Connector for Memory Stick Micro™ SCNA Series Minimum mounting area for compact devices. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features ● Applications Minimized mounting area prevents negation of size advantage of the card. ● For mobile phones, personal digital assistants, digital still cameras, compact audio equipment Typical Specifications Combine Type Items For Compact Flash™ For PC cards supporting CardBus Specifications Applicable media Memory Stick Micro™ Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Push-push type Operating temperature range −25℃ to ＋60℃ Voltage proof 250V AC 1minute Structure For Express Card™ For CMOS Camera Module Performance Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle 1,000MΩ min. 40mΩ max. 12,000cycles Product Line 34 Media ejection structure Mounting system Stand-off（mm） Packing system Product No. Push-push type Standard mount 0 Taping SCNA1A0300 Connector for Memory Stick Micro™ SCNA Dimensions Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） Style 2.7 7.85 10.45 10.75 12.35 13.9 9.15 7.8 5.95 3.85 For SIM Card 8pins For W-SIM 1 1 For microSD™ Card 7.1 2.01 0.41 14.7 13.2 12.05 13.95 13.95 15 15.5 14.9 7.1 6.57 4.4 2.8 4-1.2 0.75 1.1 0.9 0.41 4.7 0.8 1.8 7.92 4.4 2.8 0.3 1.3 2.9 2.01 For SD Memory Card 1.4 14.9 (16.9) Series For Memory Stick Micro™ 1 0.33 Card center Over travel (1) Connector center 0.75 0.9G10=9 1 Card eject travel (4) 11-0.6 0.3 P0.9 3.12 0.75 P0.9 3.07 3.12 0.9G10=9 5.92 4.47 6.57 6.72 6.57 7.62 7.77 7.77 Land area No Pattern area Ground pattern possible area No parts area For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 35 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.