TI PCA9534ADBG4

PCA9534A
www.ti.com
SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
2
REMOTE 8-BIT I C AND SMBus LOW-POWER I/O EXPANDER
WITH INTERRUPT OUTPUT AND CONFIGURATION REGISTERS
Check for Samples: PCA9534A
FEATURES
1
•
RGV PACKAGE
(TOP VIEW)
A1
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
•
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
SDA
SCL
INT
P7
P6
P5
P4
A2 1
16 15 14 13
12
P0 2
11
INT
P1 3
10
P7
P2 4
9
P6
5
6
7
8
P5
2
P4
16
GND
1
P3
A0
A1
A2
P0
P1
P2
P3
GND
RGT PACKAGE
(TOP VIEW)
A1
A0
VCC
S DA
•
•
•
•
SCL
A2
P0
P1
P2
16 15 14 13
12 SCL
2
11 INT
3
10 P7
1
9 P6
4
5 6 7
8
P3
GND
P4
P5
•
Polarity Inversion Register
Internal Power-On Reset
Power-Up With All Channels Configured as
Inputs
No Glitch on Power-Up
Noise Filter on SCL/SDA Inputs
Latched Outputs With High-Current Drive
Maximum Capability for Directly Driving LEDs
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SDA
•
•
•
•
•
•
VCC
•
•
•
Low Standby Current Consumption of
1 mA Max
I2C to Parallel Port Expander
Open-Drain Active-Low Interrupt Output
Operating Power-Supply Voltage Range of
2.3 V to 5.5 V
5-V Tolerant I/O Ports
400-kHz Fast I2C Bus
Three Hardware Address Pins Allow Up to
Eight Devices on the I2C/SMBus
Allows Up to 16 Devices on the I2C/SMBus
When Used in Conjunction with the PCA9534
See Table 1 for I2C Expander offerings
Input/Output Configuration Register
A0
•
DESCRIPTION/ORDERING INFORMATION
This 8-bit I/O expander for the two-line bidirectional bus (I2C) is designed for 2.3-V to 5.5-V VCC operation. It
provides general-purpose remote I/O expansion for most microcontroller families via the I2C interface [serial clock
(SCL), serial data (SDA)].
The PCA9534A consists of one 8-bit configuration (input or output selection), input port, output port, and polarity
inversion (active high or active low) register. At power on, the I/Os are configured as inputs. However, the system
master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each
input or output is kept in the corresponding input or output register. The polarity of the input port register can be
inverted with the polarity inversion register. All registers can be read by the system master.
The system master can reset the PCA9534A in the event of a timeout or other improper operation by utilizing the
power-on reset feature, which puts the registers in their default state and initializes the I2C/SMBus state machine.
The PCA9534A open-drain interrupt (INT) output is activated when any input state differs from its corresponding
input port register state and is used to indicate to the system master that an input state has changed.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2010, Texas Instruments Incorporated
PCA9534A
SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
www.ti.com
INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the
remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via
the I2C bus. Thus, the PCA9534A can remain a simple slave device.
The device's outputs (latched) have high-current drive capability for directly driving LEDs. It has low current
consumption.
Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I2C address and allow up to eight
devices to share the same I2C bus or SMBus.
The PCA9534A is pin-to-pin and I2C address compatible with the PCF8574A. However, software changes are
required due to the enhancements in the PCA9534A over the PCF8574A.
The PCA9534A is a low-power version of the PCA9554A. The only difference between the PCA9534A and
PCA9554A is that the PCA9534A eliminates an internal I/O pullup resistor, which dramatically reduces power
consumption in the standby mode when the I/Os are held low.
The PCA9534A and PCA9534 are identical, except for their fixed I2C address. This allows for up to 16 of these
devices (8 of each) on the same I2C bus.
ORDERING INFORMATION
PACKAGE (1)
TA
TOP-SIDE MARKING
Reel of 3000
PCA9534ARGTR
ZVJ
QFN – RGV
Reel of 2500
PCA9534ARGVR
PD534A
QSOP – DBQ
Reel of 2500
PCA9534ADBQR
PDA534A
Tube of 40
PCA9534ADW
Reel of 2000
PCA9534ADWR
Reel of 2000
PCA9534ADBR
Tube of 80
PCA9534ADB
Tube of 90
PCA9534APW
Reel of 2000
PCA9534APWR
