Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picture Card™) SCDE Series Push-in push-out eject mechanism applicable to four media types. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features ● ● ● Applications Applicable to four memory card standards - SD Memory Card, MultiMediaCardTM, Memory StickTM and xD-Picture CardTM. Push-push ejection mechanism applied in both card types. Same insertion and ejection position applied for both cards. ● ● ● Combine Type For Compact Flash™ ● Typical Specifications Items Specifications For PC cards supporting CardBus SD Memory Card MultiMediaCard™ For Express Card™ For CMOS Camera Module For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players Applicable media Memory StickTM Structure xD-Picture CardTM Mounting type Surface mounting type Mounting style Standard mount / Reverse mount Media ejection structure Push-push type Operating temperature range −10℃ to ＋60℃ Voltage proof Performance 500V AC 1minute（SCDE1）, 250V AC 1minute（SCDE2） Insulation resistance（Initial） Contact resistance （Initial） 1,000MΩ min. Connector contacts 100mΩ max.（SCDE1）, 150mΩ max.（SCDE2） Detection switch 500mΩ max.（SCDE1）, 600mΩ max.（SCDE2） Insertion and removal cycle 10,000cycles（SD Memory Card, xD-Picture CardTM） 12,000cycles（Memory StickTM） Product Line Media ejection structure Mounting system Stand-off（mm） Packing system Standard mount Push-push type 0 Reverse mount 40 Product No. Drawing No. SCDE1C0200 1 SCDE2B0100 2 Tray Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picure Card™) SCDE Series Dimensions Unit:mm Style MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 4.5 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 13.95 19-1.1 27(P1.5×18) 13.025 10.475 10.475 SD No.3 SD No.2 SD No.1 SD No.9 8.65 48.1 SD No.4 SD No.5 SD No.6 SD No.7 SD No.8 For SD Memory Card 33.25 29.7 Common (for SD) (5.5) (5) Locked position WP switch (for SD) Eject position xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 xD No.!3 xD No.!2 xD No.!1 xD No.!0 Card center Connector center 31 27 16.7 14.9 28.75 26.6 25.5 (hole) ø2 For W-SIM 27 6.25 15.5 1 ø1.55 (hole) 19.375 17.175 16.05 14.55 4.95 3.15 0.9 (1.2)Over travel 21 CD switch (for SD) For microSD™ Card For SIM Card 8pins 1.55 1.4 13.7 No. PC board mounting hole dimensions （Viewed from the mounting face side） Ground For Memory Stick Micro™ 15(P1×15) xD No.1 xD No.0 (CD for xD) xD No.2 xD No.3 xD No.4 xD No.5 xD No.6 xD No.7 xD No.8 xD No.9 For Memory Stick™ 6.65 7.5 8.35 19-0.6 9.2 9.3 10 Combine Type Land No pattern area For Compact Flash™ ø1.5 ø1 .7 1.5 8.475 7.525 xD card center xD No.!3 xD No.!2 xD No.!1 xD No.!0 .5h 14 1. 1 0.75 ø3 .5 0.95 0.65 xD No.6 xD No.7 xD No.8 xD No.9 (GND for xD) WP Switch (for SD) xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 For CMOS Camera Module ø1 ole 14 39.25 36.25 30.175 Connector center 30.5 0.95 le 0.65 For Express Card™ 12 GND xD No.1 xD No.0 xD No.2 xD No.3 xD No.4 xD No.5 (5) Eject Position 9.7 1.775 Lock Position (5.5) 4.9 5.1 6.65 22 (1.2) Over travel 21.2 47.7 43.95 2 7.255 6.275 0.95 ho 1.5 SD No.4 SD No.3 (Dummy) SD No.2 (Dummy) SD No.1 SD No.9 5.7 2.2 5.3 15.85 23.6 SD No.5 (Dummy) SD No.6 (Dummy) SD No.7 SD No.8 Common(for SD) CD Switch(for SD) 0.65 0.975 MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 2.8 15.85 4.6 4.75 0.2 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 For PC cards supporting CardBus 4.5 6 14.1 14.1 2.25 2.25 On the card entry side, the metal exposed part is connected to terminal No.9 of the xD card. No pattern area 2-φ1.3 No pattern exposure area 28 MS, SD card center 41 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.