TI TUSB2046BIRHBRQ1

TUSB2046BI-Q1
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SLLSE50 – SEPTEMBER 2010
4-PORT HUB FOR THE UNIVERSAL SERIAL BUS
WITH OPTIONAL SERIAL EEPROM INTERFACE
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FEATURES
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(1)
Fully Compliant With the USB Specification as
a Full-Speed Hub: TID #30220231
32-Terminal LQFP (1) Package With a 0.8-mm
Terminal Pitch or QFN Package with a 0.5-mm
Terminal Pitch
3.3-V Low Power ASIC Logic
Integrated USB Transceivers
State Machine Implementation Requires No
Firmware Programming
One Upstream Port and Four Downstream
Ports
All Downstream Ports Support Full-Speed and
Low-Speed Operations
Two Power Source Modes
– Self-Powered Mode
– Bus-Powered Mode
Power Switching and Overcurrent Reporting Is
Provided Ganged or Per Port
Supports Suspend and Resume Operations
Supports Programmable Vendor ID and
Product ID With External Serial EEPROM
3-State EEPROM Interface Allows EEPROM
Sharing
Push-Pull Outputs for PWRON Eliminate the
Need for External Pullup Resistors
Noise Filtering on OVRCUR Provides Immunity
to Voltage Spikes
Package Pinout Allows 2-Layer PCB
Low EMI Emission Achieved by a 6-MHz
Crystal Input
Migrated From Proven TUSB2040 Hub
Lower Cost Than the TUSB2040 Hub
Enhanced System ESD Performance
Supports 6-MHz Operation Through a Crystal
Input or a 48-MHz Input Clock
VF PACKAGE
(TOP VIEW)
RHB PACKAGE
(TOP VIEW)
JEDEC descriptor S-PQFP-G for low profile quad flat pack
(LQFP).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TUSB2046BI-Q1
SLLSE50 – SEPTEMBER 2010
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DESCRIPTION/ORDERING INFORMATION
The TUSB2046B is a 3.3-V CMOS hub device that provides one upstream port and four downstream ports in
compliance with the Universal Serial Bus (USB) specification as a full-speed hub. Because this device is
implemented with a digital state machine instead of a microcontroller, no firmware programming is required.
Fully-compliant USB transceivers are integrated into the ASIC for all upstream and downstream ports. The
downstream ports support both full-speed and low-speed devices by automatically setting the slew rate according
to the speed of the device attached to the ports. The configuration of the BUSPWR terminal selects either the
bus-powered or the self-powered mode.
Configuring the GANGED input determines the power switching and overcurrent detection modes for the
downstream ports. External power-management devices, such as the TPS2044, are required to control the 5-V
source to the downstream ports according to the corresponding values of the PWRON terminal. Upon detecting
any overcurrent conditions, the power-management device sets the corresponding OVRCUR terminal of the
TUSB2046B to a logic low. If GANGED is high, all PWRON outputs switch together and if any OVRCUR is
activated, all ports transition to the power-off state. If GANGED is low, the PWRON outputs and OVRCUR inputs
operate on a per-port basis.
The TUSB2046B provides the flexibility of using a 6-MHz or a 48-MHz clock. The logic level of the TSTMODE
terminal controls the selection of the clock source. When TSTMODE is low, the output of the internal APLL
circuitry is selected to drive the internal core of the device. When TSTMODE is high, the TSTPLL/48MCLK input
is selected as the input clock source and the APLL circuitry is powered down and bypassed. The internal
oscillator cell is also powered down while TSTMODE is high.
Low EMI emission is achieved because the TUSB2046B is able to utilize a 6-MHz crystal input. Connect the
crystal as shown in Figure 6. An internal PLL then generates the 48-MHz clock used to sample data from the
upstream port and to synchronize the 12 MHz used for the USB clock. If low-power suspend and resume are
desired, a passive crystal or resonator must be used. However, a 6-MHz oscillator may be used by connecting
the output to the XTAL1 terminal and leaving the XTAL2 terminal open. The oscillator TTL output must not
exceed 3.6 V.
For 48-MHz operation, the clock cannot be generated with a crystal using the XTAL2 output because the internal
oscillator cell supports only the fundamental frequency.
See Figure 7 and Figure 8 in the input clock configuration section for more detailed information regarding the
input clock configuration.