Reel of 2000
PCA9534ADGVR
–40°C to 85°C
SSOP – DB
TSSOP – PW
TVSOP – DGV
2
ORDERABLE PART NUMBER
QFN – RGT
SOIC – DW
(1)
(2)
(2)
PCA9534A
PDA534A
PD534A
PD534A
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
Table 1. I2C Expander offerings
DEVICE
MAX
FREQUENCY
I2C
ADDRESS
TCA6408
400
0100 00x
TCA6408
400
TCA6416
VCC
RANGE
NO. OF
GPIOs
INTERRUPT
OUTPUT
RESET
INPUT
1.65 to 5.5
8
Yes
Yes
0100 00x
1.65 to 5.5
8
Yes
400
0100 00x
1.65 to 5.5
16
TCA6416A
400
0100 00x
1.65 to 5.5
TCA6424
400
0100 00x
TCA9535
400
TCA9539
400
TCA9555
400
0100 xxx
CONFIGURATION
REGISTERS
5-V
TOLERANT
PUSH-PULL
I/O TYPE
OPEN-DRAIN
I/O TYPE
COMMENT
Yes
Yes
Yes
No
Power on reset, tf (fall time) > 100 ms and tr (ramp time) <
10 ms
Yes
Yes
Yes
Yes
No
Unrestricted power on reset ramp/fall time. Both tf (fall
time) and TRT (ramp time) can be between 0.1 ms and
2000 ms
Yes
Yes
Yes
Yes
Yes
No
Power on reset, tf (fall time) > 100 ms and TRT (ramp
time) < 10 ms
16
Yes
Yes
Yes
Yes
Yes
No
Unrestricted power on reset ramp/fall time. Both tf (fall
time) and TRT (ramp time) can be between 0.1 ms and
2000ms
1.65 to 5.5
24
Yes
Yes
Yes
Yes
Yes
No
Power on reset, tf (fall time) > 100 ms and TRT (ramp
time) < 10 ms
0100 xxx
1.65 to 5.5
16
Yes
No
Yes
Yes
Yes
No
1110 1xx
1.65 to 5.5
16
Yes
Yes
Yes
Yes
Yes
No
1.65 to 5.5
16
Yes
No
Yes
Yes
Yes
No
Yes
P0 bit
PCA6107
400
0011 xxx
2.3 to 5.5
8
Yes
Yes
Yes
Yes
Yes
P1―P7 bits
One open drain output; eight push pull outputs
PCA9534
400
0100 xxx
2.3 to 5.5
8
Yes
No
Yes
Yes
Yes
No
PCA9534 has a different slave address as the PCA9534A,
allowing up to 16 devices '9534 type devices on the same
I2C bus
PCA9534A
400
0111 xxx
2.3 to 5.5
8
Yes
No
Yes
Yes
Yes
No
PCA9534A has a different slave address as the PCA9534,
allowing up to 16 devices '9534 type devices on the same
I2C bus
PCA9535
400
0100 xxx
2.3 to 5.5
16
Yes
No
Yes
Yes
Yes
No
PCA9536
400
1000 001
2.3 to 5.5
4
No
No
Yes
Yes
Yes
No
PCA9538
400
1110 0xx
2.3 to 5.5
8
Yes
Yes
Yes
Yes
Yes
No
PCA9539
400
1110 1xx
2.3 to 5.5
16
Yes
Yes
Yes
Yes
Yes
No
PCA9554
400
0100 xxx
2.3 to 5.5
8
Yes
No
Yes
Yes
Yes
No
PCA9554A
400
0111 xxx
2.3 to 5.5
8
Yes
No
Yes
Yes
Yes
No
PCA9555
400
0100 xxx
2.3 to 5.5
16
Yes
No
Yes
Yes
Yes
No
PCA9557
400
0011 xxx
2.3 to 5.5
8
No
Yes
Yes
Yes
Yes
Yes
PCF8574
400
0100 xxx
2.5 to 6.0
8
Yes
No
No
Yes
Yes
No
PCA8574 has a different slave address as the PCA8574A,
allowing up to 16 devices '9534 type devices on the same
I2C bus
PCF8574A
400
0111 xxx
2.5 to 6.0
8
Yes
No
No
Yes
Yes
No
PCA8574A has a different slave address as the PCA8574,
allowing up to 16 devices '9534 type devices on the same
I2C bus
PCF8575
400
0100 xxx
2.5 to 5.5
16
Yes
No
No
Yes
Yes
No
PCF8575C
400
0100 xxx
4.5 to 5.5
16
Yes
No
No
Yes
No
Yes
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
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Table 2. TERMINAL FUNCTIONS
NO.
QSOP (DBQ),
SOIC (DW),
SSOP (DB),
TSSOP (PW), AND
TVSOP (DGV)
QFN (RGT)
AND
QFN (RGV)
NAME
1
15
A0
Address input. Connect directly to VCC or ground.
2
16
A1
Address input. Connect directly to VCC or ground.
3
1
A2
Address input. Connect directly to VCC or ground.
4
2
P0
P-port input/output. Push-pull design structure.
5
3
P1
P-port input/output. Push-pull design structure.
6
4
P2
P-port input/output. Push-pull design structure.
7
5
P3
P-port input/output. Push-pull design structure.
8
6
GND
9
7
P4
P-port input/output. Push-pull design structure.
10
8
P5
P-port input/output. Push-pull design structure.
11
9
P6
P-port input/output. Push-pull design structure.
12
10
P7
P-port input/output. Push-pull design structure.
13
11
INT
Interrupt output. Connect to VCC through a pullup resistor.
14
12
SCL
Serial clock bus. Connect to VCC through a pullup resistor.
15
13
SDA
Serial data bus. Connect to VCC through a pullup resistor.
16
14
VCC
Supply voltage
DESCRIPTION
Ground
LOGIC DIAGRAM (POSITIVE LOGIC)
INT
A0
A1
A2
SCL
SDA
13
Interrupt
Logic
LP Filter
1
2
P7−P0
3
14
15
Input
Filter
I2C Bus
Control
Shift
Register
8 Bits
I/O
Port
Write Pulse
VCC
GND
4
16
8
Power-On
Reset
Read Pulse
A.
Pin numbers shown are for DB, DBQ, DGV, DW, or PW package.
B.
All I/Os are set to inputs at reset.
