) tWUVDD tPUCD (1) TEST CONDITIONS MIN SHUTDOWN Entry Time Time delay from SHUTDOWN command to LDO output disable. SHUTDOWN GPOUT Low time Minimum low time of GPOUT (input) in SHUTDOWN before WAKEUP Wake-up VDD Output delay Time delay from rising edge of GPOUT (input) to nominal VDD output. Power-up communication delay Time delay from rising edge of REGIN to the Active state. Includes firmware initialization time. MAX UNIT 250 ms μs 10 Initial VDD Output delay (1) TYP 13 ms 8 ms 250 ms Specified by design. Not production tested. SHUTDOWN and WAKE-UP Timing tPUCD tSHUP tVDD tSHDN tPUCD tWUVDD REGIN VDD I2C Bus GPOUT SHUTDOWN_ ENABLE SHUTDOWN * State Off WAKE-UP Active SHUTDOWN WAKE-UP Active * GPOUT is configured as an input for wake-up signaling. Figure 1. SHUTDOWN and WAKE-UP Timing Diagram 6 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 ADC (TEMPERATURE AND CELL MEASUREMENT) CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER VIN(BAT) BAT pin voltage measurement range. tADC_CONV Conversion time TEST CONDITIONS Voltage divider enabled. MIN TYP 2.45 4.5 Effective Resolution (1) MAX UNIT V 125 ms 15 bits Specified by design. Not tested in production. INTEGRATING ADC (COULOMB COUNTER) CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX VSR Input voltage range from BAT to SRX pins tSR_CONV Conversion time Single conversion 1 s Effective Resolution Single conversion 16 bits (1) BAT ± 25 UNIT mV Assured by design. Not tested in production. INTEGRATED SENSE RESISTOR CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER SRXRES ISRX (1) (2) (3) (1) (2) TEST CONDITIONS MIN TYP MAX 7 UNIT Resistance of Integrated Sense Resistor from SRX to VSS. TA = 30°C mΩ Recommended Sense Resistor input current. Long term RMS, average device utilization. 2000 mA Peak RMS current, 10% device utilization. (3) 2500 mA Peak pulsed current, 250mS max, 1% device utilization. (3) 3500 mA Specified by design. Not tested in production. Firmware compensation applied for temperature coefficient of resistor. Device utilization is the long term usage profile at a specific condition compared to the average condition. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 7 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com I2C-COMPATIBLE INTERFACE COMMUNICATION TIMING CHARACTERISTICS TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Standard Mode (100 kHz) td(STA) Start to first falling edge of SCL 4.0 μs tw(L) SCL pulse duration (low) 4.7 μs tw(H) SCL pulse duration (high) 4.0 μs tsu(STA) Setup for repeated start 4.7 μs tsu(DAT) Data setup time Host drives SDA 250 ns th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 4.0 μs t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) 300 (1) ns 300 ns 100 kHz Fast Mode (400 kHz) td(STA) Start to first falling edge of SCL 600 ns tw(L) SCL pulse duration (low) 1300 ns tw(H) SCL pulse duration (high) 600 ns tsu(STA) Setup for repeated start 600 ns tsu(DAT) Data setup time Host drives SDA 100 ns th(DAT) Data hold time Host drives SDA 0 ns tsu(STOP) Setup time for stop 600 ns t(BUF) Bus free time between stop and Includes Command Waiting Time start 66 μs tf SCL/SDA fall time tr SCL/SDA rise time fSCL Clock frequency (2) (1) (2) (1) 300 (1) ns 300 ns 400 kHz Specified by design. Not production tested. If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (Refer to I2C INTERFACE and I2C Command Waiting Time) tSU(STA) tw(H) tf tw(L) tr t(BUF) SCL SDA td(STA) tsu(STOP) tf tr th(DAT) tsu(DAT) REPEATED START STOP START Figure 2. I2C-Compatible Interface Timing Diagrams 8 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 GENERAL DESCRIPTION The bq27421-G1 accurately predicts the battery capacity and other operational characteristics of a single Libased rechargeable cell. It can be interrogated by a system processor to provide cell information, such as stateof-charge (SOC). Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command( ), are used to read and write information contained within the bq27421-G1 control and status registers, as well as its data locations. Commands are sent from system to gauge using the bq27421-G1’s I2C serial communications engine, and can be executed during application development, system manufacture, or end-equipment operation. The key to the bq27421-G1’s high-accuracy gas gauging prediction is Texas Instrument’s proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-ofcharge predictions that can achieve high accuracy across a wide variety of operating conditions and over the lifetime of the battery. The bq27421-G1 measures charge/discharge activity by monitoring the voltage across a small-value sense resistor. When a cell is attached to the bq27421-G1, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions. The bq27421-G1 uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host processor can provide temperature data for the bq27421-G1. To minimize power consumption, the bq27421-G1 has several power modes: INITIALIZATION, NORMAL, SLEEP, HIBERNATE and SHUTDOWN. The bq27421-G1 passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. More details are found in the bq27421-G1 Technical Reference Manual (SLUUAC5). NOTE Formatting Conventions in this Document: Commands: italics with parentheses( ) and no breaking spaces, for example, RemainingCapacity( ). Data Flash: italics, bold, and breaking spaces, for example, Design Capacity. Register bits and flags: italics with brackets [ ], for example, [TDA] Data flash bits: italics, bold, and brackets [ ], for example, [LED1] Modes and states: ALL CAPITALS, for example, UNSEALED mode. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 9 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com DATA COMMANDS STANDARD DATA COMMANDS The bq27421-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in . Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional details are found in the bq27421-G1 Technical Reference Manual (SLUUAC5). Table 1. Standard Commands NAME COMMAND CODE SEALED ACCESS Control( ) CNTL 0x00 / 0x01 N/A R/W Temperature( ) TEMP 0x02 / 0x03 0.1°K R/W VOLT 0x04 / 0x05 mV R FLAGS 0x06 / 0x07 N/A R NominalAvailableCapacity( ) 0x08 / 0x09 mAh R FullAvailableCapacity( ) 0x0a / 0x0b mAh R Voltage( ) Flags( ) RemainingCapacity( ) RM 0x0c / 0x0d mAh R FullChargeCapacity( ) FCC 0x0e / 0x0f mAh R AverageCurrent( ) 0x10 / 0x11 mA R StandbyCurrent( ) 0x12 / 0x13 mA R MaxLoadCurrent( ) 0x14 / 0x15 mA R AveragePower( ) 0x18 / 0x19 mW R 0x1c / 0x1d % R 0x1e / 0x1f 0.1°K R 0x20 / 0x21 num / % R StateOfCharge( ) SOC IntTemperature( ) StateOfHealth( ) 10 UNITS SOH Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 Control( ): 0x00/0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the bq27421-G1 during normal operation and additional features when the device is in different access modes, as described in . Additional details are found in the bq27421-G1 Technical Reference Manual (SLUUAC5). Table 2. Control( ) Subcommands CNTL FUNCTION CNTL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes DESCRIPTION Reports the status of device. DEVICE_TYPE 0x0001 Yes Reports the device type (0x0421). FW_VERSION 0x0002 Yes Reports the firmware version of the device. DM_CODE 0x0004 Yes Reports the Data Memory Code number stored in NVM. PREV_MACWRITE 0x0007 Yes Returns previous MAC command code. CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration BAT_INSERT 0x000c Yes Forces the [BAT_DET] bit set when the [BIE] bit is 0. BAT_REMOVE 0x000d Yes Forces the [BAT_DET] bit clear when the [BIE] bit is 0. SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1. CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0. SET_CFGUPDATE 0x0013 No Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters CONFIG UPDATE mode. SHUTDOWN_ENABLE 0x001b No Enables device SHUTDOWN mode. SHUTDOWN 0x001c No Commands the device to enter SHUTDOWN mode. TOGGLE_GPOUT 0x0023 Yes Commands the device to toggle the GPOUT pin for 1ms. SEALED 0x0020 No Places the device in SEALED access mode. RESET 0x0041 No Performs a full device reset. SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode. Refer to the bq27421-G1 Technical Reference Manual for detailed descriptions for the Standard Data Commands and Control( ) subcommands. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 11 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com FUNCTIONAL DESCRIPTION I2C INTERFACE The bq27421-G1 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the bq27421-G1 or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Attempt to read an address above 0x6B (NACK command): I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27421-G1 is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode. 12 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 bq27421-G1 www.ti.com SLUSB85 – MAY 2013 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all packets addressed to the bq27421-G1. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand the reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL £ 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] DATA [7:0] A P A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL £ 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short ≤ 100 µs clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes ( INITIALIZATION , NORMAL) a ≤ 4 ms clock stretching period may occur within packets addressed for the fuel gauge as the I2C interface performs normal data flow control. Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 13 bq27421-G1 SLUSB85 – MAY 2013 www.ti.com REFERENCE (EVM) SCHEMATIC 14 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: bq27421-G1 PACKAGE OPTION ADDENDUM www.ti.com 13-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) BQ27421YZFR-G1A ACTIVE DSBGA YZF 9 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1A BQ27421YZFR-G1B ACTIVE DSBGA YZF 9 3000 TBD Call TI Call TI -40 to 85 BQ27421 G1B BQ27421YZFT-G1A ACTIVE DSBGA YZF 9 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27421 G1A BQ27421YZFT-G1B ACTIVE DSBGA YZF 9 250 TBD Call TI Call TI -40 to 85 BQ27421 G1B (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 13-May-2013 Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) BQ27421YZFR-G1A DSBGA YZF 9 3000 180.0 8.4 BQ27421YZFT-G1A DSBGA YZF 9 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.78 1.78 0.69 4.0 8.0 Q1 1.78 1.78 0.69 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27421YZFR-G1A DSBGA YZF 9 3000 210.0 185.0 35.0 BQ27421YZFT-G1A DSBGA YZF 9 250 210.0 185.0 35.0 Pack Materials-Page 2 D: Max = 1.651 mm, Min = 1.59 mm E: Max = 1.61 mm, Min = 1.55 mm IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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