The EXTMEM terminal enables or disables the optional EEPROM interface. When the EXTMEM terminal is high,
the product ID (PID) displayed during enumeration is the general-purpose USB hub. For this default, terminal 5 is
disabled and terminal 6 functions as the GANGED input terminal. If custom PID and vendor ID (VID) descriptors
are desired, the EXTMEM terminal must be low (EXTMEM = 0). For this configuration, terminals 5 and 6 function
as the EEPROM interface with terminals 5 and 6 functioning as EECLK and EEDATA, respectively. See Table 1
for a description of the EEPROM memory map.
Other useful features of the TUSB2046B include a package with a 0.8-mm terminal pitch for easy PCB routing
and assembly, push-pull outputs for the PWRON terminals eliminate the need for pullup resistors required by
traditional open-collector I/Os, and OVRCUR terminals have noise filtering for increased immunity to voltage
spikes.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
2
QFN – RHB
Reel of 3000
ORDERABLE PART NUMBER
TUSB2046BIRHBRQ1
TOP-SIDE MARKING
TUSB
2046BQ1
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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FUNCTIONAL BLOCK DIAGRAM
DP0
DM0
1
2
USB
Transceiver
32
27
SUSPND
TSTPLL/48MCLK
30 XTAL1
29
Suspend/Resume
Logic and
Frame Timer
HUB Repeater
OSC/PLL
XTAL2
SIE
4
26
6
SIE Interface
Logic
Serial
EEPROM
Interface
5
RESET
EXTMEM
EEDATA/GANGED
EECLK
Port 1
Logic
Port 2
Logic
Hub/Device
Command
Decoder
Port 3
Logic
8
BUSPWR
Port 4
Logic
USB
Transceiver
24
DP4
23
DM4
USB
Transceiver
20
DP3
19
DM3
USB
Transceiver
16
DP2
15
DM2
USB
Transceiver
12
DP1
Hub
Power
Logic
10, 14, 18, 22
OVRCUR1 – OVRCUR4
11
DM1
9, 13, 17, 21
PWRON1 – PWRON4
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TERMINAL FUNCTIONS
TERMINAL
NAME
BUSPWR
DM0
DM1–DM4
DP0
DP1–DP4
EECLK
NO.
I/O
DESCRIPTION
8
I
Power source indicator. BUSPWR is an active-high input that indicates whether the downstream
ports source their power from the USB cable or a local power supply. For the bus-power mode,
this terminal must be pulled to 3.3 V, and for the self-powered mode, this terminal must be pulled
low. Input must not change dynamically during operation.
2
I/O
Root port USB differential data minus. DM0 paired with DP0 constitutes the upstream USB port.
11, 15,
19, 23
I/O
USB differential data minus. DM1–DM4 paired with DP1–DP4 support up to four downstream USB
ports.
1
I/O
Root port USB differential data plus. DP0 paired with DM0 constitutes the upstream USB port.
12, 16,
20, 24
I/O
USB differential data plus. DP1–DP4 paired with DM1–DM4 support up to four downstream USB
ports.
5
O
EEPROM serial clock. When EXTMEM is high, the EEPROM interface is disabled. The EECLK
terminal is disabled and must be left floating (unconnected). When EXTMEM is low, EECLK acts
as a 3-state serial clock output to the EEPROM with a 100-mA internal pulldown.
EEDATA/
GANGED
6
I/O
EEPROM serial data/power-management mode indicator. When EXTMEM is high,
EEDATA/GANGED selects between ganged or per-port power overcurrent detection for the
downstream ports. When EXTMEM is low, EEDATA/GANGED acts as a serial data I/O for the
EEPROM and is internally pulled down with a 100-mA pulldown. This standard TTL input must not
change dynamically during operation.
EXTMEM
26
I
When EXTMEM is high, the serial EEPROM interface of the device is disabled. When EXTMEM is
low, terminals 5 and 6 are configured as the clock and data terminals of the serial EEPROM
interface, respectively.
GND
7, 28
GND terminals must be tied to ground for proper operation.
OVRCUR1 –
OVRCUR4
10, 14,
18, 22
I
Overcurrent input. OVRCUR1–OVRCUR4 are active low. For per-port overcurrent detection, one
overcurrent input is available for each of the four downstream ports. In the ganged mode, any
OVRCUR input may be used and all OVRCUR terminals must be tied together. OVRCUR
terminals are active low inputs with noise filtering logic.