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
SIMPLIFIED SCHEMATIC OF P0 TO P7
Data From
Shift Register
Data From
Shift Register
Output Port
Register Data
Configuration
Register
VCC
Q1
Q
D
FF
Write Configuration
Pulse
CK Q
Write Pulse
Q
D
FF
P0 to P7
CK Q
Q2
Output Port
Register
Input Port
Register
Q
D
FF
Read Pulse
CK Q
Data From
Shift Register
Q
D
ESD Protection
Diode
GND
Input Port
Register Data
To INT
Polarity
Register Data
FF
Write Polarity
Pulse
CK Q
Polarity
Inversion
Register
A.
At power-on reset, all registers return to default values.
I/O Port
When an I/O is configured as an input, FETs Q1 and Q2 are off, creating a high-impedance input. The input
voltage may be raised above VCC to a maximum of 5.5 V.
If the I/O is configured as an output, Q1 or Q2 is enabled, depending on the state of the output port register. In
this case, there are low-impedance paths between the I/O pin and either VCC or GND. The external voltage
applied to this I/O pin should not exceed the recommended levels for proper operation.
I2C Interface
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be
connected to a positive supply through a pull-up resistor when connected to the output stages of a device. Data
transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by a master sending a start condition, a high-to-low transition on
the SDA input/output while the SCL input is high (see Figure 1). After the start condition, the device address byte
is sent, MSB first, including the data direction bit (R/W).
After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA
input/output during the high of the ACK-related clock pulse. The address inputs (A0–A2) of the slave device must
not be changed between the start and the stop conditions.
On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control
commands (start or stop) (see Figure 2).
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A stop condition, a low-to-high transition on the SDA input/output while the SCL input is high, is sent by the
master (see Figure 1).
Any number of data bytes can be transferred from the transmitter to receiver between the start and the stop
conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before
the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK
clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period (see
Figure 3). When a slave receiver is addressed, it must generate an ACK after each byte is received. Similarly,
the master must generate an ACK after each byte that it receives from the slave transmitter. Setup and hold
times must be met to ensure proper operation.
A master receiver will signal an end of data to the slave transmitter by not generating an acknowledge (NACK)
after the last byte has been clocked out of the slave. This is done by the master receiver by holding the SDA line
high. In this event, the transmitter must release the data line to enable the master to generate a stop condition.
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 1. Definition of Start and Stop Conditions
SDA
SCL
Data Line
Stable;
Data Valid
Change
of Data
Allowed
Figure 2. Bit Transfer
Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
2
8
9
S
Clock Pulse for
Acknowledgment
Start
Condition
Figure 3. Acknowledgment on I2C Bus
6
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Table 3. Interface Definition
BYTE
I2C slave address
Px I/O data bus
BIT
7 (MSB)
6
5
4
3
2
1
0 (LSB)
L
H
H
H
A2
A1
A0
R/W
P7
P6
P5
P4
P3
P2
P1
P0
Device Address
Figure 4 shows the address byte of the PCA9534A.
Slave Address
0
1
1
1
A2
A1
A0 R/W
Hardware
Selectable
Fixed
Figure 4. PCA9534A Address
Table 4. Address Reference
INPUTS
I2C BUS SLAVE ADDRESS
A2
A1
A0
L
L
L
L
L
H
57 (decimal), 39 (hexadecimal)
L
H
L
58 (decimal), 3A (hexadecimal)
L
H
H
59 (decimal), 3B (hexadecimal)
H
L
L
60 (decimal), 3C (hexadecimal)
H
L
H
61 (decimal), 3D (hexadecimal)
H
H
L
62 (decimal), 3E (hexadecimal)
H
H
H
63 (decimal), 3F (hexadecimal)
56 (decimal), 38 (hexadecimal)
The last bit of the slave address defines the operation (read or write) to be performed. When it is high (1), a read
is selected, while a low (0) selects a write operation.
Control Register and Command Byte
Following the successful acknowledgment of the address byte, the bus master sends a command byte which is
stored in the control register in the PCA9534A. Two bits of this command byte state the operation (read or write)
and the internal register (input, output, polarity inversion or configuration) that will be affected. This register can
be written or read through the I2C bus. The command byte is sent only during a write transmission.
Once a command byte has been sent, the register that was addressed continues to be accessed by reads until a
new command byte has been sent.
0
0
0
0
0
0
B1
B0
Figure 5. Control Register Bits
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Table 5. Command Byte
CONTROL
REGISTER BITS
COMMAND
BYTE (HEX)
REGISTER
POWER-UP
DEFAULT
PROTOCOL
B1
B0
0
0
0x00
Input Port
Read byte
xxxx xxxx
0
1
0x01
Output Port
Read/write byte
1111 1111
1
0
0x02
Polarity Inversion
Read/write byte
0000 0000
1
1
0x03
Configuration
Read/write byte
1111 1111
Register Descriptions
The input port register (register 0) reflects the incoming logic levels of the pins, regardless of whether the pin is
defined as an input or an output by the configuration register. It only acts on read operation. Writes to these
registers have no effect. The default value, X, is determined by the externally applied logic level.
Before a read operation, a write transmission is sent with the command byte to let the I2C device know that the
input port register will be accessed next.
Table 6. Register 0 (Input Port Register)
BIT
I7
I6
I5
I4
I3
I2
I1
I0
DEFAULT
X
X
X
X
X
X
X
X
The output port register (register 1) shows the outgoing logic levels of the pins defined as outputs by the
configuration register. Bit values in this register have no effect on pins defined as inputs. In turn, reads from this
register reflect the value that is in the flip-flop controlling the output selection, not the actual pin value.
