Connector for SIM Card 8pins SCGC Series Small size surface mounting contributes to improved flexibility in set design. For SD Memory Card NEW For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● Applications Thin type 1.55mm push-push type. Equipped with card detection switch. ● For Memory Stick Micro™ PCs and personal digital assistants For Memory Stick™ Combine Type Typical Specifications Items Specifications Applicable media For Compact Flash™ SIM Card 8pins Mounting type Surface mounting type Mounting style Standard mount Media ejection structure Push-push type Operating temperature range −25℃ to ＋70℃ Voltage proof 500V AC 1minute For PC cards supporting CardBus Structure Performance Insulation resistance（Initial） Contact resistance （Initial） For Express Card™ For CMOS Camera Module 1,000MΩ min. Connector contacts 100mΩ max. Detection switch 500mΩ max. Insertion and removal cycle 5,000cycles Product Line Media ejection structure Mounting style Stand-off （mm） Packing system Product No. Push-push type Standard mount 0 Taping SCGC1B0101 27 Connector for SIM Card 8pins SCGC Series Unit:mm Dimensions PC board mounting hole dimensions （Viewed from the mounting face side） Style For SD Memory Card 2-0.7 Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 28 10.35 9.045 8.5 1.3 13.77 4.6 11.47 4.6 0.86 P= 0.8 0.6 26.77 25.77 21.22 6.045 9.2 9.2 2.6 2.4 2-2 C2 C1 :No pattern area :Land area :No parts area (1.23) 18.44 19.94 3.455 2.4 C5 C6 21.22 25.77 C8 C7 C3 C4 3-0.8 Pitch C6 C5 C2 C1 8-0.3 26.77 Card lock(1.3) Over travel(0.3) C7 C8 C3 C4 Card center Connector center 1.55 For Memory Stick™ Eject stroke(3.5) For Memory Stick Micro™ 11.47 For SIM Card 8pins For W-SIM 10.35 9.045 3.65 1.3 3.59 Common 8.5 0.18 3.65 0.17 3.59 4-4 Card detect switch For microSD™ Card Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.