PWRON1 –
PWRON4
9, 13,
17, 21
O
Power-on/-off control signals. PWRON1–PWRON4 are active low, push-pull outputs. Push-pull
outputs eliminate the pullup resistors which open-drain outputs require. However, the external
power switches that connect to these terminals must be able to operate with 3.3-V inputs because
these outputs cannot drive 5-V signals.
RESET
4
I
RESET is an active low TTL input with hysteresis and must be asserted at power up. When
RESET is asserted, all logic is initialized. Generally, a reset with a pulse width between 100 ms
and 1 ms is recommended after 3.3-V VCC reaches its 90%. Clock signal has to be active during
the last 60 ms of the reset window.
SUSPND
32
O
Suspend status. SUSPND is an active high output available for external logic power-down
operations. During the suspend mode, SUSPND is high. SUSPND is low for normal operation.
TSTMODE
31
I
Test/mode terminal. TSTMODE is used as a test terminal during production testing. This terminal
must be tied to ground or 3.3-V VCC for normal 6-MHz or 48-MHz operation, respectively.
TSTPLL/
48MCLK
27
I/O
Test/48-MHz clock input. TSTPLL/48MCLK is used as a test terminal during production testing.
This terminal must be tied to ground for normal 6-MHz operation. If 48-MHz input clock is desired,
a 48-MHz clock source (no crystal) can be connected to this input terminal.
VCC
3, 25
3.3-V supply voltage
XTAL1
30
I
Crystal 1. XTAL1 is a 6-MHz crystal input with 50% duty cycle. An internal PLL generates the
48-MHz and 12-MHz clocks used internally by the ASIC logic.
XTAL2
29
O
Crystal 2. XTAL2 is a 6-MHz crystal output. This terminal must be left open when using an
oscillator.
4
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range (2)
–0.5
3.6
V
VI
Input voltage range
–0.5
VCC + 0.5
V
VO
Output voltage range
–0.5
VCC + 0.5
IIK
Input clamp current
VI < 0 V or VI < VCC
±20
mA
IOK
Output clamp current
VO < 0 V or VO < VCC
±20
mA
Tstg
Storage temperature range
–65
150
°C
TA
Operating free-air temperature range
–40
85
°C
(1)
(2)
TUSB2046BI
UNIT
V
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage levels are with respect to GND.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
VCC
Supply voltage
VI
VO
MIN
TUSB2046BI
NOM
MAX
UNIT
3.3
3.6
V
Input voltage, TTL/LVCMOS
0
VCC
V
Output voltage, TTL/LVCMOS
0
VCC
V
VIH(REC)
High-level input voltage, signal-ended receiver
2
VCC
V
VIL(REC)
Low-level input voltage, signal-ended receiver
0.8
V
VIH(TTL)
High-level input voltage, TTL/LVCMOS
2
VCC
V
VIL(TTL)
Low-level input voltage, TTL/LVCMOS
0
0.8
V
TA
Operating free-air temperature
–40
85
°C
R(DRV)
External series, differential driver resistor
22 (–5%)
22 (5%)
f(OPRH)
Operating (dc differential driver) high speed mode
12
Mb/s
f(OPRL)
Operating (dc differential driver) low speed mode
1.5
Mb/s
VICR
Common mode, input range, differential receiver
tt
Input transition times, TTL/LVCMOS
TJ
Junction temperature range
TUSB2046BI
Ω
0.8
2.5
V
0
25
ns
–40
115
°C
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ELECTRICAL CHARACTERISTICS
over recommended ranges of operating free-air temperature and supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TTL/LVCMOS
VOH
High-level output voltage
USB data lines
TTL/LVCMOS
VOL
Low-level output voltage
VIT+
Positive input threshold
VIT–
Negative-input threshold
Vhys
Input hysteresis (1)
(VT+ – VT–)
IOZ
High-impedance output current
IIL
USB data lines
IOH = –4 mA
MIN
R(DRV) = 15 kΩ to GND
IOH = –12 mA (without R(DRV))
MAX
2.8
V
VCC – 0.5
IOL = 4 mA
0.5
R(DRV) = 1.5 kΩ to 3.6 V
0.3
IOL = 12 mA (without R(DRV))
0.5
TTL/LVCMOS
Single-ended
V
1.8
0.8
0.8 V ≤ VICR ≤ 2.5 V
V
1
TTL/LVCMOS
0.3
0.7
300
500
Single-ended
0.8 V ≤ VICR ≤ 2.5 V
TTL/LVCMOS
V = VCC or GND (2)
±10
USB data lines
0 V ≤ VO ≤ VCC
±10
Low-level input current
TTL/LVCMOS
VI = GND
IIH
High-level input current
TTL/LVCMOS
VI = VCC
z0(DRV)
Driver output impedance (3)
USB data lines
Static VOH or VOL
7.1
VID
Differential input voltage
USB data lines
0.8 V ≤ VICR ≤ 2.5 V
0.2
ICC
Input supply current
(1)
(2)
(3)
V
1.8
0.8 V ≤ VICR ≤ 2.5 V
TTL/LVCMOS
Single-ended
UNIT
VCC – 0.5
mV
mA
–1
mA
1
mA
19.9
Ω
V
Normal operation
Suspend mode
40
mA
1
mA
Applies for input buffers with hysteresis.