Table 7. Register 1 (Output Port Register)
BIT
O7
O6
O5
O4
O3
O2
O1
O0
DEFAULT
1
1
1
1
1
1
1
1
The polarity inversion register (register 2) allows polarity inversion of pins defined as inputs by the configuration
register. If a bit in this register is set (written with 1), the corresponding port pin polarity is inverted. If a bit in this
register is cleared (written with a 0), the corresponding port pin original polarity is retained.
Table 8. Register 2 (Polarity Inversion Register)
BIT
N7
N6
N5
N4
N3
N2
N1
N0
DEFAULT
0
0
0
0
0
0
0
0
The configuration register (register 3) configures the directions of the I/O pins. If a bit in this register is set to 1,
the corresponding port pin is enabled as an input with high-impedance output driver. If a bit in this register is
cleared to 0, the corresponding port pin is enabled as an output.
Table 9. Register 3 (Configuration Register)
BIT
C7
C6
C5
C4
C3
C2
C1
C0
DEFAULT
1
1
1
1
1
1
1
1
Power-On Reset
When power (from 0 V) is applied to VCC, an internal power-on reset holds the PCA9534A in a reset condition
until VCC has reached VPOR. At that point, the reset condition is released and the PCA9534A registers and
I2C/SMBus state machine initialize to their default states. After that, VCC must be lowered to below 0.2 V and
then back up to the operating voltage for a power-reset cycle.
8
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Interrupt Output (INT)
An interrupt is generated by any rising or falling edge of the port inputs in the input mode. After time, tiv, the
signal INT is valid. Resetting the interrupt circuit is achieved when data on the port is changed to the original
setting, data is read from the port that generated the interrupt. Resetting occurs in the read mode at the
acknowledge (ACK) or not acknowledge (NACK) bit after the rising edge of the SCL signal.
Interrupts that occur during the ACK or NACK clock pulse can be lost (or be very short) due to the resetting of
the interrupt during this pulse. Each change of the I/Os after resetting is detected and is transmitted as INT.
Writing to another device does not affect the interrupt circuit, and a pin configured as an output cannot cause an
interrupt. Changing an I/O from an output to an input may cause a false interrupt to occur, if the state of the pin
does not match the contents of the Input Port register. Because each 8-pin port is read independently, the
interrupt caused by port 0 is not cleared by a read of port 1 or vice versa.
The INT output has an open-drain structure and requires pullup resistor to VCC.
Bus Transactions
Data is exchanged between the master and PCA9534A through write and read commands.
Writes
Data is transmitted to the PCA9534A by sending the device address and setting the least-significant bit to a logic
0 (see Figure 4 for device address). The command byte is sent after the address and determines which register
receives the data that follows the command byte (see Figure 6 and Figure 7). There is no limitation on the
number of data bytes sent in one write transmission.
SCL
1
2
3
4
5
6
7
8
9
Slave Address
S
SDA
0
1
1
Command Byte
1 A2 A1 A0 0
A
0
0
0
0
0
0
0
1
A
Data 1
A
P
ACK From Slave
ACK From Slave
R/W ACK From Slave
Start Condition
Data to Port
Write to Port
Data Out
From Port
Data 1 Valid
tpv
Figure 6. Write to Output Port Register
<br/>
SCL
1
2
3
4
5
6
7
8
9
Slave Address
SDA
S
0
1
1
Command Byte
1 A2 A1 A0 0
Start Condition
R/W
A
0
0
0
0
ACK From Slave
0
0
Data to Register
1 1/0 A
Data
ACK From Slave
A
P
ACK From Slave
Data to
Register
Figure 7. Write to Configuration or Polarity Inversion Registers
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Reads
The bus master first must send the PCA9534A address with the least-significant bit set to a logic 0 (see Figure 4
for device address). The command byte is sent after the address and determines which register is accessed.
After a restart, the device address is sent again but, this time, the least-significant bit is set to a logic 1. Data
from the register defined by the command byte then is sent by the PCA9534A (see Figure 8 and Figure 9). After
a restart, the value of the register defined by the command byte matches the register being accessed when the
restart occurred. Data is clocked into the register on the rising edge of the ACK clock pulse. There is no limitation
on the number of data bytes received in one read transmission, but when the final byte is received, the bus
master must not acknowledge the data.
S 0
1
1
ACK From
Slave
ACK From
Slave
Slave Address
1 A2 A1 A0 0
Command Byte
A
A S 0
ACK From
ACK From
Master
Slave Data from Register
Slave Address
1
1
Data
A
Data from Register
NACK From
Master
1 A2 A1 A0 1 A
R/W
R/W
Data
NA P
Last Byte
Figure 8. Read From Register
<br/>
1
SCL
2
3
4
5
6
7
8
9
Data From Port
Slave Address
S 0
SDA
1
1 1 A2 A1 A0 1
Start
Condition
R/W
Data 1
A
Data From Port
Data 4
A
ACK From
Master
ACK From
Slave
NA P
NACK From
Master
Stop
Condition
Read From
Port
Data Into
Port
Data 2
tph
Data 3
Data 4
Data 5
tps
INT
tiv
tir
A.
This figure assumes that the command byte has previously been programmed with 00h.
B.
