ALPS SCDB1C0105

Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™)
SCDB Series
Push-push type featuring contact protection function with less impact to media cards.
For
SD Memory
Card
For
microSD™
Card
For
SIM Card
8pins
For
W-SIM
For
Memory
Stick Micro™
Features
●
For
Memory
Stick™
●
Combine Type
●
●
Applications
Applicable to three memory card standards - SD Memory
Card, Multi Media CardTM and Memory StickTM.
Push-push ejection mechanism applied in both card types.
Contact point protection to minimize card damage during
insertion and ejection.
Same insertion and ejection position applied for both cards.
●
●
●
●
●
●
For desktop PCs, notebook PCs and personal digital
assistants
For home audio equipment (TVs and set top boxes)
For audio systems
For digital camcorders
For digital still cameras
For headphone players
For
Compact
Flash™
For PC cards
supporting
CardBus
Typical Specifications
Items
For
Express
Card™
For CMOS
Camera Module
Specifications
Applicable media
SD Memory Card, MultiMediaCard™, Memory StickTM
Mounting type
Surface mounting type
Mounting style
Standard mount/Reverse mount
Media ejection
structure
Push-push type
Operating temperature
range
−25℃ to ＋60℃
Voltage proof
500V AC 1minute
Structure
Performance
Insulation resistance
（Initial）
Contact
resistance
（Initial）
1,000MΩ min.
Connector
contacts
100mΩ max.
Detection
switch
500mΩ max.
Insertion and
removal cycle
10,000cycles（SD Memory Card）
12,000cycles（Memory StickTM）
Product Line
Media ejection
structure
Mounting system
Feature
Standoff（mm）
Packing
system
With boss
0
Tray
Standard mount
Push-push type
Reverse mount
38
Product No.
Drawing
No.
SCDB1C0105
1
SCDB2A0200
2
Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™) SCDB Series
Dimensions
Unit:mm
No.
PC board mounting hole dimensions
（Viewed from the mounting face side）
Style
Standard mount
32.2
32.3
27
13.5（1.5×9）
31
4.5
No.!0
0.65
No.!9
16.6
14.15
5.525
No.!4
No.!3
No.!2
No.!1
No.!0
No.!5
No.!6
No.!7
No.!8
No.!9
10-1
For
microSD™
Card
ø1.5
No.@1
For
SD Memory
Card
6.25
17
19.2
ø2
For
W-SIM
1.55
（Hole）
23.05
23.55
24.55
25.35
2.9
13.45
11.65
For
SIM Card
8pins
10.65
11
18.5
28.5
20.8
28
8.05
（35）Card lock position
No.@0
No.@2:Common
6.95
（5）
1
（7）
（1.2）Over travel
No.@2
ø1.55
Positioning
boss hole
18.7
46.15
No.@1:
Card detect switch
No.@3:Ground
No.@0:Write protect
detect switch
Card eject travel
No.8
No.9
Connector center
No.i
No.u
No.y
No.t
Card center
21.5
22.5
No.o
No.q
No.w
No.e
No.r
9-1
16（2×8）
29.6
33.2
For
Compact
Flash™
Land area
For PC cards
supporting
CardBus
No pattern area
27
For
Express
Card™
Reverse mount
31
No.!0
2-ø1.5
No.@1
16.6
14.15
10-1
5.525
19.7
18.85
17.3
46.15
4.1
28
Ground
ø1
(h .55
ol
e)
2
Ground
No.9
No.1
No.2
No.3
27
30.8
33.9
No.8
No.7
No.6
6-0.9
Card eject travel
4.5
(0.35)
1.55
2.25
24.1
22.5
21.5
Over travel (1.2)
0.55
1
4-0.9
No.4
(hole)
1.6
3.2
19.65
20.95
22.25
23.55
25.15
No.@0
28.6
25.5
24.2
22.9
21.6
20.3
19
12.3
(5)
（7）
12.6
For CMOS
Camera Module
No.!4
No.!3
No.!2
No.!1
No.!0
No.5
Card center
Connector center
2.85
2
（35）Card inserting
16.4
No.@2
32.3
13.5(1.5G9)
6.4
8.2
No.!5
No.!6
No.!7
No.!8
No.!9
1.55
No.!9
For
Memory
Stick™
Combine Type
No part mounting
24.1
For
Memory
Stick Micro™
No.4
No.5
Land area
No part mounting
No.@0
27
PC board surface
39
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition（Reference）
For
SD Memory
Card
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）.
3. Temperature profile（Surface of products）.
For
microSD™
Card
For
W-SIM
For
Memory
Stick Micro™
For
Memory
Stick™
Temperature (˚C )
For
SIM Card
8pins
240℃(max.)
230℃(min.)
200
180℃
150℃
100
Room
temperature
Time (s)
Pre-heating
90±30 sec.
10 sec.(max.)
Combine Type
Heating time
sec.
For
Compact
Flash™
For PC cards
supporting
CardBus
For
Express
Card™
For CMOS
Camera Module
50
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or
electrical degradation to occur depending on the conditions. Caution is therefore required.
2. Avoid use of water-soluble soldering flux, since it may corrode the product.
3. Check and conform to reflow soldering requirements under actual mass production conditions.
4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and
layout.
5. The card specifications are provided by the above manufactures. Products by other manufactures may not be
compliant with these specifications and are subject to change without prior notice.