Applies for open drain buffers.
Characterization only. Limits are approved by design and are not production tested.
DIFFERENTIAL DRIVER SWITCHING CHARACTERISTICS
Full Speed Mode
over recommended ranges of operating free-air temperature and supply voltage, CL = 50 pF (unless otherwise noted)
MIN
MAX
tr
Transition rise time for DP or DM
PARAMETER
See Figure 1 and Figure 2
TEST CONDITIONS
4
20
ns
tf
Transition fall time for DP or DM
See Figure 1 and Figure 2
4
20
ns
90
110
%
1.3
2.0
V
(1)
t(RFM)
Rise/fall time matching
VO(CRS)
Signal crossover output voltage (1)
(1)
(tr/tf) × 100
UNIT
Characterized only. Limits are approved by design and are not production tested.
DIFFERENTIAL DRIVER SWITCHING CHARACTERISTICS
Low Speed Mode
over recommended ranges of operating free-air temperature and supply voltage, CL = 50 pF (unless otherwise noted)
MIN
MAX
UNIT
tr
Transition rise time for DP or DM (1)
PARAMETER
CL = 200 pF to 600 pF,
TEST CONDITIONS
See Figure 1 and Figure 2
75
300
ns
tf
Transition fall time for DP or DM (1)
CL = 200 pF to 600 pF,
See Figure 1 and Figure 2
75
300
ns
(tr/tf) × 100
80
120
%
CL = 200 pF to 600 pF
1.3
2.0
V
(1)
t(RFM)
Rise/fall time matching
VO(CRS)
Signal crossover output voltage (1)
(1)
6
Characterized only. Limits are approved by design and are not production tested.
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22 Ω
1.5 kΩ
15 kΩ
22 Ω
15 kΩ
Figure 1. Differential Driver Switching Load
V ID - Diff erential Receiver Input Sensitivity - V
Figure 2. Differential Driver Timing Waveforms
1.5
1.3
1
0.5
0.2
0
0
3
1
2
3.6
0.8
2.5
VICR - Common Mode Input Rang e - V
4
Figure 3. Differential Receiver Input Sensitivity vs Common Mode Input Range
Vhys
Logic high
VCC
VIH
VIT+
VIT-
VIL
Logic low
0V
Figure 4. Single-Ended Receiver Input Signal Parameter Definitions
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APPLICATION INFORMATION
A major advantage of USB is the ability to connect 127 functions configured in up to 6 logical layers (tiers) to a
single personal computer (see Figure 5).
PC
With Root Hub
Monitor
With 4-Port Hub (Self-Powered)
Printer
With 4-Port Hub
(Self-Powered)
Scanner
Digital
Scanner
Figure 5. USB-Tiered Configuration Example
Another advantage of USB is that all peripherals are connected using a standardized four-wire cable that
provides both communication and power distribution. The power configurations are bus-powered and
self-powered modes. The maximum current that may be drawn from the USB 5-V line during power up is 100
mA. For the bus-powered mode, a hub can draw a maximum of 500 mA from the 5-V line of the USB cable. A
bus-powered hub must always be connected downstream to a self-powered hub unless it is the only hub
connected to the PC and there are no high-powered functions connected downstream. In the self-powered mode,
the hub is connected to an external power supply and can supply up to 500 mA to each downstream port.