Transfer of data can be stopped at any moment by a stop condition.
C.
This figure eliminates the command byte transfer, a restart and slave address call between the initial slave address
call and the actual data transfer from the P Port. See Figure 8 for these details.
Figure 9. Read Input Port Register
10
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6
V
VI
Input voltage range (2)
–0.5
6
V
VO
Output voltage range (2)
–0.5
6
V
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–20
mA
IIOK
Input/output clamp current
VO < 0 or VO > VCC
±20
mA
IOL
Continuous output low current
VO = 0 to VCC
50
mA
IOH
Continuous output high current
VO = 0 to VCC
–50
mA
ICC
qJA
Continuous current through GND
–250
Continuous current through VCC
160
Package thermal impedance (3)
DB package
82
DBQ package
90
DGV package
86
DW package
46
N package
67
PW package
88
RGT package
(1)
(2)
(3)
Storage temperature range
mA
°C/W
TBD
RGV package
Tstg
UNIT
51
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
VCC
Supply voltage
MIN
MAX
2.3
5.5
0.7 × VCC
5.5
2
5.5
SCL, SDA
–0.5
0.3 × VCC
A2–A0, P7–P0
–0.5
0.8
SCL, SDA
VIH
High-level input voltage
VIL
Low-level input voltage
IOH
High-level output current
P7–P0
IOL
Low-level output current
P7–P0
TA
Operating free-air temperature
A2–A0, P7–P0
–40
Product Folder Link(s): PCA9534A
V
V
V
–10
mA
25
mA
85
°C
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11
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Input diode clamp voltage
II = –18 mA
VPOR
Power-on reset voltage
VI = VCC or GND, IO = 0
VCC
MIN
2.3 V to 5.5 V
–1.2
VPOR
IOH = –8 mA
P-port high-level output voltage (2)
VOH
IOH = –10 mA
SDA
VOL = 0.4 V
II
A2–A0
2.6
4.1
4.75 V
4.1
2.3 V
1.7
3V
2.5
4.5 V
4
8
8
10
3V
8
14
4.5 V
8
17
4.75 V
8
35
2.3 V
10
13
3V
10
19
4.5 V
10
24
4.75 V
10
45
VOL = 0.4 V
2.3 V to 5.5 V
3
10
VI = VCC or GND
2.3 V to 5.5 V
VI = VCC
2.3 V to 5.5 V
IIL
P port
VI = GND
2.3 V to 5.5 V
VI = VCC or GND, IO = 0,
I/O = inputs, fscl = 400 kHz
Operating mode
VI = VCC or GND, IO = 0,
I/O = inputs, fscl = 100 kHz
Standby mode
ΔICC
CI
Cio
(1)
(2)
(3)
12
Additional current in standby
mode
SCL
SDA
P port
VI = GND, IO = 0,
I/O = inputs, fscl = 0 kHz
One input at VCC – 0.6 V,
Other inputs at VCC or GND
VIO = VCC or GND
mA
±1
±1
mA
1
mA
–1
mA
5.5 V
104
175
3.6 V
50
90
2.7 V
20
65
5.5 V
60
150
3.6 V
15
40
2.7 V
8
20
5.5 V
0.25
1
3.6 V
0.2
0.9
2.7 V
0.1
0.8
2.3 V to 5.5 V
mA
1.5
mA
All LED I/Os at VI = 4.3 V,
fscl = 0 kHz
VI = VCC or GND
V
V
3
P port
UNIT
V
2.3 V
IIH
ICC
1.65
4
VOL = 0.7 V
SCL, SDA
3V
4.5 V
1.5
4.75 V
P port (3)
INT
1.8
MAX
2.3 V to 5.5 V
VOL = 0.5 V
IOL
2.3 V
TYP (1)
5.5 V
2.3 V to 5.5 V
2.3 V to 5.5 V
1
4
5
5.5
6.5
8
9.5
pF
pF
All typical values are at nominal supply voltage (2.5-V, 3.3-V, or 5-V VCC) and TA = 25°C.
The total current sourced by all I/Os must be limited to 85 mA.
Each I/O must be externally limited to a maximum of 25 mA, and the P port (P7–P0) must be limited to a maximum current of 200 mA.