High-powered functions may draw a maximum of 500 mA from each downstream port and may only be
connected downstream to self-powered hubs. Per the USB specification, in the bus-powered mode, each
downstream port can provide a maximum of 100 mA of current, and in the self-powered mode, each downstream
port can provide a maximum of 500 mA of current.
Both bus-powered and self-powered hubs require overcurrent protection for all downstream ports. The two types
of protection are individual-port management (individual-port basis) or ganged-port management (multiple-port
basis). Individual-port management requires power-management devices for each individual downstream port,
but adds robustness to the USB system because, in the event of an overcurrent condition, the USB host only
powers down the port that has the condition. The ganged configuration uses fewer power management devices
and thus has lower system costs, but in the event of an overcurrent condition on any of the downstream ports, all
the ganged ports are disabled by the USB host.
Using a combination of the BUSPWR and EEDATA/GANGED inputs, the TUSB2046B supports four modes of
power management: bus-powered hub with either individual-port power management or ganged-port power
management, and the self-powered hub with either individual-port power management or ganged-port power
management. Texas Instruments supplies the complete hub solution with the TUSB2036 (2/3-port), TUSB2046B,
and the TUSB2077 (7-port) hubs along with the power-management devices needed to implement a fully USB
specification-compliant system.
8
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USB Design Notes
The following sections provide block diagram examples of how to implement the TUSB2046B device. Note, even
though no resistors are shown, pullup, pulldown, and series resistors must be used to properly implement this
device.
Figure 6 is an example of how to generate the 6-MHz clock signal.
CL
XTAL1
XTAL2
C1
C2
NOTE: This figure assumes a 6-MHz fundamental crystal that is parallel loaded. The component values of C1, C2, and Rd
are determined using a crystal from Fox Electronics – part number HC49U-6.00MHz 30\50\0-70\20, which means
±30 ppm at 25°C and ±50 ppm from 0°C to 70°C. The characteristics for the crystal include a load capacitance (CL) of
20 pF, maximum shunt capacitance (Co) of 7 pF, and the maximum ESR of 50 Ω. In order to insure enough negative
resistance, use C1 = C2 = 27 pF. The resistor Rd is used to trim the gain, and Rd = 1.5 kΩ is recommended.
Figure 6. Crystal Tuning Circuit
Input Clock Configuration
The input clock configuration logic of TUSB2046B is enhanced to accept a 6-MHz crystal or 48-MHz
on-the-board clock source with a simple tie-off change on TSTMODE (terminal 31).
•
A 6-MHz input clock configuration is shown in Figure 7.
In this mode, both TSTMODE and TSTPLL/48MCLK terminals must be tied to ground. The hub is configured
to use the 6-MHz clock on terminals 30 and 29, which are XTAL1 and XTAL2, respectively, on the
TUSB2046B. This is identical to the TUSB2046.
Figure 7. 6-MHz Input Clock Configuration
•
A 48-MHz input clock configuration is shown in Figure 8.
In this mode, both TSTMODE and XTAL1 terminals must be tied to 3.3-V VCC. The hub accepts the 48-MHz
clock input on TSTPLL/48MCLK (terminal 27). XTAL2 must be left floating (open) for this configuration. Only
the oscillator or the onboard clock source is accepted for this mode. A crystal can not be used for this mode,
since the chip’s internal oscillator cell only supports the fundamental frequency.
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TUSB2046B USB HUB
3.3 V
30
XTAL1
29
Open
XTAL2
31
TSTMODE
48-MHz Oscillator
or on Board Clock Source 27
TSTPLL/48MCLK
Figure 8. 48-MHz Input Clock Configuration
Figure 9 is a block diagram example of how to connect the external EEPROM if a custom product ID and vendor
ID are desired. Figure 10 shows the EEPROM read operation timing diagram. Figure 11, Figure 12, and
Figure 13 illustrate how to connect the TUSB2046B device for different power source and port
power-management combinations.
Ω
Figure 9. Typical Application of the TUSB2046B USB Hub
10
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Programming the EEPROM
An SGS Thompson M93C46 EEPROM, or equivalent, stores the programmable VID and PID. When the
EEPROM interface is enabled (EXTMEM = 0), the EECLK and EEDATA are internally pulled down (100 mA)
inside the TUSB2046B. The internal pulldowns are disabled when the EEPROM interface is disabled
(EXTMEM = 1).
The EEPROM is programmed with the three 16-bit locations as shown in Table 1. Connecting terminal 6 of the
EEPROM high (ORG = 1) organizes the EEPROM memory into 64×16-bit words.