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
I2C INTERFACE TIMING REQUIREMENTS
over operating free-air temperature range (unless otherwise noted) (see Figure 10)
STANDARD MODE
I2C BUS
I2C clock frequency
fscl
2
tsch
I C clock high time
tscl
I2C clock low time
tsp
I2C spike time
FAST MODE
I2C BUS
UNIT
MIN
MAX
MIN
MAX
0
100
0
400
4
0.6
4.7
1.3
ms
ms
50
2
50
100
0
0
ns
tsds
I C serial-data setup time
tsdh
I2C serial-data hold time
ticr
I2C input rise time
1000 20 + 0.1Cb
(1)
300
ns
ticf
I2C input fall time
300 20 + 0.1Cb
(1)
300
ns
300 20 + 0.1Cb
(1)
300
2
250
kHz
10-pF to 400-pF bus
ns
ns
tocf
I C output fall time
tbuf
I2C bus free time between stop and start
4.7
1.3
ms
tsts
I2C start or repeated start condition setup
4.7
0.6
ms
2
ns
tsth
I C start or repeated start condition hold
4
0.6
ms
tsps
I2C stop condition setup
4
0.6
ms
50
ns
tvd(data) Valid data time
SCL low to SDA output valid
300
tvd(ack)
ACK signal from SCL low to
SDA (out) low
0.3
Cb
(1)
Valid data time of ACK condition
3.45
2
I C bus capacitive load
0.1
400
0.9
ms
400
ns
Cb = total capacitive of one bus in pF
SWITCHING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted) (see Figure 11 and Figure 12)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
STANDARD MODE
I2C BUS
MIN
MAX
FAST MODE
I2C BUS
MIN
UNIT
MAX
tiv
Interrupt valid time
P port
INT
4
4
ms
tir
Interrupt reset delay time
SCL
INT
4
4
ms
tpv
Output data valid
SCL
P7–P0
200
200
ns
tps
Input data setup time
P port
SCL
100
100
ns
tph
Input data hold time
P port
SCL
1
1
ms
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TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
TEMPERATURE
QUIESCENT SUPPLY CURRENT
vs
TEMPERATURE
35
55
50
VCC = 5 V
30
ICC – Supply Current – nA
ICC – Supply Current – µA
45
40
f SCL = 400 kHz
I/Os unloaded
35
30
25
20
VCC = 3.3 V
15
10
VCC = 2.5 V
VCC = 5 V
25
VCC = 3.3 V
20
15
VCC = 2.5 V
10
5
5
SCL = VCC
0
-40
-15
10
35
60
0
-40
85
10
35
60
TA – Free-Air Temperature – °C
TA – Free-Air Temperature – °C
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
SUPPLY CURRENT
vs
NUMBER OF I/Os HELD LOW
70
85
600
f SCL = 400 kHz
I/Os unloaded
60
VCC = 5 V
550
500
ICC – Supply Current – µA
ICC – Supply Current – µA
-15
50
40
30
20
450
400
TA = –40°C
350
300
TA = 25°C
250
200
TA = 85°C
150
100
10
50
0
0
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
0
VCC – Supply Voltage – V
14
1
2
3
4
5
6
7
8
Number of I/Os Held Low
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TYPICAL CHARACTERISTICS (continued)
I/O OUTPUT LOW VOLTAGE
vs
TEMPERATURE
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
30
300
250
VCC = 2.5 V
VCC = 2.5 V, ISINK = 10 mA
25
ISINK – I/O Sink Current – mA
VOL – Output Low Voltage – mV
275
225
200
175
150
VCC = 5 V, ISINK = 10 mA
125
100
VCC = 2.5 V, ISINK = 1 mA
75
50
VCC = 5 V, ISINK = 1 mA
TA = –40°C
20
TA = 25°C
15
TA = 85°C
10
5
25
0
0
-40
-15
10
35
60
0.0
85
0.2
0.3
0.4
0.5
0.6
TA – Free-Air Temperature – °C
VOL – Output Low Voltage – V
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
I/O SINK CURRENT
vs
OUTPUT LOW VOLTAGE
0.7
60
40
VCC = 3.3 V
VCC = 5 V
55
35
50
TA = –40°C
ISINK – I/O Sink Current – mA
ISINK – I/O Sink Current – mA
0.1
30
25
TA = 25°C
20
15
TA = 85°C
10
45
TA = –40°C
40
35
TA = 25°C
30
25
TA = 85°C
20
15
10
5
5
0
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0
VOL – Output Low Voltage – V
0.1
0.2
0.3
0.4
0.5
0.6
VOL – Output Low Voltage – V
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15
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TYPICAL CHARACTERISTICS (continued)
I/O OUTPUT HIGH VOLTAGE
vs
TEMPERATURE
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
275
35
VCC = 2.5 V
VCC = 2.5 V, IOL = 10 mA
ISOURCE – I/O Source Current – mA
(V CC – V OH ) – Output High Voltage – mV
250
225
200
175
150
125
VCC = 5 V, IOL = 10 mA
100
75
VCC = 2.5 V, IOL = 1 mA
50
VCC = 5 V, IOL = 1 mA
25
30
TA = –40°C
25
TA = 25°C
20
15
10
TA = 85°C
5
0
0
-40
0.0
-15
10
35
60
0.1
85
0.2
0.3
0.4
0.5
0.6
0.7
(VCC – VOH) – Output High Voltage – V
TA – Free-Air Temperature – °C
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
I/O SOURCE CURRENT
vs
OUTPUT HIGH VOLTAGE
75
70
50
ISOURCE – I/O Source Current – mA
45
40
ISOURCE – I/O Source Current – mA
VCC = 3.3 V
TA = –40°C
35
TA = 25°C
30
25
20
TA = 85°C
15
10
5
VCC = 5 V
65
60
55
50
TA = –40°C
45
40
35
30
TA = 25°C
TA = 85°C
25
20
15
10
5
0
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.0
(VCC – VOH) – Output High Voltage – V
16
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0.1
0.2
0.3
0.4
0.5
0.6
0.7
(VCC – VOH) – Output High Voltage – V
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
TYPICAL CHARACTERISTICS (continued)
OUTPUT HIGH VOLTAGE
vs
SUPPLY VOLTAGE
6
TA = 25°C
VOH – Output High Voltage – V
5
4
IOH = –8 mA
3
IOH = –10 mA
2
1
0
2.3
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
VCC – Supply Voltage – V
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PARAMETER MEASUREMENT INFORMATION
VCC
RL = 1 kΩ
SDA
DUT
CL = 50 pF
(see Note A)
SDA LOAD CONFIGURATION
Three Bytes for Complete
Device Programming
Stop
Condition
(P)
Start
Address
Address
Condition
Bit 7
Bit 6
(S)
(MSB)
Address
Bit 1
tscl
R/W
Bit 0
(LSB)
ACK
(A)
Data
Bit 07
(MSB)
Data
Bit 10
(LSB)
Stop
Condition
(P)
tsch
0.7 × VCC
SCL
0.3 × VCC
ticr
ticf
tbuf
tsts
tPHL
tPLH
tsp
0.7 × VCC
SDA
0.3 × VCC
ticf
ticr
tsth
tsdh
tsds
tsps
Repeat
Start
Condition
Start or
Repeat
Start
Condition
Stop
Condition
VOLTAGE WAVEFORMS
BYTE
DESCRIPTION
1
I2C address
2, 3
P-port data
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
All parameters and waveforms are not applicable to all devices.