Table 1. EEPROM Memory Map
ADDRESS
D15
D14
D13
D12–D8
D7–D0
00000
0
GANGED
00000
00000
00000000
00001
VID High-byte
VID Low-byte
00010
PID High-byte
PID Low-byte
XXXXXXXX
The D and Q signals of the EEPROM must be tied together using a 1-kΩ resistor with the common I/O
operations forming a single-wire bus. After system power-on reset, the TUSB2046B performs a one-time access
read operation from the EEPROM if the EXTMEM terminal is pulled low and the chip select(s) of the EEPROM is
connected to the system power-on reset. Initially, the EEDATA terminal is driven by the TUSB2046B to send a
start bit (1) which is followed by the read instruction (10) and the starting-word address (00000). Once the read
instruction is received, the instruction and address are decoded by the EEPROM, which then sends the data to
the output shift register. At this point, the hub stops driving the EEDATA terminal and the EEPROM starts driving.
A dummy (0) bit is then output and the first three 16-bit words in the EEPROM are output with the most
significant bit (MSB) first.
The output data changes are triggered by the rising edge of the clock provided by the TUSB2046B on the
EECLK terminal. The SGS-Thompson M936C46 EEPROM is recommended because it advances to the next
memory location by automatically incrementing the address internally. Any EEPROM used must have the
automatic internal address advance function. After reading the three words of data from the EEPROM, the
TUSB2046B puts the EEPROM interface into a high-impedance condition (pulled down internally) to allow other
logic to share the EEPROM. The EEPROM read operation is summarized in Figure 10. For more details on
EEPROM operation, refer to SGS-Thompson Microelectronics M93C46 Serial Microwire Bus EEPROM data
sheet.
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12
D
C
S
Start
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A5
Hub Driving Data Line
Read OP Code(10)
Other
Address
Bits
A1
6 Bit Address (000000)
A0
Dummy
Bit
MSB of The
First Word
D15
Other
LSB of
Data Bits Third Word
D0
EEPROM Driving Data Line
D14
48 Data Bits
MSB of
Fourth Word
XX
Don’t Care
3-Stated
With Internal
Pulldown
TUSB2046BI-Q1
SLLSE50 – SEPTEMBER 2010
www.ti.com
Figure 10. EEPROM Read Operation Timing Diagram
Copyright © 2010, Texas Instruments Incorporated
TUSB2046BI-Q1
www.ti.com
SLLSE50 – SEPTEMBER 2010
Bus-Powered Hub, Ganged-Port Power Management
When used in bus-powered mode, the TUSB2046B supports up to four downstream ports by controlling a
TPS2041 device which is capable of supplying 100 mA of current to each downstream port. Bus-powered hubs
must implement power switching to ensure current demand is held below 100 mA when the hub is hot-plugged
into the system. Utilizing the TPS2041 for ganged-port power management provides overcurrent protection for
the downstream ports. The SN75240 transient suppressors reduce inrush current and voltage spikes on the data
lines. The OVRCUR signals must be tied together for a ganged operation.
3.3 V
1.5 kΩ
Downstream
Ports
D
D+
SN75240
A
SN75240
3.3 V LDO
A
Ferrite Beads
A C
B D
15 kΩ
15 kΩ
GND
A
5V
100 µF
15 kΩ
D-
B
15 kΩ
D+
DFerrite Beads
GND
A C
B D
15 kΩ
15 kΩ
SN75240
5V
A
100 µF
B
15 kΩ
15 kΩ
TPS2041
EN
D+
D-
A
Ferrite Beads
GND
IN
IN
5V
1 µF
100 µF
B
OUT
OUT
OUT
OC
D+
DFerrite Beads
GND
5V
100 µF
B
NOTES: A. TPS2041 and SN75240 are Texas Instruments devices. The OCn outputs of the TPS204n are open drain. A 10-kΩ pullup is
recommended.
B. 120 µF per hub is the minimum required per the USB specification, version 1.1. However, TI recommends a 100-µF, low ESR,
tantalum capacitor per port for immunity to voltage droop.
C. LDO is a 5-V-to-3.3-V voltage regulator
D. All USB DP, DM signal pairs require series resistors of approximately 27Ω to ensure proper termination. An optional filter
capacitor of about 22 pF is recommended for EMI suppression. This capacitor, if used, must be placed between the hub
terminal and the series resistor, as per section 7.1.6 of the USB specification.
Figure 11. TUSB2046B Bus-Powered Hub, Ganged-Port Power-Management Application
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :TUSB2046BI-Q1
13
TUSB2046BI-Q1
SLLSE50 – SEPTEMBER 2010
www.ti.com
Self-Powered Hub, Ganged-Port Power Management
The TUSB2046B can also be implemented for ganged-port power management in a self-powered configuration.
The implementation is very similar to the bus-powered example with the exception that a self-powered port
supplies 500 mA of current to each downstream port. The overcurrent protection can be provided by a TPS2044
quad device or a TPS2024 single power switch.
1.5 kΩ
D
SN75240
A
Ω
Ω
3.3 V LDO
C
SN75240
Ω
Ω
A
100 µF
B
Ω
Ω
SN75240
Ω
Ω
TPS2044
A
100 µF
B
A
100 µF
100 µF
B
B
NOTES: A. TPS2044, TPS2042, and SN75240 are Texas Instruments devices. The TPS2042 can be substituted for the TPS2044. The OCn
outputs of the TPS204n are open drain. A 10-kΩ pullup is recommended.
B. 120 µF per hub is the minimum required per the USB specification, version 1.1. However, TI recommends a 100-µF, low ESR,
tantalum capacitor per port for immunity to voltage droop.
C. LDO is a 5-V-to-3.3-V voltage regulator
D. All USB DP, DM signal pairs require series resistors of approximately 27Ω to ensure proper termination. An optional filter
capacitor of about 22 pF is recommended for EMI suppression. This capacitor, if used, must be placed between the hub
terminal and the series resistor, as per section 7.1.6 of the USB specification.
Figure 12. TUSB2046B Self-Powered Hub, Ganged-Port Power-Management Application
14
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :TUSB2046BI-Q1
TUSB2046BI-Q1
www.ti.com
SLLSE50 – SEPTEMBER 2010
Self-Powered Hub, Individual-Port Power Management
In a self-powered configuration, the TUSB2046B can be implemented for individual-port power management
when used with the TPS2044, because it is capable of supplying 500 mA of current to each downstream port and
can provide current limiting on a per-port basis. When the hub detects a fault on a downstream port, power is
removed from only the port with the fault and the remaining ports continue to operate normally. Self-powered
hubs are required to implement overcurrent protection and report overcurrent conditions. The SN75240 transient
suppressors reduce inrush current and voltage spikes on the data lines.
D
1.5 kΩ
SN75240
Ω
Ω
A
SN75240
3.3 V LDO
A
C
100 µF
Ω
Ω
B
Ω
Ω
SN75240
A
B
100 µF
TPS2044
A
100 µF
100 µF
B
B
NOTES: A. TPS2044, TPS2042, and SN75240 are Texas Instruments devices. Two TPS2042 devices can be substituted for the TPS2044.
The OCn outputs of the TPS204n are open drain. A 10-kΩ pullup is recommended.
B. 120 µF per hub is the minimum required per the USB specification, version 1.1. However, TI recommends a 100-µF, low ESR,
tantalum capacitor per port for immunity to voltage droop.
C. LDO is a 5-V-to-3.3-V voltage regulator
D. All USB DP, DM signal pairs require series resistors of approximately 27Ω to ensure proper termination. An optional filter
capacitor of about 22 pF is recommended for EMI suppression. This capacitor, if used, must be placed between the hub
terminal and the series resistor, as per section 7.1.6 of the USB specification.
Figure 13. TUSB2046B Self-Powered Hub, Individual-Port Power-Management Application
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s) :TUSB2046BI-Q1
15
PACKAGE OPTION ADDENDUM
www.ti.com
8-Oct-2010
PACKAGING INFORMATION
Orderable Device
TUSB2046BIRHBRQ1
Status
(1)
Package Type Package
Drawing
ACTIVE
QFN
RHB
Pins
Package Qty
32
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
Purchase Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TUSB2046B-Q1 :
• Catalog: TUSB2046B
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TUSB2046BIRHBRQ1
Package Package Pins
Type Drawing
QFN
RHB
32
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
330.0
12.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
5.3
1.5
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Feb-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TUSB2046BIRHBRQ1
QFN
RHB
32
3000
338.1
338.1
20.6
Pack Materials-Page 2
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