Figure 10. I2C Interface Load Circuit and Voltage Waveforms
18
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
RL = 4.7 kΩ
INT
DUT
CL = 100 pF
(see Note A)
INTERRUPT LOAD CONFIGURATION
ACK
From Slave
Start
Condition
8 Bits
(One Data Byte)
From Port
R/W
Slave Address
S
0
1
1
1 A2 A1 A0 1
A
1
2
3
4
A
5
6
7
8
Data 1
ACK
From Slave
Data From Port
A
Data 2
1
P
A
tir
tir
B
B
INT
A
tiv
tsps
A
Data
Into
Port
Address
Data 1
0.7 × VCC
INT
0.3 × VCC
SCL
Data 2
0.7 × VCC
R/W
tiv
A
0.3 × VCC
tir
0.7 × VCC
Pn
0.7 × VCC
INT
0.3 × VCC
0.3 × VCC
View A−A
View B−B
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
All parameters and waveforms are not applicable to all devices.
Figure 11. Interrupt Load Circuit and Voltage Waveforms
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PARAMETER MEASUREMENT INFORMATION (continued)
500 W
Pn
2 × VCC
DUT
CL = 50 pF
(see Note A)
500 W
P-PORT LOAD CONFIGURATION
0.7 × VCC
SCL
P0
A
P3
0.3 × VCC
Slave
ACK
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
SDA
Pn
tpv
(see Note B)
Unstable
Data
Last Stable Bit
WRITE MODE (R/W = 0)
0.7 × VCC
SCL
P0
A
tps
P3
0.3 × VCC
tph
0.7 × VCC
Pn
0.3 × VCC
READ MODE (R/W = 1)
A.
CL includes probe and jig capacitance.
B.
tpv is measured from 0.7 × VCC on SCL to 50% I/O (Pn) output.
C.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
D.
The outputs are measured one at a time, with one transition per measurement.
E.
All parameters and waveforms are not applicable to all devices.
Figure 12. P-Port Load Circuit and Voltage Waveforms
20
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Pn
RL = 1 kΩ
DUT
500 W
2 × VCC
DUT
SDA
CL = 50 pF
(see Note A)
500 W
CL = 50 pF
(see Note A)
SDA LOAD CONFIGURATION
P-PORT LOAD CONFIGURATION
Start
SCL
ACK or Read Cycle
SDA
0.3 y VCC
tRESET
RESET
VCC/2
tREC
tw
Pn
VCC/2
tRESET
A.
CL includes probe and jig capacitance.
B.
All inputs are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr/tf ≤ 30 ns.
C.
I/Os are configured as inputs.
D.
All parameters and waveforms are not applicable to all devices.
Figure 13. Reset Load Circuits and Voltage Waveforms
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APPLICATION INFORMATION
Figure 14 shows an application in which the PCA9534A can be used.
VCC
(5 V)
10 kΩ
VCC
Master
Controller
10 kΩ
10 kΩ
10 kΩ
100 kΩ
2 kΩ
SDA
VCC
SDA
SCL
SCL
INT
INT
100 kΩ
(X 3)
P0
Subsystem 1
(e.g., Temperature Sensor)
P1
INT
P2
RESET
GND
P3
Subsystem 2
(e.g., Counter)
PCA9534A
P4
A
P5
A2
Controlled Device
(e.g., CBT Device)
P6
ENABLE
A1
P7
B
A0
GND
ALARM
Subsystem 3
(e.g., Alarm System)
4.7 kΩ
GND
A.
Device address is configured as 0111100 for this example.
B.
P0, P2, and P3 are configured as outputs.
C.
P1, P4, and P5 are configured as inputs.
D.
P6 and P7 are not used and must be configured as outputs.
Figure 14. Typical Application
22
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SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
Minimizing ICC When the I/O Controls LEDs
When the I/Os are used to control LEDs, they normally are connected to VCC through a resistor as shown in
Figure 14. Because the LED acts as a diode, when the LED is off, the I/O VIN is about 1.2 V less than VCC. The
supply current, ICC, increases as VIN becomes lower than VCC and is specified as ΔICC in Electrical
Characteristics.
For battery-powered applications, it is essential that the voltage of the I/O pins is greater than or equal to VCC
when the LED is off to minimize current consumption. Figure 15 shows a high-value resistor in parallel with the
LED. Figure 16 shows VCC less than the LED supply voltage by at least 1.2 V. Both of these methods maintain
the I/O VIN at or above VCC and prevents additional supply-current consumption when the LED is off.
VCC
LED
100 kW
VCC
LEDx
Figure 15. High-Value Resistor in Parallel With the LED
3.3 V
VCC
5V
LED
LEDx
Figure 16. Device Supplied by a Lower Voltage
Power-On Reset Requirements
In the event of a glitch or data corruption, PCA9534A can be reset to its default conditions by using the power-on
reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This
reset also happens when the device is powered on for the first time in an application.
The two types of power-on reset are shown in Figure 17 and Figure 18.
VCC
Ramp-Up
Ramp-Down
Re-Ramp-Up
VCC_TRR_GND
Time
VCC_RT
VCC_FT
Time to Re-Ramp
VCC_RT
Figure 17. VCC is Lowered Below 0.2 V or 0 V and Then Ramped Up to VCC
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VCC
Ramp-Down
Ramp-Up
VCC_TRR_VPOR50
VIN drops below POR levels
Time
Time to Re-Ramp
VCC_FT
VCC_RT
Figure 18. VCC is Lowered Below the POR Threshold, Then Ramped Back Up to VCC
Table 10 specifies the performance of the power-on reset feature for PCA9534A for both types of power-on
reset.
Table 10. RECOMMENDED SUPPLY SEQUENCING AND RAMP RATES (1)
MAX
UNIT
VCC_FT
Fall rate
PARAMETER
See Figure 17
1
100
ms
VCC_RT
Rise rate
See Figure 17
0.01
100
ms
VCC_TRR_GND
Time to re-ramp (when VCC drops to GND)
See Figure 17
0.001
ms
VCC_TRR_POR50
Time to re-ramp (when VCC drops to VPOR_MIN – 50 mV)
See Figure 18
0.001
ms
VCC_GH
Level that VCCP can glitch down to, but not cause a functional
disruption when VCCX_GW = 1 ms
See Figure 19
VCC_GW
Glitch width that will not cause a functional disruption when
VCCX_GH = 0.5 × VCCx
See Figure 19
VPORF
Voltage trip point of POR on falling VCC
0.767
1.144
V
VPORR
Voltage trip point of POR on fising VCC
1.033
1.428
V
(1)
MIN
TYP
1.2
V
ms
TA = –40°C to 85°C (unless otherwise noted)
Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width
(VCC_GW) and height (VCC_GH) are dependent on each other. The bypass capacitance, source impedance, and
device impedance are factors that affect power-on reset performance. Figure 19 and Table 10 provide more
information on how to measure these specifications.
VCC
VCC_GH
Time
VCC_GW
Figure 19. Glitch Width and Glitch Height
VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the
registers and the I2C/SMBus state machine are initialized to their default states. The value of VPOR differs based
on the VCC being lowered to or from 0. Figure 20 and Table 10 provide more details on this specification.
24
Submit Documentation Feedback
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): PCA9534A
PCA9534A
www.ti.com
SCPS141F – SEPTEMBER 2006 – REVISED JUNE 2010
VCC
VPOR
VPORF
Time
POR
Time
Figure 20. VPOR
Interrupt Requirements
The expected performance of the interrupt feature is that INT is to be cleared (de-asserted) when the input
register is read or all inputs return to the last read values. INT is also de-asserted when both of the following
occur:
• The last I2C command byte (register pointer) written was 00h. This generally means the last operation with
the device was a read of the input register, but the command byte may have been written with 00h without
ever going on to read the Input register.
• Any other slave device on the I2C bus acknowledges an address byte with the R/W bit set high. This occurs
when reading any other valid device on the bus.
In order to prevent INT from de-asserting when another device is read on the I2C bus, the user needs to change
the command byte to something other than 00 (hex) after a read operation to the device.
Submit Documentation Feedback
Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): PCA9534A
25
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
PCA9534ADB
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534ADBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534ADBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ADBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ADGVR
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ADGVRG4
ACTIVE
TVSOP
DGV
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ADW
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534ADWG4
ACTIVE
SOIC
DW
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534ADWR
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ADWRG4
ACTIVE
SOIC
DW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PCA9534APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534APWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
PCA9534ARGTR
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
PCA9534ARGTRG4
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
PCA9534ARGVR
ACTIVE
VQFN
RGV
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Request Free Samples
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
PCA9534ARGVRG4
24-Jun-2010
Status
(1)
ACTIVE
Package Type Package
Drawing
VQFN
RGV
Pins
16
Package Qty
2500
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
Request Free Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.6
2.5
12.0
16.0
Q1
PCA9534ADBR
SSOP
DB
16
2000
330.0
16.4
PCA9534ADGVR
TVSOP
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
PCA9534ADWR
SOIC
DW
16
2000
330.0
16.4
10.75
10.7
2.7
12.0
16.0
Q1
PCA9534APWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
PCA9534ARGTR
QFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
PCA9534ARGVR
VQFN
RGV
16
2500
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
Pack Materials-Page 1
8.2
B0
(mm)
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jun-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
PCA9534ADBR
SSOP
DB
16
2000
346.0
346.0
33.0
PCA9534ADGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
PCA9534ADWR
SOIC
DW
16
2000
346.0
346.0
33.0
PCA9534APWR
TSSOP
PW
16
2000
346.0
346.0
29.0
PCA9534ARGTR
QFN
RGT
16
3000
346.0
346.0
29.0
PCA9534ARGVR
VQFN
RGV
16
2500
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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